Semiconductor devices - Semiconductor interface for automotive vehicles - Part 4: Evaluation method of data interface for automotive vehicle sensors

IEC 62969-4:2018 specifies a method of directly fault injection test for automotive semiconductor sensor interface that can be used to support the conformance assurance in the vehicle communications interface.

Dispositifs à semiconducteurs – Interface à semiconducteurs pour les véhicules automobiles - Partie 4: Méthode d'évaluation de l'interface de données destinée aux capteurs de véhicules automobiles

L’IEC 62969-4:2018 spécifie une méthode d’essai par injection directe de défaut pour l’interface à semiconducteurs des capteurs de véhicules automobiles, pouvant être utilisée pour assurer la conformité de l’interface de communication du véhicule.

General Information

Status
Published
Publication Date
17-Jun-2018
Technical Committee
Current Stage
PPUB - Publication issued
Completion Date
18-Jun-2018
Ref Project

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IEC 62969-4
Edition 1.0 2018-06
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices – Semiconductor interface for automotive vehicles –
Part 4: Evaluation method of data interface for automotive vehicle sensors
Dispositifs à semiconducteurs – Interface à semiconducteurs pour les véhicules
automobiles –
Partie 4: Méthode d’évaluation de l’interface de données destinée aux capteurs
de véhicules automobiles
IEC 62969-4:2018-06(en-fr)
---------------------- Page: 1 ----------------------
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---------------------- Page: 2 ----------------------
IEC 62969-4
Edition 1.0 2018-06
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices – Semiconductor interface for automotive vehicles –
Part 4: Evaluation method of data interface for automotive vehicle sensors
Dispositifs à semiconducteurs – Interface à semiconducteurs pour les véhicules
automobiles –
Partie 4: Méthode d’évaluation de l’interface de données destinée aux capteurs
de véhicules automobiles
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.99 ISBN 978-2-8322-5791-3

Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
---------------------- Page: 3 ----------------------
– 2 – IEC 62969-4:2018 © IEC 2018
CONTENTS

FOREWORD ........................................................................................................................... 3

INTRODUCTION ..................................................................................................................... 5

1 Scope .............................................................................................................................. 6

2 Normative references ...................................................................................................... 6

3 Terms, definitions and abbreviated terms ........................................................................ 6

3.1 Terms and definitions .............................................................................................. 6

3.2 Abbreviated terms ................................................................................................... 7

4 Evaluation and tests ........................................................................................................ 7

4.1 Evaluation test setup .............................................................................................. 7

4.2 Block diagram ......................................................................................................... 7

4.3 Input and output connector setup ............................................................................ 8

4.4 Test conditions and configurations .......................................................................... 8

4.5 Disturbances test conditions ................................................................................... 9

5 Disturbance test item ..................................................................................................... 10

5.1 Data interface load ................................................................................................ 10

5.1.1 Variable impedance ....................................................................................... 10

5.1.2 Direct crosstalk .............................................................................................. 11

5.1.3 Diagonal crosstalk ......................................................................................... 11

5.2 Data interface line status ...................................................................................... 11

5.2.1 Short circuit ................................................................................................... 11

5.2.2 Data interface break ...................................................................................... 12

5.3 Fault injection ....................................................................................................... 12

5.3.1 Disturbing signals .......................................................................................... 12

5.3.2 Overwrite signals ........................................................................................... 14

5.3.3 Signal generator ............................................................................................ 15

5.3.4 Trigger ........................................................................................................... 15

Annex A (informative) Description of disturbance detail items .............................................. 17

Bibliography .......................................................................................................................... 19

Figure 1 – The semiconductor-based sensor data interface test with fault injection ................. 7

Figure 2 – Block diagram of the data interface example of duplex channel .............................. 8

Figure 3 – Fault injection test configuration example of the sensor data interface ................. 10

Figure 4 – Disturbing signal put onto the data interface ........................................................ 13

Figure 5 – The node receives invalid signals ......................................................................... 14

---------------------- Page: 4 ----------------------
IEC 62969-4:2018 © IEC 2018 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
SEMICONDUCTOR INTERFACE FOR AUTOMOTIVE VEHICLES –
Part 4: Evaluation method of data interface
for automotive vehicle sensors
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote

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9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of

patent rights. IEC shall not be held responsible for identifying any or all such patent rights.

