IEC TS 62686-1:2020

Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors

IEC TS 62686-1:2020 defines the minimum requirements for general purpose "off the shelf" COTS (commercial off-the-shelf) integrated circuits and discrete semiconductors for ADHP (aerospace, defence and high performance) applications. This Technical Specification applies to all components that can be operated in ADHP applications within the manufacturers' publicly available data sheet limits in conjunction with IEC TS 62239-1. It may be used by other high performance and high reliability industries, at their discretion. This new edition includes the following significant technical changes with respect to the previous edition:
- update related to obsolescence of STACK Specification S/0001 revision 14 notice 3;
- addition of alternative automotive methods of compliance and revision of Annex B initially related to cross-reference to STACK Specification S/0001;
- addition of an Annex C to include a requirement matrix for IEC TS 62686-1 verification.

General Information

• Status: Published
• Publication Date: 19-Apr-2020
• ICS: 03.100.50 - Production. Production management
• ICS: 31.020 - Electronic components in general
• ICS: 49.060 - Aerospace electric equipment and systems
• Technical Committee: TC 107 - Process management for avionics
• Drafting Committee: MT 3 - TC 107/MT 3
• Current Stage: PPUB - Publication issued
• Start Date: 20-Apr-2020
• Completion Date: 30-Mar-2020

Relations

• Revises: IEC TS 62686-1:2015 - Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors
• Effective Date: 05-Sep-2023

Overview

IEC TS 62686-1:2020 - Process management for avionics - Part 1 defines minimum requirements for general-purpose COTS integrated circuits and discrete semiconductors used in ADHP (aerospace, defence and high performance) applications. The Technical Specification applies when components are used within manufacturers’ publicly available datasheet limits and in conjunction with IEC TS 62239-1. The 2020 edition includes updates addressing the obsolescence of STACK Specification S/0001 rev.14 notice 3, addition of alternative automotive compliance methods, revision of Annex B, and a new Annex C requirement matrix for verification.

Key topics and technical requirements

IEC TS 62686-1 organizes practical process, quality and technical controls relevant to high-reliability electronic parts. Major topics include:

• Scope and applicability for COTS ICs and discrete semiconductors in ADHP systems
• Procedures for product discontinuance, ESD protection during manufacture, specification control and anti‑counterfeit traceability
• Product Change Notification (PCN) requirements and notifiable-change categories
• Shipment and packaging controls: date‑code marking, inner containers, MSL and lead‑free marking
• Electrical and mechanical requirements: electrical testing, parameter assessment, device marking, moisture sensitivity and hermeticity
• Qualification and reliability: qualification methodology, sample plans, maintenance of qualification, HTOL/HTRB/HTGB and other stress tests (see Annex A test code list)
• Quality assurance and auditability: internal audits, subcontract manufacturing controls, failure analysis support and outgoing quality
• Supplier performance monitoring: lot acceptance, suspension/termination processes and product monitor programs
• Environmental health & safety (EHS) and material handling requirements
• Single Event Effects (SEE) monitoring and corrective action reporting
• Annexes: Test code information and a verification requirement matrix (Annex C)

Practical applications and who uses it

This Technical Specification is essential for:

• Avionics and defence systems engineers selecting or qualifying high-reliability COTS ICs and discrete semiconductors
• Procurement and supplier quality teams managing supplier performance, PCNs and obsolescence risk
• Component manufacturers and contract manufacturers implementing traceability, ESD and shipment controls
• Reliability and test laboratories performing qualification testing, product monitoring and failure analysis
• Systems integrators and high‑performance industry users applying ADHP best practices

Using IEC TS 62686-1 helps reduce field failures, manage obsolescence, and ensure consistent supplier controls for safety‑critical electronics.

Related standards

• IEC TS 62239-1 (used in conjunction with this TS)
• STACK Specification S/0001 (referenced in prior editions; note recent obsolescence-related updates in this edition)

Keywords: IEC TS 62686-1:2020, ADHP, avionics, COTS components, high reliability integrated circuits, discrete semiconductors, qualification, product change notification, traceability, ESD, MSL, supplier performance.

Standards Content (Sample)

IEC TS 62686-1 ®
Edition 3.0 2020-04
TECHNICAL
SPECIFICATION
Process management for avionics – Electronic components for aerospace,
defence and high performance (ADHP) applications –
Part 1: General requirements for high reliability integrated circuits and discrete
semiconductors
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IEC TS 62686-1 ®
Edition 3.0 2020-04
TECHNICAL
SPECIFICATION
Process management for avionics – Electronic components for aerospace,

defence and high performance (ADHP) applications –

Part 1: General requirements for high reliability integrated circuits and discrete

semiconductors
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 03.100.50; 31.020; 49.060 ISBN 978-2-8322-8011-9

– 2 – IEC TS 62686-1:2020 © IEC 2020
CONTENTS
FOREWORD . 6
INTRODUCTION . 8
1 Scope . 9
2 Normative references . 9
3 Terms, definitions and abbreviated terms . 10
3.1 Terms and definitions . 10
3.2 Abbreviated terms . 12
4 Technical requirements . 14
4.1 General . 14
4.1.1 Overview . 14
4.1.2 Automotive components . 15
4.2 Procedures . 15
4.2.1 General . 15
4.2.2 Product discontinuance . 15
4.2.3 ESD protection during manufacture . 15
4.2.4 Specification control . 16
4.2.5 Traceability including anti-counterfeit measures . 16
4.3 Product or process change notification (PCN) . 16
4.3.1 General . 16
4.3.2 Notification . 16
4.3.3 Notification details . 16
4.3.4 Notifiable changes . 17
4.4 Shipment controls . 17
4.4.1 General . 17
4.4.2 Shipping container and date code marking . 17
4.4.3 Date code remarking . 17
4.4.4 Inner container formation . 17
4.4.5 Date code age on delivery . 18
4.4.6 ESD marking . 18
4.4.7 MSL . 18
4.4.8 Lead-free marking . 18
4.4.9 Labels . 18
4.5 Electrical . 19
4.5.1 General . 19
4.5.2 Electrical test . 19
4.5.3 Electrical parameter assessment . 19
4.5.4 SDRAM memories . 20
4.5.5 Logic families . 20
4.5.6 Power MOSFETs . 20
4.5.7 Silicon rectifier diodes . 20
4.6 Mechanical . 20
4.6.1 General . 20
4.6.2 Device marking . 20
4.6.3 Small packages . 20
4.6.4 Moisture sensitivity . 20
4.6.5 Robustness of hermetic seals . 21

