IEC 61000-4-36:2014

Electromagnetic compatibility (EMC) - Part 4-36: Testing and measurement techniques - IEMI immunity test methods for equipment and systems

IEC 61000-4-36:2014(E) provides methods to determine test levels for the assessment of the immunity of equipment and systems to intentional electromagnetic interference (IEMI) sources. It introduces the general IEMI problem, IEMI source parameters, derivation of test limits and summarises practical test methods. Keywords: EMC, electromagnetic compatibility

General Information

• Status: Published
• Publication Date: 06-Nov-2014
• ICS: 29.100.10 - Magnetic components
• ICS: 29.180 - Transformers. Reactors
• ICS: 33.100.20 - Immunity
• Technical Committee: SC 77C - High power transient phenomena
• Current Stage: DELPUB - Deleted Publication
• Completion Date: 23-Mar-2020

Relations

• Revised: IEC 61000-4-36:2020 - Electromagnetic compatibility (EMC) - Part 4-36: Testing and measurement techniques - IEMI immunity test methods for equipment and systems
• Effective Date: 05-Sep-2023

Standards Content (Sample)

IEC 61000-4-36


®


Edition 1.0 2014-11



INTERNATIONAL



STANDARD




colour
inside
BASIC EMC PUBLICATION
Electromagnetic compatibility (EMC) –
Part 4-36: Testing and measurement techniques – IEMI immunity test methods
for equipment and systems

IEC 61000-4-36:2014-11(en)

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IEC 61000-4-36



®



Edition 1.0 2014-11







INTERNATIONAL





STANDARD











colour

inside



BASIC EMC PUBLICATION






Electromagnetic compatibility (EMC) –

Part 4-36: Testing and measurement techniques – IEMI immunity test methods

for equipment and systems



























INTERNATIONAL

ELECTROTECHNICAL

COMMISSION

PRICE CODE
XC




ICS 33.100.20 ISBN 978-2-8322-1904-1



  Warning! Make sure that you obtained this publication from an authorized distributor.


® Registered trademark of the International Electrotechnical Commission

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CONTENTS



FOREWORD . 6

INTRODUCTION . 8

1 Scope . 9


2 Normative references . 9

3 Terms, definitions and abbreviations . 9

3.1 Terms and defintions . 9

3.2 Abbreviations . 12
4 General . 13
5 IEMI environments and interaction . 13
5.1 General . 13
5.2 IEMI environments . 14
5.2.1 Technical capability groups . 14
5.2.2 IEMI deployment scenarios . 14
5.2.3 Radiated IEMI environment summary . 15
5.2.4 Published conducted IEMI environments. 15
5.3 Interaction with fixed installations . 16
5.3.1 General . 16
5.3.2 Protection level . 17
6 Test methods . 17
6.1 Derivation of applicable test methods . 17
6.2 Derivation of transfer functions . 18
6.3 Radiated tests using IEMI simulator . 19
6.4 Radiated tests using a reverberation chamber . 19
6.5 Complex waveform injection (CWI) . 19
6.6 Damped sinusoidal injection (DSI) . 19
6.7 Electrostatic discharge (ESD) . 19
6.8 Electrically fast transient (EFT) . 19
6.9 Antenna port injection . 20
7 Test parameters . 20
7.1 Derivation of immunity test parameters . 20
7.2 Radiated test parameters . 21
7.2.1 Generic hyperband test parameters (skilled capability group) . 21
7.2.2 Generic mesoband test parameters (skilled capability group). 21
7.2.3 Generic hypoband/narrowband test parameters (skilled capability
group) . 23
7.3 Generic conducted IEMI test parameters. 24
7.3.1 General . 24
7.3.2 Characteristics and performance of the fast damped oscillatory wave
generator . 25
7.4 Tailored test level derivation . 26
7.5 Relevance of EMC immunity data . 26
8 Bibliography . 27
Annex A (informative) Failure mechanisms and performance criteria . 29
A.1 General . 29
A.2 Failure mechanisms . 29
A.2.1 General . 29

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IEC 61000-4-36:2014 © IEC 2014 – 3 –