International Standard IEC 62969-4 has been prepared by IEC technical committee 47:

Semiconductor devices.
The text of this International Standard is based on the following documents:
FDIS Report on voting
47/2470/FDIS 47/2487/RVD

Full information on the voting for the approval of this International Standard can be found in

the report on voting indicated in the above table.

This document has been drafted in accordance with the ISO/IEC Directives, Part 2.

---------------------- Page: 5 ----------------------
– 4 – IEC 62969-4:2018 © IEC 2018

A list of all parts in the IEC 62969 series, published under the general title Semiconductor

devices – Semiconductor interface for automotive vehicles, can be found on the IEC website.

The committee has decided that the contents of this document will remain unchanged until the

stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to

the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
---------------------- Page: 6 ----------------------
IEC 62969-4:2018 © IEC 2018 – 5 –
INTRODUCTION
The IEC 62969 series is composed of four parts as follow:

• IEC 62969-1 Semiconductor devices – Semiconductor interface for automotive vehicles –

Part 1: General requirements of power interface for automotive vehicle sensors

• IEC 62969-2 Semiconductor devices – Semiconductor interface for automotive vehicles –

Part 2: Efficiency evaluation methods of wireless power transmission using resonance for

automotive vehicle sensors

• IEC 62969-3 Semiconductor devices – Semiconductor interface for automotive vehicles –

Part 3: Shock driven piezoelectric energy harvesting for automotive vehicle sensors

• IEC 62969-4 Semiconductor devices – Semiconductor interface for automotive vehicles –

Part 4: Evaluation method of data interface for automotive vehicle sensors

The IEC 62969 series covers power and data interfaces for sensors in automotive vehicles.

The first part covers general requirements of test conditions such as temperature, humidity,

vibration, etc., for automotive sensor power interface. It also includes various electrical

performances of power interface such as voltage drop from power source to automotive

sensors, noises, voltage level, etc. The second part covers “Efficiency evaluation methods of

wireless power transmission using resonance for automotive vehicle sensors “. The third part

covers “Shock driven piezoelectric energy harvesting for automotive vehicle sensors”. The

fourth part covers “Evaluation methods of data interface for automotive vehicle sensors”.

---------------------- Page: 7 ----------------------
– 6 – IEC 62969-4:2018 © IEC 2018
SEMICONDUCTOR DEVICES –
SEMICONDUCTOR INTERFACE FOR AUTOMOTIVE VEHICLES –
Part 4: Evaluation method of data interface
for automotive vehicle sensors
1 Scope

This part of IEC 62969 specifies a method of directly fault injection test for automotive

semiconductor sensor interface that can be used to support the conformance assurance in the

vehicle communications interface.
2 Normative references

The following documents are referred to in the text in such a way that some or all of their

content constitutes requirements of this document. For dated references, only the edition

cited applies. For undated references, the latest edition of the referenced document (including

any amendments) applies.
There are no normative references in this document.
3 Terms, definitions and abbreviated terms
For the purposes of this document, the following terms and definitions apply.

ISO and IEC maintain terminological databases for use in standardization at the following

addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1 Terms and definitions
3.1.1
data interface

transfer of data with electrical signal from a sensor source to another ECU in vehicle such as

ECU and sensors via cable or electric and/or magnetic fields through air or medium

3.1.2
fault injection

technique for improving the coverage of a test by introducing faults to device under test

3.1.3
disturbance

temporary change of environmental conditions that can cause a fault to the device under test

3.1.4
crosstalk

appearance of undesired energy in a channel, owing to the presence of a signal in another

channel, caused by, for example induction, conduction or non-linearity
[SOURCE: IEC 60050-722:1992, 722-15-03]
---------------------- Page: 8 ----------------------
IEC 62969-4:2018 © IEC 2018 – 7 –
3.2 Abbreviated terms
ECU: Electronic Control Unit (see IEC 60050-442:1998, 442-04-22)
DUT: Device Under Test
4 Evaluation and tests
4.1 Evaluation test setup

Figure 1 shows the conceptual diagram of the semiconductor-based sensor data interface test

with fault injection.
Sensor ECU (Electronic Control Unit)
Sensor(s) Microprocessor
Fault Injection
Example: Example:
MEMS sensor, Micro-controller,
CMOS image sensor, Communication controller,
Etc. Etc.
Example:
SPI (Serial Peripheral Interface),
SCI (Serial Communication Interface),
IIC (Inter-Integrated Circuit),
Etc.
In-Vehicle Network ECU
Example:
Fault Injection
CAN, LIN, FlexRay,
Etc.
IEC

Figure 1 – The semiconductor-based sensor data interface test with fault injection

The fault injection tool can do the fault injection to a semiconductor type sensor and works as

a communication monitoring for the fault injection node and system during fault injection. The

fault injection tool provides fault injection of physical level and monitoring of node level.

