Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

IEC 61190-1-3:2017 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453. This document is a quality control document and is not intended to relate directly to the material's performance in the manufacturing process.
This edition includes the following significant technical changes with respect to the previous edition:
a) The maximum impurity level of Pb has been revised and the table of lead free solder alloys includes some additional lead free solder alloys.

Matériaux de fixation pour les assemblages électroniques - Partie 1-3: Exigences relatives aux alliages à braser de catégorie électronique et brasure solide fluxée et non-fluxée pour les applications de brasage électronique

L'IEC 61190-1-3:2017 prescrit les exigences et méthodes d'essai pour les alliages à braser de catégorie électronique, les brasures en baguette, en ruban et en poudre fluxées et non fluxées et les pâtes à braser, pour les applications de brasage électronique et pour les brasures de catégorie électronique "spéciales". Pour les spécifications génériques relatives aux alliages et aux flux à braser, voir l'ISO 9453. Le présent document est un document de contrôle de la qualité et n'a pas pour objet de s'intéresser directement à la performance du matériau au cours du procédé de fabrication.
La présente édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:
a) Le niveau maximal d'impureté du plomb a été révisé et le tableau d'alliages à braser sans plomb qui comporte des alliages à braser sans plomb supplémentaires.

General Information

Status
Published
Publication Date
12-Dec-2017
Current Stage
PPUB - Publication issued
Completion Date
13-Dec-2017
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IEC 61190-1-3
Edition 3.0 2017-12
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Attachment materials for electronic assembly –
Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-
fluxed solid solder for electronic soldering applications
Matériaux de fixation pour les assemblages électroniques –

Partie 1-3: Exigences relatives aux alliages à braser de catégorie électronique et

brasure solide fluxée et non-fluxée pour les applications de brasage
électronique
IEC 61190-1-3:2017-12(en-fr)
---------------------- Page: 1 ----------------------
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---------------------- Page: 2 ----------------------
IEC 61190-1-3
Edition 3.0 2017-12
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Attachment materials for electronic assembly –
Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-
fluxed solid solder for electronic soldering applications
Matériaux de fixation pour les assemblages électroniques –

Partie 1-3: Exigences relatives aux alliages à braser de catégorie électronique et

brasure solide fluxée et non-fluxée pour les applications de brasage
électronique
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.190 ISBN 978-2-8322-5127-0

Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
---------------------- Page: 3 ----------------------
– 2 – IEC 61190-1-3:2017 © IEC 2017
CONTENTS

FOREWORD ........................................................................................................................... 5

INTRODUCTION ..................................................................................................................... 7

1 Scope .............................................................................................................................. 8

2 Normative references ...................................................................................................... 8

3 Terms and definitions ...................................................................................................... 8

4 Classification ................................................................................................................. 11

4.1 General ................................................................................................................. 11

4.2 Alloy composition .................................................................................................. 11

4.3 Solder form ........................................................................................................... 12

4.4 Flux type ............................................................................................................... 12

4.5 Flux percentage and metal content ....................................................................... 13

4.6 Other characteristics ............................................................................................. 14

5 Requirements ................................................................................................................ 14

5.1 Materials ............................................................................................................... 14

5.2 Alloys .................................................................................................................... 14

5.2.1 General ......................................................................................................... 14

5.2.2 Variation D alloys .......................................................................................... 14

5.3 Solder forms ......................................................................................................... 15

5.3.1 General ......................................................................................................... 15

5.3.2 Bar solder ...................................................................................................... 15

5.3.3 Wire solder .................................................................................................... 15

5.3.4 Ribbon solder ................................................................................................ 15

5.3.5 Solder powder ............................................................................................... 15

5.3.6 Special solder ................................................................................................ 16

5.4 Flux type and form ................................................................................................ 16

5.4.1 General ......................................................................................................... 16

5.4.2 Flux percentage ............................................................................................. 16

5.4.3 Solder cores .................................................................................................. 17

5.4.4 Solder coatings .............................................................................................. 17

5.5 Flux residue dryness ............................................................................................. 17

5.6 Spitting ................................................................................................................. 17

5.7 Solder pool ........................................................................................................... 17

5.8 Labelling for product identification......................................................................... 17

5.9 Workmanship ........................................................................................................ 18

6 Quality assurance provisions ......................................................................................... 18

6.1 Responsibility for inspection and compliance ........................................................ 18

6.1.1 General ......................................................................................................... 18

6.1.2 Quality assurance programme ....................................................................... 18

6.1.3 Test equipment and inspection facilities ......................................................... 18

6.1.4 Inspection conditions ..................................................................................... 18

6.2 Classification of inspections .................................................................................. 18

6.3 Inspection of materials .......................................................................................... 23

6.4 Qualification inspections ....................................................................................... 23

6.4.1 General ......................................................................................................... 23

6.4.2 Sample size ................................................................................................... 23

6.4.3 Inspection routine .......................................................................................... 23

---------------------- Page: 4 ----------------------
IEC 61190-1-3:2017 © IEC 2017 – 3 –

6.5 Quality conformance ............................................................................................. 24

6.5.1 General ......................................................................................................... 24

