IEC PAS 60191-6-18:2008

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

This PAS provides common outline drawings and dimensions for all types of structures and composed materials of ball grid array (hereinafter called BGA), whose terminal pitch is one millimetre or larger and whose package body outline is square.

General Information

• Status: Replaced
• Publication Date: 21-Jan-2008
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: SC 47D - Semiconductor devices packaging
• Drafting Committee: WG 2 - TC 47/SC 47D/WG 2
• Current Stage: DELPUB - Deleted Publication
• Completion Date: 07-Jan-2010

Relations

• Replaced By: IEC 60191-6-18:2010 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
• Effective Date: 05-Sep-2023
• Corrected By: IEC 60191-6-18:2010/COR1:2010 - Corrigendum 1 - Mechanical stardardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
• Effective Date: 05-Sep-2023
• Corrected By: IEC 60191-6-18:2010/COR2:2010 - Corrigendum 2 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
• Effective Date: 05-Sep-2023

Standards Content (Sample)

IEC/PAS 60191-6-18
Edition 1.0 2008-01
PUBLICLY AVAILABLE
SPECIFICATION
PRE-STANDARD
Mechanical standardization of semiconductor devices –
Part 6-18: General rules for the preparation of outline drawings of surface
mounted semiconductor device packages – Design guide for ball grid array
(BGA)
IEC/PAS 60191-6-18:2008(E)
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IEC/PAS 60191-6-18
Edition 1.0 2008-01
PUBLICLY AVAILABLE
SPECIFICATION
PRE-STANDARD
Mechanical standardization of semiconductor devices –
Part 6-18: General rules for the preparation of outline drawings of surface
mounted semiconductor device packages – Design guide for ball grid array
(BGA)
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
PRICE CODE
R
ICS: 31.080.01 ISBN 2-8318-9526-X

– 2 – PAS 60191-6-18 © IEC:2008(E)

CONTENTS
FOREWORD.3

1 Scope.5

2 Normative references .5

3 Terms and definitions .5

4 Terminal position numbering.6

5 Nominal package dimension .6
6 Symbols and drawings.7
6.1 BGA outline.7
7 Dimensions .10
7.1 Group 1.10
7.2 Group 2.13
8 Recommended BGA variations .15
Figure 1 – Cavity down type.7
Figure 2 – Cavity up type .8
Figure 3 – Pattern of terminal position areas.9
Figure 4 – Example of terminal de-populations .14

Table 1 – Group 1: Dimensions appropriate to mounting and interchangeability.10
Table 2 – Group 2: Dimensions appropriate to mounting and gauging.13
Table 3 – Combinations of D, E, e, M , M , and n .13
D E
Table 4 – P-BGA (Cavity up) 1.27mm pitch.15
Table 5 – P-BGA (Cavity up) 1,0 mm pitch.16
Table 6 – P-BGA (Cavity down) 1,27 mm pitch.17
Table 7 – T-BGA 1,27 mm pitch .17
Table 8 – T-BGA 1,0 mm pitch .17
Table 9 – P-BGA and C-BGA (Flip-chip interconnection) 1,0 mm pitch.18

PAS 60191-6-18 © IEC:2008(E) – 3 –

INTERNATIONAL ELECTROTECHNICAL COMMISSION

____________
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES –

Part 6-18: General rules for the preparation of outline drawings of surface

mounted semiconductor device packages –

Design guide for ball grid array (BGA)

FOREWORD
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international co-operation on all questions concerning standardization in the electrical and electronic fields. To
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.

A PAS is a technical specification not fulfilling the requirements for a standard but made
available to the public.
IEC-PAS 60191-6-18 was submitted by the JEITA (Japan Electronics and Information
Technology Industries Association) and has been processed by IEC subcommittee 47D:
Mechanical standardization for semiconductor devices, of IEC technical committee 47:
Semiconductor devices.
The text of this PAS is based on This PAS was approved for
the following documents publication by the P-members of the
committee concerned as indicated in
the following document:
Draft PAS Report on voting
47D/677/NP 47D/701/RVN
– 4 – PAS 60191-6-18 © IEC:2008(E)

Following publication of this PAS, which is a pre-standard publication, the technical committee
or subcommittee concerned will transform it into an International Standard.