4.6.6 Termination finishes . 21
4.7 Audit capability . 21
4.7.1 General . 21
4.7.2 Internal quality audits . 21
4.7.3 Subcontract manufacturing . 22
4.8 Quality assurance . 22
4.8.1 General . 22
4.8.2 Quality system . 22
4.8.3 Sampling plans . 22
4.8.4 Failure analysis support . 22
4.8.5 Outgoing quality . 22
4.9 Qualification . 23
4.9.1 General . 23
4.9.2 Methodology . 24
4.9.3 Test samples . 25
4.9.4 Qualification categories . 26
4.9.5 Maintenance of qualification standard . 26
4.9.6 In-process test results . 26
4.9.7 Product monitor results . 30
4.9.8 References . 30
4.9.9 Qualification report . 30
4.9.10 Archiving . 30
4.9.11 Qualification by similarity . 30
4.9.12 Similarity assessment . 30
4.10 Reliability . 31
4.10.1 General . 31
4.10.2 Operating reliability. 31
4.10.3 Failure criteria . 31
4.10.4 Corrective action . 32
4.10.5 Warranty . 32
4.10.6 Single event effects (SEEs) . 32
4.11 Product monitor . 32
4.11.1 General . 32
4.11.2 Monitor programme . 32
4.11.3 Problem notification . 32
4.11.4 Data reporting. 33
4.11.5 Samples . 33
4.11.6 Corrective action . 33
4.11.7 Product monitor results . 33
4.11.8 Accumulated test data . 33
4.12 Environmental health and safety (EHS) . 34
4.12.1 General . 34
4.12.2 EHS compliance . 34
4.12.3 Device handling . 34
4.12.4 Device materials . 34
4.13 Shipping containers . 34
4.13.1 General . 34
4.13.2 ESD requirements . 34
4.13.3 Magazine reuse . 36

– 4 – IEC TS 62686-1:2020 © IEC 2020
4.13.4 Tubes . 36
4.13.5 Trays . 36
4.13.6 Tape and reel . 37
4.14 Compliance with internal standards . 37
Annex A (informative) Test code (TC) information . 38
A.1 General . 38
A.2 TC1 – Autoclave (ATC) . 38
A.3 TC2 – Bond strength, internal (BS) . 38
A.4 TC3 – Die shear strength (DS) . 38
A.5 TC4 – Electromigration (EM) . 38
A.6 TC5 – Electrostatic discharge (ESD) . 39
A.7 TC6 – Electrical test (ET) . 39
A.8 TC7 – Electrical distributions (EDs) . 39
A.9 TC8 – Flammability (FL) . 40
A.10 TC9 – Hot carrier injection (HCI) . 40
A.11 TC10 – Hermeticity (HE) . 40
A.12 TC11 – High temperature bake (HTB) . 40
A.13 TC12 – High temperature blocking bias (HTBB) . 41
A.14 TC13 – High temperature gate bias (HTGB) . 41
A.15 TC14 – High temperature reverse bias (HTRB) . 41
A.16 TC15 – High temperature operating life (HTOL) . 41
A.16.1 General . 41
A.16.2 Qualification conditions . 41
A.16.3 Test results assessment . 42
A.16.4 Temperature acceleration factor . 42
A.16.5 Supply voltage acceleration factor . 43
A.17 TC16 – Latch-up (LU) . 43
A.18 TC17 – Lead integrity (LI) . 43
A.19 TC18 – Lid torque (LT) . 43
A.20 TC19 – Mechanical sequence (MS) . 43
A.20.1 General . 43
A.20.2 Constant acceleration . 44
A.20.3 Vibration (variable frequency) . 44
A.20.4 Mechanical shock . 44
A.21 TC20 – Marking permanency (MP) . 44
A.22 TC21 – Non-volatile memory operating life (NVL) . 44
A.23 TC22 – Time dependent dielectric breakdown (oxide integrity) (OI) . 45
A.24 TC23 – Package dimensions (PD) . 45
A.25 TC24 – Power cycling (PTC) . 45
A.26 TC25 – Resistance to solder heat (RSH) . 45
A.27 TC26 – Solder preconditioning (PC) . 46
A.28 TC27 – Solderability (SD) . 46
A.29 TC28 – Soft error rate (SER). 46
A.30 TC29 – Steady state operating life (SSOL) . 47
A.31 TC30 – Temperature cycling (TPC) . 47
A.32 TC31 – Temperature humidity reverse bias (THRB) . 48
A.33 TC32 – Temperature humidity bias (THB or HAST) . 48
A.34 TC33 – Terminal strength (TS) . 48
A.35 TC34 – Thermal resistance (thermal impedance) (TR) . 48

A.36 TC35 – Visual inspection (VI) . 49
A.36.1 TC35a – External visual inspection . 49
A.36.2 TC35b – Internal visual inspection . 49
A.37 TC36 – Water vapour content, internal (WV) . 50
A.38 TC37 – X-ray inspection (XR) . 50
A.39 TC38 – Moisture sensitivity level (MSL) . 50
A.40 TC39 – Ball shear test (BST) . 50
A.41 TC40 – Negative bias temperature instability (NBTI) . 50
A.42 TC41 – Accelerated tin whisker test . 51
Annex B (informative) Typical automotive component requirements . 52
Annex C (informative) Requirement matrix for IEC TS 62686-1 verification . 54
Bibliography . 78

