IEC 60749-15:2020

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices

IEC 60749-15:2020 is available as IEC 60749-15:2020 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 60749-15:2020 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering. In order to establish a standard test procedure for the most reproducible methods, the solder dip method is used because of its more controllable conditions. This procedure determines whether devices are capable of withstanding the soldering temperature encountered in printed wiring board assembly operations, without degrading their electrical characteristics or internal connections. This test is destructive and may be used for qualification, lot acceptance and as a product monitor. The heat is conducted through the leads into the device package from solder heat at the reverse side of the board. This procedure does not simulate wave soldering or reflow heat exposure on the same side of the board as the package body. This edition includes the following significant technical changes with respect to the previous edition:
- inclusion of new Clause 3, Terms and definitions;
- clarification of the use of a soldering iron for producing the heating effect;
- inclusion an option to use accelerated ageing.

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 15: Résistance à la température de brasage pour dispositifs par trous traversants

IEC 60749-15:2020 est disponible sous forme de IEC 60749-15:2020 RLV qui contient la Norme internationale et sa version Redline, illustrant les modifications du contenu technique depuis l'édition précédente.
L'IEC 60749-15:2020 décrit un essai utilisé pour déterminer si les dispositifs à semiconducteurs encapsulés utilisés pour le montage par trous traversants peuvent résister aux effets de la température à laquelle ils sont soumis pendant le brasage de leurs broches en utilisant le brasage à la vague. Dans le but d'établir une procédure d'essai normalisée pour les méthodes les plus reproductibles, la méthode d'immersion dans la brasure est utilisée en raison de ses conditions plus contrôlables. Cette procédure détermine si les dispositifs sont capables de résister à la température de brasage rencontrée lors d'opérations de fabrication des cartes à câblage imprimé, sans endommager leurs caractéristiques électriques ou leurs connexions internes. Cet essai est destructif et il peut être utilisé en vue de la qualification, de l’acceptation de lots et pour contrôler les produits.
La chaleur du brasage se propage dans le boîtier du dispositif par les broches de l'autre côté de la carte. Cette procédure ne simule pas l'exposition à la chaleur du brasage à la vague ou à la chaleur de refusion sur le même côté de la carte que le corps du boîtier. La présente édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:
- ajout de l'Article 3, Termes et définitions;
- clarification sur l'utilisation d'un fer à braser pour produire un effet thermique;
- ajout d'une option relative à l'utilisation du vieillissement accéléré.

General Information

• Status: Published
• Publication Date: 13-Jul-2020
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: TC 47 - Semiconductor devices
• Drafting Committee: WG 2 - TC 47/WG 2
• Current Stage: PPUB - Publication issued
• Start Date: 07-Aug-2020
• Completion Date: 14-Jul-2020

Relations

• Revises: IEC 60749-15:2010 - Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
• Effective Date: 05-Sep-2023

Standards Content (Sample)

IEC 60749-15 ®
Edition 3.0 2020-07
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
Semiconductor devices – Mechanical and climatic test methods –
Part 15: Resistance to soldering temperature for through-hole mounted devices

All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
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About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

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IEC 60749-15 ®
Edition 3.0 2020-07
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
Semiconductor devices – Mechanical and climatic test methods –

Part 15: Resistance to soldering temperature for through-hole mounted devices

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.080.01 ISBN 978-2-8322-8686-9

– 2 – IEC 60749-15:2020 RLV © IEC 2020
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Test apparatus . 6
4.1 Solder pot . 6
4.2 Dipping device . 7
4.3 Heatsinks or shielding . 7
5 Materials . 7
5.1 Solder . 7
5.2 Flux . 8
6 Procedure . 8
6.1 Test method . 8
6.2 Ageing and pre-conditioning of specimens . 8
6.3 Preparation of the solder bath . 8
6.4 Use of flux . 8
6.5 Solder dip . 8
6.6 Precautions . 8
6.7 Measurements . 9
6.8 Failure criteria . 9
7 Summary . 9
Bibliography . 10

Table 1 – Parameters for solder dipping. 7

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 15: Resistance to soldering temperature
for through-hole mounted devices

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
This redline version of the official IEC Standard allows the user to identify the changes
made to the previous edition. A vertical bar appears in the margin wherever a change
has been made. Additions are in green text, deletions are in strikethrough red text.

