IEC TS 62239-1:2012
(Main)Process management for avionics - Management plan - Part 1: Preparation and maintenance of an electronic components management plan
Process management for avionics - Management plan - Part 1: Preparation and maintenance of an electronic components management plan
IEC/TS 62239-1:2012(E) defines the requirements for developing an Electronic Components Management Plan (ECMP) to assure customers and regulatory agencies that all of the electronic components in the equipment of the plan owner are selected and applied in controlled processes compatible with the end application and that certain technical requirements are accomplished. In general, the owners of a complete electronic components management plan are avionics equipment manufacturers. Keywords: avionics, electronic components, management
General Information
Relations
Standards Content (Sample)
IEC/TS 62239-1
®
Edition 1.0 2012-07
TECHNICAL
SPECIFICATION
Process management for avionics – Management plan –
Part 1: Preparation and maintenance of an electronic components management
plan
IEC/TS 62239-1:2012(E)
---------------------- Page: 1 ----------------------
THIS PUBLICATION IS COPYRIGHT PROTECTED
Copyright © 2012 IEC, Geneva, Switzerland
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester.
If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication,
please contact the address below or your local IEC member National Committee for further information.
IEC Central Office Tel.: +41 22 919 02 11
3, rue de Varembé Fax: +41 22 919 03 00
CH-1211 Geneva 20 info@iec.ch
Switzerland www.iec.ch
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.
About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigenda or an amendment might have been published.
Useful links:
IEC publications search - www.iec.ch/searchpub Electropedia - www.electropedia.org
The advanced search enables you to find IEC publications The world's leading online dictionary of electronic and
by a variety of criteria (reference number, text, technical electrical terms containing more than 30 000 terms and
committee,…). definitions in English and French, with equivalent terms in
It also gives information on projects, replaced and additional languages. Also known as the International
withdrawn publications. Electrotechnical Vocabulary (IEV) on-line.
IEC Just Published - webstore.iec.ch/justpublished Customer Service Centre - webstore.iec.ch/csc
Stay up to date on all new IEC publications. Just Published If you wish to give us your feedback on this publication
details all new publications released. Available on-line and or need further assistance, please contact the
also once a month by email. Customer Service Centre: csc@iec.ch.
---------------------- Page: 2 ----------------------
IEC/TS 62239-1
®
Edition 1.0 2012-07
TECHNICAL
SPECIFICATION
Process management for avionics – Management plan –
Part 1: Preparation and maintenance of an electronic components management
plan
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
PRICE CODE
XA
ICS 03.100.50; 31.020; 49.060 ISBN 978-2-83220-224-1
Warning! Make sure that you obtained this publication from an authorized distributor.
® Registered trademark of the International Electrotechnical Commission
---------------------- Page: 3 ----------------------
– 2 – TS 62239-1 © IEC:2012(E)
CONTENTS
FOREWORD . 4
INTRODUCTION . 7
1 Scope . 8
2 Normative references . 8
3 Terms, definitions and abbreviations . 10
3.1 Terms and definitions . 10
3.2 Abbreviations . 14
4 Technical requirements . 14
4.1 General . 14
4.2 Component selection . 15
4.3 Component application . 16
4.3.1 General . 16
4.3.2 Electromagnetic compatibility (EMC) . 16
4.3.3 Derating and stress analysis . 17
4.3.4 Thermal analysis . 17
4.3.5 Mechanical analysis . 18
4.3.6 Testing, testability, and maintainability . 18
4.3.7 Avionics radiation environment . 18
4.3.8 Management of lead-free termination finish and soldering . 18
4.3.9 Counterfeit, fraudulent and recycled component avoidance . 19
4.4 Component qualification . 19
4.4.1 General . 19
4.4.2 General component qualification requirements . 19
4.4.3 Component manufacturer quality management . 19
4.4.4 Component manufacturer process management approval . 19
4.4.5 Demonstration of component qualification . 20
4.4.6 Qualification of components from a supplier that is not qualified . 21
4.4.7 Distributor process management approval . 21
4.4.8 Subcontractor assembly facility quality and process management
approval . 22
4.5 Continuous component quality assurance . 22
4.5.1 General quality assurance requirements . 22
4.5.2 On-going component quality assurance . 22
4.5.3 Plan owner in-house continuous monitoring . 23
4.5.4 Component design and manufacturing process change monitoring . 23
4.6 Component availability and associated risk assessment . 23
4.6.1 General . 23
4.6.2 Component obsolescence . 24
4.6.3 Pro-active measures . 24
4.6.4 Component obsolescence awareness . 25
4.6.5 Reporting. 25
4.6.6 Component dependability . 25
4.6.7 Semiconductor reliability and wear out. 25
4.6.8 Reliability assessment . 25
4.7 Component compatibility with the equipment manufacturing process . 26
