IEC 60748-23-3:2002

Semiconductor devices - Integrated circuits - Part 23-3: Hybrid integrated circuits and film structures - Manufacturing line certification - Manufacturers' self-audit checklist and report

Applies to a high quality approval system for hybrid integrated circuits and film structures.This checklist is intended for the use of a hybrid microcircuit manufacturer's internal assessment team. It will provide the hybrid manufacturer and the National Supervising Inspectorate with ongoing information on process control demonstrating compliance with IEC 60748-23-1.

General Information

• Status: Published
• Publication Date: 16-May-2002
• ICS: 31.200 - Integrated circuits. Microelectronics
• Technical Committee: SC 47A - Integrated circuits
• Drafting Committee: WG 7 - TC 47/SC 47A/WG 7
• Current Stage: PPUB - Publication issued
• Start Date: 17-May-2002
• Completion Date: 15-Jun-2002

Overview

IEC 60748-23-3:2002 is an International Electrotechnical Commission (IEC) standard that defines a manufacturers' self-audit checklist and report for manufacturing line certification of hybrid integrated circuits and film structures. It supports a high quality approval system and is intended for use by a hybrid microcircuit manufacturer's internal assessment team and by National Supervising Inspectorates (NSI) to demonstrate ongoing process control and compliance with IEC 60748-23-1. The checklist is submitted during application or as evidence of continuing compliance (at intervals not exceeding one year).

Key Topics and Requirements

This part focuses on practical, process-level controls rather than broader quality management systems. Major technical topics covered include:

• Self-audit checklist and reporting structure for thick and thin film hybrid manufacturers
• Approval information and description of company/report structure
• Summary of testing and analytical methods; supporting evidence (SPC, engineering reports) should be appended
• Control of procurement sources and incoming materials
• Environmental control and electrostatic handling (ESD protection)
• Change notification requirements and hybrid design controls
• Detailed process-area sections:
  • Thick film processing (artwork, substrates, pastes, drying/firing, trimming, inspection, rework)
  • Thin film processing (masks, deposition, patterning, stabilization, trimming, rework)
  • Hybrid assembly (soldering, chip and wire assembly, termination robustness)
  • Test and dispatch procedures (electrical tests, burn‑in, environmental tests such as damp heat, vibration, shock, sealing/leak tests, visual/radiographic inspection)
• Certain checklist items are shown as mandatory in the document and must be addressed affirmatively or clearly marked “not applicable.”

Applications and Who Should Use It

IEC 60748-23-3 is intended for:

• Hybrid integrated circuit manufacturers performing internal process audits
• Quality engineers and process control teams establishing evidence of manufacturing line certification
• NSIs and certifying bodies reviewing submissions for IEC 60748-23-1 approval
• Procurement and design engineers who need to verify supplier capability for hybrid microcircuits and film structures

Practical uses include line certification submissions, annual self-assessments, supplier qualification, and documenting in‑process controls (e.g., SPC data, engineering reports) to support product reliability claims.

Related Standards

• IEC 60748-23-1 (Generic manufacturing line certification)
• IEC 60748-23-2 (Internal visual inspection and special tests)
• IEC 60748-23-4 (Blank detail specification)
• IEC 60748-1, IEC 60068-2-20, IEC 60695-2-2, IEC 61340-5-1 (referenced normative documents)
• IECQ 001002-3 (IECQ approval procedures)

Keywords: IEC 60748-23-3, hybrid integrated circuits, manufacturing line certification, manufacturers' self-audit, checklist and report, hybrid microcircuit, film structures, process control, NSI, SPC.

Standards Content (Sample)