Table 1 – Label requirements. 19
Table 2 – Internal quality audit requirements. 21
Table 3 – Outgoing quality . 23
Table 4 – Technology/family qualification and device qualification (1 of 3) . 27
Table 5 – Product monitor tests . 34
Table A.1 – Conditions of the DC over voltage stress method of JP001.01 or
IEC 62416 test . 40
Table A.2 – Examples of temperature acceleration factors . 42
Table A.3 – Dip and look test references. 46
Table A.4 – Parameter values for consideration . 47
Table A.5 – Test conditions. 47
Table A.6 – Test methods . 48
Table C.1 – Requirement matrix . 54

– 6 – IEC TS 62686-1:2020 © IEC 2020
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PROCESS MANAGEMENT FOR AVIONICS –
ELECTRONIC COMPONENTS FOR AEROSPACE, DEFENCE
AND HIGH PERFORMANCE (ADHP) APPLICATIONS –

Part 1: General requirements for high reliability
integrated circuits and discrete semiconductors

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
The main task of IEC technical committees is to prepare International Standards. In exceptional
circumstances, a technical committee may propose the publication of a Technical Specification
when
• the required support cannot be obtained for the publication of an International Standard,
despite repeated efforts, or
• the subject is still under technical development or where, for any other reason, there is the
future but no immediate possibility of an agreement on an International Standard.
Technical Specifications are subject to review within three years of publication to decide
whether they can be transformed into International Standards.
IEC TS 62686-1, which is a Technical Specification, has been prepared by IEC technical
committee 107: Process management for avionics.

This third edition cancels and replaces the second edition, published in 2015. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) update related to obsolescence of STACK Specification S/0001 revision 14 notice 3;
b) addition of alternative automotive methods of compliance and revision of Annex B initially
related to cross-reference to STACK Specification S/0001;
c) addition of an Annex C to include a requirement matrix for IEC TS 62686-1 verification.
The text of this Technical Specificationis based on the following documents:
Draft TS Report on voting
107/361A/RVDTS
107/349/DTS
107/361/RVDTS
Full information on the voting for the approval of this Technical Specification can be found in
the report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 62686 series, published under the general title Process management
for avionics – Electronic components for aerospace, defence and high performance (ADHP)
applications, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific publication. At this date, the publication will be
• transformed into an International standard,
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
– 8 – IEC TS 62686-1:2020 © IEC 2020
INTRODUCTION
This part of IEC 62686 includes all the requirements of the now obsolete STACK Specification
S/0001 revision 14 notice 3 and also contains revisions for alternative strategies using for
example automotive standards together with the option of using various qualification test
methods and additional test information.
This document complements IEC TS 62564-1 which is used for ADHP applications when
additional manufacturers' data is required beyond the publicly available original component
manufacturers' published data sheets (for example when additional thermal performance data
is required for thermally challenging applications or when additional verification data is needed,
for example to comply with the requirements of RTCA DO-254/EUROCAE ED-80 for complex
components for flight critical applications, etc.).
This document can also be used to comply with the typical qualification requirements of
IEC TS 62564-1. Further guidance is given in IEC 62239-1.
NOTE Existing STACK certified manufacturers can be audited by IECQ under the new STACK-IECQ joint venture
or alternatively to the new IECQ automotive scheme.

PROCESS MANAGEMENT FOR AVIONICS –
ELECTRONIC COMPONENTS FOR AEROSPACE, DEFENCE
AND HIGH PERFORMANCE (ADHP) APPLICATIONS –

Part 1: General requirements for high reliability
integrated circuits and discrete semiconductors

1 Scope
This part of IEC 62686, which is a Technical Specification, defines the minimum requirements
for general purpose "off the shelf" COTS (commercial off-the-shelf) integrated circuits and
discrete semiconductors for ADHP (aerospace, defence and high performance) applications.
This document applies to all components that can be operated in ADHP applications within the
manufacturers’ publicly available data sheet limits in conjunction with IEC 62239-1. It can be
used by other high performance and high reliability industries, at their discretion.
ADHP application requirements are not necessarily fulfilled by this document alone. ADHP
OEMs (original equipment manufacturers) might need to consider redesigning their products or
conducting further testing to verify suitability in ADHP applications using their IEC 62239-1
ECMP procedures. Alternatively, a component in accordance with IEC TS 62564-1 can be more
suitable.
NOTE Component qualification and outgoing quality discussed herein do not addres component atmospheric
radations SEE effects per IEC 62396-1.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies.
For undated references, the latest edition of the referenced document (including any
amendments) applies.
ANSI/EIA-556, Outer Shipping Container Bar Code Label Standard
ANSI/ESD S541, Packaging Materials Standards for ESD Sensitive Items
IPC/JEDEC J-STD-609, Marking and Labeling of Components, PCBs and PCBAs to Identify
Lead (Pb), Lead-Free (Pb-Free) and Other Attributes
JEDEC/IPC/ECIA J-STD-048, Notification Standard for Product Discontinuance
JEP130, Guidelines for Packing and Labeling of Integrated Circuits in Unit Container Packing
JESD471, Symbol and Label for Electrostatic Sensitive Devices
J-STD-046, Customer Notification of Product/Process Changes by Solid-State Suppliers

– 10 – IEC TS 62686-1:2020 © IEC 2020
3 Terms, definitions and abbreviated terms
For the purposes of this document, the following terms, definitions and abbreviated terms apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1 Terms and definitions
3.1.1
calendar days, pl.
continuous days, including week-ends and holidays
3.1.2
container
outer shipping container consisting of one or more inner containers
3.1.3
customer
user
original equipment manufacturer (OEM) which purchases electronic components, including
integrated circuits and/or semiconductor devices compliant to this document and uses them to
design, produce, and maintain systems
3.1.4
data sheet
document prepared by the manufacturer that describes the electrical, mechanical, and
environmental characteristics of the component
3.1.5
deviation
user agreement to allow the delivery of a shipping lot which does not fully meet the requirements
of this document
Note 1 to entry: Considered equivalent to concession for the purposes of this document.
3.1.6
device specification
document written by a user and agreed by the supplier or OCM
3.1.7
form
shape, arrangement of parts, visible aspect, mode in which a part exists or manifests itself, and
material an item is constructed from
3.1.8
fit
fitability of an item to physically interface or interconnect with or become an integral part of
another item or assembly
Note 1 to entry: Size and scale are examples of considered characteristics.
3.1.9
function
work that an item is designed to do without degrading reliability