A.2.2 Noise . 30

A.2.3 Parameter offset and drifts . 30

A.2.4 System upset or breakdown . 31

A.2.5 Component destruction . 31

A.3 Effect of pulse width. 32

A.4 Performance criteria . 32

A.5 References . 33

Annex B (informative) Developments in IEMI source environments . 35

B.1 General . 35


B.2 IEMI environment . 36
B.3 IEMI sources . 37
B.4 Published radiated IEMI environments . 41
B.4.1 IEC 61000-2-13 . 41
B.4.2 Mil-Std-464C . 41
B.4.3 The International Telecommunication Union (ITU) . 42
B.4.4 Practical determination of a tailored test level – An example. 42
B.5 Summary . 43
B.6 References . 44
Annex C (informative) Interaction with buildings . 46
C.1 Building attenuation . 46
C.2 Coupling to cables . 47
C.3 Low voltage cable attenuation . 48
C.4 References . 49
Annex D (informative) Relation between plane wave immunity testing and immunity
testing in a reverberation chamber . 51
D.1 General . 51
D.2 Relation between measurements of shielding effectiveness in the two
environments . 52
D.3 Relation between immunity testing in the two environments . 55
D.4 Additional aspects . 57
D.5 References . 57
Annex E (informative) Complex waveform injection – Test method . 60
E.1 General . 60
E.2 Prediction . 60
E.2.1 General . 60

E.2.2 Example . 64
E.3 Construction . 66
E.4 Injection . 70
E.5 Summary . 72
E.6 References . 72
Annex F (informative) Significance of test methodology margins . 74
F.1 General . 74
F.2 Examples . 74
F.2.1 General . 74
F.2.2 Negative contributions . 75
F.2.3 Positive contributions. 77
F.2.4 Summary . 79
F.3 References . 79
Annex G (informative) Intentional EMI – The issue of jammers . 80

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G.1 General . 80

G.2 Effects . 80

G.3 Published accounts of jamming . 81

G.4 Risk assessment . 81

G.5 Mitigation . 81

G.6 References . 82



Figure 1 – Example of radiated and conducted IEMI interaction with a building . 16


Figure 2 – Assessment options . 18

Figure 3 – Examples of ports . 20
Figure 4 – Typical hyperband waveform . 21
Figure 5 – Typical mesoband waveform . 23
Figure 6 – Typical hypoband/narrowband waveform . 24
Figure 7 – Waveform of the damped oscillatory wave (open circuit voltage) . 25
Figure A.1 – IEMI induced offset of sensor output – Corruption of information . 30
Figure A.2 – Collision of an induced disturbance with data bits [1] . 31
Figure A.3 – Examples of destruction on a chip [2] . 31
Figure A.4 – Generic failure trend as a function of pulse width . 32
Figure B.1 – A comparison of HPEM and IEMI spectra [6] . 35
Figure B.2 – Representation of typical IEMI radiation and coupling onto systems [3] . 37
Figure B.3 – Parameter space in power/frequency occupied by sophisticated IEMI (i.e.
DEW) sources [1] . 38
Figure B.4 – Peak power and energy from continuous and pulsed (durations shown)
microwave sources, narrowband and wideband . 38
Figure B.5 – Peak powers of various types of pulsed HPM sources [1]. 39
Figure B.6 – Peak vs. average power for microwave sources with duty factors
indicated . 39
2
Figure B.7 – Phase coherence leading to a compact HPM source with N scaling of
output power . 40
Figure B.8 – Briefcase mesoband UWB source sold by Diehl-Rheinmetall [3] . 40
Figure B.9 – A do-it-yourself electromagnetic weapon made from an oven magnetron
[13] . 41
Figure B.10 – Plot of entire narrowband system weight as a function of output

microwave power for land-mobile and land-transportable systems . 43
Figure C.1 – Typical unprotected low-rise building plane wave E-field attenuation
collected from references . 46
Figure C.2 – Cable coupling – Resonance region . 48
Figure C.3 – Mains cable attenuation profile . 49
Figure E.1 – LLSC reference field measurement set-up . 61
Figure E.2 – LLSC induced current measurement set-up . 62
Figure E.3 – Typical LLSC magnitude-only transfer function . 62
Figure E.4 – Prediction of induced current using minimum phase constraints . 63
Figure E.5 – IEC 61000-2-9 early-time (E1) HEMP environment . 64
Figure E.6 – Overlay of transfer function and threat (frequency domain) . 65
Figure E.7 – Predicted current . 65
Figure E.8 – Example of de-convolution result . 67