INTERNATIONAL IEC
STANDARD
60748-23-3
QC 165000-3
First edition
2002-05
Semiconductor devices –
Integrated circuits –
Part 23-3:
Hybrid integrated circuits and film structures –
Manufacturing line certification –
Manufacturers' self-audit checklist and report
Dispositifs à semiconducteurs –
Circuits intégrés –
Partie 23-3:
Circuits intégrés hybrides et structures par films –
Certification de la ligne de fabrication –
Liste de contrôle et rapport d’évaluation interne
pour fabricants
Reference number
Publication numbering
As from 1 January 1997 all IEC publications are issued with a designation in the
60000 series. For example, IEC 34-1 is now referred to as IEC 60034-1.
Consolidated editions
The IEC is now publishing consolidated versions of its publications. For example,
edition numbers 1.0, 1.1 and 1.2 refer, respectively, to the base publication, the
base publication incorporating amendment 1 and the base publication incorporating
amendments 1 and 2.
Further information on IEC publications
The technical content of IEC publications is kept under constant review by the IEC,
thus ensuring that the content reflects current technology. Information relating to
this publication, including its validity, is available in the IEC Catalogue of
publications (see below) in addition to new editions, amendments and corrigenda.
Information on the subjects under consideration and work in progress undertaken
by the technical committee which has prepared this publication, as well as the list
of publications issued, is also available from the following:
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you to search by a variety of criteria including text searches, technical
committees and date of publication. On-line information is also available on
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further information.
• Customer Service Centre
If you have any questions regarding this publication or need further assistance,
please contact the Customer Service Centre:
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INTERNATIONAL IEC
STANDARD
60748-23-3
QC 165000-3
First edition
2002-05
Semiconductor devices –
Integrated circuits –
Part 23-3:
Hybrid integrated circuits and film structures –
Manufacturing line certification –
Manufacturers' self-audit checklist and report
Dispositifs à semiconducteurs –
Circuits intégrés –
Partie 23-3:
Circuits intégrés hybrides et structures par films –
Certification de la ligne de fabrication –
Liste de contrôle et rapport d’évaluation interne
pour fabricants
 IEC 2002  Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: [phone] Telefax: [phone] E-mail: [e-mail]  Web: www.iec.ch
PRICE CODE
Commission Electrotechnique Internationale
XC
International Electrotechnical Commission
Международная Электротехническая Комиссия
For price, see current catalogue

– 2 – 60748-23-3  IEC:2002(E)
CONTENTS
FOREWORD.4
INTRODUCTION.5
1 Scope.6
2 Document information.6
2.1 General .6
2.2 Normative references .6
3 Definitions .7
4 General requirements .7
4.1 Self-audit checklist and report for thick and thin film
hybrid integrated circuit manufacturers.8
4.2 Description of report/company structure .9
4.3 Approval information .10
4.4 Summary of testing .12
4.5 Analytical methods .14
4.6 Control of procurement sources and incoming material.15
4.7 Control of procurement sources and incoming material, continued .15
4.8 Environmental control and static handling .16
4.9 Change notification requirements .17
4.10 Hybrid design .17
5 Thick film processing.19
5.1 Artwork and screen fabrication .19
5.2 Substrates.20
5.3 Substrate saw or scribe and break and substrate hole drilling .21
5.4 Thick film pastes and printing .22
5.5 Drying and firing.26
5.6 Resistor trimming .27
5.7 Inspection and test of processing .28
5.8 Rework.29
6 Thin film processing .30
6.1 Artwork and mask fabrication .30
6.2 Substrates.31
6.3 Substrate saw or scribe and break and substrate hole drilling .33
6.4 Thin film processing materials and pattern forming.33
6.5 Drying and stabilization .35
6.6 Resistor trimming .36
6.7 Rework.37
7 Hybrid assembly.38
7.1 Solder assembly.39
7.2 Chip and wire assembly.46
8 Test and dispatch .57
8.1 Electrical tests.58
8.2 Burn-in .59
8.3 Endurance.61
8.4 Dry heat (stabilization bake).62
8.5 Change of temperature.63

60748-23-3  IEC:2002(E) – 3 –
8.6 Damp heat testing .64
8.7 Particle impact noise detection.65
8.8 Fine leak test.66
8.9 Gross leak test .67
8.10 Resistance to soldering heat .68
8.11 Termination robustness .68
8.12 Acceleration .69
8.13 Vibration.69
8.14 Shock.70
8.15 Dimensions .70
8.16 Bond-pull testing .71
8.17 Salt mist.72
8.18 Flammability.73
8.19 Solderability .73
8.20 Resistance to solvents .75
8.21 Internal visual inspection .76
8.22 External visual inspection.77
8.23 Radiographic inspection .77
8.24 Acceptance to dispatch .78