6.5.2 Inspection routine .......................................................................................... 24

6.5.3 Sampling plan ................................................................................................ 24

6.5.4 Rejected lots ................................................................................................. 24

6.6 Preparation of solder alloy for test ........................................................................ 24

6.6.1 General ......................................................................................................... 24

6.6.2 Wire solder up to approximately 6 mm diameter............................................. 24

6.6.3 Ribbon solder and wire solder larger than approximately 6 mm diameter ....... 24

7 Preparation for delivery – Preservation, packing and packaging .................................... 24

Annex A (informative) Selection of various alloys and fluxes for use in electronic

soldering – General information concerning IEC 61190-1-3 ........................................... 25

A.1 Overview............................................................................................................... 25

A.2 Intended use ......................................................................................................... 25

A.2.1 General ......................................................................................................... 25

A.2.2 Alloys ............................................................................................................ 25

A.3 Acquisition requirements ....................................................................................... 26

A.4 Standard solder product packages ........................................................................ 27

A.4.1 General ......................................................................................................... 27

A.4.2 Wire and ribbon solders ................................................................................. 27

A.4.3 Bar solders .................................................................................................... 27

A.4.4 Solder powder ............................................................................................... 27

A.5 Protocol for establishing short names for IEC 61190-1-3 alloys ............................. 28

A.5.1 Lead containing solder alloys and specialty alloy ........................................... 28

A.5.2 Lead-free solder alloys .................................................................................. 28

A.6 Standard description of solid solder products ........................................................ 29

Annex B (normative) Lead-free solder alloys ........................................................................ 30

Annex C (informative) Marking method of solder designation for mounted board, used

in electronic equipment .................................................................................................. 41

C.1 General ................................................................................................................. 41

C.2 Marking ................................................................................................................. 41

C.2.1 Recommendation for marking ........................................................................ 41

C.2.2 Marking for solder designation ....................................................................... 41

C.2.3 Marking unit and location ............................................................................... 42

Bibliography .......................................................................................................................... 43

Figure 1 – Report form for solder alloy tests ......................................................................... 19

Figure 2 – Report form for solder powder tests ..................................................................... 20

Figure 3 – Report form for non-fluxed solder tests ................................................................ 21

Figure 4 – Report form for fluxed wire/ribbon solder tests ..................................................... 22

Figure C.1 – Example of the marking for assembled board ................................................... 42

Table 1 – Solder materials .................................................................................................... 12

Table 2 – Flux types and designating symbols ...................................................................... 13

Table 3 – Flux percentage .................................................................................................... 14

Table 4 – Standard solder powders ....................................................................................... 16

Table 5 – Solder inspections ................................................................................................. 23

---------------------- Page: 5 ----------------------
– 4 – IEC 61190-1-3:2017 © IEC 2017

Table B.1 – The composition and temperature characteristics of lead-free solder alloys ....... 30

Table B.2 – The composition and temperature characteristics of common tin-lead

alloys .................................................................................................................................... 33

Table B.3 – The composition and temperature characteristics for specialty (non-tin/lead)

alloys .................................................................................................................................... 36

Table B.4 – the cross-reference from solidus and liquidus temperatures to alloy names

by temperature ..................................................................................................................... 37

Table B.5 – The cross-reference from ISO 9453 alloy numbers and designations to

IEC 61190-1-3 alloy names ................................................................................................... 39

---------------------- Page: 6 ----------------------
IEC 61190-1-3:2017 © IEC 2017 – 5 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY –
Part 1–3: Requirements for electronic grade solder alloys and fluxed
and non-fluxed solid solder for electronic soldering applications
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote

international co-operation on all questions concerning standardization in the electrical and electronic fields. To

this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,

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governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely

with the International Organization for Standardization (ISO) in accordance with conditions determined by

agreement between the two organizations.

2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international

consensus of opinion on the relevant subjects since each technical committee has representation from all

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3) IEC Publications have the form of recommendations for international use and are accepted by IEC National

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assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any

services carried out by independent certification bodies.

6) All users should ensure that they have the latest edition of this publication.

7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and

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other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and

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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is

indispensable for the correct application of this publication.

9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of

patent rights. IEC shall not be held responsible for identifying any or all such patent rights.

International Standard IEC 61190-1-3 has been prepared by IEC technical committee 91:

Electronics assembly technology.

This third edition cancels and replaces the second edition, published in 2007 and

Amendment 1:2010. This edition constitutes a technical revision.

This edition includes the following significant technical changes with respect to the previous

edition:

a) The maximum impurity level of Pb has been revised and the table of lead free solder

alloys includes some additional lead free solder alloys.
---------------------- Page: 7 ----------------------
– 6 – IEC 61190-1-3:2017 © IEC 2017
The text of this standard is based on the following documents:
FDIS Report on voting
91/1468/FDIS 91/1488/RVD

Full information on the voting for the approval of this standard can be found in the report on

voting indicated in the above table.

A list of all parts in the IEC 61190 series, under the general title Attachment materials for

electronic assembly, can be found on the IEC website.