3.1.10
incoming lot
one or more shipments of a device, grouped together for the purpose of incoming inspection
3.1.11
inner container
box or bag containing devices, either in magazines or bulk packaged
3.1.12
magazine
shipping container that feeds into automatic placement machines
Note 1 to entry: Sticks, tubes, matrix trays, tape/reel, etc., are examples of magazine.
3.1.13
microcircuit
component
device
electrical or electronic device that is not subject to disassembly without destruction or
impairment of design use and is a small circuit having a high equivalent circuit element density
Note 1 to entry: It is considered as a single part composed of interconnected elements on or within a single substrate
to perform an electronic circuit function.
Note 2 to entry: This excludes printed wiring boards/printed circuit boards, circuit card assemblies and modules
composed exclusively of discrete electronic components.
3.1.14
moisture sensitivity level
MSL
rating indicating a component’s susceptibility to damage due to absorbed moisture when
subjected to reflow soldering
3.1.15
original component manufacturer
OCM
company specifying and manufacturing the electronic component
3.1.16
room temperature
temperature identified at 25 °C ± 5 °C in a room
3.1.17
semiconductor device
electronic devices in which the characteristic distinguishing electronic conduction takes place
with a semiconductor
Note 1 to entry: Semiconductor diodes are examples of semiconductor devices having two terminals and exhibiting
a nonlinear voltage-current characteristic.
Note 2 to entry: Transistors are examples of active semiconductor devices capable of providing power amplification
and having three or more terminals.
3.1.18
shipping lot
single lot of one or more containers received by a user
3.1.19
supplier
company which provides to another an electronic component which is identified by the logo or
name marked on the device
– 12 – IEC TS 62686-1:2020 © IEC 2020
Note 1 to entry: A supplier can be the OCM, a franchised distributor or agent, a non-franchised distributor, broker,
reseller, OEM, CEM and EMS etc.
3.1.20
termination
element of a component that connects it electrically and mechanically to the next level of
assembly
3.1.21
triboelectric charge
electrical charge generated by frictional movement or separation of two surfaces
3.2 Abbreviated terms
AC alternating current
ADHP aerospace, defence and high performance
AEC Automotive Electronics Council
AOQ average outgoing quality
AQEC aerospace qualified electronic component
AQL acceptable quality level
ASIC application specific integrated circuit
ATC autoclave
BGA ball grid array
BPSG borophosphosilicate glass
BS bond strength
BST ball shear test
CB certification body
CEM contract electronic manufacturer
CFC chlorofluorocarbon
COTS commercial off-the-shelf
CMOS complementary metal oxide semiconductor
D semiconductor device
DC direct current
DFMEA design failure modes and effect analysis
DLA Defense Logistics Agency (see http://www.dscc.dla.mil/)
DPM defects per million
DRAM dynamic random access memory
DS die shear
DVP&R design verification plan and report
ECMP electronic component management plan
ED electrical distribution
EHS environmental health and safety
EM electromigtration
EMAS Eco-Management and Audit Scheme (established by the European Union)
EMS electronic manufacturing services
ESD electrostatic sensitive damage
ET electrical test
FFF form, fit and function
FIT failures in time
FL flamability
GR&R gage repeatability and reproducibility analysis
h hour
HAST highly accelerated stress test
HCI hot carrier injection
HE hermeticity
HTB high temperature bake
HTBB high temperature blocking bias
HTGB high temperature gate bias
HTOL high temperature operating life
HTRB high temperature reverse bias
IECQ International Electrotechnical Commission Quality Assessment System for
Electronic Components
IATF International Automotive Task Force
IC integrated circuit
I/O input and output
IR infra-red
LI lead integrity
LT lid torgue
LTB last time buy
LTPD lot tolerance percent defective
LU latchup
min minute
MOSFET metal-oxide-semiconductor field-effect transistor
MP marking permenancy
MS mechanical sequence
MSA measurements system analysis
MSL moisture sensitivity level
NBTI negative bias temperature Instability
NMOS n-type metal oxide-semiconductor (refers to field effect transistors (MOSFETs))
NVL non-volatile memory operating life
OCM original component manufacturer
OEM original equipment manufacturer
OI oxide integrity
PC preconditioning
PCB printed circuit board
PCM process control monitor
PCN product or process change notification
PD package dimension
PFMEA process failure modes and effects analysis
PGA pin grid array
Pkg package
– 14 – IEC TS 62686-1:2020 © IEC 2020
PPAP production part approval process
PTC power cycling
QA quality assurance
RSH resistance to solder heat
SD solderability
SDRAM synchronous dynamic random access memory
SEE single event effect
SEFI single event functional interrupt
SEL single event latchup
SEU single event upset
SER soft error rate
SMD surface mount device
SPC statistical process control
SRAM static random access memory
SS sample size
SSOL solid state operating life
T ambient temperature
amb
TC test code
THB temperature humidity bias
THM through hole mount
THRB temperature humidity reverse bias
TPC temperature cycling
TR thermal resistance
TS terminal strength
T minimum operating temperature
opmin
T maximum operating temperature
opmax
UCL upper control limit
VI visual inspection
VPR vapour
WV water vapour
XR X-ray
4 Technical requirements
4.1 General
4.1.1 Overview
The supplier, preferably the original component manufacturer (OCM) or the franchised
distributor, as defined in 3.1.19 and 3.1.15 respectively, shall have an appropriate quality
management system and shall provide the following minimum technical requirements. The
supplier or the OCM can use the test methods and methodologies specified herein which are
based on IEC semiconductor test methods or any other equivalent test method, for example
JEDEC test methods (see 4.9.2.3 and Annex A) or the automotive alternative process, see
4.1.2. Proposed equivalent test methods, rationale and supporting data shall be reviewed and
shall achieve the same end objectives as specified herein. Use of such equivalent tests shall
not be considered to be deviations or waivers to the requirements of this document.

