IEC 61760-3:2010

Surface mounting technology - Part 3: Standard method for the specification of components for through hole reflow (THR) soldering

IEC 61760-3:2010 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through hole reflow soldering technology. The object of this standard is to ensure that components with leads intended for through hole reflow and surface mounting components can be subjected to the same placement and mounting processes. Hereto, this standard defines test and requirements that need to be part of any component generic, sectional or detail specification, when through hole reflow soldering is intended. Further this standard provides component users and manufacturers with a reference set of typical process conditions used in through hole reflow soldering technology.

Technique du montage en surface - Partie 3 : Méthode normalisée relative à la spécification des composants pour le brasage par refusion à trous traversants (THR, Through Hole Reflow)

La CEI 61760-3:2010 fournit un ensemble de références d'exigences indiquant les conditions de processus et d'essai correspondantes qui doivent être utilisées lors de l'élaboration des spécifications des composants électroniques qui sont destinés à être utilisés dans le cadre de la technologie du brasage par refusion à trous traversants. L'objet de la présente norme est de s'assurer que les composants comportant des sorties destinées à la THR et les composants pour montage en surface peuvent être soumis au même placement et au même processus de montage. Ici, la présente norme définit les essais et les exigences faisant nécessairement partie de toute spécification générique, intermédiaire ou particulière de composant, lorsqu'il s'agit de brasage par refusion à trou traversant. De plus, la présente norme fournit aux utilisateurs de composants et à leurs fabricants un ensemble de référence des conditions de processus typiques utilisées dans le cadre de la technologie du brasage par refusion à trou traversant.

General Information

• Status: Published
• Publication Date: 15-Mar-2010
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 31.190 - Electronic component assemblies
• Technical Committee: TC 91 - Electronics assembly technology
• Drafting Committee: WG 1 - TC 91/WG 1
• Current Stage: DELPUB - Deleted Publication
• Start Date: 28-Jun-2019
• Completion Date: 03-Feb-2021

Relations

• Revised: IEC 61760-3:2021 - Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering
• Effective Date: 05-Sep-2023

Standards Content (Sample)

IEC 61760-3 ®
Edition 1.0 2010-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Surface mounting technology –
Part 3: Standard method for the specification of components for through hole
reflow (THR) soldering
Technique du montage en surface –
Partie 3: Méthode normalisée relative à la spécification des composants pour
le brasage par refusion à trous traversants (THR, Through Hole Reflow)

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IEC 61760-3 ®
Edition 1.0 2010-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Surface mounting technology –
Part 3: Standard method for the specification of components for through hole
reflow (THR) soldering
Technique du montage en surface –
Partie 3: Méthode normalisée relative à la spécification des composants pour
le brasage par refusion à trous traversants (THR, Through Hole Reflow)

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
S
CODE PRIX
ICS 31.190 ISBN 978-2-88910-572-4
– 2 – 61760-3 © IEC:2010
CONTENTS
FOREWORD.4
1 Scope and object.6
2 Normative references .6
3 Terms and definitions .7
4 Requirements to component design and component specifications .8
4.1 General requirement .8
4.2 Packaging .8
4.3 Labelling of product packaging .9
4.4 Component marking .9
4.5 Storage and transportation .10
4.6 Component outline and design .10
4.6.1 Drawing and specification.10
4.6.2 Pick-up area requirements.10
4.6.3 Bottom surface requirements .10
4.6.4 Requirements to terminals.10
4.6.5 Component height .14
4.6.6 Component weight.14
4.7 Mechanical stress .14
4.8 Component reliability.14
4.9 Additional requirements for compatibility with lead-free soldering .15
5 Specification of assembly process conditions .15
5.1 Mounting by soldering .15
5.2 Reflow soldering methods (recommended) .16
5.2.1 Vapour phase reflow soldering.16
5.2.2 Forced air convection reflow soldering.16
5.3 Cleaning (where applicable) .17
5.3.1 General .17
5.3.2 Fluid .17
5.3.3 Ultrasonic cleaning .17
5.3.4 Vapour .17
5.3.5 Spray.17
5.3.6 Plasma cleaning .17
5.4 Removal and/or replacement.17
5.4.1 Removal and/or replacement of soldered components .17
6 Typical process conditions.18
6.1 Printing of solder paste .18
6.2 Component insertion .18
6.3 Soldering processes, temperature/time profiles .18
6.3.1 Vapour phase soldering.19
6.3.2 Forced gas convection reflow soldering .20
6.4 Typical cleaning conditions for assemblies .21
6.5 Inspection of solder joints.21
7 Requirements for components and component specifications for THR  soldering
processes.21
7.1 General .21
7.2 Wettability .21

61760-3 © IEC:2010 – 3 –
7.3 Dewetting .22
7.4 Resistance to soldering heat .22
7.5 Resistance to cleaning solvent .22
7.5.1 Solvent resistance of component .22
7.5.2 Solvent resistance of marking.22
7.6 Soldering profiles .22
7.7 Moisture sensitivity level (MSL) .22

Figure 1 – Example of a component with marked specific orientation put in tape and tray.9
Figure 2 – Example of components in a tape.9
Figure 3 – Examples for clearances (stand-off) .10
Figure 4 – Examples for terminal shapes and position tolerances .12
Figure 5 – Schematic example of contrast of bottom surface – terminals underneath
component body .13
Figure 6 – Schematic example of contrast of bottom surface – terminals outside
component body .13
Figure 7 – Component weight / pipette suction strength .14
Figure 8 – Process steps for soldering .15
Figure 9 – Examples for printing of solder paste .18
Figure 10 – SnPb Vapour phase soldering – temperature/time profile (terminal
temperature) .19
Figure 11 – Lead-free SnAgCu Vapour phase soldering – temperature/time profile
(terminal temperature) .19
Figure 12 – Forced gas convection reflow soldering – temperature/time profile for
SnPb solders .20
Figure 13 – Forced gas convection reflow soldering – temperature/time profile for lead-
free SnAgCu solders.20

Table 1 – Basic cleaning processes .21

– 4 – 61760-3 © IEC:2010
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SURFACE MOUNTING TECHNOLOGY –
Part 3: Standard method for the specification of
components for through hole reflow (THR) soldering

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Tech
...