Semiconductor devices - Part 17: Magnetic and capacitive coupler for basic and reinforced insulation

IEC 60747-17:2020 specifies the terminology, essential ratings, characteristics, safety test and the measuring methods of magnetic coupler and capacitive coupler.
It specifies the principles and requirements of insulation and isolation characteristics for magnetic and capacitive couplers for basic insulation and reinforced insulation.
This first edition cancels and replaces IEC PAS 60747-17:2011. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to IEC PAS 60747-17:2011:
a) introduced lifetime safety factors for improved life time consideration, to comply with widely recognized aging mechanisms of silicone dioxide (TDDB) and thin film polymer isolation layers;
b) significantly improved "end of life testing" paragraph and statistical life time consideration by adding detailed description on process, safety factors, methods of generating data points and respective lifetime interpolations as well as being specific on minimum amount of samples required;
c) introduced concept of certification by similarity, including Annex A, giving guidance on qualification considerations and required certification process;
d) alternative pulse shape allowed for surge pulse testing, to avoid issues due to surge tester availability;
e) various improvements throughout the standard: definitions, for example type of coupler have been improved, introduction of surge impulse VIMP rating, usage of glass transition temperature, pre-conditioning have been redefined for improved usability and better compatibility with today’s design and functionality of couplers, available mold compounds, etc.
The contents of the corrigendum of January 2021 have been included in this copy.

Dispositifs à semiconducteurs - Partie 17 : Coupleur magnétique et capacitif pour l’isolation principale et renforcée

L'IEC 60747-17:2020 spécifie la terminologie, les valeurs assignées essentielles, les caractéristiques, l’essai de sécurité et les méthodes de mesure des coupleurs magnétiques et des coupleurs capacitifs.
Elle spécifie les principes et exigences de l’isolation et les caractéristiques d’isolement des coupleurs magnétiques et capacitifs pour l’isolation principale et l’isolation renforcée.
Cette première édition annule et remplace l’IEC PAS 60747-17:2011. Cette édition constitue une révision technique.
Cette édition inclut les modifications techniques majeures suivantes par rapport à l’IEC PAS 60747‑17:2011:
a) introduction des facteurs de sécurité de durée de vie pour la prise en considération de la durée de vie améliorée, conformément aux mécanismes de vieillissement du dioxyde de silicium (TDDB) largement reconnus, et couches d’isolement en polymère à couches minces;
b) prise en considération de l’alinéa et de la durée de vie statistique de l’"essai de fin de vie" considérablement améliorée par l’ajout d’une description détaillée du processus, des facteurs de sécurité, des méthodes de génération de points de données et des interpolations de la durée de vie respective, ainsi que par la spécification de la quantité minimale d'échantillons exigés;
c) introduction du concept de certification par similarité, comprenant l’Annexe A, qui donne des recommandations relatives aux considérations de qualification et au processus de certification exigé;
d) forme d'impulsion alternative admise pour l’essai d’impulsion de choc afin d'éviter les problèmes de disponibilité de l’appareil d’essai aux ondes de choc;
e) plusieurs améliorations tout au long de la norme: amélioration des définitions, par exemple des types de coupleurs; introduction de la valeur assignée de l’impulsion de choc VIMP, utilisation d’une température de transition vitreuse, redéfinition du préconditionnement pour une utilisation améliorée et une meilleure compatibilité avec la conception et les fonctionnalités actuelles des coupleurs, les composants moulés disponibles, etc.
Le contenu du corrigendum de janvier 2021 a été pris en considération dans cet exemplaire.

General Information

Status
Published
Publication Date
20-Sep-2020
Current Stage
PPUB - Publication issued
Completion Date
21-Sep-2020
Ref Project

Buy Standard

Standard
IEC 60747-17:2020 - Semiconductor devices - Part 17: Magnetic and capacitive coupler for basic and reinforced insulation
English language
51 pages
sale 15% off
Preview
sale 15% off
Preview
Standard
IEC 60747-17:2020 - Semiconductor devices - Part 17: Magnetic and capacitive coupler for basic and reinforced insulation
English and French language
104 pages
sale 15% off
Preview
sale 15% off
Preview

Standards Content (sample)

IEC 60747-17
Edition 1.0 2020-09
INTERNATIONAL
STANDARD
Semiconductor devices –
Part 17: Magnetic and capacitive coupler for basic and reinforced insulation
IEC 60747-17:2020-09(en)
---------------------- Page: 1 ----------------------
THIS PUBLICATION IS COPYRIGHT PROTECTED
Copyright © 2020 IEC, Geneva, Switzerland

All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form

or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from

either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC

copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or

your local IEC member National Committee for further information.
IEC Central Office Tel.: +41 22 919 02 11
3, rue de Varembé info@iec.ch
CH-1211 Geneva 20 www.iec.ch
Switzerland
About the IEC

The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes

International Standards for all electrical, electronic and related technologies.
About IEC publications

The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the

latest edition, a corrigendum or an amendment might have been published.