– 4 – 60748-23-3  IEC:2002(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
___________
SEMICONDUCTOR DEVICES – INTEGRATED CIRCUITS –
Part 23-3: Hybrid integrated circuits and film structures –
Manufacturing line certification –
Manufacturers' self-audit checklist and report
FOREWORD
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of the IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, the IEC publishes International Standards. Their preparation is
entrusted to technical committees; any IEC National Committee interested in the subject dealt with may
participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. The IEC collaborates closely with the International
Organization for Standardization (ISO) in accordance with conditions determined by agreement between the
two organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an
international consensus of opinion on the relevant subjects since each technical committee has representation
from all interested National Committees.
3) The documents produced have the form of recommendations for international use and are published in the form
of standards, technical specifications, technical reports or guides and they are accepted by the National
Committees in that sense.
4) In order to promote international unification, IEC National Committees undertake to apply IEC International
Standards transparently to the maximum extent possible in their national and regional standards. Any
divergence between the IEC Standard and the corresponding national or regional standard shall be clearly
indicated in the latter.
5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with one of its standards.
6) Attention is drawn to the possibility that some of the elements of this International Standard may be the subject
of patent rights. The IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60748-23-3 has been prepared by subcommittee 47A: Integrated
circuits, of IEC technical committee 47: Semiconductor devices.
The text of this standard is based on the European standard EN 165000-3 and the following
documents:
FDIS Report on voting
47A/640/FDIS 47A/651/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
IEC 60748-23-3 should be read in conjunction with Parts 23-1, 23-2 and 23-4.
The QC number that appears on the front cover of this publication is the specification number
in the IEC Quality Assessment System for Electronic Components (IECQ).
The committee has decided that the contents of this publication will remain unchanged until 2006.
At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
60748-23-3  IEC:2002(E) – 5 –
INTRODUCTION
This set of specifications prescribes a set of procedures to be used by users and
manufacturers for the production and delivery of high-quality, special requirement hybrid
integrated circuits and film structures with a specified level of quality and reliability.
This set of specifications prescribes reference criteria for the establishment, control,
maintenance and development of a certified manufacturing line and represents a
manufacturing line certification methodology.
The targeted level of quality and reliability is to be achieved by using best design and
manufacturing practices. Examples of quality and reliability best practices for elimination of
potential failure mechanisms and achievement of a targeted quality and reliability level
include: material characterization for derivation of process design rules, in-process control,
continuous improvement, etc.
Assessment (estimation) of the targeted quality and reliability level may be accomplished by:
a) using data obtained from the material characterization, design and process control and
improvement activities; or
b) through the use of product assessment level schedule (PALS) tests.
Part 23-1 of this set of specifications provides general information.
Part 23-2 of this set of specifications provides guidance to 'users' of hybrids in terms of the
'visual inspection standards' to be expected.
Part 23-4 of this set of specifications provides a blank detail specification, which provides
guidance to 'users' of hybrids for procurement purposes.
Part 23-5 of this set of specifications provides a means of quality assessment on the basis of
qualification approval.
– 6 – 60748-23-3  IEC:2002(E)
SEMICONDUCTOR DEVICES – INTEGRATED CIRCUITS –
Part 23-3: Hybrid integrated circuits and film structures –
Manufacturing line certification –
Manufacturers' self-audit checklist and report
1 Scope
This part of IEC 60748 applies to a high quality approval system for hybrid integrated circuits
and film structures.
This checklist is intended for the use of a hybrid microcircuit manufacturer's internal
assessment team.
It will provide the hybrid manufacturer and the National Supervising Inspectorate (NSI) with
ongoing information on process control demonstrating compliance with IEC 60748-23-1. It is
not intended to include quality system requirements.
2 Document information
2.1 General
The checklist and subsequent report is for submission to the NSI in support of an application
for approval to IEC 60748-23-1, or as a demonstration of continuing compliance at intervals
not exceeding 1 year. Each item in clauses 3 to 7 shall be completed or marked “not
applicable”; items which invoke mandatory process or inspection requirements are shown in
bold italics.
It should be noted that it is not the requirement or the intention that each item has to be
answered with an affirmative, excepting mandatory requirements. The objective of the report
is for the manufacturer to demonstrate that all manufacturing processes are under control by
whatever means this is achieved.
Where supporting evidence is included, for example engineering reports, statistical process
control (SPC) data, etc., it should be appended to the report.
The manufacturer may use his own style of typeface to reproduce this document and produce
his report.
The NSI may subsequently validate any part of the submission as a process assessment.
2.2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60050 (all parts), International Electrotechnical Vocabulary
IEC 60068-2-20:1979, Basic environmental testing procedures – Part 2: Tests – Test T: Soldering

