IEC 60749-15:2020

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices

IEC 60749-15:2020 is available as IEC 60749-15:2020 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 60749-15:2020 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering. In order to establish a standard test procedure for the most reproducible methods, the solder dip method is used because of its more controllable conditions. This procedure determines whether devices are capable of withstanding the soldering temperature encountered in printed wiring board assembly operations, without degrading their electrical characteristics or internal connections. This test is destructive and may be used for qualification, lot acceptance and as a product monitor. The heat is conducted through the leads into the device package from solder heat at the reverse side of the board. This procedure does not simulate wave soldering or reflow heat exposure on the same side of the board as the package body. This edition includes the following significant technical changes with respect to the previous edition:
- inclusion of new Clause 3, Terms and definitions;
- clarification of the use of a soldering iron for producing the heating effect;
- inclusion an option to use accelerated ageing.

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 15: Résistance à la température de brasage pour dispositifs par trous traversants

IEC 60749-15:2020 est disponible sous forme de IEC 60749-15:2020 RLV qui contient la Norme internationale et sa version Redline, illustrant les modifications du contenu technique depuis l'édition précédente.
L'IEC 60749-15:2020 décrit un essai utilisé pour déterminer si les dispositifs à semiconducteurs encapsulés utilisés pour le montage par trous traversants peuvent résister aux effets de la température à laquelle ils sont soumis pendant le brasage de leurs broches en utilisant le brasage à la vague. Dans le but d'établir une procédure d'essai normalisée pour les méthodes les plus reproductibles, la méthode d'immersion dans la brasure est utilisée en raison de ses conditions plus contrôlables. Cette procédure détermine si les dispositifs sont capables de résister à la température de brasage rencontrée lors d'opérations de fabrication des cartes à câblage imprimé, sans endommager leurs caractéristiques électriques ou leurs connexions internes. Cet essai est destructif et il peut être utilisé en vue de la qualification, de l’acceptation de lots et pour contrôler les produits.
La chaleur du brasage se propage dans le boîtier du dispositif par les broches de l'autre côté de la carte. Cette procédure ne simule pas l'exposition à la chaleur du brasage à la vague ou à la chaleur de refusion sur le même côté de la carte que le corps du boîtier. La présente édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:
- ajout de l'Article 3, Termes et définitions;
- clarification sur l'utilisation d'un fer à braser pour produire un effet thermique;
- ajout d'une option relative à l'utilisation du vieillissement accéléré.

General Information

• Status: Published
• Publication Date: 13-Jul-2020
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: TC 47 - Semiconductor devices
• Drafting Committee: WG 2 - TC 47/WG 2
• Current Stage: PPUB - Publication issued
• Start Date: 07-Aug-2020
• Completion Date: 14-Jul-2020

Relations

• Revises: IEC 60749-15:2010 - Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
• Effective Date: 05-Sep-2023

Standards Content (Sample)

IEC 60749-15
®

Edition 3.0 2020-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE


Semiconductor devices – Mechanical and climatic test methods –
Part 15: Resistance to soldering temperature for through-hole mounted devices

Dispositifs à semiconducteurs – Méthodes d'essais mécaniques
et climatiques –
Partie 15: Résistance à la température de brasage pour dispositifs par trous
traversants

IEC 60749-15:2020-07(en-fr)

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IEC 60749-15

®


Edition 3.0 2020-07




INTERNATIONAL



STANDARD




NORME


INTERNATIONALE











Semiconductor devices – Mechanical and climatic test methods –

Part 15: Resistance to soldering temperature for through-hole mounted devices



Dispositifs à semiconducteurs – Méthodes d'essais mécaniques

et climatiques –

Partie 15: Résistance à la température de brasage pour dispositifs par trous


traversants













INTERNATIONAL

ELECTROTECHNICAL

COMMISSION


COMMISSION

ELECTROTECHNIQUE


INTERNATIONALE




ICS 31.080.01 ISBN 978-2-8322-8604-3




Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

---------------------- Page: 3 ----------------------
– 2 – IEC 60749-15:2020 © IEC 2020
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Test apparatus . 6
4.1 Solder pot . 6
4.2 Dipping device . 6
4.3 Heatsinks or shielding . 6
5 Materials . 7
5.1 Solder . 7
5.2 Flux . 7
6 Procedure . 7
6.1 Test method . 7
6.2 Ageing and pre-conditioning of specimens . 7
6.3 Preparation of the solder bath . 7
6.4 Use of flux . 7
6.5 Solder dip . 8
6.6 Precautions . 8
6.7 Measurements . 8
6.8 Failure criteria . 8
7 Summary . 8
Bibliography . 9

Table 1 – Parameters for solder dipping. 6

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IEC 60749-15:2020 © IEC 2020 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 15: Resistance to soldering temperature
for through-hole mounted devices

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
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9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60749-15 has been prepared by IEC technical committee 47:
Semiconductor devices.
This third edition cancels and replaces the second edition published in 2010. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) inclusion of new Clause 3, Terms and definitions;
b) clarification of the use of a soldering iron for producing the heating effect;
c) inclusion an option to use accelerated ageing.

