Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices

IEC 60749-15:2020 is available as IEC 60749-15:2020 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 60749-15:2020 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering. In order to establish a standard test procedure for the most reproducible methods, the solder dip method is used because of its more controllable conditions. This procedure determines whether devices are capable of withstanding the soldering temperature encountered in printed wiring board assembly operations, without degrading their electrical characteristics or internal connections. This test is destructive and may be used for qualification, lot acceptance and as a product monitor. The heat is conducted through the leads into the device package from solder heat at the reverse side of the board. This procedure does not simulate wave soldering or reflow heat exposure on the same side of the board as the package body. This edition includes the following significant technical changes with respect to the previous edition:
- inclusion of new Clause 3, Terms and definitions;
- clarification of the use of a soldering iron for producing the heating effect;
- inclusion an option to use accelerated ageing.

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 15: Résistance à la température de brasage pour dispositifs par trous traversants

IEC 60749-15:2020 est disponible sous forme de IEC 60749-15:2020 RLV qui contient la Norme internationale et sa version Redline, illustrant les modifications du contenu technique depuis l'édition précédente.
L'IEC 60749-15:2020 décrit un essai utilisé pour déterminer si les dispositifs à semiconducteurs encapsulés utilisés pour le montage par trous traversants peuvent résister aux effets de la température à laquelle ils sont soumis pendant le brasage de leurs broches en utilisant le brasage à la vague. Dans le but d'établir une procédure d'essai normalisée pour les méthodes les plus reproductibles, la méthode d'immersion dans la brasure est utilisée en raison de ses conditions plus contrôlables. Cette procédure détermine si les dispositifs sont capables de résister à la température de brasage rencontrée lors d'opérations de fabrication des cartes à câblage imprimé, sans endommager leurs caractéristiques électriques ou leurs connexions internes. Cet essai est destructif et il peut être utilisé en vue de la qualification, de l’acceptation de lots et pour contrôler les produits.
La chaleur du brasage se propage dans le boîtier du dispositif par les broches de l'autre côté de la carte. Cette procédure ne simule pas l'exposition à la chaleur du brasage à la vague ou à la chaleur de refusion sur le même côté de la carte que le corps du boîtier. La présente édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:
- ajout de l'Article 3, Termes et définitions;
- clarification sur l'utilisation d'un fer à braser pour produire un effet thermique;
- ajout d'une option relative à l'utilisation du vieillissement accéléré.

General Information

Status
Published
Publication Date
13-Jul-2020
Technical Committee
Current Stage
PPUB - Publication issued
Completion Date
14-Jul-2020
Ref Project

Buy Standard

Standard
IEC 60749-15:2020 - Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
English and French language
17 pages
sale 15% off
Preview
sale 15% off
Preview

Standards Content (sample)

IEC 60749-15
Edition 3.0 2020-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices – Mechanical and climatic test methods –
Part 15: Resistance to soldering temperature for through-hole mounted devices
Dispositifs à semiconducteurs – Méthodes d'essais mécaniques
et climatiques –
Partie 15: Résistance à la température de brasage pour dispositifs par trous
traversants
IEC 60749-15:2020-07(en-fr)
---------------------- Page: 1 ----------------------
THIS PUBLICATION IS COPYRIGHT PROTECTED
Copyright © 2020 IEC, Geneva, Switzerland

All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form

or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from

either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC

copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or

your local IEC member National Committee for further information.

Droits de reproduction réservés. Sauf indication contraire, aucune partie de cette publication ne peut être reproduite

ni utilisée sous quelque forme que ce soit et par aucun procédé, électronique ou mécanique, y compris la photocopie

et les microfilms, sans l'accord écrit de l'IEC ou du Comité national de l'IEC du pays du demandeur. Si vous avez des

questions sur le copyright de l'IEC ou si vous désirez obtenir des droits supplémentaires sur cette publication, utilisez

les coordonnées ci-après ou contactez le Comité national de l'IEC de votre pays de résidence.

IEC Central Office Tel.: +41 22 919 02 11
3, rue de Varembé info@iec.ch
CH-1211 Geneva 20 www.iec.ch
Switzerland
About the IEC

The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes

International Standards for all electrical, electronic and related technologies.
About IEC publications

The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the

latest edition, a corrigendum or an amendment might have been published.

