IEC 61967-6:2002+AMD1:2008 CSV

Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method

IEC 61967-6 Ed 1.1:2008 specifies a method for evaluating RF currents on the pins of an integrated circuit (IC) by means of non-contact current measurement using a miniature magnetic probe. This method is capable of measuring the RF currents generated by the IC over a frequency range of 0,15 MHz to 1 000 MHz. This method is applicable to the measurement of a single IC or a chip set of ICs on the standardized test board for characterization and comparison purposes. It is also usable to evaluate the electromagnetic characteristics of an IC or group of ICs on an actual application PCB for emission reduction purposes. This method is called the "magnetic probe method". This consolidated version consists of the first edition (2002) and its amendment 1 (2008). Therefore, no need to order amendment in addition to this publication.

Circuits intégrés - Mesure des émissions électromagnétiques, 150 kHz à 1 GHz - Partie 6: Mesure des émissions conduites - Méthode de la sonde magnétique

La CEI 61967-6 Ed 1.1:2008 spécifie une méthode pour l'évaluation des courants RF sur les broches d'un circuit intégré par la mesure du courant sans contact en utilisant une sonde magnétique miniature. Cette méthode permet de mesurer les courants RF générés par le circuit intégré (CI) dans une plage de fréquences allant de 0,15 MHz à 1 000 MHz. Cette méthode est applicable aux mesures sur un seul CI ou sur un ensemble de puces de CI sur la carte d'essai normalisée afin de fournir les caractéristiques et de permettre les comparaisons. Elle est également utilisable pour l'évaluation des caractéristiques électromagnétiques d'un CI ou d'un groupe de CI sur une carte de circuit imprimé d'application réelle afin de réduire les émissions. Cette méthode est désignée sous le terme "Méthode de la sonde magnétique".  Cette version consolidée comprend la première édition (2002) et son amendement 1 (2008). Il n'est donc pas nécessaire de commander l'amendement avec cette publication.

General Information

• Status: Published
• Publication Date: 23-Jun-2008
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 23.120 - Ventilators. Fans. Air-conditioners
• ICS: 31.200 - Integrated circuits. Microelectronics
• Technical Committee: SC 47A - Integrated circuits
• Current Stage: PPUB - Publication issued
• Start Date: 24-Jun-2008
• Completion Date: 24-Jun-2008

Standards Content (Sample)

IEC 61967-6
Edition 1.1 2008-06
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Integrated circuits – Measurement of electromagnetic emissions, 150 kHz
to 1 GHz –
Part 6: Measurement of conducted emissions – Magnetic probe method

Circuits intégrés – Mesure des émissions électromagnétiques, 150 kHz à 1 GHz –
Partie 6: Mesure des émissions conduites – Méthode de la sonde magnétique
IEC 61967-6:2002+A1:2008

---------------------- Page: 1 ----------------------
THIS PUBLICATION IS COPYRIGHT PROTECTED
Copyright © 2008 IEC, Geneva, Switzerland

All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by
any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from either IEC or
IEC's member National Committee in the country of the requester.
If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication,
please contact the address below or your local IEC member National Committee for further information.

Droits de reproduction réservés. Sauf indication contraire, aucune partie de cette publication ne peut être reproduite
ni utilisée sous quelque forme que ce soit et par aucun procédé, électronique ou mécanique, y compris la photocopie
et les microfilms, sans l'accord écrit de la CEI ou du Comité national de la CEI du pays du demandeur.
Si vous avez des questions sur le copyright de la CEI ou si vous désirez obtenir des droits supplémentaires sur cette
publication, utilisez les coordonnées ci-après ou contactez le Comité national de la CEI de votre pays de résidence.

