Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz)

IEC 61189-2-719:2016 specifies a test method of relative permittivity and loss tangent of printed board and assembly materials, expected to be determined 2 to 10 of relative permittivity and 0,001 to 0,050 of loss tangent at 500 MHz to 10 GHz.

Méthode d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-719: Méthodes d'essai des matériaux pour structures d'interconnexion - Permittivité relative et tangente de perte (500 MHz à 10 GHz)

L'IEC 61189-2-719:2016 spécifie une méthode d'essai de la permittivité relative et de la tangente de perte des cartes imprimées et des matériaux d'assemblage, les valeurs prévues étant comprises entre 2 et 10 pour la permittivité relative et entre 0,001 et 0,050 pour la tangente de perte entre 500 MHz et 10 GHz.

General Information

Status
Published
Publication Date
11-Jul-2016
Current Stage
PPUB - Publication issued
Completion Date
12-Jul-2016
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IEC 61189-2-719:2016 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz)
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IEC 61189-2-719
Edition 1.0 2016-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Test methods for electrical materials, printed boards and other interconnection
structures and assemblies –
Part 2-719: Test methods for materials for interconnection structures – Relative
permittivity and loss tangent (500 MHz to 10 GHz)
Méthode d'essai pour les matériaux électriques, les cartes imprimées et autres
structures d'interconnexion et ensembles –
Partie 2-719: Méthodes d'essai des matériaux pour structures d'interconnexion –
Permittivité relative et tangente de perte (500 MHz à 10 GHz)
IEC 61189-2-719:2016-07(en-fr)
---------------------- Page: 1 ----------------------
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---------------------- Page: 2 ----------------------
IEC 61189-2-719
Edition 2.0 2016-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Test methods for electrical materials, printed boards and other interconnection
structures and assemblies –
Part 2-719: Test methods for materials for interconnection structures – Relative
permittivity and loss tangent (500 MHz to 10 GHz)
Méthode d'essai pour les matériaux électriques, les cartes imprimées et autres
structures d'interconnexion et ensembles –
Partie 2-719: Méthodes d'essai des matériaux pour structures d'interconnexion –
Permittivité relative et tangente de perte (500 MHz à 10 GHz)
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180 ISBN 978-2-8322-3520-1

Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
---------------------- Page: 3 ----------------------
– 2 – IEC 61189-2-719:2016 © IEC 2016
CONTENTS

FOREWORD......................................................................................................................... 4

1 Scope ............................................................................................................................ 6

2 Normative references .................................................................................................... 6

3 Terms and definitions .................................................................................................... 6

4 Test methods................................................................................................................. 6

4.1 Test specimens ..................................................................................................... 6

4.1.1 General ......................................................................................................... 6

4.1.2 Size ............................................................................................................... 6

4.1.3 Thickness of dielectric .................................................................................... 6

4.1.4 Thickness of copper foil ................................................................................. 6

4.2 Test set ................................................................................................................ 7

4.3 Test fixture ............................................................................................................ 9

4.4 Test equipment ................................................................................................... 11

4.5 Procedure ........................................................................................................... 11

4.5.1 Measurements ............................................................................................. 11

4.5.2 Calculations ................................................................................................. 12

5 Report ......................................................................................................................... 14

6 Additional information .................................................................................................. 14

6.1 Accuracy ............................................................................................................. 14

6.2 Additional information concerning fixtures and results .......................................... 14

Annex A (informative) Example of test fixture and test results ............................................. 15

A.1 Dimension example of a test fixture ..................................................................... 15

A.2 Example of test results ........................................................................................ 19

Figure 1 – One side of board A ............................................................................................. 7

Figure 2 – Another side of board A ........................................................................................ 7

Figure 3 – Cross section between X1 and X2 of board A ........................................................ 8

Figure 4 – Cross section between Y1 and Y2 of board A ........................................................ 8

Figure 5 – One side of board B ............................................................................................. 8

Figure 6 – Another side of board B ........................................................................................ 9

Figure 7 – Cross-section between X1 and X2 of board B ........................................................ 9

Figure 8 – Cross section between Y1 and Y2 of board B ........................................................ 9

Figure 9 – Top view of test fixture ....................................................................................... 10

Figure 10 – Horizontal cross section of test fixture with test set ........................................... 10

Figure 11 – Side view of test fixture .................................................................................... 10

Figure 12 – Vertical cross-section of test fixture with test set ............................................... 11

Figure 13 – Example of VNA raw data ................................................................................. 12

Figure 14 – Envelopes of raw data from VNA measurement ................................................. 14

Figure A.1 – Parts of test fixture .......................................................................................... 17