IEC publications search - webstore.iec.ch/advsearchform Electropedia - www.electropedia.org

The advanced search enables to find IEC publications by a The world's leading online dictionary on electrotechnology,

variety of criteria (reference number, text, technical containing more than 22 000 terminological entries in English

committee,…). It also gives information on projects, replaced and French, with equivalent terms in 16 additional languages.

and withdrawn publications. Also known as the International Electrotechnical Vocabulary

(IEV) online.
IEC Just Published - webstore.iec.ch/justpublished

Stay up to date on all new IEC publications. Just Published IEC Glossary - std.iec.ch/glossary

details all new publications released. Available online and 67 000 electrotechnical terminology entries in English and

once a month by email. French extracted from the Terms and Definitions clause of

IEC publications issued since 2002. Some entries have been

IEC Customer Service Centre - webstore.iec.ch/csc collected from earlier publications of IEC TC 37, 77, 86 and

If you wish to give us your feedback on this publication or CISPR.
need further assistance, please contact the Customer Service
Centre: sales@iec.ch.
---------------------- Page: 2 ----------------------
IEC 60747-17
Edition 1.0 2020-09
INTERNATIONAL
STANDARD
Semiconductor devices –
Part 17: Magnetic and capacitive coupler for basic and reinforced insulation
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.080.99 ISBN 978-2-8322-8801-6

Warning! Make sure that you obtained this publication from an authorized distributor.

® Registered trademark of the International Electrotechnical Commission
---------------------- Page: 3 ----------------------
– 2 – IEC 60747-17:2020 © IEC 2020
CONTENTS

FOREWORD ........................................................................................................................... 5

1 Scope .............................................................................................................................. 7

2 Normative references ...................................................................................................... 7

3 Terms and definitions ...................................................................................................... 8

4 Electrical characteristics – Coupler logic and timing definitions ...................................... 19

5 Coupler for protection against electrical shock ............................................................... 20

5.1 General ................................................................................................................. 20

5.2 Type ..................................................................................................................... 20

5.3 Ratings ................................................................................................................. 20

5.3.1 General ......................................................................................................... 20

5.3.2 Safety limiting values ..................................................................................... 20

5.3.3 Functional ratings .......................................................................................... 20

5.3.4 Rated isolation voltages................................................................................. 20

5.4 Electrical safety requirements ............................................................................... 20

5.5 Electrical, environmental and/or endurance test information .................................. 21

5.5.1 General ......................................................................................................... 21

5.5.2 Routine test ................................................................................................... 23

5.5.3 Sample test ................................................................................................... 23

5.5.4 Maximum surge isolation voltage ................................................................... 23

5.5.5 Type test ....................................................................................................... 24

6 Measuring methods for couplers .................................................................................... 35

6.1 General ................................................................................................................. 35

6.2 Isolation capacitance (C ) ................................................................................... 35

6.2.1 Purpose ......................................................................................................... 35

6.2.2 Circuit diagram .............................................................................................. 35

6.2.3 Measurement procedure ................................................................................ 36

6.2.4 Precautions to be observed ........................................................................... 36

6.2.5 Special conditions ......................................................................................... 36

6.3 Isolation resistance between input and output, R ............................................... 36

6.3.1 Purpose ......................................................................................................... 36

6.3.2 Circuit diagram .............................................................................................. 36

6.3.3 Precautions to be observed ........................................................................... 37

6.3.4 Measurement procedure ................................................................................ 37

6.3.5 Special conditions ......................................................................................... 37

6.4 Isolation test ......................................................................................................... 37

6.4.1 Purpose ......................................................................................................... 37

6.4.2 Circuit diagram .............................................................................................. 37

6.4.3 Test procedure .............................................................................................. 38

6.4.4 Requirements ................................................................................................ 38

6.5 Partial discharges of coupler ................................................................................. 39

6.5.1 Purpose ......................................................................................................... 39

6.5.2 Circuit diagram .............................................................................................. 39

6.5.3 Description of Figure 9 test circuit and requirements ..................................... 39

6.5.4 Test procedure .............................................................................................. 40

6.5.5 Description of calibration circuit (see Figure 10) ............................................ 40

---------------------- Page: 4 ----------------------
IEC 60747-17:2020 © IEC 2020 – 3 –

6.5.6 Test methods ................................................................................................. 41

6.5.7 Specified conditions ....................................................................................... 41

6.5.8 Test voltage conditions .................................................................................. 42

6.6 Switching times of couplers ................................................................................... 42

6.6.1 Purpose ......................................................................................................... 42

6.6.2 Circuit diagram .............................................................................................. 42

6.6.3 Measurement procedure ................................................................................ 43

6.6.4 Specified conditions ....................................................................................... 44

6.7 Measuring methods of common-mode transient immunity (CMTI) for

magnetic and capacitive couplers ......................................................................... 44

6.7.1 Purpose ......................................................................................................... 44

6.7.2 Circuit diagram .............................................................................................. 44

6.7.3 Precautions to be observed ........................................................................... 45

6.7.4 Static CMTI measuring procedure .................................................................. 46

6.7.5 Specified conditions ....................................................................................... 47

6.7.6 Dynamic CMTI measuring procedure ............................................................. 47

Annex A (informative) Qualification guidance ....................................................................... 48

Bibliography .......................................................................................................................... 51

Figure 1 – Time intervals for methods a and b of the test voltage .......................................... 15

Figure 2 –1,2/50 µs surge pulse according 61000-4-5:2014 allowed as equivalent

impulse for isolation testing .................................................................................................. 24

Figure 3 – Determination of time to failure (referring to method in 5.5.5.8) ............................ 31

Figure 4 – Determination of working voltage (referring to method in 5.5.5.8 for

exponential model) ............................................................................................................... 32

Figure 5 – Determination of working voltage (referring to method in 5.5.5.8 for non-

linear model) ......................................................................................................................... 33

