IEC 60194-2:2017
(Main)Printed boards design, manufacture and assembly - Vocabulary - Part 2: Common usage in electronic technologies as well as printed board and electronic assembly technologies
Printed boards design, manufacture and assembly - Vocabulary - Part 2: Common usage in electronic technologies as well as printed board and electronic assembly technologies
IEC 60194-2:2017(E) covers terms and definitions related to printed board and electronic assembly technologies as well as other electronic technologies.
This first edition, together with IEC 60194-1, will cancel and replace IEC 60194:2015. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to IEC 60194:2015:
a) exclusion of 32 general terms better served by other TCs;
b) exclusion of 47 terms no longer used by the electronics assembly industry;
c) inclusion of 13 new terms related with device embedded substrate technology;
d) removal of identification codes for terms as well as annexes.
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IEC 60194-2 ®
Edition 1.0 2017-12
INTERNATIONAL
STANDARD
colour
inside
Printed boards design, manufacture and assembly – Vocabulary –
Part 2: Common usage in electronic technologies as well as printed board and
electronic assembly technologies
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IEC 60194-2 ®
Edition 1.0 2017-12
INTERNATIONAL
STANDARD
colour
inside
Printed boards design, manufacture and assembly – Vocabulary –
Part 2: Common usage in electronic technologies as well as printed board and
electronic assembly technologies
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.180; 31.190 ISBN 978-2-8322-5133-1
– 2 – IEC 60194-2:2017 © IEC 2017
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
3.1 A . 5
3.2 B . 8
3.3 C . 11
3.4 D . 17
3.5 E . 19
3.6 F . 20
3.7 G . 22
3.8 H . 23
3.9 I . 24
3.10 J . 25
3.11 K . 25
3.12 L . 25
3.13 M . 28
3.14 N . 30
3.15 O . 30
3.16 P . 30
3.17 Q . 34
3.18 R . 35
3.19 S . 37
3.20 T . 40
3.21 U . 41
3.22 V . 42
3.23 W . 42
3.24 Z . 43
Bibliography . 44
Figure 1 – Ball grid array (BGA) . 9
Figure 2 – Bumped die . 11
Figure 3 – Chip on board (COB) . 13
Figure 4 – Flip chip . 22
Figure 5 – Histogram . 23
Figure 6 – Leaded surface-mount component – Gull wing-shaped lead . 26
Figure 7 – Passive array . 31
Figure 8 – Pin grid array . 32
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PRINTED BOARDS DESIGN, MANUFACTURE
AND ASSEMBLY – VOCABULARY –
Part 2: Common usage in electronic technologies as well
as printed board and electronic assembly technologies
FOREWORD
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International Standard IEC 60194-2 has been prepared by IEC technical committee 91:
Electronics assembly technology.
This first edition, together with IEC 60194-1, will cancel and replace IEC 60194:2015. This
edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to
IEC 60194:2015:
a) exclusion of 32 general terms better served by other TCs;
b) exclusion of 47 terms no longer used by the electronics assembly industry;
c) inclusion of 13 new terms related with device embedded substrate technology;
d) removal of identification codes for terms as well as annexes.
– 4 – IEC 60194-2:2017 © IEC 2017
The text of this International Standard is based on the following documents:
CDV Report on voting
91/1442/CDV 91/1473/RVC
Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.
PRINTED BOARDS DESIGN, MANUFACTURE
AND ASSEMBLY – VOCABULARY –
Part 2: Common usage in electronic technologies as well
as printed board and electronic assembly technologies
1 Scope
This part of IEC 60194 covers terms and definitions related to printed board and electronic
assembly technologies as well as other electronic technologies.
2 Normative references
There are no normative references in this document.
3 Terms and definitions
For the purposes of electronics assembly technology, the terms and definitions in 3.1 to 3.24
apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1
...
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