---------------------- Page: 4 ----------------------
TS 62239-1 © IEC:2012(E) – 3 –
4.8 Component data . 26
4.9 Configuration control . 27
4.9.1 General . 27
4.9.2 Alternative sources . 27
4.9.3 Equipment change documentation . 27
4.9.4 Customer notifications and approvals . 28
4.9.5 Focal organisation . 28
5 Plan administration requirements. 28
5.1 Using components outside the manufacturer’s specified temperature range . 28
5.2 Plan organization . 28
5.3 Plan terms and definitions . 29
5.4 Plan focal point . 29
5.5 Plan references . 29
5.6 Plan applicability . 29
5.7 Plan implementation . 29
5.8 Plan acceptance . 29
5.9 Plan maintenance . 29
Annex A (informative) Typical qualification requirements, typical component minimum
qualification requirements . 30
Annex B (informative) Semiconductor reliability and wear out . 34
Annex C (informative) Guidelines for environmental protection techniques, and for
comparison of components specifications . 35
Bibliography . 50
Table A.1 – Typical qualification requirements, typical component minimum
qualification requirements . 31
Table C.1 – Environmental protection techniques to be considered during the avionics
design process . 35
Table C.2 – Guidelines for the comparison of internationally available component
specifications – Microcircuits. . 40
---------------------- Page: 5 ----------------------
– 4 – TS 62239-1 © IEC:2012(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PROCESS MANAGEMENT FOR AVIONICS –
MANAGEMENT PLAN –
Part 1: Preparation and maintenance of an
electronic components management plan
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
The main task of IEC technical committees is to prepare International Standards. In
exceptional circumstances, a technical committee may propose the publication of a technical
specification when
• the required support cannot be obtained for the publication of an International Standard,
despite repeated efforts, or
• the subject is still under technical development or where, for any other reason, there is the
future but no immediate possibility of an agreement on an International Standard.
Technical specifications are subject to review within three years of publication to decide
whether they can be transformed into International Standards.
IEC/TS 62239-1, which is a technical specification, has been prepared by IEC Technical
Committee 107: Process management for avionics.
---------------------- Page: 6 ----------------------
TS 62239-1 © IEC:2012(E) – 5 –
This edition cancels and replaces IEC/TS 62239 published in 2008. This edition constitutes a
technical revision.
This edition includes the following significant technical changes with respect to
IEC/TS 62239:2008:
a) Scope – Added DO-254 for clarification
b) Normative references – Added additional references
c) Terms, definitions and abbreviations – Clarified some definitions
d) 4 Technical requirements – Added clarification related to managing ECMP at
subcontractor
e) 4.2 Component selection – Clarified temperature range requirements
f) 4.3.3 De-rating and stress analysis – Added information relative to part wear out
g) 4.3.8 Management of lead free termination finish and soldering – Added requirement
h) 4.3.9 Counterfeit, fraudulent and recycled component avoidance – Added requirement
i) 4.4.5 Demonstration of component qualification – Clarified documentation required
j) 4.4.5.3.4 Equipment manufacturer validation – Added additional requirements
k) 4.4.7 Distributor process management approval – Added additional requirements
l) 4.5.2. On-going component quality assurance – Changed title to clarify purpose and
changed STACK 0001 reference to IEC/PAS 62686-1
m) 4.6.5 Reporting – Added requirement to periodically report status of obsolescence
program to customer
n) 4.6.7 Semiconductor reliability and wear out – Added requirement to address
semiconductor wear out
o) Annex A: Typical Qualification Requirements – Added requirement for minimum part
qualification
p) Annex B Semiconductor reliability and wear out – Added annex B to provide information
about wear out
The text of this technical specification is based on the following documents:
Enquiry draft Report on voting
107/161/DTS 107/179/RVC
Full information on the voting for the approval of this technical specification can be found in
the report on voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all the parts in the IEC/TS 62239 series under the general title Process management
for avionics – Management plan, can be found on the IEC website.
---------------------- Page: 7 ----------------------
– 6 – TS 62239-1 © IEC:2012(E)
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• transformed into an International Standard,
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.
---------------------- Page: 8 ----------------------
TS 62239-1 © IEC:2012(E) – 7 –
INTRODUCTION
This Technical Specification provides the structure for aerospace equipment manufacturers,
subcontractors, maintenance facilities, and other aerospace component users to develop their
own Electronic Component Management Plans (ECMPs), hereinafter also referred to as ‘plan’.