Figure 6 – Isolation capacitance measurement circuit ........................................................... 36

Figure 7 – Isolation resistance measurement circuit .............................................................. 37

Figure 8 – Isolation voltage measurement circuit .................................................................. 38

Figure 9 – Partial discharge test circuit ................................................................................. 39

Figure 10 – Connections for the calibration of the complete test arrangement ....................... 40

Figure 11 – Switching time test circuit ................................................................................... 43

Figure 12 – Transition time waveform measurement ............................................................. 43

Figure 13 – Propagation delay time waveform measurement ................................................. 44

Figure 14 – Static versus dynamic data source signal VI ....................................................... 45

Figure 15 – Common-mode transient immunity (CMTI) test setup for both static and

dynamic testing ..................................................................................................................... 45

Figure 16 – Static common-mode transient immunity (CMTI) and V and low to high

data transition waveform ....................................................................................................... 47

Figure A.1 – Lifetime verification ........................................................................................... 49

Table 1 – Overview on characteristics and symbols .............................................................. 19

Table 2 – Datasheet characteristics ...................................................................................... 21

Table 3 – Tests and test sequence for coupler providing basic insulation and reinforced

insulation for protection against electrical shock ................................................................... 22

Table 4 – Test conditions ...................................................................................................... 23

---------------------- Page: 5 ----------------------
– 4 – IEC 60747-17:2020 © IEC 2020

Table 5 – Safety factor F....................................................................................................... 41

Table 6 – Specified conditions for method a and method b.................................................... 42

Table A.1 – Front end process changes within component .................................................... 49

Table A.2 – Front End Process Changes within SiO/SiN/imide-passivation ........................... 50

Table A.3 – Layout changes .................................................................................................. 50

Table A.4 – Backend changes ............................................................................................... 50

---------------------- Page: 6 ----------------------
IEC 60747-17:2020 © IEC 2020 – 5 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
Part 17: Magnetic and capacitive coupler
for basic and reinforced insulation
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote

international co-operation on all questions concerning standardization in the electrical and electronic fields. To

this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,

Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as "IEC

Publication(s)"). Their preparation is entrusted to technical committees; any IEC National Committee interested

in the subject dealt with may participate in this preparatory work. International, governmental and non-

governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely

with the International Organization for Standardization (ISO) in accordance with conditions determined by

agreement between the two organizations.

2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international

consensus of opinion on the relevant subjects since each technical committee has representation from all

interested IEC National Committees.

3) IEC Publications have the form of recommendations for international use and are accepted by IEC National

Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC

Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any

misinterpretation by any end user.

4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications

transparently to the maximum extent possible in their national and regional publications. Any divergence

between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in

the latter.

5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity

assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any

services carried out by independent certification bodies.

6) All users should ensure that they have the latest edition of this publication.

7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and

members of its technical committees and IEC National Committees for any personal injury, property damage or

other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and

expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC

Publications.

8) Attention is drawn to the normative references cited in this publication. Use of the referenced publications is

indispensable for the correct application of this publication.

9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of

patent rights. IEC shall not be held responsible for identifying any or all such patent rights.

International Standard IEC 60747-17 has been prepared by subcommittee SC 47E: Discrete

semiconductor devices, of IEC technical committee TC 47: Semiconductor devices.

This first edition cancels and replaces IEC PAS 60747-17:2011. This edition constitutes a

technical revision.

This edition includes the following significant technical changes with respect to

IEC PAS 60747-17:2011:

a) introduced lifetime safety factors for improved life time consideration, to comply with

widely recognized aging mechanisms of silicone dioxide (TDDB) and thin film polymer

isolation layers;

b) significantly improved "end of life testing" paragraph and statistical life time consideration

by adding detailed description on process, safety factors, methods of generating data

points and respective lifetime interpolations as well as being specific on minimum amount

of samples required;
---------------------- Page: 7 ----------------------
– 6 – IEC 60747-17:2020 © IEC 2020

c) introduced concept of certification by similarity, including Annex A, giving guidance on

qualification considerations and required certification process;

d) alternative pulse shape allowed for surge pulse testing, to avoid issues due to surge tester

availability;

e) various improvements throughout the standard: definitions, for example type of coupler

have been improved, introduction of surge impulse V rating, usage of glass transition

IMP

temperature, pre-conditioning have been redefined for improved usability and better

compatibility with today’s design and functionality of couplers, available mold compounds,

etc.
The text of this International Standard is based on the following documents:
FDIS Report on voting
47E/711/FDIS 47E/715/RVD

Full information on the voting for the approval of this International Standard can be found in

the report on voting indicated in the above table.

This document has been drafted in accordance with the ISO/IEC Directives, Part 2.

A list of all parts in the IEC 60747 series, published under the general title Semiconductor

devices, can be found on the IEC website.

The committee has decided that the contents of this document will remain unchanged until the

stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to

the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
---------------------- Page: 8 ----------------------
IEC 60747-17:2020 © IEC 2020 – 7 –
SEMICONDUCTOR DEVICES –
Part 17: Magnetic and capacitive coupler
for basic and reinforced insulation
1 Scope

This part of IEC 60747 specifies the terminology, essential ratings, characteristics, safety test

and the measuring methods of magnetic coupler and capacitive coupler.