Figure A.2 – Construction of parts ....................................................................................... 18

Figure A.3 – Part for connector attachment ......................................................................... 18

Figure A.4 – Attachment with connector .............................................................................. 19

Figure A.5 – An example of measured ε data, PTFE CCL ................................................... 19

---------------------- Page: 4 ----------------------
IEC 61189-2-719:2016 © IEC 2016 – 3 –

Figure A.6 – An example of measured tanδ data, PTFE CCL ................................................ 20

---------------------- Page: 5 ----------------------
– 4 – IEC 61189-2-719:2016 © IEC 2016
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND
OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –
Part 2-719: Test methods for materials for interconnection structures –
Relative permittivity and loss tangent (500 MHz to 10 GHz)
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote

international co-operation on all questions concerning standardization in the electrical and electronic fields. To

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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is

indispensable for the correct application of this publication.

9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of

patent rights. IEC shall not be held responsible for identifying any or all such patent rights.

International Standard IEC 61189-2-719 has been prepared by IEC technical committee 91:

Electronics assembly technology.
The text of this standard is based on the following documents:
FDIS Report on voting
91/1366/FDIS 91/1380/RVD

Full information on the voting for the approval of this standard can be found in the report on

voting indicated in the above table.

This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

---------------------- Page: 6 ----------------------
IEC 61189-2-719:2016 © IEC 2016 – 5 –

A list of all parts in the IEC 61189 series, published under the general title Test methods for

electrical materials, printed boards and other interconnection structures and assemblies, can

be found on the IEC website.

The committee has decided that the contents of this publication will remain unchanged until

the stability date indicated on the IEC website under "http://webstore.iec.ch" in the data

related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates

that it contains colours which are considered to be useful for the correct

understanding of its contents. Users should therefore print this document using a

colour printer.
---------------------- Page: 7 ----------------------
– 6 – IEC 61189-2-719:2016 © IEC 2016
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND
OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –
Part 2-719: Test methods for materials for interconnection structures –
Relative permittivity and loss tangent (500 MHz to 10 GHz)
1 Scope

This part of IEC 61189 specifies a test method of relative permittivity and loss tangent of

printed board and assembly materials, expected to be determined 2 to 10 of relative

permittivity and 0,001 to 0,050 of loss tangent at 500 MHz to 10 GHz.
2 Normative references

The following documents, in whole or in part, are normatively referenced in this document and

are indispensable for its application. For dated references, only the edition cited applies. For

undated references, the latest edition of the referenced document (including any
amendments) applies.

IEC 60194, Printed board design, manufacture and assembly – Terms and definitions

3 Terms and definitions

For the purposes of this document, the terms and definitions given in IEC 60194 apply.

4 Test methods
4.1 Test specimens
4.1.1 General
The requirements with respect to test specimens are as follows.
a) Specimens shall be copper clad laminate.
b) Specimens shall be cut not less than 25 mm from the edge of the sheet.
c) A minimum of four specimens shall be tested.
4.1.2 Size
The size of each specimen shall be ((200 ± 0,5) × (50 ± 1)) mm.
4.1.3 Thickness of dielectric

The dielectric thickness of each specimen shall be 0,6 mm to 1,6 mm. Typically 0,8 mm is

suitable.
4.1.4 Thickness of copper foil
The copper foil thickness of each specimen should be 0,010 mm to 0,040 mm.
---------------------- Page: 8 ----------------------
IEC 61189-2-719:2016 © IEC 2016 – 7 –
4.2 Test set
The setup of the test shall be as follows.

a) The test set consists of two boards. Board A shall be a board with a conductive line on

one side and with a copper foil on another side. The width of conductive line shall be

0,9 mm ± 0,2 mm. Board B shall be a board without copper foil on one side and with a

copper foil on another side. These boards shall be shown in Figure 1, Figure 2, Figure 3,

Figure 4, Figure 5, Figure 6, Figure 7 and Figure 8.

b) Board A and board B are produced from test specimens. Copper foil on copper clad

laminate shall be etched for the test set design.
c) After etching, the test set shall be etched laminate.

d) The test set shall be dried 1 h in the oven with 105 °C ± 2 °C, and kept 96 h in 20 °C

