Semiconductor devices - Integrated circuits - Part 23-3: Hybrid integrated circuits and film structures - Manufacturing line certification - Manufacturers' self-audit checklist and report

Applies to a high quality approval system for hybrid integrated circuits and film structures.This checklist is intended for the use of a hybrid microcircuit manufacturer's internal assessment team. It will provide the hybrid manufacturer and the National Supervising Inspectorate with ongoing information on process control demonstrating compliance with IEC 60748-23-1.

General Information

Status
Published
Publication Date
16-May-2002
Technical Committee
Drafting Committee
Current Stage
PPUB - Publication issued
Start Date
15-Jun-2002
Completion Date
17-May-2002
Ref Project

Buy Standard

Standard
IEC 60748-23-3:2002 - Semiconductor devices - Integrated circuits - Part 23-3: Hybrid integrated circuits and film structures - Manufacturing line certification - Manufacturers' self-audit checklist and report
English language
78 pages
sale 15% off
Preview
sale 15% off
Preview

Standards Content (Sample)

INTERNATIONAL IEC
STANDARD
60748-23-3
QC 165000-3
First edition
2002-05
Semiconductor devices –
Integrated circuits –
Part 23-3:
Hybrid integrated circuits and film structures –
Manufacturing line certification –
Manufacturers' self-audit checklist and report
Dispositifs à semiconducteurs –
Circuits intégrés –
Partie 23-3:
Circuits intégrés hybrides et structures par films –
Certification de la ligne de fabrication –
Liste de contrôle et rapport d’évaluation interne
pour fabricants
Reference number
IEC 60748-23-3:2002(E)

---------------------- Page: 1 ----------------------
Publication numbering
As from 1 January 1997 all IEC publications are issued with a designation in the
60000 series. For example, IEC 34-1 is now referred to as IEC 60034-1.
Consolidated editions
The IEC is now publishing consolidated versions of its publications. For example,
edition numbers 1.0, 1.1 and 1.2 refer, respectively, to the base publication, the
base publication incorporating amendment 1 and the base publication incorporating
amendments 1 and 2.
Further information on IEC publications
The technical content of IEC publications is kept under constant review by the IEC,
thus ensuring that the content reflects current technology. Information relating to
this publication, including its validity, is available in the IEC Catalogue of
publications (see below) in addition to new editions, amendments and corrigenda.
Information on the subjects under consideration and work in progress undertaken
by the technical committee which has prepared this publication, as well as the list
of publications issued, is also available from the following:
• IEC Web Site (www.iec.ch)
• Catalogue of IEC publications
The on-line catalogue on the IEC web site (www.iec.ch/catlg-e.htm) enables
you to search by a variety of criteria including text searches, technical
committees and date of publication. On-line information is also available on
recently issued publications, withdrawn and replaced publications, as well as
corrigenda.
• IEC Just Published
This summary of recently issued publications (www.iec.ch/JP.htm) is also
available by email. Please contact the Customer Service Centre (see below) for
further information.
• Customer Service Centre
If you have any questions regarding this publication or need further assistance,
please contact the Customer Service Centre:
Email: custserv@iec.ch
Tel: +41 22 919 02 11
Fax: +41 22 919 03 00

---------------------- Page: 2 ----------------------
INTERNATIONAL IEC
STANDARD
60748-23-3
QC 165000-3
First edition
2002-05
Semiconductor devices –
Integrated circuits –
Part 23-3:
Hybrid integrated circuits and film structures –
Manufacturing line certification –
Manufacturers' self-audit checklist and report
Dispositifs à semiconducteurs –
Circuits intégrés –
Partie 23-3:
Circuits intégrés hybrides et structures par films –
Certification de la ligne de fabrication –
Liste de contrôle et rapport d’évaluation interne
pour fabricants
 IEC 2002  Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmail@iec.ch  Web: www.iec.ch
PRICE CODE
Commission Electrotechnique Internationale
XC
International Electrotechnical Commission
Международная Электротехническая Комиссия
For price, see current catalogue

---------------------- Page: 3 ----------------------
– 2 – 60748-23-3  IEC:2002(E)
CONTENTS
FOREWORD.4
INTRODUCTION.5
1 Scope.6
2 Document information.6
2.1 General .6
2.2 Normative references .6
3 Definitions .7
4 General requirements .7
4.1 Self-audit checklist and report for thick and thin film
hybrid integrated circuit manufacturers.8
4.2 Description of report/company structure .
...

Questions, Comments and Discussion

Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.