IEC PAS 60191-6-19:2008

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage

This PAS stipulates the package warpage criteria and the package warpage measurement methods at elevated temperature for BGA, FBGA, and FLGA.

General Information

• Status: Replaced
• Publication Date: 21-Jan-2008
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: SC 47D - Semiconductor devices packaging
• Drafting Committee: WG 2 - TC 47/SC 47D/WG 2
• Current Stage: DELPUB - Deleted Publication
• Completion Date: 25-Feb-2010

Relations

• Replaced By: IEC 60191-6-19:2010 - Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
• Effective Date: 05-Sep-2023

Standards Content (Sample)

IEC/PAS 60191-6-19
Edition 1.0 2008-01
PUBLICLY AVAILABLE
SPECIFICATION
PRE-STANDARD
Mechanical standardization of semiconductor devices –
Part 6-19: Measurement methods of package warpage at elevated temperature
and the maximum permissible warpage

IEC/PAS 60191-6-19:2008(E)
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IEC/PAS 60191-6-19
Edition 1.0 2008-01
PUBLICLY AVAILABLE
SPECIFICATION
PRE-STANDARD
Mechanical standardization of semiconductor devices –
Part 6-19: Measurement methods of package warpage at elevated temperature
and the maximum permissible warpage

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
PRICE CODE
S
ICS : 31.080.01 ISBN 2-8318-9527-8

– 2 – PAS 60191-6-19 © IEC:2008(E)

CONTENTS
FOREWORD.3

1 Scope.5

2 Normative references .5

3 Terms and definitions .5

4 Sample.9

4.1 Sample size .9

4.2 Solder ball removal .9

4.3 Pre-treatment conditions .9
4.4 Maximum time after pretreatment until measurement.9
4.5 Repetition of the reflow cycles for the sample.9
5 Measurement .9
5.1 General description .9
5.2 Temperature profile and the temperatures for measurements .9
5.3 Measurement method.10
6 Maximum permissible package warpage at elevated temperature .11
7 Recommended datasheet for the package warpage.11
7.1 Measurement temperatures for data sheet .11
7.2 Data sheet.11
7.3 Example of data sheets .12

Annex A (informative) Explanatory notes .14
Bibliography.22

Figure 1 – Measuring zone of BGA and FBGA in full grid layout.6
Figure 2 – Measuring zone of BGA and FBGA perimeter layout with 4 rows and 4
columns .6
Figure 3 – Measuring zone of FLGA perimeter layout with 4 rows and 4 columns.7
Figure 4 – Calculation of the sign of package warpage .8
Figure 5 – Package warpage .8
Figure 6 – Thermocouple placement .10
Figure 7 – Temperature dependency of the package warpage .12

Figure 8 – Recommended data sheet.13
Figure A.1 – Calculation of maximum relative displacement immmune from open solder
joints.16
Figure A.2 – Calculation of maximum relative displacement immmune from solder ball
bridges .17
Figure A.3 – Package warpage of FLGA at elevated temperature.19

Table 1 – Maximum permissible package warpages for BGA and FBGA.11
Table 2 – Maximum permissible package warpages for FLGA.11
Table A.1 – Maximum permissible package warpage for BGA and FBGA – Explanatory
table .18
Table A.2 – Maximum permissible package warpage for FLGA – Explanatory table .19
Table A.3 – Comparison between JESD22B112 and IEC/JEITA PAS 60191-6-19 .20

PAS 60191-6-19 © IEC:2008(E) – 3 –

INTERNATIONAL ELECTROTECHNICAL COMMISSION

____________
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES –

Part 6-19: Measurement methods of package warpage at elevated

temperature and the maximum permissible warpage

FOREWORD
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A PAS is a technical specification not fulfilling the requirements for a standard but made
available to the public.
IEC-PAS 60191-6-19 was submitted by the JEITA (Japan Electronics and Information
Technology Industries Association) and has been processed by IEC subcommittee SC47D:
Mechanical standardization for semiconductor devices.
The text of this PAS is based on This PAS was approved for
the following documents publication by the P-members of the
committee concerned as indicated in
the following document:
Draft PAS Report on voting
47D/691/NP 47D/707/RVN
Following publication of this PAS, which is a pre-standard publication, the technical committee
or subcommittee concerned will transform it into an International Standard.

– 4 – PAS 60191-6-19 © IEC:2008(E)

This PAS shall remain valid for an initial maximum period of three years starting from the

publication date. The validity may be extended for a single three-year period, following which

it shall be revised to become another type of normative document or shall be withdrawn.

PAS 60191-6-19 © IEC:2008(E) – 5 –

MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES –

Part 6-19: Measurement methods of package warpage at elevated

temperature and the maximum permissible warpage

1 Scope
This PAS stipulates the package warpage criteria and the package warpage measurement

methods at elevated temperature for BGA, FBGA, and FLGA

2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document applies.
JEITA EDR-4701/301, Resistance to soldering heat for surface mounting devices (SMD)

3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
3.1
measuring zone
area to be measured to determine the package warpage
NOTE 1 For the packages whose stand-off height is more than 0,1 mm, such as BGA and FBGA, the measuring
zone is the area where terminals are located. This area is bordered by the lines connecting the centers of the
outermost neighboring solder balls (see Figure 1 and Figure 2). If there are thermal balls at the package centre,
their area is also considered as a part of the measuring zone
NOTE 2 For the packages whose stand-off height is 0,1 mm or less, such as FLGA, the measuring area is the
substrate surface except certain edge margin (see Figure 3, dimension L). The width of this margin L depends on
the capability of each measuring instrument (0,2 mm recommended).

– 6 – PAS 60191-6-19 © IEC:2008(E)

NOTE The hatched area indicates the measuring zone.
Figure 1 – Measuring zone of BGA and FBGA in full grid layout

Figure 2 – Measuring zone of BGA and FBGA perimeter layout
with 4 rows and 4 columns
PAS 60191-6-19 © IEC:2008(E) – 7 –

NOTE The edge margin L indicates the exempt area from measurement to avoid measurement noise depending
on the instrument capability. Recommended edge margin L = 0,2 mm.
Figure 3 – Measuring zone of FLGA perimeter layout with 4 rows and 4 columns
3.2
convex warpage
arched top surface (not interconnect side) of package being mounted on PWB
NOTE The sign of the convex warpage is defined as plus.
3.3
...