It offers many new possibilities for the analysis of data interface errors. A representation of

the physical layer is often indispensable, particularly during the execution of conformity tests.

With data interface-specific trigger conditions and time synchronization, it can find the causes

of protocol errors much quicker than with a traditional test method.
4.2 Block diagram

The block diagrams of the data communication interfaces and digital or analog disturbance

units clarify the terminal assignments and uses of the externally accessible interface lines.

Figure 2 shows conceptual block diagram of the data interface example of duplex channel.

The signals for generating trigger events are evaluated via the trig-high and trig-low

connections. The digital disturbance types 'recessive' and 'dominant' are also output over

these two connections.

V represents the reference voltage of the data interface signals. If the high-speed interface

Ref

is being used, V shall be connected to the GND. When using the low-speed interface,

Ref
connection to the GND is optional.
---------------------- Page: 9 ----------------------
– 8 – IEC 62969-4:2018 © IEC 2018

The supply voltage for the low-speed transceiver is fed in via V – which acts as the

Bat

operating voltage for the rest of the transceivers used in the system. Alternatively, V may

Bat

be left unconnected, and in this case an internal power supply generates a regulated voltage

of vehicle for the transceiver supply. V is not necessary for operation of the high-speed

Bat
interface.

RTH and RTL supply the voltages needed for a low-speed data interface termination by 1 kΩ

internal resistors. If required, these connections can be made to the data interface lines

directly or via supplemental external resistors in the cable connector.
1 2
Disturbance
dominant
Disturbance
recessive
Trigger
Trig-high
Trig-low
GND (V )
Ref
Bat
Trigger
Disturbance
recessive
RTH
RTL
Disturbance
dominant
IEC
Key
1 Operational Amplifier
2 Connector
3 Switch
Figure 2 – Block diagram of the data interface example of duplex channel
4.3 Input and output connector setup

The non-shield of the interface connectors is connected to GND. The output and input pins of

the fault injection tool connectors are connected to input port and output port of the DUT,

respectively. All port pins have a series resistance value and clamp diodes to GND and input

voltages to protect them against overloading.
4.4 Test conditions and configurations

The test specification defines three test cases of the data interface: data interface, data

interface line status, and fault injection. The disturbance test specification concerning the

physical layer test is close to the data interface.
Channel A
Channel B
---------------------- Page: 10 ----------------------
IEC 62969-4:2018 © IEC 2018 – 9 –
4.5 Disturbances test conditions

A test procedure consists of the definition of test condition and corresponding action. With the

start of measurement, a set of test procedure can be transferred to the hardware for execution.

The test condition applies only to the DUT; it does not affect the device for the disturbance

source.

The resistor settings are validated before the configuration that is set at the disturbance test

user interface is downloaded to the hardware. This involves checking whether the current

settings may be transferred to the hardware, or whether they could result in potential

hardware damage. If there is a risk of hardware damage, transfer of the configuration to the

hardware is aborted.

To ensure that the validation process will detect potential hardware damage and prevent

transfer of the configuration that could result in damage, the voltage applied as the

disturbance voltage shall be entered in the entry voltage signals.
If no changes are made to the hardware, the V supply voltage is also used as the

disturbance voltage. Therefore, the entry signal voltage has already been set in the

disturbance test.

A fault injection is placed on the data interface when a start of signal is detected. This occurs

five times within one disturbance cycle. Afterwards the data interface is left undisturbed for

some period of time such as 10 ms for signal stabilization. In this time period the data

interface can recover, and the error counters of the nodes are decremented by correct receipt

and transmission of messages.

The error rate of the protocol is according to the conformance test reference for each

interface protocol.

