IEC 62047-10:2011

Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials

IEC 62047-10:2011 specifies micro-pillar compression test method to measure compressive properties of MEMS materials with high accuracy, repeatability, and moderate effort of specimen fabrication. The uniaxial compressive stress-strain relationship of a specimen is measured, and the compressive modulus of elasticity and yield strength can be obtained. This standard is applicable to metallic, ceramic, and polymeric materials. The contents of the corrigendum of February 2012 have been included in this copy.

Dispositifs à semiconducteur - Dispositifs microélectromécaniques - Partie 10: Essai de compression utilisant la technique des micro-piliers pour les matériaux des MEMS

La CEI 62047-10:2011 spécifie une méthode d'essai de compression utilisant la technique des micro-piliers destinée à mesurer les propriétés de compression des matériaux des MEMS avec une précision et une répétabilité élevées et un effort modéré pour la fabrication des éprouvettes. La relation contrainte-déformation de compression uniaxiale d'une éprouvette est mesurée ce qui permet ainsi d'obtenir le module de compression et la limite d'élasticité. La présente norme est applicable aux matériaux métalliques, céramiques, et en polymères. Le contenu du corrigendum de février 2012 a été pris en considération dans cet exemplaire.

General Information

• Status: Published
• Publication Date: 25-Jul-2011
• ICS: 31.080.99 - Other semiconductor devices
• Technical Committee: SC 47F - Micro-electromechanical systems
• Drafting Committee: WG 1 - TC 47/SC 47F/WG 1
• Current Stage: PPUB - Publication issued
• Start Date: 26-Jul-2011
• Completion Date: 31-Aug-2011

Relations

• Corrected By: IEC 62047-10:2011/COR1:2012 - Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
• Effective Date: 05-Sep-2023

Overview

IEC 62047-10:2011 is an international standard developed by the International Electrotechnical Commission (IEC) that defines a micro-pillar compression test method specifically designed for micro-electromechanical system (MEMS) materials. This standard details a precise technique to measure compressive properties such as the modulus of elasticity and yield strength of MEMS materials using micro-pillars fabricated on rigid substrates. Applicable to a variety of materials-including metallic, ceramic, and polymeric-IEC 62047-10 provides a reliable and repeatable means to evaluate mechanical performance at the microscale, which is critical for advanced semiconductor and MEMS device applications.

Key Topics

• Micro-Pillar Compression Principle
  The test involves applying uniaxial compressive force to a cylindrical micro-pillar, with stress defined as the applied force divided by the micro-pillar's cross-sectional area, and strain evaluated from the longitudinal displacement relative to pillar height.
• Specimen Design and Fabrication
  The micro-pillar test specimen-a cylindrical pillar with an aspect ratio (height to diameter) of at least 3-is micro-machined onto a stiff substrate. The shape and verticality of these pillars are verified using electron or optical microscopy to ensure accurate testing conditions.
• Accurate Dimensional Measurements
  Precise measurement of the micro-pillar's dimensions (diameter and height) is crucial for calculating mechanical properties. Techniques such as interferometry or focused ion beam (FIB) sectioning ensure dimensional accuracy within ±1%. If geometric deviations exist, finite element analysis may be employed to interpret results correctly.
• Testing Equipment and Setup
  The standard emphasizes high-resolution force and displacement sensors with resolutions better than 0.1% of the maximum expected values. Test actuators must provide linear movement aligned carefully to minimize errors due to tool-pillar misalignment.
• Error Considerations
  Errors may arise from friction between the compression punch and pillar, boundary conditions differing from bulk material tests, and inaccuracies in strain measurement. IEC 62047-10 discusses mitigating these errors by maintaining appropriate aspect ratios (preferably below 10 to avoid buckling) and minimizing frictional effects.

Applications

This standard is essential for engineers and researchers working on:

• MEMS Device Development
  Enables precise mechanical characterization of miniature components, ensuring device reliability and performance under mechanical load.
• Material Science and Characterization
  Provides fundamental compressive property data for thin films and microscale materials used in semiconductor and microelectronic applications.
• Quality Control in Semiconductor Manufacturing
  Assists in verifying material consistency and properties during fabrication processes for micro-electromechanical systems.
• Advanced Research in Microfabrication Techniques
  Supports development of novel microfabrication methods through rigorous mechanical testing standards.