IEC publications search - webstore.iec.ch/advsearchform Electropedia - www.electropedia.org

The advanced search enables to find IEC publications by a The world's leading online dictionary on electrotechnology,

variety of criteria (reference number, text, technical containing more than 22 000 terminological entries in English

committee,…). It also gives information on projects, replaced and French, with equivalent terms in 16 additional languages.

and withdrawn publications. Also known as the International Electrotechnical Vocabulary

(IEV) online.
IEC Just Published - webstore.iec.ch/justpublished

Stay up to date on all new IEC publications. Just Published IEC Glossary - std.iec.ch/glossary

details all new publications released. Available online and 67 000 electrotechnical terminology entries in English and

once a month by email. French extracted from the Terms and Definitions clause of

IEC publications issued since 2002. Some entries have been

IEC Customer Service Centre - webstore.iec.ch/csc collected from earlier publications of IEC TC 37, 77, 86 and

If you wish to give us your feedback on this publication or CISPR.
need further assistance, please contact the Customer Service
Centre: sales@iec.ch.
A propos de l'IEC

La Commission Electrotechnique Internationale (IEC) est la première organisation mondiale qui élabore et publie des

Normes internationales pour tout ce qui a trait à l'électricité, à l'électronique et aux technologies apparentées.

A propos des publications IEC

Le contenu technique des publications IEC est constamment revu. Veuillez vous assurer que vous possédez l’édition la

plus récente, un corrigendum ou amendement peut avoir été publié.
Recherche de publications IEC - Electropedia - www.electropedia.org

webstore.iec.ch/advsearchform Le premier dictionnaire d'électrotechnologie en ligne au

La recherche avancée permet de trouver des publications IEC monde, avec plus de 22 000 articles terminologiques en

en utilisant différents critères (numéro de référence, texte, anglais et en français, ainsi que les termes équivalents dans

comité d’études,…). Elle donne aussi des informations sur les 16 langues additionnelles. Egalement appelé Vocabulaire

projets et les publications remplacées ou retirées. Electrotechnique International (IEV) en ligne.

IEC Just Published - webstore.iec.ch/justpublished Glossaire IEC - std.iec.ch/glossary

Restez informé sur les nouvelles publications IEC. Just 67 000 entrées terminologiques électrotechniques, en anglais

Published détaille les nouvelles publications parues. et en français, extraites des articles Termes et Définitions des

Disponible en ligne et une fois par mois par email. publications IEC parues depuis 2002. Plus certaines entrées

antérieures extraites des publications des CE 37, 77, 86 et
Service Clients - webstore.iec.ch/csc CISPR de l'IEC.
Si vous désirez nous donner des commentaires sur cette
publication ou si vous avez des questions contactez-nous:
sales@iec.ch.
---------------------- Page: 2 ----------------------
IEC 60749-15
Edition 3.0 2020-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices – Mechanical and climatic test methods –
Part 15: Resistance to soldering temperature for through-hole mounted devices
Dispositifs à semiconducteurs – Méthodes d'essais mécaniques
et climatiques –
Partie 15: Résistance à la température de brasage pour dispositifs par trous
traversants
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.01 ISBN 978-2-8322-8604-3

Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
---------------------- Page: 3 ----------------------
– 2 – IEC 60749-15:2020 © IEC 2020
CONTENTS

FOREWORD ........................................................................................................................... 3

1 Scope .............................................................................................................................. 5

2 Normative references ...................................................................................................... 5

3 Terms and definitions ...................................................................................................... 5

4 Test apparatus ................................................................................................................ 6

4.1 Solder pot ............................................................................................................... 6

4.2 Dipping device ........................................................................................................ 6

4.3 Heatsinks or shielding ............................................................................................. 6

5 Materials ......................................................................................................................... 7

5.1 Solder ..................................................................................................................... 7

5.2 Flux ........................................................................................................................ 7

6 Procedure ........................................................................................................................ 7

6.1 Test method ............................................................................................................ 7

6.2 Ageing and pre-conditioning of specimens .............................................................. 7

6.3 Preparation of the solder bath ................................................................................. 7

6.4 Use of flux .............................................................................................................. 7