This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

The committee has decided that the contents of this publication will remain unchanged until

the stability date indicated on the IEC website under "http://webstore.iec.ch" in the data

related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
---------------------- Page: 8 ----------------------
IEC 61190-1-3:2017 © IEC 2017 – 7 –
INTRODUCTION

Attention is drawn to the possibility that some of the elements of this document may be the

subject of patent rights. IEC shall not be held responsible for identifying any or all such patent

rights.

The International Electrotechnical Commission (IEC) draws attention to the fact that it is

claimed that compliance with this document may involve the use of patents concerning

particular alloy compositions.

IEC takes no position concerning the evidence, validity and scope of these patent rights.

The holders of these patent rights have assured the IEC that they are willing to negotiate

licences under reasonable and non-discriminatory terms and conditions with applicants

throughout the world. In this respect, the statements of the holders of these patent rights are

registered with IEC. Information may be obtained from:
KR PAT No. 10-0797161
(KR patent application number: KR10-2007-0050905)
KOREA Institute of Industrial technology

89, Yangdaegiro-gil, Ipjang-myeon, Seobuk-gu, Cheonan-si Chungcheongnam-do 331-822 Korea

KR PAT No.10-0445350
Heesung Material LTD.
820-7, Donghang-ri, Yangseong-Myeon,Anseong-Si,Gyeonggi-Do, 456-931, KOREA
JP PAT No.3152945 , and the foreign patents
Nihon Superior
NS Bldg., 1-16-15 Esaka-Cho, Suita City, Osaka, 564-0063, Japan
JP PAT No.3296289, and the foreign patents
Fuji Electronics

Gate City Ohsaki, East tower 11-2, Osaki 1-Chome, Shinagawa-ku, Tokyo, 141-0032, Japan

JP PAT No. 3736819
Toyota Central R&D Labs., Inc.
41-1, Yokomichi, Nagakute, Aichi 480-1192, Japan
Taiho Kogyo Co., Ltd.
3-65 Midorigaoka Toyota-city, Aichi 471-8502, Japan
JP PAT No. 3622788, and the foreign patents
JP PAT No.3753168, and the foreign patents
Senju Metal Industry Co., Ltd.
Senju Hashido-cho 23, Adachi-ku, Tokyo, 120-8555, Japan

NOTE Patent rights vary between country of manufacture, sale, use and final destination; suppliers or users

remain responsible for establishing the exact legal position relevant to their own situation.

Attention is drawn to the possibility that some of the elements of this document may be the

subject of patent rights other than those identified above. IEC shall not be held responsible for

identifying any or all such patent rights.

ISO (www.iso.org/patents) and IEC (http://patents.iec.ch) maintain on-line data bases of

patents relevant to their standards. Users are encouraged to consult the data bases for the

most up to date information concerning patents.
---------------------- Page: 9 ----------------------
– 8 – IEC 61190-1-3:2017 © IEC 2017
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY –
Part 1–3: Requirements for electronic grade solder alloys and fluxed
and non-fluxed solid solder for electronic soldering applications
1 Scope

This part of IEC 61190 prescribes the requirements and test methods for electronic grade

solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for

electronic soldering applications and for "special" electronic grade solders. For the generic

specifications of solder alloys and fluxes, see ISO 9453. This document is a quality control

document and is not intended to relate directly to the material's performance in the

manufacturing process.

Special electronic grade solders include all solders which do not fully comply with the

requirements of standard solder alloys and solder materials listed herein. Examples of special

solders include anodes, ingots, preforms, bars with hook and eye ends, and multiple-alloy

solder powders.
2 Normative references

The following documents are referred to in the text in such a way that some or all of their

content constitutes requirements of this document. For dated references, only the edition

cited applies. For undated references, the latest edition of the referenced document (including

any amendments) applies.

IEC 60194:2015, Printed board design, manufacture and assembly – Terms and definitions

IEC 61189-5-2:2015, Test methods for electrical materials, printed boards and other

interconnection structures and assemblies – Part 5-2: General test methods for materials and

assemblies – Soldering flux for printed board assemblies

IEC 61189-5-3:2015, Test methods for electrical materials, printed boards and other

interconnection structures and assemblies – Part 5-3: General test methods for materials and

assemblies – Soldering paste for printed board assemblies

IEC 61189-5-4:2015, Test methods for electrical materials, printed boards and other

interconnection structures and assemblies – Part 5-4: General test methods for materials and

assemblies – Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies

IEC 61190-1-1:2002, Attachment materials for electronic assembly – Part 1-1: Requirements

for soldering fluxes for high-quality interconnections in electronics assembly

IEC 61190-1-2, Attachment materials for electronic assembly – Part 1-2: Requirements for

soldering pastes for high-quality interconnects in electronics assembly
3 Terms and definitions

For the purposes of this document, the terms and definitions given in IEC 60194 and the

following apply.

ISO and IEC maintain terminological databases for use in standardization at the following

addresses:
---------------------- Page: 10 ----------------------
IEC 61190-1-3:2017 © IEC 2017 – 9 –
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform:
...

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