Surface mounting technology - Part 3-1: Standard method for the specification of components for through hole reflow (THR) soldering – Guidelines for through hole diameter design with solder paste surface printing method

IEC TR 61760-3-1:2022(E) supplements IEC 61760-3 to describe examples of solder paste supply methods, the relationship between the terminal position tolerance and the through hole diameter, and provides guidelines for the design of printed circuit boards with solder paste surface printing method, including specific examples.

General Information

Status
Published
Publication Date
16-Jun-2022
Drafting Committee
Current Stage
PPUB - Publication issued
Start Date
25-Jul-2022
Completion Date
17-Jun-2022
Ref Project

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IEC TR 61760-3-1:2022 - Surface mounting technology - Part 3-1: Standard method for the specification of components for through hole reflow (THR) soldering – Guidelines for through hole diameter design with solder paste surface printing method
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IEC TR 61760-3-1
®

Edition 1.0 2022-06
TECHNICAL
REPORT

colour
inside


Surface mounting technology –
Part 3-1: Standard method for the specification of components for through hole
reflow (THR) soldering – Guidelines for through hole diameter design with solder
paste surface printing method
IEC TR 61760-3-1:2022-06(en)

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IEC TR 61760-3-1

®


Edition 1.0 2022-06




TECHNICAL



REPORT








colour

inside










Surface mounting technology –

Part 3-1: Standard method for the specification of components for through hole

reflow (THR) soldering – Guidelines for through hole diameter design with solder

paste surface printing method
























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ICS 31.190 ISBN 978-2-8322-3928-5




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– 2 – IEC TR 61760-3-1:2022  IEC 2022
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Solder paste application methods . 6
4.1 General . 6
4.2 Through hole filled method . 8
4.2.1 Overview . 8
4.2.2 Advantages . 9
4.2.3 Disadvantages . 9
4.3 Solder paste surface printing method .
...

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