This Technical Specification states objectives to be accomplished; it does not require specific
tasks to be performed, specific data to be collected or reports to be issued. Those who
prepare plans in compliance with this Technical Specification will document processes that
are the most effective and efficient for them in accomplishing the objectives of this Technical
Specification. In order to allow flexibility in implementing and updating the documented
processes, plan authors are encouraged to refer to their own internal process documents
instead of including detailed process documentation within their plans.
Subcontractors or test houses will be assessed by the plan owner on the relevant parts of 4.1
to 4.9 as agreed with the plan owner
This component management Technical Specification is intended for aerospace users of
electronic components. This Technical Specification is not intended for use by the
manufacturers of electronic components. Components selected and managed according to the
requirements of a plan compliant to this Technical Specification may be approved by the
concerned parties for the proposed application, and for other applications with equal or less
severe requirements.
Organizations that prepare such plans may prepare a single plan, and use it for all relevant
products supplied by the organization, or may prepare a separate plan for each relevant
product or customer.
---------------------- Page: 9 ----------------------
– 8 – TS 62239-1 © IEC:2012(E)
PROCESS MANAGEMENT FOR AVIONICS –
MANAGEMENT PLAN –
Part 1: Preparation and maintenance of an
electronic components management plan
1 Scope
This part of the IEC/TS 62239 series defines the requirements for developing an Electronic
Components Management Plan (ECMP) to assure customers and regulatory agencies that all
of the electronic components in the equipment of the plan owner are selected and applied in
controlled processes compatible with the end application and that the technical requirements
detailed in Clause 4 are accomplished. In general, the owners of a complete electronic
components management plan are avionics equipment manufacturers. This part of the
IEC/TS 62239 series provides the minimum requirements for system development assurance
levels according to levels A, B and C of the DO-254 A, B and C for flight equipment.
Although developed for the avionics industry, this process may be applied by other industrial
sectors.
2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and
are indispensable for its application. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 61340-5-1, Electrostatics – Part 5-1: Protection of electronic devices from electrostatic
phenomena – General requirements
IEC/TR 61340-5-2, Electrostatics – Part 5-2: Protection of electronic devices from
electrostatic phenomena – User guide
IEC/TR 62240, Process management for avionics – Use of semiconductor devices outside
manufacturers' specified temperature range
IEC 62396-1, Process management for avionics – Atmospheric radiation effects – Part 1:
Accommodation of atmospheric radiation effects via single event effects within avionics
electronic equipment
IEC/TS 62396-2, Process management for avionics – Atmospheric radiation effects – Part 2:
Guidelines for single event effects testing for avionics systems
IEC/TS 62396-3, Process management for avionics – Atmospheric radiation effects – Part 3:
Optimising system design to accommodate the single event effects (SEE) of atmospheric
radiation
IEC/TS 62396-4, Process management for avionics – Atmospheric radiation effects – Part 4:
Guidelines for designing with high voltage aircraft electronics and potential single event
effects
IEC/TS 62396-5, Process management for avionics – Atmospheric radiation effects – Part 5:
Guidelines for assessing thermal neutron fluxes and effects in avionics systems
---------------------- Page: 10 ----------------------
TS 62239-1 © IEC:2012(E) – 9 –
IEC 62402, Obsolescence management – Application guide
IEC/TS 62564-1, Process management for avionics Aerospace qualified electronic
components (AQEC) – Part 1: Integrated circuits and discrete semiconductors
IEC/PAS 62647-1, Process management for avionics – Aerospace and defence electronic
systems containing lead-free solder – Part 1: Lead-free management
1
IEC/TS 62647-1 , Process management for avionics – Aerospace and defence electronic
systems containing lead-free solder – Part 1: Preparation for a lead-free control plan
IEC/PAS 62647-2, Process management for avionics – Aerospace and defence electronic
systems containing lead-free solder – Part 2: Mitigation of the deleterious effects of tin
2
IEC/TS 62647-2 , Process management for avionics – Aerospace and defence electronic
systems containing lead-free solder – Part 2: Mitigation of the deleterious effects of tin
IEC/TS 62668-1, Process management for avionics – Counterfeit prevention – Part 1:
Avoiding the use of counterfeit, fraudulent and recycled electronic components
IEC/PAS 62686-1, Process management for avionics – Aerospace qualified electronic
components (AQEC) – Part 1: General requirements for high reliability integrated circuits and
discrete semiconductors
3
IEC/TS 62686-1 , Process management for avionics – Aerospace qualified electronic
components (AQEC) – Part 1: General requirements for high reliability integrated circuits and
discrete semiconductors
ISO 9000:2005, Quality management systems – Fundamentals and vocabulary
JEP 149:2004, JEDEC Standard, Application Thermal Derating Methodologies
JESD 47, JEDEC Standard, Stress – Test-driven qualification of integrated circuits
JESD 94.01, JEDEC Standard, Application Specific Qualification Using Knowledge Based
Test Methodology
MIL-HDBK-263, Revision B, Electrostatic Discharge Control Handbook
AEC–Q100, Failure Mechanism based Stress Test Qualification for Integrated Circuits
AEC–Q101, Stress Test Qualification for Automotive Grade Discrete Semiconductors
AEC–Q200, Stress Test Qualification for Passive components
SAE AS5553, Counterfeit Electronic Parts, Avoidance, Detection, Mitigation, and Disposition
ANSI/GEIA-STD-0002-1, Aerospace Qualified Electronic Component (AQEC) Volume 1 –
Integrated Circuits and Semiconductors
___________
1
To be published. This will supersede the PAS document.