IEC Central Office
3, rue de Varembé
CH-1211 Geneva 20
Switzerland
Email: [e-mail]
Web: www.iec.ch

About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigenda or an amendment might have been published.
ƒ Catalogue of IEC publications: www.iec.ch/searchpub
The IEC on-line Catalogue enables you to search by a variety of criteria (reference number, text, technical committee,…).
It also gives information on projects, withdrawn and replaced publications.
ƒ IEC Just Published: www.iec.ch/online_news/justpub
Stay up to date on all new IEC publications. Just Published details twice a month all new publications released. Available
on-line and also by email.
ƒ Electropedia: www.electropedia.org
The world's leading online dictionary of electronic and electrical terms containing more than 20 000 terms and definitions
in English and French, with equivalent terms in additional languages. Also known as the International Electrotechnical
Vocabulary online.
ƒ Customer Service Centre: www.iec.ch/webstore/custserv
If you wish to give us your feedback on this publication or need further assistance, please visit the Customer Service
Centre FAQ or contact us:
Email: [e-mail]
Tel.: [phone]
Fax: [phone]


A propos de la CEI
La Commission Electrotechnique Internationale (CEI) est la première organisation mondiale qui élabore et publie des
normes internationales pour tout ce qui a trait à l'électricité, à l'électronique et aux technologies apparentées.

A propos des publications CEI
Le contenu technique des publications de la CEI est constamment revu. Veuillez vous assurer que vous possédez
l’édition la plus récente, un corrigendum ou amendement peut avoir été publié.
ƒ Catalogue des publications de la CEI: www.iec.ch/searchpub/cur_fut-f.htm
Le Catalogue en-ligne de la CEI vous permet d’effectuer des recherches en utilisant différents critères (numéro de référence,
texte, comité d’études,…). Il donne aussi des informations sur les projets et les publications retirées ou remplacées.
ƒ Just Published CEI: www.iec.ch/online_news/justpub
Restez informé sur les nouvelles publications de la CEI. Just Published détaille deux fois par mois les nouvelles
publications parues. Disponible en-ligne et aussi par email.
ƒ Electropedia: www.electropedia.org
Le premier dictionnaire en ligne au monde de termes électroniques et électriques. Il contient plus de 20 000 termes et
définitions en anglais et en français, ainsi que les termes équivalents dans les langues additionnelles. Egalement appelé
Vocabulaire Electrotechnique International en ligne.
ƒ Service Clients: www.iec.ch/webstore/custserv/custserv_entry-f.htm
Si vous désirez nous donner des commentaires sur cette publication ou si vous avez des questions, visitez le FAQ du
Service clients ou contactez-nous:
Email: [e-mail]
Tél.: [phone]
Fax: [phone]

---------------------- Page: 2 ----------------------
IEC 61967-6
Edition 1.1 2008-06
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Integrated circuits – Measurement of electromagnetic emissions, 150 kHz
to 1 GHz –
Part 6: Measurement of conducted emissions – Magnetic probe method

Circuits intégrés – Mesure des émissions électromagnétiques, 150 kHz à 1 GHz –
Partie 6: Mesure des émissions conduites – Méthode de la sonde magnétique

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CP
CODE PRIX
ICS 31.200 ISBN 2-8318-9726-2

---------------------- Page: 3 ----------------------
– 2 – 61967-6 © IEC:2002+A1:2008
CONTENTS
FOREWORD.5
1 Scope.7
2 Normative references.7
3 Definitions.7
4 General.7
4.1 Measurement philosophy.7
4.2 Measurement principle.8
5 Test conditions.8
5.1 General.8
5.2 Frequency range.8
6 Test equipment.8
6.1 General.8
6.2 Magnetic probe .8
6.3 Probe spacing fixture and placement.8
7 Test set-up.11
7.1 General.11
7.2 Probe calibration.11
7.3 Modifications to standardized IC test board .11
7.3.1 Layer arrangement.11
7.3.2 Layer thickness.11
7.3.3 Decoupling capacitors.11
7.3.4 I/O pin loading.12
8 Test procedure.16
8.1 General.16
8.2 Test technique.16
9 Test report.16
9.1 General.16
9.2 Documentation.16

Annex A (normative) Probe calibration procedure – Microstrip line method .18
Annex B (informative) Measurement principle and calibration factor.21
Annex C (informative) Spatial resolution of magnetic probe .25
Annex D (informative) Angle pattern of probe placement.26
Annex E (informative) Advanced magnetic probe .27