60748-23-3  IEC:2002(E) – 7 –
IEC 60695-2-2:1991, Fire hazard testing – Part 2: Test methods – Section 2: Needle-flame test
Amendment 1 (1994)
IEC 60748-1, Semiconductor devices – Integrated circuits – Part 1: General
IEC 60748-23-1:2002, Semiconductor devices – Integrated circuits – Part 23-1: Hybrid
integrated circuits and film structures – Manufacturing line certification – Generic specification
IEC 60748-23-2:2002, Semiconductor devices – Integrated circuits – Part 23-2: Hybrid
integrated circuits and film structures – Manufacturing line certification – Internal visual
inspection and special tests
IEC 60748-23-4:2002, Semiconductor devices – Integrated circuits – Part 23-4: Hybrid
integrated circuits and film structures – Manufacturing line certification – Blank detail
specification
IEC 61340-5-1:1998, Electrostatics – Part 5-1: Protection of electronic devices from
electrostatic phenomena – General requirements
IECQ 001002-3:1998, IEC Quality Assessment System for Electronic Components (IECQ) –
Rules of Procedure – Part 3: Approval procedures
3 Definitions
For the purpose of this part of IEC 60748, the definitions given in IEC 60050, IEC 60748-1,
IEC 60748-23-1 and IEC 60748-23-2 shall apply.
4 General requirements
The following subclauses contain:
4.1 Self-audit checklist and report for thick and thin film hybrid integrated circuit
manufacturers
4.2 Description of report/company structure
4.3 Approval information
4.4 Summary of testing
4.5 Analytical methods
4.6 Control of procurement sources and incoming material
4.7 Control of procurement sources and incoming material, continued
4.8 Environmental control and static handling
4.9 Change notification requirements
4.10 Hybrid design
– 8 – 60748-23-3  IEC:2002(E)
4.1 Self-audit checklist and report for thick and thin film hybrid integrated circuit
manufacturers
Report No: Date:
Previous report No: Date:
*
Approval: application/periodic review/extension/major change
Company name:
Address:
Postcode:
Telephone: Telex: Facsimile:
Company declaration
The information contained herein is a true and accurate record of appraisals carried out
between  /  /  and  /  /  .
Report compiled by: Signed: Date:   /  /
Report approved by: Signed: Date:   /  /
NSI counter-signature
The information supplied in this report fully supports the application/periodic
*
review/extension/major change as detailed.
The following items of this report have been subject to subsequent evaluation by the NSI:
For NSI: Signed: Date:  /  /
———————
*
Delete as appropriate.
60748-23-3  IEC:2002(E) – 9 –
4.2 Description of report/company structure
Provide a description for the purpose of this report.
a. For a new approval application – State the extent of the technology sought in terms of
materials, complexity, packaging, etc. together with
the maximum screening/test level applied for from
IEC 60748-23-1, annex A.
b. For an extension/major change – Nature of technology extension required, or details
of process/equipment change.
Senior management:
Name:                 Position:                 Location:
Name:                 Position:                 Location:
Name:                 Position:                 Location:
Name:                 Position:                 Location:
Name:                 Position:                 Location:
Name:                 Position:                 Location:
Name:                 Position:                 Location:
Name:                 Position:                 Location:
Quality department:
Name:                  Position: Quality Manager Reports to:
Name:                  Position: Deputy Quality Manager
Number of quality engineers:
Number of inspectors per shift:
Number of employees engaged in hybrid production:
Total:
Administration:
Production engineers:
Production operators:
Production inspection:
Design engineers:
Reliability engineers:
Supervisors:
Production:
*