NOTE 1 ISO 9001 or AS/EN/JISQ 9100 can assist with compliance to Clause 4.
NOTE 2 In case the COTS integrated circuits and discrete semiconductors cannot be procured directly from the
OCM (for example if the quantity is too small), the franchised distribution network is usually privileged with regard to
potential risks (for example lack of traceability and counterfeiting).
Informative annexes are provided at the end of this document and their content is subject to
change. Users of this document are encouraged to review the latest data available whenever
referencing the content of these annexes as well as the Bibliography:
• Annex A: test code information which summarises all semiconductor test methods discussed
herein;
• Annex B: typical automotive component requirements;
• Annex C: requirement matrix for IEC TS 62686-1 verification;
• Bibliography.
4.1.2 Automotive components
Automotive components, which are typically manufactured on IATF 16949 certified
manufacturing lines and qualified to AEC-Q100 for temperature grades 0 and 1, with the
outgoing quality requirements typically included in a production part approval process (PPAP)
process and with the obsolescence and product change notification as specified herein, can
meet the requirements of this document; see Annex B for guidance.
NOTE 1 The IECQ automotive qualification programme can be expanded to cover this category of automotive
component.
NOTE 2 The VDA 6 series assessment, particularly VDA 6.3, can be used for the PPAP element of the IECQ
assessment process.
4.2 Procedures
4.2.1 General
The OCM shall have the following procedures:
• product discontinuance (4.2.2);
• ESD protection during manufacture (4.2.3);
• specification control (4.2.4);
• traceability including anti-counterfeit measures (4.2.5).
4.2.2 Product discontinuance
Notification shall be in accordance with JEDEC/IPC/ECIA J-STD-048 or equivalent, with the
exception of timing as described in a) and b) below:
a) the OCM shall provide the user with a notice of last order dates:
– a minimum of 12 months before these dates for single-source devices, and
– 6 months before these dates for multi-sourced devices;
b) the OCM may give less than the specified notice period provided a mutually acceptable
extension (up to the specification limit) is negotiated
...

IEC TS 62686-1 ®
Edition 3.0 2020-04
REDLINE VERSION
TECHNICAL
SPECIFICATION
colour
inside
Process management for avionics – Electronic components for aerospace,
defence and high performance (ADHP) applications –
Part 1: General requirements for high reliability integrated circuits and discrete
semiconductors
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IEC TS 62686-1 ®
Edition 3.0 2020-04
REDLINE VERSION
TECHNICAL
SPECIFICATION
colour
inside
Process management for avionics – Electronic components for aerospace,

defence and high performance (ADHP) applications –

Part 1: General requirements for high reliability integrated circuits and discrete

semiconductors
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 03.100.50; 31.020; 49.060 ISBN 978-2-8322-8246-5

– 2 – IEC TS 62686-1:2020 RLV © IEC 2020
CONTENTS
FOREWORD . 6
INTRODUCTION . 8
1 Scope . 9
2 Normative references . 9
3 Terms, definitions and abbreviated terms . 10
3.1 Terms and definitions . 10
3.2 Abbreviated terms . 12
4 Technical requirements . 15
4.1 General . 15
4.1.1 Overview . 15
4.1.2 Automotive components . 15
4.2 Procedures . 15
4.2.1 General . 15
4.2.2 Product discontinuance . 16
4.2.3 ESD protection during manufacture . 16
4.2.4 Specification control . 16
4.2.5 Traceability including anti-counterfeit measures . 16
4.3 Product or process change notification (PCN) . 16
4.3.1 General . 16
4.3.2 Notification . 17
4.3.3 Notification details . 17
4.3.4 Notifiable changes . 17
4.4 Shipment controls . 17
4.4.1 General . 17
4.4.2 Shipping container and date code marking . 18
4.4.3 Date code remarking . 18
4.4.4 Inner container formation . 18
4.4.5 Date code age on delivery . 18
4.4.6 ESD marking . 18
4.4.7 MSL . 18
4.4.8 Lead-free marking . 18
4.4.9 Labels . 18
4.5 Electrical . 19
4.5.1 General . 19
4.5.2 Electrical test . 19
4.5.3 Electrical parameter assessment . 20
4.5.4 SDRAM memories . 20
4.5.5 Logic families . 20
4.5.6 Power MOSFETs . 20
4.5.7 Silicon rectifier diodes . 20
4.6 Mechanical . 20
4.6.1 General . 20
4.6.2 Device marking . 20
4.6.3 Small packages . 20
4.6.4 Moisture sensitivity . 21
4.6.5 Robustness of hermetic seals . 21

4.6.6 Termination finishes . 21
4.7 Audit capability . 21
4.7.1 General . 21
4.7.2 Internal quality audits . 21
4.7.3 Subcontract manufacturing . 22
4.8 Quality assurance . 22
4.8.1 General . 22
4.8.2 Quality system . 22
4.8.3 Sampling plans . 22
4.8.4 Failure analysis support . 23
4.8.5 Outgoing quality . 23
4.9 Supplier performance monitoring by the user .
4.9.1 General .
4.9.2 Lot acceptance .
4.9.3 Suspension of deliveries .
4.9.4 Loss of approval .
4.9.5 AQL figures .
4.9.6 100 % screening .
4.9.7 Termination determination .
4.9 Qualification . 25
4.9.1 General . 25
4.9.2 Methodology . 25
4.9.3 Test samples . 27
4.9.4 Qualification categories . 27
4.9.5 Maintenance of qualification standards . 27
4.9.6 In-process test results . 27
4.9.7 Product monitor results . 32
4.9.8 References . 32
4.9.9 Qualification report . 32
4.9.10 Archiving . 32
4.9.11 Qualification by similarity . 32
4.9.12 Similarity assessment . 32
4.10 Reliability . 33
4.10.1 General . 33
4.10.2 Operating reliability. 33
4.10.3 Failure criteria . 33
4.10.4 Corrective action . 34
4.10.5 Warranty . 34
Suspension of certification .
4.10.6 Single event effects (SEEs) . 34
4.11 Product monitor . 34
4.11.1 General . 34
4.11.2 Monitor programme . 34
4.11.3 Problem notification . 35
4.11.4 Data reporting. 35
4.11.5 Samples . 35
4.11.6 Corrective action . 35
4.11.7 Product monitor results . 35
4.11.8 Accumulated test data . 35