Bibliography.44

Figure 1 – Magnetic probe .9
Figure 2 – Magnetic probe 1st and 3rd layers .9
Figure 3 – Magnetic probe 2nd layer.10
Figure 4 – Magnetic probe – layer construction.10
Figure 5 – Standardized IC test board (sectional view 1).12
Figure 6 – Standardized IC test board (sectional view 2 – measurement line) .12

---------------------- Page: 4 ----------------------
61967-6 © IEC:2002+A1:2008 – 3 –
Figure 7 – Power line pattern on the standardized IC test board – Bottom layer .13
Figure 8 – I/O signal line pattern on the standardized IC test board – Bottom layer .14
Figure 9 – Multi-power lines on the standardized IC test board – Bottom layer .14
Figure 10 – Measurement set-up .15
Figure 11 – Measurement circuit schematic .15
Figure 12 – Transfer constant for current calculation as a function of insulator
thickness of microstrip board. .17
Figure A.1 – Cross-sectional view of a microstrip line for calibration .18
Figure A.2 – Measurement set-up for probe calibration .20
Figure B.1 – Cross-sectional view of a microstrip line .21
Figure B.2 – Measurement of magnetic probe output .23
Figure B.3 – Example of calibration factor for the magnetic probe
specified in figures 1, 2, 3, and 4 .24
Figure C.1 – Diagram for measuring a magnetic field distribution.25
Figure C.2 – Magnetic field distribution across the microstrip line (800 MHz) .25
Figure D.1 – Diagram for measuring an angle pattern of probe placement .26
Figure D.2 – Probe output to angle ϕ .26
Figure 1 – Magnetic probe .9
Figure 2 – Magnetic probe – First and third layers .9
Figure 3 – Magnetic probe – Second layer .10
Figure 4 – Magnetic probe – Layer construction.10
Figure 5 – Standardized IC test board – Sectional view 1 .12
Figure 6 – Standardized IC test board – Sectional view 2 – Measurement line .12
Figure 7 – Power line pattern on the standardized IC test board – Bottom layer.13
Figure 8 – I/O signal line pattern on the standardized IC test board – Bottom layer.14
Figure 9 – Multi-power lines on the standardized IC test board – Bottom layer.14
Figure 10 – Measurement set-up .15
Figure 11 – Measurement circuit schematic .15
Figure 12 – Transfer constant for current calculation as a function of insulator
thickness of microstrip board .17
Figure A.1 – Cross-sectional view of a microstrip line for calibration .18
Figure A.2 – Measurement set-up for probe calibration .20
Figure B.1 – Cross-sectional view of a microstrip line .21
Figure B.2 – Measurement of magnetic probe output .23
Figure B.3 – Example of calibration factor for the magnetic probe specified in figures 1,
2, 3, and 4 .24
Figure C.1 – Diagram for measuring a magnetic field distribution.25
Figure C.2 – Magnetic field distribution across the microstrip line (at 800 MHz) .25
Figure D.1 – Diagram for measuring an angle pattern of probe placement .26
Figure D.2 – Probe output to angle ϕ .26
Figure E.1 – Illustration of the assembled advanced magnetic probe .29
Figure E.2 – Enlarged view of part A of Figure E.1
(an example of connection construction) .29

---------------------- Page: 5 ----------------------
– 4 – 61967-6 © IEC:2002+A1:2008
Figure E.3 – Main pattern (layer 2 to 4) of advanced magnetic probe.30
Figure E.4 – Layer 1 (ground pattern) of advanced magnetic probe .30
Figure E.5 – Layer 2 and 4 (ground pattern) of advanced magnetic probe.31
Figure E.6 – Layer 3 (signal pattern) of advanced magnetic probe .31
Figure E.7 – Layer 5 (ground pattern) of advanced magnetic probe .32
Figure E.8 – Construction of advanced magnetic probe .32
Figure E.9 – Measurement set-up .33
Figure E.10 – Definition of loop center .33
Figure E.11 – Error graph of the measured voltage versus measurement distance.34
Figure E.12 – Set-up for measuring magnetic field distribution.34
Figure E.13 – Magnetic field distribution across microstrip line (1 GHz) .35
Figure E.14 – Set-up for measuring an angle pattern of probe placement .35
Figure E.15 – Probe output amplitude as function of angle ϕ (D is 0,47 mm) .36
m
Figure E.16 – Current models of strip conductor of microstrip line.38
Figure E.17 – Calibration factor for different board parameters .39
Figure E.18 – Example of measured (C – C ) at microstrip line under
f_dB h-distributed_dB
the same condition (W=1,0 mm, h=0,6 mm) as shown in Figure E.9.39
Figure E.19 – Cross-sectional view of a microstrip line for calibration (example).41
Figure E.20 – Measurement set-up for probe calibration .42
Figure E.21 – Example of IC test board – Bottom layer .43
Figure E.22 – Example of measurement pattern of V .43
DD1