It specifies the principles and requirements of insulation and isolation characteristics for

magnetic and capacitive couplers for basic insulation and reinforced insulation.
2 Normative references

The following documents are referred to in the text in such a way that some or all of their

content constitutes requirements of this document. For dated references, only the edition

cited applies. For undated references, the latest edition of the referenced document (including

any amendments) applies.
IEC 60068-2-1:2007, Environmental testing – Part 2-1: Tests – Test A: Cold
IEC 60068-2-2:2007, Environmental testing – Part 2-2: Tests – Test B: Dry heat

IEC 60068-2-14:2009, Environmental testing – Part 2-14: Tests – Test N: Change of

temperature

IEC 60068-2-20:2008, Environmental testing – Part 2-20: Tests – Test T: Test methods for

solderability and resistance to soldering heat of devices with leads

IEC 60068-2-30:2005, Environmental testing – Part 2-30: Tests – Test Db: Damp heat, cyclic

(12 h + 12 h cycle)

IEC 60068-2-58:2015, Environmental testing – Part 2-58: Tests – Test Td: Test methods for

solderability, resistance to dissolution of metallization and to soldering heat of surface

mounting devices (SMD)

IEC 60068-2-67:1995, Environmental testing – Part 2: Tests – Test Cy: Damp heat, steady

state, accelerated test primarily intended for components

IEC 60112:2003, Method for the determination of the proof and the comparative tracking

indices of solid insulating materials

IEC 60216-1:2013, Electrical insulating materials – Thermal endurance properties – Part 1:

Ageing procedures and evaluation of test results

IEC 60216-2:2005, Electrical insulating materials – Thermal endurance properties – Part 2:

Determination of thermal endurance properties of electrical insulating materials – Choice of

test criteria

IEC 60664-1:2007, Insulation coordination for equipment within low-voltage systems – Part 1:

Principles, requirements and tests
---------------------- Page: 9 ----------------------
– 8 – IEC 60747-17:2020 © IEC 2020

IEC 60672-2:1999, Ceramic and glass insulating materials – Part 2: Methods of test

IEC 60695-11-5:2016, Fire hazard testing – Part 11-5: Test flames – Needle-flame test

method – Apparatus, confirmatory test arrangement and guidance

IEC 62539:2007, Guide for the statistical analysis of electrical insulation breakdown data

3 Terms and definitions
3.1
details of outline and encapsulation

information related method of encapsulation and terminal connections within the coupler's

isolation system
3.1.1
outline drawing

drawing or sketch restricted to line to describe the shape of objects or circuitry

3.1.2
method of encapsulation
encapsulating materials used forming part of the isolation system
3.1.3
terminal identification

terminal identification and indication of any connection between a terminal and the case

3.2
type of coupler

internal construction and insulation method of coupler to achieve basic or reinforced

insulation
3.2.1
SiO isolator

isolator with an internal insulation construction utilizing silicon dioxide based material

3.2.2
thin film polymer isolator

isolator with an internal insulation construction, utilising a thin film polymer insulation

3.3
isolation
ability to reject electrical and magnetic interference or noise
3.4
insulation

part of an electromechanical product which galvanically separates the conducting parts at

different electrical potentials
3.4.1
reinforced insulation

insulation of hazardous-live-parts which provides a degree of protection against electric shock

equivalent to double insulation

Note 1 to entry: Reinforced insulation may comprise several layers which cannot be tested singly as basic

insulation or supplementary insulation.
[SOURCE: IEC 60664-1:2007, 3.17.5]
---------------------- Page: 10 ----------------------
IEC 60747-17:2020 © IEC 2020 – 9 –
3.4.2
basic insulation
insulation providing a basic safeguard against electric shock
3.5
isolation side

all terminals of side 1 which are isolated from all terminals of side 2 by an isolation barrier,

forming a two-terminal device
3.6
isolation capacitance

total capacitance between the terminals on side 1 of the isolation barrier connected together

and the terminals on side 2 of the isolation barrier connected together forming a two-terminal

device
Note 1 to entry: See IEC 60747-5-5:2007, 4.3.
3.7
isolation resistance

resistance between the terminals on side 1 of the isolation barrier connected together and all

the terminals on side 2 of the isolation barrier connected together forming a two-terminal

device
3.8
isolation resistance at safety limiting temperature
IO_S

resistance at safety limiting temperature T between the terminals on side 1 of the isolation

barrier connected together and all the terminals on side 2 of the isolation barrier connected

together forming a two-terminal device which should be larger or equal to 1E9 Ω
3.9
isolation voltage

voltage between any specified terminals connected together on side 1 of the isolation barrier

and any terminals connected together on side 2 of the isolation barrier
3.10
logic state match

condition in which an output logic state matches the associated input logic state

3.11
logic state transition match

condition in which an output logic state change follows the associated input logic state change

3.12
common mode transient immunity
CMTI
maximum tolerable rate-of-rise (or fall) of a common-mode voltage

Note 1 to entry: The common mode transient immunity is given in volts per second. CMTl should include the

amplitude of the common-mode voltage that can be tolerated.
3.12.1
common mode transient immunity at logic high output
|CM |
common mode transient immunity of the coupler with logic at high output
---------------------- Page: 11 ----------------------
– 10 – IEC 60747-17:2020 © IEC 2020
3.12.2
common mode transient immunity at logic low output
|CM |
common mode transient immunity of the coupler with logic at low output
3.12.3
common mode transient immunity at logic dynamic output
|CM |

maximum slew rate of a common-mode voltage (V ) at which the coupler transmits the data

without missing the transition or creating unexpected transitions for all combinations of slew

rate polarity and data edges

Note 1 to entry: The data transition shall occur in the specified time frame, and invalid data in terms of delay

times, transitions or number of transitions, or magnitude (not meeting minimum logic V or maximum logic low