– 4 – IEC TS 62686-1:2020 RLV © IEC 2020
4.12 Environmental health and safety (EHS) . 36
4.12.1 General . 36
4.12.2 EHS compliance . 36
4.12.3 Device handling . 36
4.12.4 Device materials . 36
4.13 Shipping containers . 36
4.13.1 General . 36
4.13.2 ESD requirements . 37
4.13.3 Magazine reuse . 38
4.13.4 Tubes . 38
4.13.5 Trays . 38
4.13.6 Tape and reel . 39
4.14 Compliance with internal standards . 39
Annex A (informative) Test code (TC) information . 40
A.1 General . 40
A.2 TC1 – Autoclave (AC ATC) . 40
A.3 TC2 – Bond strength, internal (BS) . 40
A.4 TC3 – Die shear strength (DS) . 40
A.5 TC4 – Electromigration (EM) . 40
A.6 TC5 – Electrostatic discharge (ESD) . 41
A.7 TC6 – Electrical test (ET) . 41
A.8 TC7 – Electrical distributions (EDs) . 41
A.9 TC8 – Flammability (FL) . 42
A.10 TC9 – Hot carrier injection (HCI) . 42
A.11 TC10 – Hermeticity (HE) . 42
A.12 TC11 – High temperature bake (HTB) . 42
A.13 TC12 – High temperature blocking bias (HTBB) . 43
A.14 TC13 – High temperature gate bias (HTGB) . 43
A.15 TC14 – High temperature reverse bias (HTRB) . 43
A.16 TC15 – High temperature operating life (HTOL) . 43
A.16.1 General . 43
A.16.2 Qualification conditions . 43
A.16.3 Test results assessment . 44
A.16.4 Temperature acceleration factor . 44
A.16.5 Supply voltage acceleration factor . 45
A.17 TC16 – Latch-up (LU) . 45
A.18 TC17 – Lead integrity (LI) . 45
A.19 TC18 – Lid torque (LT) . 45
A.20 TC19 – Mechanical sequence (MS) . 45
A.20.1 General . 45
A.20.2 Constant acceleration . 46
A.20.3 Vibration (variable frequency) . 46
A.20.4 Mechanical shock . 46
A.21 TC20 – Marking permanency (MP) . 46
A.22 TC21 – Non-volatile memory operating life (NVL) . 46
A.23 TC22 – Time dependent dielectric breakdown (oxide integrity) (OI) . 47
A.24 TC23 – Package dimensions (PD) . 47
A.25 TC24 – Power cycling (PTC) . 47
A.26 TC25 – Resistance to solder heat (RSH) . 47

A.27 TC26 – Solder preconditioning (PC) . 48
A.28 TC27 – Solderability (SD) . 48
A.29 TC28 – Soft error rate (SER). 48
A.30 TC29 – Steady state operating life (SSOL) . 49
A.31 TC30 – Temperature cycling (TP TPC) . 49
A.32 TC31 – Temperature humidity reverse bias (THRB) . 50
A.33 TC32 – Temperature humidity bias (THB or HAST) . 50
A.34 TC33 – Terminal strength (TS) . 50
A.35 TC34 – Thermal resistance (thermal impedance) (TR) . 50
A.36 TC35 – Visual inspection (VI) . 51
A.36.1 TC35a – External visual inspection . 51
A.36.2 TC35b – Internal visual inspection . 51
A.37 TC36 – Water vapour content, internal (WV) . 52
A.38 TC37 – X-ray inspection (XR) . 52
A.39 TC38 – Moisture sensitivity level (MSL) . 52
A.40 TC39 – Ball shear test (BST) . 52
A.41 TC40 – Negative bias temperature instability (NBTI) . 52
A.42 TC41 – Accelerated tin whisker test . 53
Annex B (informative) Cross-reference to STACK Specification S/0001 revision 14 .
Annex B (informative) Typical automotive component requirements . 61
Annex C (informative) Requirement matrix for IEC TS 62686-1 verification . 63
Bibliography . 87

Table 1 – Label requirements. 19
Table 2 – Internal quality audit requirements. 22
Table 3 – Outgoing quality . 23
Table 4 – Incoming test .
Table 4 – Technology/family qualification and device qualification (1 of 3) . 29
Table 5 – Product monitor tests . 36
Table A.1 – Conditions of the DC over the voltage stress method of JP001.01 or
IEC 62416 test . 42
Table A.2 – Examples of temperature acceleration factors . 44
Table A.3 – Dip and look test references. 48
Table A.4 – Parameter values for consideration . 49
Table A.5 – Test conditions. 49
Table A.6 – Test methods . 50
Table C.1 – Requirement matrix . 63

– 6 – IEC TS 62686-1:2020 RLV © IEC 2020
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PROCESS MANAGEMENT FOR AVIONICS –
ELECTRONIC COMPONENTS FOR AEROSPACE, DEFENCE
AND HIGH PERFORMANCE (ADHP) APPLICATIONS –

Part 1: General requirements for high reliability
integrated circuits and discrete semiconductors

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence between
any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
This redline version of the official IEC Standard allows the user to identify the changes
made to the previous edition. A vertical bar appears in the margin wherever a change has
been made. Additions are in green text, deletions are in strikethrough red text.