---------------------- Page: 6 ----------------------
61967-6 © IEC:2002+A1:2008 – 5 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
___________

INTEGRATED CIRCUITS –
MEASUREMENT OF ELECTROMAGNETIC EMISSIONS,
150 kHz TO 1 GHz –

Part 6: Measurement of conducted emissions –
Magnetic probe method



FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61967-6 has been prepared by subcommittee 47A: Integrated
circuits, of IEC technical committee 47: Semiconductor devices.
This consolidated version of IEC 61967-6 consists of the first edition (2002) [documents
47A/645/FDIS and 47A/653/RVD], its amendment 1 (2008) [documents 47A/781/FDIS and
47A/784/RVD] and its corrigendum 1 of August 2010.
The technical content is therefore identical to the base edition and its amendment and has
been prepared for user convenience.
It bears the edition number 1.1.
A vertical line in the margin shows where the base publication has been modified by
amendment 1.

---------------------- Page: 7 ----------------------
– 6 – 61967-6 © IEC:2002+A1:2008
Annex A forms an integral part of this standard.
Annexes B, C, D and E are for information only.
This standard should be read in conjunction with IEC 61967-1.
IEC 61967 consists of the following parts, under the general title Integrated circuits –
Measurement of electromagnetic emissions, 150 kHz to 1 GHz:
Part 1: General conditions and definitions
1
Part 2: Measurement of radiated emissions – TEM-cell method
1
Part 3: Measurement of radiated emissions – Surface scan method (technical specification)
2
Part 4: Measurement of conducted emissions – 1 Ω/150 Ω direct coupling method
2
Part 5: Measurement of conducted emissions – Workbench Faraday cage method
Part 6: Measurement of conducted emissions – Magnetic probe method
The committee has decided that the contents of the base publication and its amendments will
remain unchanged until the maintenance result date indicated on the IEC web site under
"http://webstore.iec.ch" in the data related to the specific publication. At this date,
the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.


IMPORTANT – The “colour inside” logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct understanding
of its contents. Users should therefore print this publication using a colour printer.

___________
1
Under consideration.
2
To be published.

---------------------- Page: 8 ----------------------
61967-6 © IEC:2002+A1:2008 – 7 –
INTEGRATED CIRCUITS –
MEASUREMENT OF ELECTROMAGNETIC EMISSIONS,
150 kHz TO 1 GHz –

Part 6: Measurement of conducted emissions –
Magnetic probe method


1 Scope
This part of the IEC 61967 specifies a method for evaluating RF currents on the pins of an
integrated circuit (IC) by means of non-contact current measurement using a miniature
magnetic probe. This method is capable of measuring the RF currents generated by the IC
over a frequency range of 0,15 MHz to 1 000 MHz. This method is applicable to the
measurement of a single IC or a chip set of ICs on the standardized test board for
characterization and comparison purposes. It is also usable to evaluate the electromagnetic
characteristics of an IC or group of ICs on an actual application PCB for emission reduction
purposes. This method is called the "magnetic probe method".
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 61967-1, Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to
1 GHz – Part 1: General conditions and definitions
IEC 61967-4, Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to
3
1 GHz – Part 4: Measurement of conducted emissions – 1 Ω/150 Ω direct coupling method
3 Definitions
For the purposes of this part of IEC 61967 the definitions found in IEC 61967-1 apply.
4 General
4.1 Measurement philosophy
The emissions radiated from a PCB are, in part, caused by RF current generated by the
onboard IC which drives PCB traces, PCB ground and supply planes, and cables connected to
the PCB. All of these can act as RF antennas to radiate the emissions. The emission level is
proportional to the driving RF current, and is also affected significantly by PCB design,
radiation effectiveness of the pseudo-antennas, and noise coupling path coefficients from the
IC to the pseudo-antennas.
For this emission mechanism, the driving force of the IC can be a significant parameter for
both users and manufacturers to estimate and predict the electromagnetic characteristics of a
PCB, module, or system. A measure of the emission driving force can be obtained by
measuring the RF currents generated by the IC under test. Thus, the measured RF noise
current can be regarded as an indicator of the undesirable electromagnetic emission driving
force generated by the IC.
___________
3
To be published.