V specifications) will be construed as a failure.
3.12.4
CMTI performance
dV /dt

maximum slew rate of a common mode voltage at which the output of the coupler remains at

the specific logic level and at the specified timing
3.12.5
common mode voltage
common mode voltage at which the slew rate is measured
3.13
propagation delay
t t
pLH , pHL

time required for a change in the input state of a digital coupler to propagate to the

corresponding output
Note 1 to entry: The propagation delay from LOW to HIGH is expressed by t .
pLH
Note 2 to entry: The propagation delay from HIGH to LOW is expressed by t .
pHL
3.14
pulse width distortion
|t – t |
pLH pHL
PWD

unintentional and generally undesired change in the form of a signal causing the signal input

pulse width to differ from signal output pulse width
3.15
supply voltage
supply voltages supplied on input and output side of coupler
Note 1 to entry: The supply voltage is also commonly expressed by V
CC.
3.16
integrated circuit

microcircuit in which all or some of the circuit elements are inseparably associated and

electrically interconnected so that it is considered to be indivisible for the purpose of

construction and commerce on side 1 and side 2
---------------------- Page: 12 ----------------------
IEC 60747-17:2020 © IEC 2020 – 11 –

[SOURCE: IEC 60050-521:2002, 521-10-03, modified – The words "on side 1 and side 2"

have been added.]
3.17
input and output terminal
I/O

side 1 and side 2 terminals of an integrated circuit providing signal conditioning to the internal

coupling element
3.18
ground potential
GND
reference potential for any side of a coupler
3.19
input voltage
input voltage, either V , V or analog level
IL IH
3.20
output voltage
output voltage, either V , V or analog level
OL OH
3.21
maximum ambient operating temperature
op max
maximum ambient operating temperature allowed during operation of coupler
3.22
reference-point temperature
REF

temperature defined by the manufacturer to refer to a defined point such as junctio

...

IEC 60747-17
Edition 1.0 2020-09
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices –
Part 17: Magnetic and capacitive coupler for basic and reinforced insulation
Dispositifs à semiconducteurs –
Partie 17: Coupleur magnétique et capacitif pour l’isolation principale et
renforcée
IEC 60747-17:2020-09(en-fr)
---------------------- Page: 1 ----------------------
THIS PUBLICATION IS COPYRIGHT PROTECTED
Copyright © 2020 IEC, Geneva, Switzerland

All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form

or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from

either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC

copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or

your local IEC member National Committee for further information.

Droits de reproduction réservés. Sauf indication contraire, aucune partie de cette publication ne peut être reproduite

ni utilisée sous quelque forme que ce soit et par aucun procédé, électronique ou mécanique, y compris la photocopie

et les microfilms, sans l'accord écrit de l'IEC ou du Comité national de l'IEC du pays du demandeur. Si vous avez des

questions sur le copyright de l'IEC ou si vous désirez obtenir des droits supplémentaires sur cette publication, utilisez

les coordonnées ci-après ou contactez le Comité national de l'IEC de votre pays de résidence.

IEC Central Office Tel.: +41 22 919 02 11
3, rue de Varembé info@iec.ch
CH-1211 Geneva 20 www.iec.ch
Switzerland
About the IEC

The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes

International Standards for all electrical, electronic and related technologies.
About IEC publications

The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the

latest edition, a corrigendum or an amendment might have been published.

IEC publications search - webstore.iec.ch/advsearchform Electropedia - www.electropedia.org

The advanced search enables to find IEC publications by a The world's leading online dictionary on electrotechnology,

variety of criteria (reference number, text, technical containing more than 22 000 terminological entries in English

committee,…). It also gives information on projects, replaced and French, with equivalent terms in 16 additional languages.

and withdrawn publications. Also known as the International Electrotechnical Vocabulary

(IEV) online.
IEC Just Published - webstore.iec.ch/justpublished

Stay up to date on all new IEC publications. Just Published IEC Glossary - std.iec.ch/glossary

details all new publications released. Available online and 67 000 electrotechnical terminology entries in English and

once a month by email. French extracted from the Terms and Definitions clause of

IEC publications issued since 2002. Some entries have been

IEC Customer Service Centre - webstore.iec.ch/csc collected from earlier publications of IEC TC 37, 77, 86 and

If you wish to give us your feedback on this publication or CISPR.
need further assistance, please contact the Customer Service
Centre: sales@iec.ch.
A propos de l'IEC

La Commission Electrotechnique Internationale (IEC) est la première organisation mondiale qui élabore et publie des

Normes internationales pour tout ce qui a trait à l'électricité, à l'électronique et aux technologies apparentées.

A propos des publications IEC

Le contenu technique des publications IEC est constamment revu. Veuillez vous assurer que vous possédez l’édition la

plus récente, un corrigendum ou amendement peut avoir été publié.
Recherche de publications IEC - Electropedia - www.electropedia.org

webstore.iec.ch/advsearchform Le premier dictionnaire d'électrotechnologie en ligne au

La recherche avancée permet de trouver des publications IEC monde, avec plus de 22 000 articles terminologiques en

en utilisant différents critères (numéro de référence, texte, anglais et en français, ainsi que les termes équivalents dans

comité d’études,…). Elle donne aussi des informations sur les 16 langues additionnelles. Egalement appelé Vocabulaire

projets et les publications remplacées ou retirées. Electrotechnique International (IEV) en ligne.