/65 %RH.
Y1 Y2
IEC
Key
WL is the width of the conductor line, in m
WB is the width of the test vehicle, in m
Figure 1 – One side of board A
IEC
Key
L is the length of the test vehicle, in m
WB is the width of the test vehicle, in m
Figure 2 – Another side of board A
---------------------- Page: 9 ----------------------
– 8 – IEC 61189-2-719:2016 © IEC 2016
IEC
Key
WL is the width of the conductor line, in m
tL is the thickness of the conductor line, in m
tB is the thickness of the test vehicle, in m
Figure 3 – Cross section between X1 and X2 of board A
IEC
Key
L is the length of the test vehicle, in m
tB is the thickness of the test vehicle, in m
tL is the thickness of the conductor line, in m
Figure 4 – Cross section between Y1 and Y2 of board A
Y1 Y2
IEC
Key
L is the length of the test vehicle, in m
WB is the width of the test vehicle, in m
Figure 5 – One side of board B
---------------------- Page: 10 ----------------------
IEC 61189-2-719:2016 © IEC 2016 – 9 –
IEC
Key
L is the length of the test vehicle, in m
WB is the width of the test vehicle, in m
Figure 6 – Another side of board B
IEC
Key
WB is the width of the test vehicle, in m
tL is the thickness of the conductor line, in m
tB is the thickness of the test vehicle, in m
Figure 7 – Cross-section between X1 and X2 of board B
IEC
Key
L is the length of the test vehicle, in m
tL is the thickness of the conductor line, in m
tB is the thickness of the test vehicle, in m
Figure 8 – Cross section between Y1 and Y2 of board B
4.3 Test fixture

Test fixture shall be set up as follows and is shown in Figure 9, Figure 10, Figure 11 and

Figure 12.

a) The test fixture consists of two coaxial connectors and a metallic box made of SUS

(Stainless steel), etc.

b) Coaxial connectors shall be the type permitting high frequency measurement. The suitable

types of connectors should be “SMA (Sub Miniature A), APC3.5 (Amphenol Precision
Connector, 3,5 mm), APC7 (7 mm) or Type-N (Navy) or equivalent.
---------------------- Page: 11 ----------------------
– 10 – IEC 61189-2-719:2016 © IEC 2016

c) The thickness of the metallic board for the metallic box shall be more than 0,6 mm.

d) The distance of the gap shall be from 0,01 mm to 0,5 mm.
IEC
Figure 9 – Top view of test fixture
Gap Gap
IEC
Key
L is the length of test vehicle, in m
WB is the width of test vehicle, in m
Figure 10 – Horizontal cross section of test fixture with test set
IEC
Figure 11 – Side view of test fixture
---------------------- Page: 12 ----------------------
IEC 61189-2-719:2016 © IEC 2016 – 11 –
Metal board
Cavity
as a spacer
Coaxial
connector
IEC
Figure 12 – Vertical cross-section of test fixture with test set
4.4 Test equipment
The test equipment includes the following.
a) A vector network analyser (VNA) shall be used.
b) Thy dynamic range of the VNA shall be more than 50 dB.
c) The frequency range of the VNA shall be from 100 MHz to over 10 GHz.
4.5 Procedure
4.5.1 Measurements
4.5.1.1 Electrical measurements
The following requirements apply to electrical measurements.
a) Electrical measurements shall be carried out by using VNA and fixture.

b) Measurement conditions shall be set in VNA, such as frequency, measurement point,

averaging number and smoothing level. On the VNA, measurement conditions should be

set as follows. Smoothing should be turned off. The number of the data points used

should be enough to capture the amplitude of the peaks of the resonances accurately.

Averaging may be set to improve signal to noise.

c) VNA shall be calibrated with coaxial cables in the range of the measurement frequency. A

full two-port calibration is needed.

d) Coaxial connectors of the test fixture shall be connected with coaxial cables.

e) The test set shall be set facing the conductive line side of board A and the dielectric side

of board B in the test fixture box.

f) The dummy board and top board of the test fixture shall be set on the test set. The dummy

board is tightened to the cavity with screws by typically 0,90 Nm, which is also a typical

torque to tighten coaxial cables, so that board A and B are in contact with each other.

g) The resonation figure of S21 shall be checked on the monitor of VNA. The example is

shown in Figure 13. The S21 response should be inspected on the display of the VNA (see

Figure 13) to ensure that all relevant information is captured across the required frequency

range. In particular, faithful capture of the amplitude of the peaks of the resonances

should be checked.

h) The data of S21 should be stored in a suitable digital device and should be used for

calibration.
---------------------- Page: 13 ----------------------
– 12 – IEC 61189-2-719:2016 © IEC 2016
Frequency (Hz)
IEC
Figure 13 – Example of VNA raw data
4.5.1.2 Measurements of line length
The line length should be measured with an uncertainty of ±0,1 mm.
4.5.1.3 Measurements of thickness

The thickness of the dielectric and conductor of test specimens shall be measured with a