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– 4 – IEC 60749-15:2020 © IEC 2020
The text of this International Standard is based on the following documents:
FDIS Report on voting
47/2630/FDIS 47/2639/RVD

Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 60749 series, published under the general title Semiconductor
devices – Mechanical and climatic test methods, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

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IEC 60749-15:2020 © IEC 2020 – 5 –
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 15: Resistance to soldering temperature
for through-hole mounted devices



1 Scope
This part of IEC 60749 describes a test used to determine whether encapsulated solid state
devices used for through-hole mounting can withstand the effects of the temperature to which
they are subjected during soldering of their leads by using wave soldering.
In order to establish a standard test procedure for the most reproducible methods, the solder
dip method is used because of its more controllable conditions. This procedure determines
whether devices are capable of withstanding the soldering temperature encountered in printed
wiring board assembly operations, without degrading their electrical characteristics or internal
connections.
This test is destructive and may be used for qualification, lot acceptance and as a product
monitor.
The heat is conducted through the leads into the device package from solder heat at the
reverse side of the board. This procedure does not simulate wave soldering or reflow heat
exposure on the same side of the board as the package body.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.
IEC 60068-2-20, Environmental testing – Part 2-20: Tests – Test T: Test methods for
solderability and resistance to soldering heat of devices with leads
IEC 60749-3, Semiconductor devices – Mechanical and climatic test methods – Part 3:
External visual examination
IEC 60749-8, Semiconductor devices – Mechanical and climatic test methods – Part 8:
Sealing
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp

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– 6 – IEC 60749-15:2020 © IEC 2020
3.1
colophony
DEPRECATED: rosin
natural resin obtained as the residue after removal of turpentine from the oleo-resin of the
pine tree, consisting mainly of abietic acid and related resin acids, the remainder being resin
acid esters
Note 1 to entry: "Rosin" is a synonym for colophony, and is deprecated because of the common confusion with
the generic term "resin".
3.2
lead-free solder
alloy that does not contain more than 0,1 % lead (Pb) by weight as its constituent and is used
for joining components to substrates or for coating surfaces
[SOURCE: IEC 60194:2015, 75.1904, modified – The words "as its constituent" have been
added to the definition.]
3.3
resistance to soldering heat
ability of device to withstand the highest temperature of the termination or lead in soldering
process, within applicable temperature range of solder alloy
4 Test apparatus
4.1 Solder pot
A solder pot of sufficient size to contain at least 1 kg of solder shall be used. The solder pot
dimensions shall allow full immersion of the leads without touching the bottom. The apparatus
shall be capable of maintaining the solder at the temperature specified in Table 1.
Table 1 – Parameters for solder dipping
Parameter SnPb solder Pb-free solder
Temperature of molten solder °C 260 ± 5 270 ± 5
Number of immersions ≤ 2 ≤ 2
−1
Immersion rate mm s 25 ± 6 25 ± 6
Dwell time s
+2 +2
10 7
0 0
−1
Emersion rate mm s 25 ± 6 25 ± 6

4.2 Dipping device
A mechanical dipping device shall be used that is capable of controlling the rates of
immersion and emersion of the leads and providing the dwell time as specified in Table 1.
4.3 Heatsinks or shielding
If applicable, heatsinks or shielding shall be attached to the devices prior to the test and shall
be as specified in the relevant specification.

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IEC 60749-15:2020 © IEC 2020 – 7 –
5 Materials
5.1 Solder
The solder specification shall be as follows.
Chemical composition:
– for SnPb solder, the composition in percentage by weight shall be as follows:
Sn60Pb40 or Sn63Pb37 (Sn ± 1 %) chemical composition
– for Pb-free solder, the composition in percentage by weight shall be as follows:
Silver: 3 % to 4 %;
Copper: 0,5 % to 1 %;
Tin: the remainder.
The solder shall not contain impurities which will adversely affect its properties.
Other solders and their applicable bath temperatures may be used as detailed in the relevant
specification.
5.2 Flux
If flux is applied prior to solder dipping, the flux shall consist of 25 % by weight of colophony
in 75 % by weight of isopropyl alcohol, unless otherwise detailed in the relevant specification.
6 Procedure
6.1 Test method
The method used in this procedure requires the specimen to be dipped into a solder bath
under specified conditions. The solder bath method is the one which simulates most closely
the soldering procedures of flow soldering and similar soldering processes. In circumstances
where the solder dip method is considered to impracticable the specimen can be tested by the
application of a heated soldering iron under controlled conditions. This is described in
IEC 60068-2-20.
6.2 Ageing and pre-conditioning of specimens
If required by the relevant specification, the test conditioning shall be preceded by
accelerated ageing such as steam ageing, damp heat conditioning, dry heat conditioning or
unsaturated pressurized vapour conditioning. Accelerated ageing shall be performed in
accordance with IEC 60068-2-20.
Any other special pre-conditioning of the specimens prior to testing shall be as detailed in
the relevant specification. This preparation may include operations such as bending or other
relocation of leads, and the attachment of heat sinks or protective shielding prior to
solder dipping.
6.3 Preparation of the solder bath
The molten solder shall be stirred to assure that the temperature is uniform. The dross shall
be skimmed from the surface of the molten solder just prior to dipping the part.
6.4 Use of flux
Where detailed in the relevant specification, all leads of the specimen shall be dipped in flux
prior to solder dip; excess flux shall be removed by draining for a suitable time.

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– 8 – IEC 60749-15:2020 © IEC 2020
6.5 Solder dip
The part shall be attached to the dipping device (see 4.2) and the leads immersed in the
molten solder to within 1 mm of the body of the device under test. The parameters for solder
temperature,
...