IEC Just Published - webstore.iec.ch/justpublished Glossaire IEC - std.iec.ch/glossary

Restez informé sur les nouvelles publications IEC. Just 67 000 entrées terminologiques électrotechniques, en anglais

Published détaille les nouvelles publications parues. et en français, extraites des articles Termes et Définitions des

Disponible en ligne et une fois par mois par email. publications IEC parues depuis 2002. Plus certaines entrées

antérieures extraites des publications des CE 37, 77, 86 et
Service Clients - webstore.iec.ch/csc CISPR de l'IEC.
Si vous désirez nous donner des commentaires sur cette
publication ou si vous avez des questions contactez-nous:
sales@iec.ch.
---------------------- Page: 2 ----------------------
IEC 60747-17
Edition 1.0 2020-09
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices –
Part 17: Magnetic and capacitive coupler for basic and reinforced insulation
Dispositifs à semiconducteurs –
Partie 17: Coupleur magnétique et capacitif pour l’isolation principale et
renforcée
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.99 ISBN 978-2-8322-8924-2

Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
---------------------- Page: 3 ----------------------
– 2 – IEC 60747-17:2020 © IEC 2020
CONTENTS

FOREWORD ........................................................................................................................... 5

1 Scope .............................................................................................................................. 7

2 Normative references ...................................................................................................... 7

3 Terms and definitions ...................................................................................................... 8

4 Electrical characteristics – Coupler logic and timing definitions ...................................... 19

5 Coupler for protection against electrical shock ............................................................... 20

5.1 General ................................................................................................................. 20

5.2 Type ..................................................................................................................... 20

5.3 Ratings ................................................................................................................. 20

5.3.1 General ......................................................................................................... 20

5.3.2 Safety limiting values ..................................................................................... 20

5.3.3 Functional ratings .......................................................................................... 20

5.3.4 Rated isolation voltages................................................................................. 20

5.4 Electrical safety requirements ............................................................................... 20

5.5 Electrical, environmental and/or endurance test information .................................. 21

5.5.1 General ......................................................................................................... 21

5.5.2 Routine test ................................................................................................... 23

5.5.3 Sample test ................................................................................................... 23

5.5.4 Maximum surge isolation voltage ................................................................... 23

5.5.5 Type test ....................................................................................................... 24

6 Measuring methods for couplers .................................................................................... 35

6.1 General ................................................................................................................. 35

6.2 Isolation capacitance (C ) ................................................................................... 35

6.2.1 Purpose ......................................................................................................... 35

6.2.2 Circuit diagram .............................................................................................. 35

6.2.3 Measurement procedure ................................................................................ 36

6.2.4 Precautions to be observed ........................................................................... 36

6.2.5 Special conditions ......................................................................................... 36

6.3 Isolation resistance between input and output, R ............................................... 36

6.3.1 Purpose ......................................................................................................... 36

6.3.2 Circuit diagram .............................................................................................. 36

6.3.3 Precautions to be observed ........................................................................... 37

6.3.4 Measurement procedure ................................................................................ 37

6.3.5 Special conditions ......................................................................................... 37

6.4 Isolation test ......................................................................................................... 37

6.4.1 Purpose ......................................................................................................... 37

6.4.2 Circuit diagram .............................................................................................. 37

6.4.3 Test procedure .............................................................................................. 38

6.4.4 Requirements ................................................................................................ 38

6.5 Partial discharges of coupler ................................................................................. 39

6.5.1 Purpose ......................................................................................................... 39

6.5.2 Circuit diagram .............................................................................................. 39

6.5.3 Description of Figure 9 test circuit and requirements ..................................... 39

6.5.4 Test procedure .............................................................................................. 40

6.5.5 Description of calibration circuit (see Figure 10) ............................................ 40

---------------------- Page: 4 ----------------------
IEC 60747-17:2020 © IEC 2020 – 3 –

6.5.6 Test methods ................................................................................................. 41

6.5.7 Specified conditions ....................................................................................... 41

6.5.8 Test voltage conditions .................................................................................. 42

6.6 Switching times of couplers ................................................................................... 42

6.6.1 Purpose ......................................................................................................... 42

6.6.2 Circuit diagram .............................................................................................. 42

6.6.3 Measurement procedure ................................................................................ 43

6.6.4 Specified conditions ....................................................................................... 44

6.7 Measuring methods of common-mode transient immunity (CMTI) for

magnetic and capacitive couplers ......................................................................... 44

6.7.1 Purpose ......................................................................................................... 44

6.7.2 Circuit diagram .............................................................................................. 44

6.7.3 Precautions to be observed ........................................................................... 45

6.7.4 Static CMTI measuring procedure .................................................................. 46

6.7.5 Specified conditions ....................................................................................... 47

6.7.6 Dynamic CMTI measuring procedure ............................................................. 47

Annex A (informative) Qualification guidance ....................................................................... 48

Bibliography .......................................................................................................................... 51

Figure 1 – Time intervals for methods a and b of the test voltage .......................................... 15

Figure 2 –1,2/50 µs surge pulse according 61000-4-5:2014 allowed as equivalent

impulse for isolation testing .................................................................................................. 24