6.5 Solder dip ............................................................................................................... 8

6.6 Precautions ............................................................................................................. 8

6.7 Measurements ........................................................................................................ 8

6.8 Failure criteria ......................................................................................................... 8

7 Summary ......................................................................................................................... 8

Bibliography ............................................................................................................................ 9

Table 1 – Parameters for solder dipping.................................................................................. 6

---------------------- Page: 4 ----------------------
IEC 60749-15:2020 © IEC 2020 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –
Part 15: Resistance to soldering temperature
for through-hole mounted devices
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote

international co-operation on all questions concerning standardization in the electrical and electronic fields. To

this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,

Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC

Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested

in the subject dealt with may participate in this preparatory work. International, governmental and non-

governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely

with the International Organization for Standardization (ISO) in accordance with conditions determined by

agreement between the two organizations.

2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international

consensus of opinion on the relevant subjects since each technical committee has representation from all

interested IEC National Committees.

3) IEC Publications have the form of recommendations for international use and are accepted by IEC National

Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC

Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any

misinterpretation by any end user.

4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications

transparently to the maximum extent possible in their national and regional publications. Any divergence

between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in

the latter.

5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity

assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any

services carried out by independent certification bodies.

6) All users should ensure that they have the latest edition of this publication.

7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and

members of its technical committees and IEC National Committees for any personal injury, property damage or

other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and

expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC

Publications.

8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is

indispensable for the correct application of this publication.

9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of

patent rights. IEC shall not be held responsible for identifying any or all such patent rights.

International Standard IEC 60749-15 has been prepared by IEC technical committee 47:

Semiconductor devices.

This third edition cancels and replaces the second edition published in 2010. This edition

constitutes a technical revision.

This edition includes the following significant technical changes with respect to the previous

edition:
a) inclusion of new Clause 3, Terms and definitions;

b) clarification of the use of a soldering iron for producing the heating effect;

c) inclusion an option to use accelerated ageing.
---------------------- Page: 5 ----------------------
– 4 – IEC 60749-15:2020 © IEC 2020
The text of this International Standard is based on the following documents:
FDIS Report on voting
47/2630/FDIS 47/2639/RVD

Full information on the voting for the approval of this International Standard can be found in

the report on voting indicated in the above table.

This document has been drafted in accordance with the ISO/IEC Directives, Part 2.

A list of all parts in the IEC 60749 series, published under the general title Semiconductor

devices – Mechanical and climatic test methods, can be found on the IEC website.

The committee has decided that the contents of this document will remain unchanged until the

stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to

the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
---------------------- Page: 6 ----------------------
IEC 60749-15:2020 © IEC 2020 – 5 –
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –
Part 15: Resistance to soldering temperature
for through-hole mounted devices
1 Scope

This part of IEC 60749 describes a test used to determine whether encapsulated solid state

devices used for through-hole mounting can withstand the effects of the temperature to which

they are subjected during soldering of their leads by using wave soldering.

In order to establish a standard test procedure for the most reproducible methods, the solder

dip method is used because of its more controllable conditions. This procedure determines

whether devices are capable of withstanding the soldering temperature encountered in printed

wiring board assembly operations, without degrading their electrical characteristics or internal

connections.

This test is destructive and may be used for qualification, lot acceptance and as a product

monitor.

The heat is conducted through the leads into the device package from solder heat at the

reverse side of the board. This procedure does not simulate wave soldering or reflow heat

exposure on the same side of the board as the package body.
2 Normative references

The following documents are referred to in the text in such a way that some or all of their

content constitutes requirements of this document. For dated references, only the edition

cited applies. For undated references, the latest edition of the referenced document (including

any amendments) applies.

IEC 60068-2-20, Environmental testing – Part 2-20: Tests – Test T: Test methods for

solderability and resistance to soldering heat of devices with leads

IEC 60749-3, Semiconductor devices – Mechanical and climatic test methods – Part 3:

External visual examination

IEC 60749-8, Semiconductor devices – Mechanical and climatic test methods – Part 8:

Sealing
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.