– 4 – IEC 60749-15:2020 RLV © IEC 2020
International Standard IEC 60749-15 has been prepared by IEC technical committee 47:
Semiconductor devices.
This third edition cancels and replaces the second edition published in 2010. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) inclusion of new Clause 3, Terms and definitions;
b) clarification of the use of a soldering iron for producing the heating effect;
c) inclusion an option to use accelerated ageing.
The text of this International Standard is based on the following documents:
FDIS Report on voting
47/2630/FDIS 47/2639/RVD
Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 60749 series, published under the general title Semiconductor
devices – Mechanical and climatic test methods, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 15: Resistance to soldering temperature
for through-hole mounted devices

1 Scope
This part of IEC 60749 describes a test used to determine whether encapsulated solid state
devices used for through-hole mounting can withstand the effects of the temperature to which
they are subjected during soldering of their leads by using wave soldering or a soldering iron.
In order to establish a standard test procedure for the most reproducible methods, the solder
dip method is used because of its more controllable conditions. This procedure determines
whether devices are capable of withstanding the soldering temperature encountered in printed
wiring board assembly operations, without degrading their electrical characteristics or internal
connections.
This test is destructive and may be used for qualification, lot acceptance and as a product
monitor.
This test is, in general, in conformity with IEC 60068-2-20 but, due to specific requirements of
semiconductors, the clauses of this standard apply.
2 General
The heat is conducted through the leads into the device package from solder heat at the
reverse side of the board. This procedure does not simulate wave soldering or reflow heat
exposure on the same side of the board as the package body.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.
IEC 60068-2-20, Environmental testing – Part 2-20: Tests – Test T: Test methods for
solderability and resistance to soldering heat of devices with leads
IEC 60749-3, Semiconductor devices – Mechanical and climatic test methods – Part 3:
External visual examination
IEC 60749-8, Semiconductor devices – Mechanical and climatic test methods – Part 8:
Sealing
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.

– 6 – IEC 60749-15:2020 RLV © IEC 2020
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1
colophony
DEPRECATED: rosin
natural resin obtained as the residue after removal of turpentine from the oleo-resin of the
pine tree, consisting mainly of abietic acid and related resin acids, the remainder being resin
acid esters
Note 1 to entry: "Rosin" is a synonym for colophony, and is deprecated because of the common co
...

IEC 60749-15 ®
Edition 3.0 2020-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices – Mechanical and climatic test methods –
Part 15: Resistance to soldering temperature for through-hole mounted devices

Dispositifs à semiconducteurs – Méthodes d'essais mécaniques
et climatiques –
Partie 15: Résistance à la température de brasage pour dispositifs par trous
traversants
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
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About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigendum or an amendment might have been published.

IEC publications search - webstore.iec.ch/advsearchform Electropedia - www.electropedia.org
The advanced search enables to find IEC publications by a The world's leading online dictionary on electrotechnology,
variety of criteria (reference number, text, technical containing more than 22 000 terminological entries in English
committee,…). It also gives information on projects, replaced and French, with equivalent terms in 16 additional languages.
and withdrawn publications. Also known as the International Electrotechnical Vocabulary

(IEV) online.
IEC Just Published - webstore.iec.ch/justpublished
Stay up to date on all new IEC publications. Just Published IEC Glossary - std.iec.ch/glossary
details all new publications released. Available online and 67 000 electrotechnical terminology entries in English and
once a month by email. French extracted from the Terms and Definitions clause of
IEC publications issued since 2002. Some entries have been
IEC Customer Service Centre - webstore.iec.ch/csc collected from earlier publications of IEC TC 37, 77, 86 and
If you wish to give us your feedback on this publication or CISPR.

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IEC 60749-15 ®
Edition 3.0 2020-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices – Mechanical and climatic test methods –

Part 15: Resistance to soldering temperature for through-hole mounted devices

Dispositifs à semiconducteurs – Méthodes d'essais mécaniques

et climatiques –
Partie 15: Résistance à la température de brasage pour dispositifs par trous

traversants
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.01 ISBN 978-2-8322-8604-3

– 2 – IEC 60749-15:2020 © IEC 2020
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Test apparatus . 6
4.1 Solder pot . 6
4.2 Dipping device . 6
4.3 Heatsinks or shielding . 6
5 Materials . 7
5.1 Solder . 7
5.2 Flux . 7
6 Procedure . 7
6.1 Test method . 7
6.2 Ageing and pre-conditioning of specimens . 7
6.3 Preparation of the solder bath . 7
6.4 Use of flux . 7
6.5 Solder dip . 8
6.6 Precautions . 8
6.7 Measurements . 8
6.8 Failure criteria . 8
7 Summary . 8
Bibliography . 9

Table 1 – Parameters for solder dipping. 6

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 15: Resistance to soldering temperature
for through-hole mounted devices

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60749-15 has been prepared by IEC technical committee 47:
Semiconductor devices.
This third edition cancels and replaces the second edition published in 2010. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) inclusion of new Clause 3, Terms and definitions;
b) clarification of the use of a soldering iron for producing the heating effect;
c) inclusion an option to use accelerated ageing.

– 4 – IEC 60749-15:2020 © IEC 2020
The text of this International Standard is based on the following documents:
FDIS Report on voting
47/2630/FDIS 47/2639/RVD
Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 60749 series, published under the general title Semiconductor
devices – Mechanical and climatic test methods, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 15: Resistance to soldering temperature
for through-hole mounted devices

1 Scope
This part of IEC 60749 describes a test used to determine whether encapsulated solid state
devices used for through-hole mounting can withstand the effects of the temperature to which
they are subjected during soldering of their leads by using wave soldering.
In order to establish a stand
...