IEC TS 62239:2008

Process management for avionics - Preparation of an electronic components management plan

IEC/TS 62239:2008(E) defines the requirements for developing an Electronic Components Management Plan (ECMP) to assure customers and regulatory agencies that all of the electronic components in the equipment of the plan owner are selected and applied in controlled processes compatible with the end application and that the technical requirements detailed in Clause 4 are accomplished. In general, the owners of a complete electronic components management plan are avionics equipment manufacturers. This new edition refers to publications that were recently issued.

General Information

• Status: Replaced
• Publication Date: 20-Oct-2008
• ICS: 03.100.50 - Production. Production management
• ICS: 31.020 - Electronic components in general
• ICS: 49.060 - Aerospace electric equipment and systems
• Technical Committee: TC 107 - Process management for avionics
• Current Stage: DELPUB - Deleted Publication
• Completion Date: 12-Jul-2012

Relations

• Replaced By: IEC TS 62239-1:2012 - Process management for avionics - Management plan - Part 1: Preparation and maintenance of an electronic components management plan
• Effective Date: 05-Sep-2023
• Revises: IEC TS 62239:2003 - Process management for avionics - Preparation of an electronic components management plan
• Effective Date: 05-Sep-2023

Standards Content (Sample)

IEC/TS 62239
Edition 2.0 2008-10
TECHNICAL
SPECIFICATION
Process management for avionics – Preparation of an electronic components
management plan
IEC/TS 62239:2008(E)
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IEC/TS 62239
Edition 2.0 2008-10
TECHNICAL
SPECIFICATION
Process management for avionics – Preparation of an electronic components
management plan
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
PRICE CODE
T
ICS 03.100.50; 31.020; 49.060 ISBN 978-2-88910-651-6
– 2 – TS 62239 © IEC:2008(E)
CONTENTS
FOREWORD.4
INTRODUCTION.6
1 Scope.7
2 Normative references .7
3 Terms, definitions and abbreviations .8
3.1 Terms and definitions .8
3.2 Abbreviations .11
4 Technical requirements .11
4.1 Component selection.12
4.2 Component application.12
4.2.1 Electromagnetic compatibility (EMC) .13
4.2.2 De-rating and stress analysis .13
4.2.3 Thermal analysis .13
4.2.4 Mechanical analysis .13
4.2.5 Testing, testability, and maintainability .14
4.2.6 Avionics radiation environment .14
4.3 Component qualification .14
4.3.1 General component qualification requirements .14
4.3.2 Component manufacturer quality management .14
4.3.3 Component manufacturer process management approval.14
4.3.4 Demonstration of component qualification .15
4.3.5 Qualification of components from a supplier that is not qualified .16
4.3.6 Distributor quality and process management approval .16
4.4 Continuous component quality assurance.16
4.4.1 General quality assurance requirements.16
4.4.2 On-going component quality assurance .17
4.4.3 Plan owner in-house continuous monitoring.17
4.4.4 Component design and manufacturing process change monitoring .17
4.5 Component dependability .18
4.5.1 Reliability assessment .18
4.5.2 Component availability and associated risk assessment .18
4.5.3 Component obsolescence.19
4.6 Component compatibility with the equipment manufacturing process .20
4.7 Component data.20
4.8 Configuration control .21
4.8.1 Alternative sources.21
4.8.2 Equipment change documentation .21
4.8.3 Customer notifications and approvals .22
4.8.4 Focal organisation .22
5 Plan administration requirements .22
5.1 Using components outside the manufacturer’s specified temperature range .22
5.2 Plan organization .22
5.3 Plan terms and definitions .23
5.4 Plan focal point .23
5.5 Plan references .23
5.6 Plan applicability .23

TS 62239 © IEC:2008(E) – 3 –
5.7 Plan implementation.23
5.8 Plan acceptance.23
Bibliography.24

– 4 – TS 62239 © IEC:2008(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PROCESS MANAGEMENT FOR AVIONICS –

Preparation of an electronic components management plan

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
The main task of IEC technical committees is to prepare International Standards. In
exceptional circumstances, a technical committee may propose the publication of a technical
specification when
• the required support cannot be obtained for the publication of an International Standard,
despite repeated efforts, or
• The subject is still under technical development or where, for any other reason, there is
the future but no immediate possibility of an agreement on an International Standard.
Technical specifications are subject to review within three years of publication to decide
whether they can be transformed into International Standards.
IEC/TS 62239, which is a technical specification, has been prepared by IEC Technical
Committee 107: Process management for avionics.

TS 62239 © IEC:2008(E) – 5 –
This second edition cancels and replaces the first edition published in 2003. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
1) 4.2.2 – Derating and stress analysis, addition of JEP149.
2) 4.2.3 – Derating and stress analysis, thermal analysis allowed using provisions of
JEP149.
3) 4.3.4.2.1 – Component manufacturing technology qualification data, added JESD47,
JESD94, AEC-Q100, AEC-Q101, and AEC-Q200.
4) 4.3.4.2.1.1- Added avionics qualified electronic component program.
5) 4.5 – Component dependability, added integrated circuit wear out criteria from JESD47.
6) 4.8 – Configuration control, added counterfeit parts requirement.
The text of this technical specification is based on the following documents:
Enquiry draft Report on voting
107/60/DTS 107/78A/RVC
Full information on the voting for the approval of this technical specification can be found in
the report on voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in
the data related to the specific publication. At this date, the publication will be
• transformed into an International standard,
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this technical specification may be issued at a later date.

– 6 – TS 62239 © IEC:2008(E)
INTRODUCTION
This Technical Specification is intended to help aerospace equipment manufacturers,
subcontractors, maintenance facilities, and other aerospace component users develop the
...