Figure 3 – Determination of time to failure (referring to method in 5.5.5.8) ............................ 31

Figure 4 – Determination of working voltage (referring to method in 5.5.5.8 for

exponential model) ............................................................................................................... 32

Figure 5 – Determination of working voltage (referring to method in 5.5.5.8 for non-

linear model) ......................................................................................................................... 33

Figure 6 – Isolation capacitance measurement circuit ........................................................... 36

Figure 7 – Isolation resistance measurement circuit .............................................................. 37

Figure 8 – Isolation voltage measurement circuit .................................................................. 38

Figure 9 – Partial discharge test circuit ................................................................................. 39

Figure 10 – Connections for the calibration of the complete test arrangement ....................... 40

Figure 11 – Switching time test circuit ................................................................................... 43

Figure 12 – Transition time waveform measurement ............................................................. 43

Figure 13 – Propagation delay time waveform measurement ................................................. 44

Figure 14 – Static versus dynamic data source signal VI ....................................................... 45

Figure 15 – Common-mode transient immunity (CMTI) test setup for both static and

dynamic testing ..................................................................................................................... 45

Figure 16 – Static common-mode transient immunity (CMTI) and V and low to high

data transition waveform ....................................................................................................... 47

Figure A.1 – Lifetime verification ........................................................................................... 49

Table 1 – Overview on characteristics and symbols .............................................................. 19

Table 2 – Datasheet characteristics ...................................................................................... 21

Table 3 – Tests and test sequence for coupler providing basic insulation and reinforced

insulation for protection against electrical shock ................................................................... 22

Table 4 – Test conditions ...................................................................................................... 23

---------------------- Page: 5 ----------------------
– 4 – IEC 60747-17:2020 © IEC 2020

Table 5 – Safety factor F....................................................................................................... 41

Table 6 – Specified conditions for method a and method b.................................................... 42

Table A.1 – Front end process changes within component .................................................... 49

Table A.2 – Front End Process Changes within SiO/SiN/imide-passivation ........................... 50

Table A.3 – Layout changes .................................................................................................. 50

Table A.4 – Backend changes ............................................................................................... 50

---------------------- Page: 6 ----------------------
IEC 60747-17:2020 © IEC 2020 – 5 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
Part 17: Magnetic and capacitive coupler
for basic and reinforced insulation
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote

international co-operation on all questions concerning standardization in the electrical and electronic fields. To

this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,

Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as "IEC

Publication(s)"). Their preparation is entrusted to technical committees; any IEC National Committee interested

in the subject dealt with may participate in this preparatory work. International, governmental and non-

governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely

with the International Organization for Standardization (ISO) in accordance with conditions determined by

agreement between the two organizations.

2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international

consensus of opinion on the relevant subjects since each technical committee has representation from all

interested IEC National Committees.

3) IEC Publications have the form of recommendations for international use and are accepted by IEC National

Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC

Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any

misinterpretation by any end user.

4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications

transparently to the maximum extent possible in their national and regional publications. Any divergence

between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in

the latter.

5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity

assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any

services carried out by independent certification bodies.

6) All users should ensure that they have the latest edition of this publication.

7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and

members of its technical committees and IEC National Committees for any personal injury, property damage or

other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and

expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC

Publications.

8) Attention is drawn to the normative references cited in this publication. Use of the referenced publications is

indispensable for the correct application of this publication.

9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of

patent rights. IEC shall not be held responsible for identifying any or all such patent rights.

International Standard IEC 60747-17 has been prepared by subcommittee SC 47E: Discrete

semiconductor devices, of IEC technical committee TC 47: Semiconductor devices.

This first edition cancels and replaces IEC PAS 60747-17:2011. This edition constitutes a

technical revision.

This edition includes the following significant technical changes with respect to

IEC PAS 60747-17:2011:

a) introduced lifetime safety factors for improved life time consideration, to comply with

widely recognized aging mechanisms of silicone dioxide (TDDB) and thin film polymer

isolation layers;

b) significantly improved "end of life testing" paragraph and statistical life time consideration

by adding detailed description on process, safety factors, methods of generating data

points and respective lifetime interpolations as well as being specific on minimum amount

of samples required;
---------------------- Page: 7 ----------------------
– 6 – IEC 60747-17:2020 © IEC 2020

c) introduced concept of certification by similarity, including Annex A, giving guidance on

qualification considerations and required certification process;

d) alternative pulse shape allowed for surge pulse testing, to avoid issues due to surge tester

availability;

e) various improvements throughout the standard: definitions, for example type of coupler

have been improved, introduction of surge impulse V rating, usage of glass transition

IMP

temperature, pre-conditioning have been redefined for improved usability and better

compatibility with today’s design and functionality of couplers, available mold compounds,

etc.
The text of this International Standard is based on the following documents:
FDIS Report on voting
47E/711/FDIS 47E/715/RVD

Full information on the voting for the approval of this International Standard can be found in

the report on voting indicated in the above table.

This document has been drafted in accordance with the ISO/IEC Directives, Part 2.

A list of all parts in the IEC 60747 series, published under the general title Semiconductor

devices, can be found on the IEC website.

The committee has decided that the contents of this document will remain unchanged until the

stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to

the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
---------------------- Page: 8 ----------------------
IEC 60747-17:2020 © IEC 2020 – 7 –
SEMICONDUCTOR DEVICES –
Part 17: Magnetic and capacitive coupler
for basic and reinforced insulation
1 Scope

This part of IEC 60747 specifies the terminology, essential ratings, characteristics, safety test

and the measuring methods of magnetic coupler and capacitive coupler.