The main task of IEC technical committees is to prepare International Standards. In exceptional
circumstances, a technical committee may propose the publication of a Technical Specification
when
• the required support cannot be obtained for the publication of an International Standard,
despite repeated efforts, or
• the subject is still under technical development or where, for any other reason, there is the
future but no immediate possibility of an agreement on an International Standard.
Technical Specifications are subject to review within three years of publication to decide
whether they can be transformed into International Standards.
IEC TS 62686-1, which is a Technical Specification, has been prepared by IEC technical
committee 107: Process management for avionics.
This third edition cancels and replaces the second edition, published in 2015. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) update related to obsolescence of STACK Specification S/0001 revision 14 notice 3;
b) addition of alternative automotive methods of compliance and revision of Annex B initially
related to cross-reference to STACK Specification S/0001;
c) addition of an Annex C to include a requirement matrix for IEC TS 62686-1 verification.
The text of this Technical Specificationis based on the following documents:
Draft TS Report on voting
107/361A/RVDTS
107/349/DTS
107/361/RVDTS
Full information on the voting for the approval of this Technical Specification can be found in
the report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 62686 series, published under the general title Process management
for avionics – Electronic components for aerospace, defence and high performance (ADHP)
applications, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific publication. At this date, the publication will be
• transformed into an International standard,
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct understanding
of its contents. Users should therefore print this document using a colour printer.

– 8 – IEC TS 62686-1:2020 RLV © IEC 2020
INTRODUCTION
This part of IEC 62686 includes all the requirements of the now obsolete STACK Specification
S/0001 revision 14 notice 3 and also contains revisions for alternative IEC strategies using for
example automotive standards together with the option of using various qualification test
methods and additional test information.
This document complements IEC TS 62564-1 which is used for ADHP applications when
additional manufacturers' data is required beyond the publicly available manufacturer original
component manufacturers' published data sheets (for example when additional thermal
performance data is required for thermally challenging applications or when additional
verification data are is needed, for example to comply with the requirements of RTCA DO-
254/EUROCAE ED-80 for complex components for flight critical applications, etc.).
This document can also be used to comply with the typical qualification requirements of
IEC TS 62564-1. Further guidance is given in IEC TS 62239-1.
NOTE With the adoption of the STACK Specification S/0001 revision 14 notice 3 it will be possible for all Existing
STACK certified manufacturers to can be audited by IECQ under the new STACK-IECQ joint venture or alternatively
to the new IECQ automotive scheme.

PROCESS MANAGEMENT FOR AVIONICS –
ELECTRONIC COMPONENTS FOR AEROSPACE, DEFENCE
AND HIGH PERFORMANCE (ADHP) APPLICATIONS –

Part 1: General requirements for high reliability
integrated circuits and discrete semiconductors

1 Scope
This part of IEC 62686, which is a Technical Specification, defines the minimum requirements
for general purpose "off the shelf" COTS (commercial off-the-shelf) integrated circuits and
discrete semiconductors for ADHP (aerospace, defence and high performance) applications.
This document applies to all components that can be operated in ADHP applications within the
manufacturers’ publicly available data sheet limits in conjunction with IEC TS 62239-1. It may
can be used by other high performance and high reliability industries, at their discretion.
ADHP application requirements may are not necessarily be fulfilled by this document alone.
ADHP OEMs (original equipment manufacturers) may might need to consider redesigning their
products or conducting further testing to verify suitability in ADHP applications using their
IEC TS 62239-1 ECMP procedures. Alternatively, a component in accordance with
IEC TS 62564-1 may can be more suitable.
NOTE Component qualification and outgoing quality discussed herein do not addres component atmospheric
radations SEE effects per IEC 62396-1.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies.
For undated references, the latest edition of the referenced document (including any
amendments) applies.
ISO 9001, Quality management systems – Requirements
ISO TS 16949, Quality management systems – Particular requirements for the application of
ISO 9001:2008 for automotive production and relevant service part organizations
ANSI/EIA-556, Outer Shipping Container Bar Code Label Standard
ANSI/ESD S541, Packaging Materials Standards for ESD Sensitive Items
AS/EN/JISQ 9100, Aerospace series – Quality management systems – Requirements for
aviation, space and defense organisations
IPC/JEDEC J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State
Surface Mount Devices
IPC/JEDEC J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive
Surface Mount Devices
IPC/JEDEC J-STD-609, Marking and Labeling of Components, PCBs and PCBAs to Identify
Lead (Pb), Lead-Free (Pb-Free) and Other Attributes

– 10 – IEC TS 62686-1:2020 RLV © IEC 2020
JEDEC/IPC/ECIA J-STD-048, Notification Standard for Product Discontinuance
JEP130, Guidelines for Packing and Labeling of Integrated Circuits in Unit Container Packing
JESD471, Symbol and Label for Electrostatic Sensitive Devices
TL 9000, Quality management system
JESD46 J-STD-046, Customer Notification of Product/Process Changes by Solid-State
Suppliers
3 Terms, definitions and abbreviated terms
For the purposes of this document, the following terms, definitions and abbreviated terms apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1 Terms and definitions
3.1.1
calendar days, pl.
continuous days, including week-ends and holidays
3.1.2
container
outer shipping container consisting of one or more inner containers
3.1.3
customer
user
original equipment manufacturer (OEM) which purchases electronic components, including
integrated circuits and/or semiconductor devices compliant to this document and uses them to
design, produce, and maintain systems
3.1.4
data sheet
document prepared by the manufacturer that describes the electrical, mechanical, and
environmental characteristics of the component
3.1.5
deviation
user agreement to allow the delivery of a shipping lot which does not fully meet the requirements
of this document
Note 1 to entry: Considered equivalent to concession for the purposes of this document.
3.1.6
device specification
document written by a user and agreed by the supplier or OCM
___________
For the telecommunications industry.

