Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines

IEC/TS 62647-22:2013(E) is intended for use as technical guidance by aerospace, defence, and high performance (ADHP) electronic applications and systems suppliers, e.g., original equipment manufacturers (OEMs) and system maintenance facilities, in developing and implementing designs and processes to ensure the continued performance, quality, reliability, safety, airworthiness, configuration control, affordability, maintainability, and supportability of high performance aerospace systems both during and after the transition to Pb-free electronics. The guidelines may be used by the OEMs and maintenance facilities to implement the methodologies they use to ensure the performance, reliability, airworthiness, safety, and certifiability of their products, in accordance with IEC/TS 62647-1:2012. This document also contains lessons learned from previous experience with Pb-free aerospace electronic systems.

General Information

Status
Published
Publication Date
24-Sep-2013
Drafting Committee
Current Stage
PPUB - Publication issued
Start Date
31-Dec-2013
Completion Date
25-Sep-2013
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IEC TS 62647-22:2013 - Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
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IEC/TS 62647-22
®

Edition 1.0 2013-09
TECHNICAL
SPECIFICATION



Process management for avionics – Aerospace and defence electronic systems
containing lead-free solder –
Part 22: Technical guidelines

IEC/TS 62647-22:2013(E)

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IEC/TS 62647-22

®


Edition 1.0 2013-09




TECHNICAL



SPECIFICATION



















Process management for avionics – Aerospace and defence electronic systems

containing lead-free solder –

Part 22: Technical guidelines


























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– 2 – TS 62647-22  IEC:2013(E)
CONTENTS
FOREWORD . 5
INTRODUCTION . 7
1 Scope . 9
2 Normative references . 9
3 Terms, definitions and abbreviations . 10
3.1 Terms and definitions . 10
3.2 Abbreviations . 15
4 Approach . 16
4.1 General . 16
4.2 Assumption . 16
5 General Pb-free solder alloy behavior . 17
5.1 General . 17
5.2 Elevated temperature . 17
5.3 Low temperatures .
...

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