Related Standards

• IEC 62047-8: Semiconductor devices – Micro-electromechanical devices – Part 8: Strip bending test method for tensile property measurement of thin films
  Complements IEC 62047-10 by providing standards for tensile testing of thin films used in MEMS, crucial for complete mechanical characterization.
• Other Parts of IEC 62047 Series
  The IEC 62047 series covers various test methods for MEMS materials to promote standardized testing for a wide range of mechanical properties.
• ISO/IEC Directives Part 2
  IEC 62047-10 adheres to ISO/IEC Directives for standardization processes ensuring consistency and international acceptance.

---

IEC 62047-10:2011 offers a scientifically rigorous and standardized approach to micro-pillar compression testing that supports high accuracy and repeatability, invaluable for advancing MEMS technology and semiconductor material characterization. By following this standard, laboratories and manufacturers can improve test efficiency, ensure comparability across studies, and facilitate innovation in micro-scale device engineering.

Standards Content (Sample)

IEC 62047-10 ®
Edition 1.0 2011-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Micro-electromechanical devices –
Part 10: Micro-pillar compression test for MEMS materials

Dispositifs à semiconducteur – Dispositifs microélectromécaniques –
Partie 10: Essai de compression utilisant la technique des micro-piliers pour
les matériaux des MEMS
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IEC 62047-10 ®
Edition 1.0 2011-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Micro-electromechanical devices –
Part 10: Micro-pillar compression test for MEMS materials

Dispositifs à semiconducteur – Dispositifs microélectromécaniques –
Partie 10: Essai de compression utilisant la technique des micro-piliers pour
les matériaux des MEMS
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX L
ICS 31.080.99 ISBN 978-2-88912-606-4

– 2 – 62047-10  IEC:2011
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Symbols and designations . 5
4 Test piece . 6
4.1 General . 6
4.2 Shape of test piece . 6
4.3 Measurement of dimensions . 6
5 Testing method and test apparatus . 7
5.1 Test principle . 7
5.2 Test machine . 7
5.3 Test procedure . 8
5.4 Test environment. 8
6 Test report. 8
Annex A (informative) Error estimation using finite element method . 10
Bibliography . 11

Figure 1 – Shape of cylindrical pillar (See Table 1 for symbols) . 5
Figure 2 – Schematic of Micro-pillar compression test . 7
Figure A.1 – Error estimation with the aspect ratio and friction coefficient in the elastic
modulus measurement . 10

Table 1 – Symbols and designations of test piece . 6

62047-10  IEC:2011 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –

Part 10: Micro-pillar compression test for MEMS materials

FOREWORD
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International Standard IEC 62047-10 has been prepared by subcommittee 47F: Micro-
electromechanical systems, of IEC technical committee 47: Semiconductor devices.
The text of this standard is based on the following documents:
FDIS Report on voting
47F/85/FDIS 47F/94/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts of IEC 62047, under the general title Semiconductor devices – Micro-
electromechanical devices, can be found on the IEC website.

– 4 – 62047-10  IEC:2011
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
The contents of the corrigendum of February 2012 have been included in this copy.

IMPORTANT – The “colour inside” logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct understanding
of its contents. Users should therefore print this publication using a colour printer.

62047-10  IEC:2011 – 5 –
SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –

Part 10: Micro-pillar compression test for MEMS materials

1 Scope
This part of IEC 62047 specifies micro-pillar compression test method to measure
compressive properties of MEMS materials with high accuracy, repeatability, and moderate
effort of specimen fabrication. The uniaxial compressive stress-strain relationship of a
specimen is measured, and the compressive modulus of elasticity and yield strength can be
obtained.
The test piece is a cylindrical pillar fabricated on a rigid (or highly stiff) substrate by micro-
machining technologies, and its aspect ratio (ratio of pillar diameter to pillar height) should be
more than 3. This standard is applicable to metallic, ceramic, and polymeric materials.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 62047-8, Semiconductor devices – Micro-electromechanical devices – Part 8: Strip
bending test method for tensile property measurement of thin films
3 Symbols and designations
For the purposes of this document, the shape of test piece and symbols are given in Figure 1
and Table 1, respectively. Test piece in this standard is often referred to as a pillar specimen.