2
To be published. This will supersede the PAS document.
3
To be published. This will supersede the PAS document.
---------------------- Page: 11 ----------------------
– 10 – TS 62239-1 © IEC:2012(E)
ANSI/GEIA-STD-0005-1, Performance Standard for Aerospace and Military Electronic
Systems Containing Lead-Free Solder
ANSI/GEIA-STD-0005-2, Standard for Mitigating the Effects of Tin Whiskers in Aerospace and
High Performance Electronic Systems
GIFAS/5052/2008, Guide for managing electronic component sourcing through non franchised
distributors. Preventing fraud and counterfeiting
AS/EN/JISQ 9100 Quality Management Systems-Requirements for Aviation Space and
Defense Organizations
IPC/JEDEC J-STD-20, Moisture/Reflow Sensitivity Classifications
3 Terms, definitions and abbreviations
For the purposes of this document, the following terms, definitions and abbreviations apply.
In their plan, plan owners may use alternative definitions consistent with convention in their
company.
3.1 Terms and definitions
3.1.1
environment
applicable environmental conditions (as described per the equipment specification) that the
equipment is able to withstand without loss or degradation in equipment performance
throughout its manufacturing cycle and maintenance life (the length of which is defined by the
equipment manufacturer in conjunction with customers)
3.1.2
purchased
bought outside the plan owner organization, from an independent supplier
Note 1 to entry: This indicates that the plan owner does not manufacture this in-house
3.1.3
capable
capacity of a component to be used successfully in the intended application
3.1.4
certified
assessed and compliant to an applicable 3rd party
3.1.5
characterization
process of testing a sample of components to determine the key electrical parameter values
that can be expected of all produced components of the type tested
3.1.6
component application
domain of use where the component meets the design requirements
3.1.7
component manufacturer
organization responsible for the component specification and its production
---------------------- Page: 12 ----------------------
TS 62239-1 © IEC:2012(E) – 11 –
3.1.8
component obsolescence
absence of availability of a component which is not procurable due to the manufacturer(s)
ceasing production
Note 1 to entry: Component obsolescence management is considered as an element of component dependability
3.1.9
component qualification
process used to demonstrate that the component is capable of meeting its specification for all
the required conditions and environments
3.1.10
component quality assurance
activities and processes to provide adequate confidence that each individual component
meets the performance and environmental requirements
3.1.11
component selection
process of choosing a specific component for a specific application
3.1.12
component standardization
process of developing and agreeing by consensus on uniform engineering criteria for products
and methods for achieving compatibility, interoperability, interchangeability, or commonality of
material
Note 1 to entry: Standardization is used to reduce proliferation of parts into inventory.
3.1.13
counterfeit
practice of producing products which are imitations or are fake goods or services and,
therefore, infringes the intellectual property rights of the original manufacturer.
Note 1 to entry: Counterfeiting is illegal and generally relates to wilful trade mark infringement
3.1.14
fraudulent
produced or distributed in violation of the law
EXAMPLE Fraudulent parts include but are not limited to:
a) parts which do not contain the proper internal construction (die, manufacturer, wire bonding etc.),
b) parts which have been used refurbished or reclaimed but represented as new product,
c) parts which have different package style or surface plating/finish than the ordered parts,
d) parts which have not successfully completed the original component manufacturer's full production and test
flow but are represented as the completed product,
e) parts sold as upscreened parts which have not successfully completed upscreening,
f) parts sold with modified labelling or markings intended to misrepresent the part’s form, fit, function or
...
Questions, Comments and Discussion
Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.