ISO and IEC maintain terminological databases for use in standardization at the following

addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
---------------------- Page: 7 ----------------------
– 6 – IEC 60749-15:2020 © IEC 2020
3.1
colophony
DEPRECATED: rosin

natural resin obtained as the residue after removal of turpentine from the oleo-resin of the

pine tree, consisting mainly of abietic acid and related resin acids, the remainder being resin

acid esters

Note 1 to entry: "Rosin" is a synonym for colophony, and is deprecated because of the common confusion with

the generic term "resin".
3.2
lead-free solder

alloy that does not contain more than 0,1 % lead (Pb) by weight as its constituent and is used

for joining components to substrates or for coating surfaces

[SOURCE: IEC 60194:2015, 75.1904, modified – The words "as its constituent" have been

added to the definition.]
3.3
resistance to soldering heat

ability of device to withstand the highest temperature of the termination or lead in soldering

process, within applicable temperature range of solder alloy
4 Test apparatus
4.1 Solder pot

A solder pot of sufficient size to contain at least 1 kg of solder shall be used. The solder pot

dimensions shall allow full immersion of the leads without touching the bottom. The apparatus

shall be capable of maintaining the solder at the temperature specified in Table 1.

Table 1 – Parameters for solder dipping
Parameter SnPb solder Pb-free solder
Temperature of molten solder °C 260 ± 5 270 ± 5
Number of immersions ≤ 2 ≤ 2
Immersion rate mm s 25 ± 6 25 ± 6
Dwell time s
+2 +2
10 7
0 0
Emersion rate mm s 25 ± 6 25 ± 6
4.2 Dipping device

A mechanical dipping device shall be used that is capable of controlling the rates of

immersion and emersion of the leads and providing the dwell time as specified in Table 1.

4.3 Heatsinks or shielding

If applicable, heatsinks or shielding shall be attached to the devices prior to the test and shall

be as specified in the relevant specification.
---------------------- Page: 8 ----------------------
IEC 60749-15:2020 © IEC 2020 – 7 –
5 Materials
5.1 Solder
The solder specification shall be as follows.
Chemical composition:
– for SnPb solder, the composition in percentage by weight shall be as follows:
Sn60Pb40 or Sn63Pb37 (Sn ± 1 %) chemical composition

– for Pb-free solder, the composition in percentage by weight shall be as follows:

Silver: 3 % to 4 %;
Copper: 0,5 % to 1 %;
Tin: the remainder.

The solder shall not contain impurities which will adversely affect its properties.

Other solders and their applicable bath temperatures may be used as detailed in the relevant

specification.
5.2 Flux

If flux is applied prior to solder dipping, the flux shall consist of 25 % by weight of colophony

in 75 % by weight of isopropyl alcohol, unless otherwise detailed in the relevant specification.

6 Procedure
6.1 Test method

The method used in this procedure requires the specimen to be dipped into a solder bath

under specified conditions. The solder bath method is the one which simulates most closely

the soldering procedures of flow soldering and similar soldering processes. In circumstances

where the solder dip method is considered to impracticable the specimen can be tested by the

application of a heated soldering iron under controlled conditions. This is described in

IEC 60068-2-20.
6.2 Ageing and pre-conditioning of specimens

If required by the relevant specification, the test conditioning shall be preceded by

accelerated ageing such as steam ageing, damp heat conditioning, dry heat conditioning or

unsaturated pressurized vapour conditioning. Accelerated ageing shall be performed in

accordance with IEC 60068-2-20.

Any other special pre-conditioning of the specimens prior to testing shall be as detailed in

the relevant specification. This preparation may include operations such as bending or other

relocation of leads, and the attachment of heat sinks or protective shielding prior to

solder dipping.
6.3 Preparation of the solder bath

The molten solder shall be stirred to assure that the temperature is uniform. The dross shall

be skimmed from the surface of the molten solder just prior to dipping the part.
6.4 Use of flux

Where detailed in the relevant specification, all leads of the specimen shall be dipped in flux

prior to solder dip; excess flux shall be removed by draining for a suitable time.

---------------------- Page: 9 ----------------------
– 8 – IEC 60749-15:2020 © IEC 2020
6.5 Solder dip

The part shall be attached to the dipping device (see 4.2) and the leads immersed in the

molten solder to within 1 mm of the body of the device under test. The parameters for solder

temperature,
...

Questions, Comments and Discussion

Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.