IEC 60748-23-3:2002

Semiconductor devices - Integrated circuits - Part 23-3: Hybrid integrated circuits and film structures - Manufacturing line certification - Manufacturers' self-audit checklist and report

Applies to a high quality approval system for hybrid integrated circuits and film structures.This checklist is intended for the use of a hybrid microcircuit manufacturer's internal assessment team. It will provide the hybrid manufacturer and the National Supervising Inspectorate with ongoing information on process control demonstrating compliance with IEC 60748-23-1.

General Information

• Status: Published
• Publication Date: 16-May-2002
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 31.200 - Integrated circuits. Microelectronics
• Technical Committee: SC 47A - Integrated circuits
• Drafting Committee: WG 7 - TC 47/SC 47A/WG 7
• Current Stage: PPUB - Publication issued
• Start Date: 15-Jun-2002
• Completion Date: 17-May-2002

Standards Content (Sample)

INTERNATIONAL IEC
STANDARD
60748-23-3
QC 165000-3
First edition
2002-05
Semiconductor devices –
Integrated circuits –
Part 23-3:
Hybrid integrated circuits and film structures –
Manufacturing line certification –
Manufacturers' self-audit checklist and report
Dispositifs à semiconducteurs –
Circuits intégrés –
Partie 23-3:
Circuits intégrés hybrides et structures par films –
Certification de la ligne de fabrication –
Liste de contrôle et rapport d’évaluation interne
pour fabricants
Reference number
Publication numbering
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60000 series. For example, IEC 34-1 is now referred to as IEC 60034-1.
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amendments 1 and 2.
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INTERNATIONAL IEC
STANDARD
60748-23-3
QC 165000-3
First edition
2002-05
Semiconductor devices –
Integrated circuits –
Part 23-3:
Hybrid integrated circuits and film structures –
Manufacturing line certification –
Manufacturers' self-audit checklist and report
Dispositifs à semiconducteurs –
Circuits intégrés –
Partie 23-3:
Circuits intégrés hybrides et structures par films –
Certification de la ligne de fabrication –
Liste de contrôle et rapport d’évaluation interne
pour fabricants
 IEC 2002  Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: [phone] Telefax: [phone] E-mail: [e-mail]  Web: www.iec.ch
PRICE CODE
Commission Electrotechnique Internationale
XC
International Electrotechnical Commission
Международная Электротехническая Комиссия
For price, see current catalogue

– 2 – 60748-23-3  IEC:2002(E)
CONTENTS
FOREWORD.4
INTRODUCTION.5
1 Scope.6
2 Document information.6
2.1 General .6
2.2 Normative references .6
3 Definitions .7
4 General requirements .7
4.1 Self-audit checklist and report for thick and thin film
hybrid integrated circuit manufacturers.8
4.2 Description of report/company structure .9
4.3 Approval information .10
4.4 Summary of testing .12
4.5 Analytical methods .14
4.6 Control of procurement sources and incoming material.15
4.7 Control of procurement sources and incoming material, continued .15
4.8 Environmental control and static handling .16
4.9 Change notification requirements .17
4.10 Hybrid design .17
5 Thick film processing.19
5.1 Artwork and screen fabrication .19
5.2 Substrates.20
5.3 Substrate saw or scribe and break and substrate hole drilling .21
5.4 Thick film pastes and printing .22
5.5 Drying and firing.26
5.6 Resistor trimming .27
5.7 Inspection and test of processing .28
5.8 Rework.29
6 Thin film processing .30
6.1 Artwork and mask fabrication .30
6.2 Substrates.31
6.3 Substrate saw or scribe and break and substrate hole drilling .33
6.4 Thin film processing materials and pattern forming.33
6.5 Drying and stabilization .35
6.6 Resistor trimming .36
6.7 Rework.37
7 Hybrid assembly.38
7.1 Solder assembly.39
7.2 Chip and wire assembly.46
8 Test and dispatch .57
8.1 Electrical tests.58
8.2 Burn-in .59
8.3 Endurance.61
8.4 Dry heat (stabilization bake).62
8.5 Change of temperature.63

60748-23-3  IEC:2002(E) – 3 –
8.6 Damp heat testing .64
8.7 Particle impact noise detection.65
8.8 Fine leak test.66
8.9 Gross leak test .67
8.10 Resistance to soldering heat .68
8.11 Termination robustness .68
8.12 Acceleration .69
8.13 Vibration.69
8.14 Shock.70
8.15 Dimensions .70
8.16 Bond-pull testing .71
8.17 Salt mist.72
8.18 Flammability.73
8.19 Solderability .73
8.20 Resistance to solvents .75
8.21 Internal visual inspection .76
8.22 External visual inspection.77
8.23 Radiographic inspection .77
8.24 Acceptance to dispatch .78

– 4 – 60748-23-3  IEC:2002(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
___________
SEMICONDUCTOR DEVICES – INTEGRATED CIRCUITS –
Part 23-3: Hybrid integrated circuits and film structures –
Manufacturing line certification –
Manufacturers' self-audit checklist and report
FOREWORD
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of the IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, the IEC publishes International Standards. Their preparation is
entrusted to technical committees; any IEC National Committee interested in the subject dealt with may
participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. The IEC collaborates closely with the International
Organization for Standardization (ISO) in accordance with conditions determined by agreement between the
two organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an
international consensus of opinion on the relevant subjects since each technical committee has representation
from all interested National Committees.
3) The documents produced have the form of recommendations for international use and are published in the form
of standards, technical specifications, technical reports or guides and they are accepted by the National
Committees in that sense.
4) In order to promote international unification, IEC National Committees undertake to apply IEC International
Standards transparently to the maximum extent possible in their national and regional standards. Any
divergence between the IEC Standard and the corresponding national or regional standard shall be clearly
indicated in the latter.
5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with one of its standards.
6) Attention is drawn to the possibility that some of the elements of this International Standard may be the subject
of patent rights. The IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60748-23-3 has been prepared by subcommittee 47A: Integrated
circuits, of IEC technical committee 47: Semiconductor devices.
The text of this standard is based on the European standard EN 165000-3 and the following
documents:
FDIS Report on voting
47A/640/FDIS 47A/651/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
IEC 60748-23-3 should be read in conjunction with Parts 23-1, 23-2 and 23-4.
The QC number that appears on the front cover of this publication is the specification number
in the IEC Quality Assessment System for Electronic Components (IECQ).
The committee has decided that the contents of this publication will remain unchanged until 2006.
At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
60748-23-3  IEC:2002(E) – 5 –
INTRODUCTION
This set of specifications prescribes a set o
...