It specifies the principles and requirements of insulation and isolation characteristics for

magnetic and capacitive couplers for basic insulation and reinforced insulation.
2 Normative references

The following documents are referred to in the text in such a way that some or all of their

content constitutes requirements of this document. For dated references, only the edition

cited applies. For undated references, the latest edition of the referenced document (including

any amendments) applies.
IEC 60068-2-1:2007, Environmental testing – Part 2-1: Tests – Test A: Cold
IEC 60068-2-2:2007, Environmental testing – Part 2-2: Tests – Test B: Dry heat

IEC 60068-2-14:2009, Environmental testing – Part 2-14: Tests – Test N: Change of

temperature

IEC 60068-2-20:2008, Environmental testing – Part 2-20: Tests – Test T: Test methods for

solderability and resistance to soldering heat of devices with leads

IEC 60068-2-30:2005, Environmental testing – Part 2-30: Tests – Test Db: Damp heat, cyclic

(12 h + 12 h cycle)

IEC 60068-2-58:2015, Environmental testing – Part 2-58: Tests – Test Td: Test methods for

solderability, resistance to dissolution of metallization and to soldering heat of surface

mounting devices (SMD)

IEC 60068-2-67:1995, Environmental testing – Part 2: Tests – Test Cy: Damp heat, steady

state, accelerated test primarily intended for components

IEC 60112:2003, Method for the determination of the proof and the comparative tracking

indices of solid insulating materials

IEC 60216-1:2013, Electrical insulating materials – Thermal endurance properties – Part 1:

Ageing procedures and evaluation of test results

IEC 60216-2:2005, Electrical insulating materials – Thermal endurance properties – Part 2:

Determination of thermal endurance properties of electrical insulating materials – Choice of

test criteria

IEC 60664-1:2007, Insulation coordination for equipment within low-voltage systems – Part 1:

Principles, requirements and tests
---------------------- Page: 9 ----------------------
– 8 – IEC 60747-17:2020 © IEC 2020

IEC 60672-2:1999, Ceramic and glass insulating materials – Part 2: Methods of test

IEC 60695-11-5:2016, Fire hazard testing – Part 11-5: Test flames – Needle-flame test

method – Apparatus, confirmatory test arrangement and guidance

IEC 62539:2007, Guide for the statistical analysis of electrical insulation breakdown data

3 Terms and definitions
3.1
details of outline and encapsulation

information related method of encapsulation and terminal connections within the coupler's

isolation system
3.1.1
outline drawing

drawing or sketch restricted to line to describe the shape of objects or circuitry

3.1.2
method of encapsulation
encapsulating materials used forming part of the isolation system
3.1.3
terminal identification

terminal identification and indication of any connection between a terminal and the case

3.2
type of coupler

internal construction and insulation method of coupler to achieve basic or reinforced

insulation
3.2.1
SiO isolator

isolator with an internal insulation construction utilizing silicon dioxide based material

3.2.2
thin film polymer isolator

isolator with an internal insulation construction, utilising a thin film polymer insulation

3.3
isolation
ability to reject electrical and magnetic interference or noise
3.4
insulation

part of an electromechanical product which galvanically separates the conducting parts at

different electrical potentials
3.4.1
reinforced insulation

insulation of hazardous-live-parts which provides a degree of protection against electric shock

equivalent to double insulation

Note 1 to entry: Reinforced insulation may comprise several layers which cannot be tested singly as basic

insulation or supplementary insulation.
[SOURCE: IEC 60664-1:2007, 3.17.5]
---------------------- Page: 10 ----------------------
IEC 60747-17:2020 © IEC 2020 – 9 –
3.4.2
basic insulation
insulation providing a basic safeguard against electric shock
3.5
isolation side

all terminals of side 1 which are isolated from all terminals of side 2 by an isolation barrier,

forming a two-terminal device
3.6
isolation capacitance

total capacitance between the terminals on side 1 of the isolation barrier connected together

and the terminals on side 2 of the isolation barrier connected together forming a two-terminal

device
Note 1 to entry: See IEC 60747-5-5:2007, 4.3.
3.7
isolation resistance

resistance between the terminals on side 1 of the isolation barrier connected together and all

the terminals on side 2 of the isolation barrier connected together forming a two-terminal

device
3.8
isolation resistance at safety limiting temperature
IO_S

resistance at safety limiting temperature T between the terminals on side 1 of the isolation

barrier connected together and all the terminals on side 2 of the isolation barrier connected

together forming a two-terminal device which should be larger or equal to 1E9 Ω
3.9
isolation voltage

voltage between any specified terminals connected together on side 1 of the isolation barrier

and any terminals connected together on side 2 of the isolation barrier
3.10
logic state match

condition in which an output logic state matches the associated input logic state

3.11
logic state transition match

condition in which an output logic state change follows the associated input logic state change

3.12
common mode transient immunity
CMTI
maximum tolerable rate-of-rise (or fall) of a common-mode voltage

Note 1 to entry: The common mode transient immunity is given in volts per second. CMTl should include the

amplitude of the common-mode voltage that can be tolerated.
3.12.1
common mode transient immunity at logic high output
|CM |
common mode transient immunity of the coupler with logic at high output
-----------------
...

Questions, Comments and Discussion

Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.