±0,001 mm tolerance.
4.5.2 Calculations
4.5.2.1 Relative permittivity
Relative permittivity (ε ) shall be calculated as follows:
λ  
  c m
ε = = ⋅ m = 1,2,3... (1)
r    
λ f 2(L +ΔL)
 
 m 
where
λ is the wavelength in vacuum;
λ is the wavelength of the dielectric when it is tested;
c is the speed of light (2,997 8 × 10 m/s);
m is a number (1, 2, 3...);
f is the resonant frequency at number m in Hz;
L is the line length of test set in m;
∆L is the total effective increase length of the resonator in m (negligible).
4.5.2.2 Loss tangent
The following requirements apply to the loss tangent.
a) The maximal and minimal envelope shall be calculated from raw data.
b) Attenuation factor (α) shall be calculated as follows:
1 1+ U 1
 
α = ln × 8,686 (dB/m) (2)
 
2 1−U L +ΔL
 
U = 10 (3)
S21 (dB)
---------------------- Page: 14 ----------------------
IEC 61189-2-719:2016 © IEC 2016 – 13 –
where
P is the difference of maximal envelope and minimal envelope in dB.
An example of P data is shown in Figure 14.

c) Because α is the sum of the conductive loss factor (α ) and the dielectric loss factor (α ),

c d
α shall be calculated as follows:
α = α − α (dB/m) (4)
d c
α shall be calculated as follows:
0,0231 R ε Z  2WL 1 tB + tL 2tB − tL 
 
s r 0
α = 1+ + ⋅ ln
(dB/m) (5)
c  
 
30π (tB − tL) tB − tL π tB − tL tL
 
 
(6)
s πµ f ρ
(Ω)
0 m
30π 1− tL / tB
Z = ⋅ (Ω) (7)
WL / tB +C / π
 
1 tL 1
 
C = 2 ln +1 − ln −1
  (8)
 
1−tL / tB tB
 
 (1−tL / tB) 
 
where
R is the surface resistance in Ω;
Z is the characteristic impedance of test set in Ω;
tB is the thickness of the dielectric in m;.
tL is the thickness of the conductor line in m;
WL is the width of the conductor line in m;
µ is the magnetic permeability in vacuum, 4π × 10 H/m;

ρ is the resistivity of copper, 1,72 × 10 Ωm. In the case of special copper foil, ρ shall

be the specific value used.
d) α shall be calculated as follows:
8,686πf ε
m r
(dB/m) (9)
α = tanδ
tan δ is the loss tangent.
e) tan δ shall be calculated as follows:
(α − α )c
tanδ =
(10)
8,686πf ε
m r
---------------------- Page: 15 ----------------------
– 14 – IEC 61189-2-719:2016 © IEC 2016
Frequency (Hz)
IEC
Key
P is the actual data acquired from VNA raw data as shown in this figure.
Figure 14 – Envelopes of raw data from VNA measurement
5 Report
The report shall include:
a) the test number and revision;
b) the identification and description of the material tested;
c) the relative permittivity and the average in each frequency;
d) the loss tangent and the average in each frequency;
e) the date of the test;
f) temperature and humidity under test (for reference);
g) any deviation from the test method;
h) the name of the person conducting the test.
6 Additional information
6.1 Accuracy
Relative permittivity: Δε/ε / = ±0,05
Loss tangent: Δtanδ/tanδ = ±0,1
6.2 Additional information concerning fixtures and results
An example of a test fixture and test result is shown in Annex A.
S21 (dB)
---------------------- Page: 16 ----------------------
IEC 61189-2-719:2016 © IEC 2016 – 15 –
Annex A
(informative)
Example of test fixture and test results
A.1 Dimension example of a test fixture

Figure A.1 shows an example of dimensions in detail for each part of the test fixture.

Figure A.2 shows the construction of the test fixture that is using the parts shown in

Figure A.1.

Figure A.3 shows the connector attachments. The hole sizes of the connector attachments

depend on the selected connector.
Figure A.4 shows an attachment with a connector.
---------------------- Page: 17 ----------------------
– 16 – IEC 61189-2-719:2016 © IEC 2016
IEC
Dimensions in millimetres
47,5 47,5
200
2 3
90 90
Thickness: 8 mm
IEC
5,8 5,8
---------------------- Page: 18 ----------------------
IEC 61189-2-719:2016 © IEC 2016 – 17 –
Dimensions in millimetres
e.g. ø4 (hole)
e.g. M2.8
5 6
(screw hole)
Thickness: 8 mm
IEC
e.g. ø3 (pin)
e.g. M2.8
(screw hole)
Thickness: 8 mm
IEC
10 11
80 80
ø4 (screw hole)
50 50
200
Thickness: 8 mm
IEC
Figure A.1 – Parts
...

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