Thick film substrate production: YES/NO Number of shifts:
*
Thin film substrate production: Number of shifts:
YES/NO
*
Solder assembly: Number of shifts:
YES/NO
Chip and wire: YES/NO * Number of shifts:
Test and environmental: YES/NO * Number of shifts:
Quality engineering: YES/NO * Number of shifts:
Quality inspection: YES/NO * Number of shifts:
Production supervision: YES/NO * Number of shifts:
———————
*
Delete as appropriate.
– 10 – 60748-23-3  IEC:2002(E)
Production line (space allocations):
Design: area in m
Development: area in m
Production: area in m
Test and environmental: area in m
Market:
Space:   % Military:   % Telecom:    % Automotive:    % Others:    %
4.3 Approval information
*
Approved quality system to IEC QC 001002-3: YES/NO  Approval No: Assessed:  /  /
Approved to IEC 60748-23-1: YES/NO * Approval No: Assessed:  /  /
Other national/international approvals held:
Approval Type: Approval No: Assessed:  /  /
Approval Type: Approval No: Assessed:  /  /
Approval Type: Approval No: Assessed:  /  /
Approval Type: Approval No: Assessed:  /  /
Approval Type: Approval No: Assessed:  /  /
Commercial approvals (e.g. Ford, IBM, etc.) held:
Approval Type: Approval No: Assessed:  /  /
Approval Type: Approval No: Assessed:  /  /
Approval Type: Approval No: Assessed:  /  /
Approval Type: Approval No: Assessed:  /  /
Approval Type: Approval No: Assessed:  /  /
Notes
———————
*
Delete as appropriate.
60748-23-3  IEC:2002(E) – 11 –
Example of abstract of capability approval
IEC 60748-23-1 approval number ABC123
Thick film technology:
General:
In 1937 Welwyn was set up to manufacture high grade resistors primarily for use by the
telecommunications industries. During 1962 the company began production of custom
electronic hybrid integrated circuits for industrial, telecommunications and military customers.
Today Welwyn uses the latest technology to design and produce high reliability hybrids
conforming to the most exacting requirements of customer applications, for customers
requiring a wide range of electronic circuit complexity/density and for quantities of hybrids
ranging from small batch production to high volume production. In addition 100 % screening
tests and customer design evaluation testing programmes are also available to provide the
highest level of quality assurance required by any customer.
Current levels of release available:
Maximum IEC 60748-23-1,
annex A
Dimensions Reference
Surface-mount, non-hermetic technology 50,8 mm × 25,4 mm PALS 5
Surface-mount, hermetic technology 54,5 mm × 29,2 mm PALS 8
Chip and wire, non-hermetic technology 50,8 mm × 25,4 mm PALS 5
Chip and wire, hermetic technology 54,5 mm × 29,2 mm PALS 8
Sub-contracted processes: None.
Address:
Welwyn Microcircuits
Factory D
BEDLINGTON
Northumberland
NE22 7AA
UNITED KINGDOM
Tel: [phone]
Fax:  [phone]
Telex: 53514
– 12 – 60748-23-3  IEC:2002(E)
Contacts:
Commercial Manager:  Mr G Thompson, Ext. 421
Quality Manager:     Mr D Oliver, Ext. 430
4.4 Summary of testing
The product testing record example shown below and overleaf is for guidance as to the
required information. The manufacturer's own records may provide this information without
amendment. Prior agreement should be reached with the NSI as to the form and content of
supplied records.
PRODUCT TESTING RECORD
Product type No:
MANUFACTURER’S
PALS release level:
NAME
Package type:
AND ADDRESS
Technology description:
DESIGN EVALUATION
TEST Date
No. No. Structural similarity claimed
tested failed type No(s)
Endurance
Damp heat
Resistance to soldering
heat
Termination robustness
Acceleration
Vibration
Shock
Solderability
Flammability
Resistance to solvents
Internal moisture content
Radiographic inspection
Salt mist
Others
60748-23-3  IEC:2002(E) – 13 –
Summary of testing (continued)
DEVICE SCREENING
BATCH No. BATCH SIZE No. FAILED TEST/FAILURE
DEVICE SAMPLE TESTING
TEST INSP. LOT BATCH(es) SAMPLE SIZE FAILURE AND CAUSE