D
Cylindrical pillar
H
Substrate
IEC  1708/11
Key
Components Dimensions of cylindrical pillar
cylindrical pillar: a part of micro-pillars fabricated on a D: diameter of a test piece
substrate using micro-machining process
shaped in a cylinder as a test piece
substrate: a kind of rigid (or highly stiff) material H: height of a test piece
supporting the test piece
Figure 1 – Shape of cylindrical pillar (See Table 1 for symbols)

– 6 – 62047-10  IEC:2011
Table 1 – Symbols and designations of test piece
Symbol Unit Designation
H µm height of a test piece
D diameter of a test piece
µm
4 Test piece
4.1 General
The test piece shall be prepared by using the same fabrication process as the actual device
fabrication. To minimize the size effect of a test piece, the structure and size of the test piece
should be similar to those of the device components. There are many fabrication methods of
the test piece depending on the applications.
4.2 Shape of test piece
This standard specifies the compressive properties of a cylindrical micro-pillar. The micro-
pillars are fabricated on a substrate using micro-machining process. The shape and the
verticality of the pillars should be checked using electron or optical microscopy. The boundary
condition on the bottom surface of the pillar is usually regarded as the fixed boundary, and
these boundary conditions are different from those of bulk scale pillars where the top and
bottom surfaces are usually lubricated and regarded as the frictionless boundary. Since it is
also difficult to directly measure the compressive strain of the micro-pillar during the test, the
strain is estimated from the displacement of the rigid punch using the Equation (2) of 5.1. This
leads to errors in strain, and consequently errors in elastic modulus and yield strength as
described in Annex A. The accuracy of this method depends on the friction coefficient
between the punch and the top surface, and the aspect ratio of the micro-pillar. The pillar with
high aspect ratio is desirable for reducing the errors in strain estimation unless the buckling
occurs. The upper limit of aspect ratio is dependent on boundary conditions and material
properties of the pillar. The maximum aspect ratio is suggested as 10 [4] . When there is no
buckling after test for a pillar with an aspect ratio larger than 10, the test data should be
considered as a valid one. The friction coefficient on the top surface can be reduced by
applying a lubricating layer for bulk pillars (see [4]), but it is very difficult to apply the
lubricating layer to micro-pillars. The maximum variation in diameter of a cross-section of a
pillar should be less than 1 % of the nominal diameter. When this is not the case, the actual
cross-sectional area should be measured.
4.3 Measurement of dimensions
To analyze the test results, the accurate measurement of the test piece dimensions is
required since the dimensions are used to extract mechanical properties of test materials. The
diameter and the height of the pillar should be measured with high accuracy with less than
±1 % error. Interferometric technique or FIB (Focused Ion Beam) sectioning can be utilized to
measure the height accurately. The test piece can have a changing cross-section in the
longitudinal direction and the diameter or the top surface can be different from that of the
bottom surface. This dimensional error should be minimized with ±1 % error if possible. When
it is impossible, the shape of the test piece should be measured using microscopic technique
and finite element analysis should be adopted to analyze the test results.
___________
Figure in square bracket refer to Bibliography.

62047-10  IEC:2011 – 7 –
5 Testing method and test apparatus
5.1 Test principle
4P
σ=
(1)
πD
d
ε=
(2)
H
where
σ is stress defined by an applied force divided by a cross-sectional area of the
test piece;
d is a longitudinal displacement of the punch during the test;
ε
is strain defined by a displacement divided by a height of the test piece.

P, d
Punch
Pillar
IEC  1709/11
Key
Components Dimension of tool and supply
punch: a kind of tool shaped as a disc with a P specified values of compressive force
large radius to reduce the error caused by
misalignment between the tool and a part
of micro-pillars
pillar: a part of micro-pillars fabricated on a d values of longitudinal displacement of
substrate using micro-machining process the pillar caused by applying specified
shaped in a cylindrical pillar specimen as values of compressive force
a test piece
Figure 2 – Schematic of micro-pillar compression test
5.2 Test machine
Depending on the dimensions and materials of the micro-pillar, the force and displacement
sensors need to be carefully chosen, and their resolutions should be better than 1/1 000 of
the maximum force and displacement, respectively. The actuator should have a linear motion