---------------------- Page: 9 ----------------------
– 8 – 61967-6 © IEC:2002+A1:2008
4.2 Measurement principle
Using this test method, the RF current on the power supply pins and I/O pins of an IC under
test can be measured using a miniature triplate-structured magnetic probe. This probe
measures the magnetic field at a specified height over a power supply or I/O strip conductor
on the standardized test board in a controlled manner. The RF current is calculated from the
measured magnetic field using the formula described in 8.2. With accurate mechanical
placement of the magnetic probe, this method provides a high degree of repeatability. In
addition, the frequency range of this method can be extended subject to the limitations
described in 5.2. Higher frequencies can be obtained without a substantial influence on
accuracy. The estimation of the RF current over the power supply or I/O strip conductor is an
easy and handy way of characterizing and comparing the ICs.
5 Test conditions
5.1 General
General test conditions are described in IEC 61967-1.
5.2 Frequency range
The effective frequency range of this measurement method is 0,15 MHz to 1 000 MHz. The
maximum frequency can be extended, if desired, subject to the limitations of the test set-up.
The upper limit of the frequency range is directly related to high frequency characteristics of
the magnetic probe and its distance from the line under test as described in annex B. At a low
frequency region of 0,15 MHz to 10 MHz, however, it may be advisable to use a low noise
pre-amplifier to improve dynamic range of the measurement.
6 Test equipment
6.1 General
For general information on test equipment see IEC 61967-1.
6.2 Magnetic probe
The magnetic probe shall be a triplate-structured strip line composed of a three-layer PCB.
Recommended probe construction details are shown in figures 1, 2, 3 and 4.
An SMA connector is attached at the edge of the PCB opposite to the rectangular loop portion
of the probe as shown in the figures . Attachment pads for the SMA connector are on layers 1
and 3, which are connected to each other through four vias. The strip conductor pattern is on
layer 2, which is connected to the centre pin of the SMA connector.
6.3 Probe spacing fixture and placement
The probe output voltage depends on the distance between the probe tip and the strip
conductor under measurement. This makes it very critical to maintain a 1 mm space between
the strip conductor and the magnetic probe tip during this measurement. Therefore, a probe
spacing fixture shall be used to maintain 1,0 mm ± 0,1 mm spacing between the bottom of the
rectangular loop portion of the probe and strip line on the IC test board, or the entire probe
can be molded into a piece of fixing block which houses the probe so as to maintain the
specified space precisely as shown in figure 10.

---------------------- Page: 10 ----------------------
61967-6 © IEC:2002+A1:2008 – 9 –
In addition, the probe output voltage depends on probe placement angle (ϕ) to direction of
microstrip line under measurement. According to an experimental measurement on angle
patterns of probe directional placement, the angle shall be less than 15° for amplitude error to
be less than –2 dB. See annex D for details.

Via for SMA connector
through layers 1, 2, and 3
Via for SMA connector
through layers 1, 2, and 3
Pads for SMA connector
on layer 1 and 3
Signal line pattern on layer 2
30 mm
50 Ω strip line
Ground plane patterns
on layer 1 and layer 3
Rectangular loop portion
for detection
10 mm
Via through layers 1, 2, and 3
IEC  1468/02


Figure 1 – Magnetic probe

Via
Center line
Via
10 mm
30 mm 0,8 mm
1,8 mm 0,2 mm
Via: 0,25 mm diameter
8,4 mm
0,1 mm
10 mm
IEC  1469/02


Figure 2 – Magnetic probe – First and third layers

---------------------- Page: 11 ----------------------
– 10 – 61967-6 ©
...