Figure 3 shows conceptual diagram of the fault injection test configuration example of the

sensor data interface.
---------------------- Page: 11 ----------------------
– 10 – IEC 62969-4:2018 © IEC 2018
Fault Injection Test Tool
Fault Injection
Signal Monitoring Tool
Disturbance Test Tool
Data Communication Signal
Satellite ECU1
2 Satellite ECU2
SCI
SCI
Physical Interface
Physical Interface
Sensor ECU
Satellite ECU3 Satellite ECU N
2 2
Network V Diagnosis
Interface
SCI SCI
Physical Interface Physical Interface
SCI
Physical Interface
IEC
Key
1 Fault injection
2 Node
3 Data communication signal

Figure 3 – Fault injection test configuration example of the sensor data interface

5 Disturbance test item
5.1 Data interface load
5.1.1 Variable impedance
5.1.1.1 Load on line

This test sets up a resistance and/or capacitance between one data interface line of a defined

channel and ground (GND). The impedance parameter consists of a capacitor and the resistor

value of the data interface-loading circuit.
5.1.1.2 Load on channel

This test sets up a resistance and/or capacitance between the high data interface and low

data interface lines of a defined channel.
No. Adjustable Parameter Description

1 Impedance of data interface-loading capacitor value pF – sets capacitor value of line-loading

circuit circuit (pF)
resistor value ohm – sets resistor value of line-loading
circuit (Ω)
Channel name – selects a channel
2 Duration of mismatch value – sets a duration value for the mismatch
unit – selects a time unit to set the mismatch duration
---------------------- Page: 12 ----------------------
IEC 62969-4:2018 © IEC 2018 – 11 –
5.1.2 Direct crosstalk

This test sets up a resistance and/or a capacitance between the high data interface lines of

channel A and the high data interface lines of channel B.
NOTE Direct crosstalk examples are described in Annex A.
5.1.3 Diagonal crosstalk

This test sets up a resistance and/or a capacitance between the high data interface lines of

channel A and the low data interface lines of channel B.
NOTE Diagonal crosstalk examples are described in Annex A.
5.2 Data interface line status
5.2.1 Short circuit
5.2.1.1 Ground

This GND-short test configures, for a predefined duration, a short circuit of one data interface

line (high data interface line or low data interface line) to ground (GND).
No. Adjustable Parameter Description
1 Channel with short circuit to GND Channel name – selects a channel
2 Data interface line with short circuit to line – selects a data interface line
GND

3 Duration of short circuit to GND value – sets a duration value for short circuit to GND

unit – selects a time unit to set duration of short circuit to
GND
NOTE Ground examples are described in Annex A.
5.2.1.2 External voltage source

V -short test configures a short circuit of one data interface line (high data interface line or

BAT

low data interface line) to an external voltage source (V ). Connect the external voltage

Bat

source to the short-circuit voltage input interface, located on the rear panel of the disturbance

node.
5.2.1.3 V

V -short test configures, for a predefined time, a short circuit of one data interface line (high

data interface line or low data interface line) to V using a predefined repetition rate.

No. Adjustable Parameter Description
1 Repetition rate of short circuit to V loop – sets a number of iterations
2 Channel with short circuit to V Channel name – selects a channel

3 Data interface line with short circuit to V line – selects a data interface line

4 Duration of short circuit to V value – sets a duration value for short circuit to V

CC CC
unit – selects a time unit to set duration of short circuit
to V

5 Delay between two iterations of short circuit value – sets a value for the delay

to V
unit – selects a time unit for the delay
---------------------- Page: 13 ----------------------
– 12 – IEC 62969-4:2018 © IEC 2018
5.2.1.4 V and GND

V and GND-short test configures, for a predefined time, a short circuit between the high

data interface line and V and a short circuit between the low data interface line and ground

by using a predefined repetition rate. This disturbance is configured by short circuit test. It

uses relays with operate and release times such as no more 1,5 ms to protect from severe

physical damage.
5.2.2 Data interface break

This test splits the data interface into two sub-data interfaces, which requires special cabling.

This means that the primary and secondary side of the data interface shall be connected to

the corresponding connectors.
5.2.2.1 Mismatched termination

This element defines a disturbance that causes a mismatched termination on one channel or

on both channels. The first test sets up a parasitic capacitance between th
...

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