– 8 – 62047-10  IEC:2011
in the direction of the loading without any parasitic motion in the other directions, and its
displacement resolution needs to be less than 1/10 of the displacement sensor resolution.
Piezoelectric or voice-coil actuator is desirable for the actuator, and LDVT, capacitive, or
optical sensor can be applicable to this type of test. The stiffness of the frame of the test
machine should be much larger than the stiffness of the test piece. The deformation of the
test machine should be checked and/or compensated, and an example for the compensation
of test machine can be found in IEC 62047-8.
The punch is an important component in the testing apparatus. A flat-ended punch has been
widely adopted in this type of test, and a spherical punch with a large radius can be used to
reduce the error caused by misalignment between a punch and a specimen. The roughness of
the surface of the punch should be better than that of the specimen. The flatness and the
parallelism of the flat-ended punch should be better than 0,0002 m/m (see [4]). The radius of
the spherical punch should be 100 times larger than the diameter of the test piece.
5.3 Test procedure
The test procedure used in this study is summarized as follows:
a) Attach a substrate to the stage of the test apparatus. A lot of micro-pillars can be
fabricated on the substrate using batch fabrication process. It is important to minimize the
deviation angle between the axial direction of the pillars and the loading direction of the
punch and the deviation should be less than 0,0002 m/m (see [4]).
b) Identify the position of a test piece. The position of the test piece can be observed using
an optical camera module, and the positioning error should be less than 1/10 of the
diameter of the test piece.
c) Apply a compressive displacement to the top surface of the pillar with a constant velocity
of the punch. The constant velocity results in a constant strain rate. The suggested strain
rate is 5 x 10 /min (see [4]) for materials of rate-insensitive. For the materials of rate-
sensitive, the effect of strain rate should be carefully investigated [3]. The maximum
applied strain needs to be properly chosen depending on the materials and testing
purpose. For the stress-strain curve measurement, the maximum strain range should be
selected to take into account the plastic behaviour of a test piece. The suggested
maximum strain range is 0,04 m/m for ductile materials and it can be less than 0,01 m/m
for brittle materials.
d) Retract the punch under the same velocity as the loading-velocity after a period of holding
time. The suggested holding period is 60 s for rate-insensitive materials. The elastic
modulus can be determined from the slope of the unloading curve in stress-strain data.
e) If necessary, repeat b) to d) several times for a prescribed increment of strain to
investigate the modulus change for a test piece.
f) The measured load and displacement are converted into stress and strain using Equations
(1) and (2). The elastic modulus and yield strength is determined using a procedure
described in Clause 4.
5.4 Test environment
It is recommended to perform a test under constant temperature and humidity. Temperature
change can induce thermal drift of highly sensitive sensors for force and displacement, and
should be less than 2 ºC. It is often necessary to check temperature change or thermal drift
before and after the test. The relative humidity change during the test is suggested to be less
than 2 percentage point.
6 Test report
The test report shall contain at least the following information:
a) Reference to this international standard;

62047-10  IEC:2011 – 9 –
b) Identification number of the test piece;
c) Fabrication procedures of the test piece ;
d) Test piece material:
– in case of single crystal: crystallographic orientation,
– in case of poly crystal: texture and grain sizes,
e) Test piece dimension and its measurement method;
f) Description of testing apparatus;
g) Measured properties and results: elastic modulus, yield strength and stress-strain curve.

– 10 – 62047-10  IEC:2011
Annex A
(informative)
Error estimation using finite element method

A.1 Sources of errors
The test results can be affected by thermal drift of force and displacement sensors,
misalignment, the geometry of the pillar, and the frictional contact.
A.2 Finite element model
The finite element analysis is performed using a commercial code, ABAQUS. The elements
are a 2-dimensional, axisymmetric, and 2nd order element with reduced integration. The
isotropic elasticity and incremental plasticity law based on experimentally measured stress-
strain curve of SU-8 (a thermosetting polymer for photo resist) is adopted as a constitutive
relation. The implicit solver with geometric nonlinearity option is utilized for the whole
simulation. The fixed boundary condition is applied to the bottom surface of the pillar and the
frictional contact with the punch is taken into account for the top surface of the pillar. Based
on the simulation result for the convergence test, the proper finite element mesh is chosen,
which yields a numerical solution with high accuracy better than 0,1 %.
A.3 Analysis results
The finite element analysis produces the displacement of the rigid punch and the
corresponding force. The displacement and force are converted into strain and stress using
the Equation (1) and (2) of 5.1, and the elastic modulus is estimated from these stress-strain
data. The estimated modulus is a little different from the modulus used in finite element
analysis as shown in Figure A.1. The error in elastic modulus is about 1 % for the pillar with
the aspect ratio of 4. The error decreases with the decrease of the friction coefficient.

3,0
...