– 14 – 60748-23-3  IEC:2002(E)
4.5 Analytical methods
Is an SPC system involving critical or key
*
YES/NO Issue No.
Document No.
process nodes defined?
Are analytical tools used to determine the
appropriate characteristics to be measured
for critical or key nodes e.g. failure mode
and effects analysis (FMEA), etc.? YES/NO * Document No. Issue No.
Do these include:
Minimum inspections? YES/NO *
Result distribution? YES/NO *
Relation to other product? YES/NO *
Corrective action? YES/NO *
Are SPC process controls in place for:
Film pattern registration? YES/NO * Document No. Issue No.
Film thickness
Wet? YES/NO * Document No. Issue No.
Dry? YES/NO * Document No. Issue No.
Fired? YES/NO * Document No. Issue No.
Film track width and separation? YES/NO * Document No. Issue No.
Fired resistor value (pre-trim)? YES/NO * Document No. Issue No.
Printed or film adhesive thickness pre-cure
(including solder paste) for add-on
components? YES/NO * Document No. Issue No.
Wire bond strength test for bare die
interconnect? YES/NO * Document No. Issue No.
Are the appropriate staff formally
trained on procedures, equipment and
visual standards? YES/NO * Document No. Issue No.
———————
*
Delete as appropriate.
60748-23-3  IEC:2002(E) – 15 –
Provide achieved process capability indices:
4.6 Control of procurement sources and incoming material
4.6.1 Added components procured to an IEC specification
Where added components are procured
to an IEC specification are they
*
procured to normal release procedures? YES/NO Document No. Issue No.
4.6.2 Added components not procured to an IEC specification
Does a procurement specification controlled
by the hybrid manufacturer exist or each
added component? YES/NO * Document No. Issue No.
Does an approved test and evaluation
programme controlled by the hybrid
manufacturer exist for each added
component? YES/NO * Document No. Issue No.
Is the approval test programme carried out
on each added component from each
manufacturing source? YES/NO * Document No. Issue No.
Do the above procedures ensure that all
added components are subject to testing
and screening equivalent to components
released to IECQ? YES/NO * Document No. Issue No.
4.6.3 Part finished added components or subcontracted processes
Are part finished components or processes
subject to the procurement controls detailed
in 3.6.1 or 3.6.2 above? YES/NO * Document No. Issue No.
Are parts stored and handled such
that they are not subject to deterioration
or damage? YES/NO * Document No. Issue No.
Do all dies conform to the relevant IEC
visual criteria? YES/NO * Document No. Issue No.
4.7 Control of procurement sources and incoming material, continued
4.7.1 Other materials and components
Do procurement specifications exist for all
other materials and components used in the
*
hybrid manufacture? YES/NO
Document No Issue No.
Do these specifications ensure that the
hybrid manufacturer is made aware of any
change to these materials and which
components might effect hybrid
*
manufacturing quality, yield or reliability? YES/NO
Document No. Issue No.
———————
*
Delete as appropriate.
– 16 – 60748-23-3  IEC:2002(E)
4.7.2 Continuous assessment of procurement sources
For components or materials not procured
to an IEC specification, is a continuous
vendor rating system of suppliers
*
maintained? YES/NO Document No. Issue No.
Are suppliers regularly informed of their
vendor rating? YES/NO * Document No Issue No.
4.7.3 Traceability
Are the circuits, their added components,
piece parts and materials traceable to
*
original manufacturers’ lot numbers? YES/NO Document No. Issue No.
Notes
4.8 Environmental control and static handling
Are there procedure(s) for controlling
the environment? YES/NO * Document No. Issue No.
Document No. Issue No.
Document No. Issue No.
Do these procedures include:
*
Compliance with IEC 61340-5-1:
YES/NO
Facility cleaning:
*
1. Control
YES/NO
*
2. Review
YES/NO
Prevention of human contamination:
*
1. Use of finger cots or gloves
YES/NO
*
2. Suitable clothing
YES/NO
*
3. Spittle control
YES/NO
*
4. Gowning procedure
YES/NO
*
5. Personnel property
YES/NO
*
6. Cosmetics
YES/NO
———————
*
Delete as appropriate.
60748-23-3  IEC:2002(E) – 17 –
Defined limits and monitoring of:
*
1. Temperature
YES/NO
*
2. Humidity
YES/NO
*
3. Particle count
YES/NO
*
4. Positive pressure
YES/NO
*
5. Field intensity
YES/NO
*
Facility shut down procedure:
YES/NO
*
Material storage and access:
YES/NO
4.9 Change notification requirements
Is there a procedure for controlling
*
change notification? YES/NO Document No. Issue No.
Does this change procedure identity
when a report is required by the NSI in
*
accordance with 6.5.2 of IEC 60748-23-1?
YES/NO
Have any notifications of change been
made during the period of this report? YES/NO *
Please provide report identities and dates:
4.10 Hybrid design
Are there separate design rules for each
technology? YES/NO *
Technology type Document No. Issue No.
Technology type Document No. Issue No.
Technology type Document No. Issue No.
Technology type Document No Issue No.
Technology type Document No. Issue No.
Do these design rules include:
Internal materials types and usage? YES/NO *
Package materials types and usage? YES/NO *
Electrical design, including current
Densities, track resistance and
Capacitance, tolerance, stability, etc.? YES/NO *
Thermal design? YES/NO *
Environmental design i.e. package type,
stress, shock, vibration, temperature, etc.? YES/NO *
Are design rules formally issued