This PAS shall remain valid for an initial maximum period of three years starting from the
publication date. The validity may be extended for a single three-year period, following which

it shall be revised to become another type of normative document or shall be withdrawn.

PAS 60191-6-18 © IEC:2008(E) – 5 –

MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES –

Part 6-18: General rules for the preparation of outline drawings of surface

mounted semiconductor device packages –

Design guide for ball grid array (BGA)

1 Scope
This PAS provides common outline drawings and dimensions for all types of structures and
composed materials of ball grid array (hereinafter called BGA), whose terminal pitch is one
millimetre or larger and whose package body outline is square.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
None.
3 Terms and definitions
For the purpose of this document, the following terms and definitions apply.
3.1
ball grid array
BGA
low-profile package whose terminals are metal balls located on one surface in a matrix of at
least three rows and three columns; terminals may be missing from some row-column
intersections
NOTE BGA stands for “Ball Grid Array” in this standard to be aligned with IEC 60191-6-2, 60191-6-4, and 60191-
6-5. Only IEC 60191-4 refers BGA as “Bottom Grid Array”, and it is not common language in the industry and no
other standard uses this name.
3.2
plastic ball grid array
P-BGA
BGA whose substrate is made of organic printed wiring board
3.3
tape ball grid array
T-BGA
BGA whose substrate is made of polyimide tape
3.4
ceramic ball grid array
C-BGA
BGA whose substrate is made of ceramic circuit board
3.5
P-BGA (flip chip interconnection)
BGA whose substrate is made of organic printed wiring board and is connected to the die by
the bumps on the die
– 6 – PAS 60191-6-18 © IEC:2008(E)

3.6
Recommended BGA variations
BGA variations that shall be considered to be the first choice for production

Package variations other than recommended BGA variations are not recommended to prevent

the endless proliferation of the BGA variations.

4 Terminal position numbering
When a package is viewed from the terminal side with the index corner in the bottom left

corner position, terminal rows are lettered from bottom to top starting with A, then B, C,,,, AA,

AB, etc., while terminal columns are numbered from left to right starting with 1. Terminal
positions are designated by a row-column grid system and shown as alphanumeric
identification, e.g., A1, B1, or AC34. The letters I, O, Q, S, X and Z are not used for naming
the terminal rows.
5 Nominal package dimension
A nominal package dimension is defined as “the package width (E) X length (D)”, which is
expressed to the tenth place, in millimetres.

PAS 60191-6-18 © IEC:2008(E) – 7 –

6 Symbols and drawings
6.1 BGA outline
E
w
S B
( )
( )
( )
×4
v
( )
S
y
S
( )
B
( )
( )
S Z
e E
E
M
D
( )
E
D
C
B
A
M
6 E
1 2 3 4 5
( )
φ b
( )
φ X M S AB
Figure 1 – Cavity down type
10 ( )
A
( )
( )
Z
D 8
e
D
S ( )
A
D
w S A
( )
A
A
– 8 – PAS 60191-6-18 © IEC:2008(E)

E
w
S B
( )
( )
×4
v
y
( ) 1
S
S
y
S
( )
B
( ) 10
( )
S Z
e E
E
M
D
E
D
C
B
A
M
E
1 2 3 4 5
( )
φ b
( )
φ X M S AB
Figure 2 – Cavity up type
10 8
( )
( ) ( )
A
Z D
D 1
e
S
D
11 w S A
( )
A
A
PAS 60191-6-18 © IEC:2008(E) – 9 –

NOTE 1 Datum S is defined as the seating plane on which a package free stands by contact of the balls.

NOTE 2 The distance between the
...