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IEC 61000-4-36:2014 © IEC 2014 – 5 –


Figure E.9 – Damped sinusoidal waveforms – Ten-component fit . 67

Figure E.10 – Approximated and predicted transient . 68


Figure E.11 – Approximated and predicted transient (0 ns to 100 ns) . 68

Figure E.12 – Approximation and prediction transient – Frequency domain comparison . 69

Figure E.13 – Variation in error for increasing number of damped sinusoids . 70


Figure E.14 – Complex injection set-up . 71

Figure E.15 – Amplifier requirements for various current levels . 71

Figure E.16 – Comparison of predicted (green) and injected (red) current . 72


Figure F.1 – Variation in induced currents as a result of configuration . 75
Figure F.2 – Comparison of HPD and VPD induced currents . 76
Figure F.3 – System variability . 76
Figure F.4 – Comparison of single- and multi-port injection . 77
Figure F.5 – Example transfer functions and worst-case envelope . 78
Figure F.6 – Comparison of individual and worst-case transfer function predictions . 78
Figure F.7 – Comparison between predicted and measured induced currents . 79

Table 1 – Possible IEMI Deployment Scenarios . 15
Table 2 – Summary of radiated IEMI source output (rE ) by capability group . 15
far
Table 3 – Example protection levels . 17
Table 4 – Generic hyperband test parameters (skilled capability group) . 21
Table 5 – Generic mesoband test parameters (skilled capability group) . 22
Table 6 – Generic hypoband/narrowband test parameters (skilled capability group) . 23
Table 7 – Conducted IEMI test levels . 24
Table 8 – Open circuit specifications . 25
Table 9 – Short Circuit Specifications . 26
Table A.1 – Recommended performance criteria . 33
Table B.1 – IEMI environments from IEC 61000-2-13 . 41
Table B.2 – Hypoband/narrowband HPM environment. 42
Table B.3 – Hyperband/wideband HPM environment . 42
Table C.1 – Shielding effectiveness measurements for various power system buildings
and rooms. 47

Table E.1 – Time waveform norms . 66

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INTERNATIONAL ELECTROTECHNICAL COMMISSION

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ELECTROMAGNETIC COMPATIBILITY (EMC) –



Part 4-36: Testing and measurement techniques –

IEMI immunity test methods for equipment and systems



FOREWORD
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International Standard IEC 61000-4-36 has been prepared by subcommittee 77C: High-power
transient phenomena, of IEC technical committee 77: Electromagnetic compatibility.
It forms part 4-36 of IEC 61000. It has the status of a basic EMC publication in accordance
with IEC Guide 107.
The text of this standard is based on the following documents:
CDV Report on voting
77C/231/CDV 77C/236/RVC

Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.

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IEC 61000-4-36:2014 © IEC 2014 – 7 –


This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.


A list of all parts in the IEC 61000 series, published under the general title Electromagnetic

compatibility (EMC), can be found on the IEC website.


The committee has decided that the contents of this publication will remain unchanged until

the stability date indicated on the IEC website under "http://webstore.iec.ch" in the data

related to the specific publication. At this date, the publication will be


• reconfirmed,

• withdrawn,

• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.

IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
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understanding of its contents. Users should therefore print this document using a
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INTRODUCTION


IEC 61000 is published in separate parts according to the following structure:


Part 1: General


General considerations (introduction, fundamental principles)


Definitions, terminology


Part 2: Environment
Description of the environment
Classification of the environment
Compatibility levels
Part 3: Limits
Emission limits
Immunity limits (in so far as they do not fall under the responsibility of the product
committees)
Part 4: Testing and measurement techniques
Measurement techniques
Test
...