and controlled? YES/NO * Document No. Issue No.
———————
*
Delete as appropriate.
– 18 – 60748-23-3  IEC:2002(E)
Do the design rules include all
aspects of the visual criteria of
*
IEC 60748-23-1? YES/NO Document No. Issue No.
Is a periodic review carried out to ensure
that new materials, processes and
*
components are incorporated? Issue No.
YES/NO Document No.
Are design layout checks performed by:
1. Engineering? YES/NO * Document No. Issue No.
2. Customer? YES/NO * Document No. Issue No.
3. Others (specify)? Document No. Issue No.
Are formal design reviews carried out
prior to production? YES/NO * Document No. Issue No.
Does this review include:
*
The fact that the design is within
YES/NO
the scope of approval?
Customer requirements? YES/NO *
Electrical functionality? YES/NO *
Thermal considerations? YES/NO *
Environmental conditions? YES/NO *
Device screening requirements? YES/NO *
Reliability e.g. material combinations? YES/NO *
Safety e.g. materials, failure mode? YES/NO *
Static e.g. handling, bonding order? YES/NO *
Delivery requirements, packaging? YES/NO *
Notes
———————
*
Delete as appropriate.
60748-23-3  IEC:2002(E) – 19 –
5 Thick film processing
The following subclauses contain:
5.1 Artwork and screen fabrication
5.2 Substrates
5.3 Substrate saw or scribe and break and substrate hole drilling
5.4 Thick film pastes and printing
5.5 Drying and firing
5.6 Resistor trimming
5.7 Inspection and test of processing
5.8 Rework
5.1 Artwork and screen fabrication
*
Is artwork prepared in-house? YES/NO Document No. Issue No.
Is screen manufacture in-house? YES/NO * Document No. Issue No.
Are quality assurance checks carried
out before use? YES/NO * Document No Issue No.
Is there evaluation of new
*
screen materials? YES/NO Document No. Issue No.
Is screen tension measured
*
before use? YES/NO Document No. Issue No.
Limits: Min.     Max.
Do screens have unique reference
and revision control? YES/NO * Document No. Issue No.
Is screen storage:
Catalogued? YES/NO * Document No. Issue No.
*
Access/segregation controlled? YES/NO Document No. Issue No.
*
In a controlled environment? YES/NO Class
Screen usage:
Is the number of prints/or wear
allowed per screen monitored and
*
recorded? YES/NO Document No. Issue No.
Is screen tension periodically
*
measured throughout screen life? YES/NO Document No. Issue No.
Limits: Min.    Max.    period
Are the appropriate staff formally
trained on procedures, equipment
*
and visual standards? YES/NO Document No Issue No
———————
*
Delete as appropriate.
– 20 – 60748-23-3  IEC:2002(E)
5.2 Substrates
Substrates used: Manufacturer Types
Manufacturer Types
Manufacturer Types
Manufacturer Types
*
Incoming checks: Dimensions YES/NO
Camber YES/NO *
Bow YES/NO *
Material YES/NO *
Surface YES/NO * Document No. Issue No.
Are substrates cleaned? YES/NO *
Chemical and method:
Chemical purity checked YES/NO *
Routine replacement YES/NO
Calibration YES/NO *
Is substrate storage controlled
between cleaning and use? YES/NO * Document No. Issue No.
Are the appropriate staff formally
trained on procedures, equipment
and visual standards? YES/NO * Document No. Issue No.
Notes
———————
*
Delete as appropriate.
60748-23-3  IEC:2002(E) – 21 –
5.3 Substrate saw or scribe and break and substrate hole drilling
Enter all equipment used, or new/refurbished equipment since last report.
Manufacturer Type No. Serial/Plant No.
Manufacturer Type No. Serial/Plant No.
Manufacturer Type No. Serial/Plant No.
Manufacturer Type No. Serial/Plant No.
Manufacturer Type No. Serial/Plant No.
Manufacturer Type No. Serial/Plant No.
Are there unique references for
*
substrate profile drawings? YES/NO Document No. Issue No.
Is the registration side of the
*
substrate clearly identified? YES/NO
Is this also the registration for
*
the pattern marking? YES/NO
Are there procedures covering
*
power/speed setting? YES/NO Document No. Issue No.
Is there a formal maintenance
*
procedure for the cutting equipment? YES/NO Document No. Issue No.
If substrates are procured prescribed
or drilled, is there a detailed
*
procurement specification? YES/NO Document No. Issue No.
Are quality assurance checks made
*
on dimensions? YES/NO Document No. Issue No.
Are the substrates cleaned prior to
*
returning to stores? YES/NO Document No. Issue No.
Chemical and method:
*
Is chemical purity checked? YES/NO
*
Is there a routine replacement programme? YES/NO
*
Is there calibration of the method? YES/NO
Are the appropriate staff formally
trained on procedures,
*
equipment and visual standards? YES/NO Document No. Issue No.
———————
*
Delete as appropriate.
– 22 – 60748-23-3  IEC:2002(E)
5.4 Thick film pastes and printing
Conductor inks:
Manufacturer Type No.       Composition Use
Manufacturer Type No.       Composition Use
Manufacturer Type No.       Composition Use
Manufacturer Type No.       Composition Use
Manufacturer Type No.       Composition Use
Manufacturer Type No.       Composition Use
NOTE Use = Minimum dimension /No. layers/termination, etc.
Resistor inks:
Manufacturer Series No.       Compatible conductor type Range
Manufacturer Series No.       Compatible conductor type Range
Manufacturer Series No.       Compatible conductor type Range
Manufacturer Series No.       Compatible conductor type Range
Manufacturer Series No.       Compatible conductor type Range
Dielectric and print protect inks:
Manufacturer Type No.       Composition Use
Manufacturer Type No.       Composition Use