3.1.7
form
shape, arrangement of parts, visible aspect, mode in which a part exists or manifests itself, and
material an item is constructed from
3.1.8
fit
fitability of an item to physically interface or interconnect with or become an integral part of
another item or assembly
Note 1 to entry: Size and scale are examples of considered characteristics.
3.1.9
function
work that an item is designed to do without degrading reliability
3.1.10
incoming lot
one or more shipments of a device, grouped together for the purpose of incoming inspection
3.1.11
inner container
box or bag containing devices, either in magazines or bulk packaged
3.1.12
magazine
shipping container that feeds into automatic placement machines
Note 1 to entry: Sticks, tubes, matrix trays, tape/reel, etc., are examples of magazine.
3.1.13
microcircuit
component
device
electrical or electronic device that is not subject to disassembly without destruction or
impairment of design use and is a small circuit having a high equivalent circuit element density
Note 1 to entry: It is considered as a single part composed of interconnected elements on or within a single substrate
to perform an electronic circuit function.
Note 2 to entry: This excludes printed wiring boards/printed circuit boards, circuit card assemblies and modules
composed exclusively of discrete electronic components.
3.1.14
moisture sensitivity level
MSL
rating indicating a component’s susceptibility to damage due to absorbed moisture when
subjected to reflow soldering
3.1.15
original component manufacturer
OCM
company specifying and manufacturing the electronic component
3.1.16
room temperature
temperature identified at 25 °C ± 5 °C in a room

– 12 – IEC TS 62686-1:2020 RLV © IEC 2020
3.1.17
semiconductor device
electronic devices in which the characteristic distinguishing electronic conduction takes place
with a semiconductor
Note 1 to entry: Semiconductor diodes are examples of semiconductor devices having two terminals and exhibiting
a nonlinear voltage-current characteristic.
Note 2 to entry: Transistors are examples of active semiconductor devices capable of providing power amplification
and having three or more terminals.
3.1.18
shipping lot
single lot of one or more containers received by a user
3.1.19
supplier
company which provides to another an electronic component which is identified by the logo or
name marked on the device
Note 1 to entry: A supplier can be the OCM, a franchised distributor or agent, a non-franchised distributor, broker,
reseller, OEM, CEM and EMS etc.
3.1.20
termination
element of a component that connects it electrically and mechanically to the next level of
assembly
3.1.21
triboelectric charge
electrical charge generated by frictional movement or separation of two surfaces
3.2 Abbreviated terms
AC alternating current
ADHP aerospace, defence and high performance
AEC Automotive Electronics Council
AOQ average outgoing quality
AQEC aerospace qualified electronic component
AQL acceptable quality level
ASIC application specific integrated circuit
ATC autoclave
BGA ball grid array
BPSG borophosphosilicate glass
BS bond strength
BST ball shear test
CB certification body
CEM contract electronic manufacturer
CFC chlorofluorocarbon
COTS commercial off-the-shelf
CMOS complementary metal oxide semiconductor
D semiconductor device
DC direct current
DFMEA design failure modes and effect analysis

DLA Defense Logistics Agency (see http://www.dscc.dla.mil/)
DPM defects per million
DRAM dynamic random access memory
DS die shear
DVP&R design verification plan and report
ECMP electronic component management plan
ED electrical distribution
EHS environmental health and safety
EM electromigtration
EMAS Eco-Management and Audit Scheme (established by the European Union)
EMS electronic manufacturing services
ESD electrostatic sensitive damage
ET electrical test
FFF form, fit and function
FIT failures in time
FL flamability
GR&R gage repeatability and reproducibility analysis
h hour
HAST highly accelerated stress test
HCI hot carrier injection
HE hermeticity
HTB high temperature bake
HTBB high temperature blocking bias
HTGB high temperature gate bias
HTOL high temperature operating life
HTRB high temperature reverse bias
IECQ International Electrotechnical Commission Quality Assessment System for
Electronic Components
IATF International Automotive Task Force
IC integrated circuit
I/O input and output
IR infra-red
LI lead integrity
LT lid torgue
LTB last time buy
LTPD lot tolerance percent defective
LU latchup
min minute
MOSFET metal-oxide-semiconductor field-effect transistor
MP marking permenancy
MS mechanical sequence
MSA measurements system analysis
MSL moisture sensitivity level

– 14 – IEC TS 62686-1:2020 RLV © IEC 2020
NBTI negative bias temperature Instability
NMOS n-type metal oxide-semiconductor (refers to field effect transistors (MOSFETs))
NVL non-volatile memory operating life
OCM original component manufacturer
OEM original equipment manufacturer
OI oxide integrity
PC preconditioning
PCB printed circuit board
PCM process control monitor
PCN product or process change notification
PD package dimension
PFMEA process failure modes and effects analysis
PGA pin grid array
Pkg package
PPAP production part approval process
PTC power cycling
QA quality assurance
RSH resistance to solder heat
SD solderability
SDRAM synchronous dynamic random access memory
SEE single event effect
SEFI single event functional interrupt
SEL single event latchup
SEU single event upset
SER soft error rate
SMD surface mount device
SPC statistical process control
SRAM static random access memory
SS sample size
SSOL solid state operating life
T ambient temperature
amb
TC test code
THB temperature humidity bias
THM through hole mount
THRB temperature humidity reverse bias
TPC temperature cycling
TR thermal resistance
TS terminal strength
T minimum operating temperature
opmin
T maximum operating temperature
opmax
UCL upper control limit
VI visual inspection
VPR vapour
WV water vapour
XR X-ray
4 Technical requirements
4.1 General
4.1.1 Overview
The supplier, preferably the original component manufacturer (OCM) or the franchised
distributor, as defined in 3.1.19 and 3.1.15 respectively, shall be Third Party ISO 9001 certified
have an appropriate quality management system and shall provide the following minimum
technical requirements. The supplier or the OCM may can use the test methods and
methodol
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