Manufacturer Type No.       Composition Use
Manufacturer Type No.       Composition Use
Overglaze/covercoats:
Manufacturer Type No.       Composition Use
Manufacturer Type No.       Composition Use
Manufacturer Type No.       Composition Use
Manufacturer Type No.       Composition Use
*
Is lot traceability maintained YES/NO Document No. Issue No.
for all ink usage?
Is age control and storage control
*
within paste manufacturers’ limits? YES/NO Document No. Issue No.
Are evaluation and viscosity
measurements carried out on each
*
batch? YES/NO Document No. Issue No.
———————
*
Delete as appropriate.
60748-23-3  IEC:2002(E) – 23 –
Have adhesion tests been carried out
*
on all substrate/ink combinations? YES/NO Document No. Issue No.
Are paste combinations from different
manufacturers used on the same
substrate or are combinations other
*
than recommended used? YES/NO
Have these combinations
*
been fully evaluated? YES/NO Document No. Issue No.
Is there control on the blending of
*
resistor inks? YES/NO Document No. Issue No.
Is each batch checked with a
*
process test vehicle? YES/NO Document No. Issue No.
Printing machines:
Enter all machines used, or new/refurbished equipment since last report.
Manufacturer Type No. Serial/Plant No.
Manufacturer Type No. Serial/Plant No.
Manufacturer Type No. Serial/Plant No.
Manufacturer Type No. Serial/Plant No.
Manufacturer Type No. Serial/Plant No.
Manufacturer Type No. Serial/Plant No.
Manufacturer Type No. Serial/Plant No.
Manufacturer Type No. Serial/Plant No.
Manufacturer Type No. Serial/Plant No
———————
*
Delete as appropriate.
– 24 – 60748-23-3  IEC:2002(E)
Is there a formal procedure for print
machine maintenance including
squeegee wear, screen usage,
*
mechanical set-up, etc? YES/NO Document No. Issue No.
Is printing carried out in a controlled
*
environment? YES/NO Class
Are there restrictions regarding
*
human contamination in the area? YES/NO Document No. Issue No.
Does the area have controlled cleaning
*
procedures? YES/NO Document No. Issue No.
Are there instructions regarding
each type of paste for
*
operators/supervisors? YES/NO Document No. Issue No.
Is there a procedure controlling
screen cleaning/paste retention. Does
this procedure guard against paste
*
contamination and dilution? YES/NO Document No. Issue No.
Are there restrictions on machine
settings speed, standoff, pressure, etc.
*
– for operators? YES/NO Document No. Issue No.
*
– for supervisors? YES/NO Document No. Issue No.
Are machine controls protected against
*
accidental movement? YES/NO
*
Is a usage log kept per machine? YES/NO Document No. Issue No.
Are visual checks carried out on each
*
print layer? YES/NO
*
By production YES/NO Document No. Issue No.
*
Sample by quality assurance YES/NO Document No. Issue No.
*
Do these visual checks conform YES/NO Document No. Issue No.
to a written procedure?
Are the appropriate staff formally
trained on procedures, equipment
*
and visual standards? YES/NO Document No. Issue No.
———————
*
Delete as appropriate.
60748-23-3  IEC:2002(E) – 25 –
*
Are thickness measurements made? YES/NO Document No. Issue No.
Conductor type Nos.       Wet Dried      Fired Min/Max
Conductor type Nos. Wet Dried      Fired Min/Max
Conductor type Nos. Wet Dried      Fired Min/Max
Dielectric type Nos. Wet Dried      Fired Min/Max
Dielectric type Nos. Wet Dried      Fired Min/Max
Dielectric type Nos. Wet Dried      Fired Min/Max
Resistor type Nos. Wet Dried      Fired Min/Max
Resistor type Nos. Wet Dried      Fired Min/Max
Resistor type Nos. Wet Dried      Fired Min/Max
Notes
———————
*
Delete as appropriate.
– 26 – 60748-23-3  IEC:2002(E)
5.5 Drying and firing
Drying:
Enter all ovens/belts used, or new/refurbished equipment since last report.
Manufacturer Type No. Serial/Plant No.
Manufacturer Type No. Serial/Plant No.
Manufacturer Type No. Serial/Plant No.
Manufacturer Type No. Serial/Plant No.
Manufacturer Type No. Serial/Plant No.
Manufacturer Type No. Serial/Plant No.
Manufacturer Type No. Serial/Plant No.
Manufacturer Type No. Serial/Plant No.
Manufacturer Type No. Serial/Plant No.
Is dwell time, before drying, controlled
*
and to manufacturer’s recommendations? Issue No.
YES/NO Document No.
Is drying carried out at paste
manufacturer’s recommended
time/temperature profiles for all
*
ink types used? YES/NO Document No. Issue No.
Are drying ovens/belts profiled at
*
maximum load and usage? YES/NO Document No. Issue No.
At what periodicity are the drying
ovens/belts profiled?
Is a usage log with time/batch information
*
kept per oven/belt? YES/NO Document No. Issue No.
Are there restrictions on multiple loading
of ovens, i.e. door opening during
*
curing cycle? YES/NO Document No Issue No.
Are machine controls protected against
*
accidental movement? YES/NO
Is there a maintenance procedure for
*
the ovens and belts? YES/NO Document No. Issue No
———————
*
Delete as appropriate.
60748-23-3  IEC:2002(E) – 27 –
Firing:
Enter all furnaces used, or new/refurbished equipment since last report.
Manufacturer Type No. Serial/Plant No.
Manufacturer Type No. Serial/Plant No.
Manufacturer Type No. Serial/Plant No.
Manufacturer Type No. Serial/Plant No.
Manufacturer Type No. Serial/Plant No.
Manufacturer Type No. Serial/Plant No.
Is the firing profile and atmosphere to the
paste manufacturers’ recommended time/
*
temperature profiles for all ink types used? YES/NO Document No. Issue No.
Are furnaces profiled at maximum
*
load and usage? YES/NO Document No. Iss
...