IEC 62779-4:2020

Semiconductor devices - Semiconductor interface for human body communication - Part 4: Capsule endoscope

IEC 62779-4:2020 defines general requirements on the electrical performances of a semiconductor interface for capsule endoscope using galvanic coupling human body communication. It includes general and functional specifications of the interface. The semiconductor interface that is covered in this document is the interface to handle or deliver an electrical signal between the capsule endoscope inside the human body and the HBC modem in the receiving device outside the human body.
NOTE Additional information on capsule endoscope using the human body communication is provided in Annex A of this document.

Dispositifs à semiconducteurs - Interface à semiconducteurs pour les communications via le corps humain - Partie 4: Capsule endoscopique

L’IEC 62779-4:2020 définit des exigences générales concernant les performances électriques d’une interface à semiconducteurs pour la capsule endoscopique utilisant les communications via le corps humain par couplage galvanique. Elle inclut des spécifications générales et fonctionnelles de l'interface. L’interface à semiconducteurs couverte dans le présent document est l’interface de traitement ou de fourniture d’un signal électrique entre la capsule endoscopique à l’intérieur du corps humain et le modem HBC du dispositif récepteur à l'extérieur de ce même corps humain.
NOTE L’Annexe A fournit des informations complémentaires concernant la capsule endoscopique utilisant les communications via le corps humain.

General Information

• Status: Published
• Publication Date: 06-Feb-2020
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: TC 47 - Semiconductor devices
• Drafting Committee: WG 6 - TC 47/WG 6
• Current Stage: PPUB - Publication issued
• Start Date: 07-Feb-2020
• Completion Date: 07-Feb-2020

Standards Content (Sample)

IEC 62779-4
®

Edition 1.0 2020-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside


Semiconductor devices – Semiconductor interface for human body
communication –
Part 4: Capsule endoscope

Dispositifs à semiconducteurs – Interface à semiconducteurs
pour les communications via le corps humain –
Partie 4: Capsule endoscopique

IEC 62779-4:2020-02(en-fr)

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IEC 62779-4

®


Edition 1.0 2020-02




INTERNATIONAL



STANDARD




NORME



INTERNATIONALE
colour

inside










Semiconductor devices – Semiconductor interface for human body

communication –

Part 4: Capsule endoscope




Dispositifs à semiconducteurs – Interface à semiconducteurs

pour les communications via le corps humain –


Partie 4: Capsule endoscopique













INTERNATIONAL

ELECTROTECHNICAL

COMMISSION


COMMISSION

ELECTROTECHNIQUE


INTERNATIONALE




ICS 31.080.01 ISBN 978-2-8322-7804-8




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® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

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– 2 – IEC 62779-4:2020 © IEC 2020

CONTENTS
FOREWORD . 3
INTRODUCTION . 5
1 Scope . 6
2 Normative references . 6
3 Terms, definitions and letter symbols . 6
3.1 General terms . 6
3.2 Rating and characteristics . 8
3.2.1 Capsule endoscope characteristics . 8
3.2.2 Receiving device characteristics . 8
3.2.3 Transfer characteristics . 8
3.3 Letter symbols . 10
4 General requirements . 10
4.1 General specifications . 10
4.1.1 General . 10
4.1.2 Function . 10
4.1.3 Implementation types . 12
4.2 Constructional specifications . 12
4.3 Electrical specifications . 12
4.3.1 General . 12
4.3.2 Power supply characteristics . 12
4.3.3 Power supply type . 13
4.3.4 Dynamic characteristics of driver in capsule endoscope. 13
4.3.5 Dynamic characteristics of analog front end . 13
4.3.6 CDR circuit interface . 14
4.3.7 Modem interface . 14
4.3.8 Limiting values. 14
4.3.9 Temperatures . 15
4.4 Operating specifications . 15
4.4.1 Main application . 15
4.4.2 Compatibility . 15
Annex A (informative) General description of capsule endoscope using human body
communication . 16

Figure 1 – Definition of cut-off frequency and bandwidth . 9
Figure 2 – Typical example of semiconductor interface structure for capsule endoscope

using galvanic coupling human body communication. 11
Figure 3 – Typical example of data recovery circuit (DRC) . 12
Figure A.1 – Capsule endoscope application . 17


Table 1 – Letter symbols . 10

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IEC 62779-4:2020 © IEC 2020 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

SEMICONDUCTOR DEVICES –
SEMICONDUCTOR INTERFACE FOR HUMAN BODY COMMUNICATION –

Part 4: Capsule endoscope

FOREWORD
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International Standard IEC 62779-4 has been prepared by IEC technical committee 47:
Semiconductor devices.
The text of this International Standard is based on the following documents:
FDIS Report on voting
47/2600/FDIS 47/2611/RVD

Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.

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– 4 – IEC 62779-4:2020 © IEC 2020
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 62779 series, published under the general title Semiconductor
devices – Semiconductor interface for human body communication, can be found on the IEC
website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.

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IEC 62779-4:2020 © IEC 2020 – 5 –
INTRODUCTION
IEC 62779-1, IEC 62779-2 and IEC 62779-3 define the general requirements, measurement
method and functional type of a semiconductor interface for human body communication.
They include the general and functional specifications of the interface, the electrical
performances of an electrode, and the operational conditions of the interface. However, an in-
body to on-body channel for a capsule endoscope using galvanic coupling human body
communication (HBC) is different from the channel that is described in IEC 62779-1,
IEC 62779-2 and IEC 62779-3 using capacitive coupling human body communication (i.e.
channel properties, such as signal loss and signal propagation mechanism, are different).
Therefore, the semiconductor interface covered by IEC 62779-1, IEC 62779-2 and
IEC 62779-3 cannot be used for the capsule endoscope using galvanic coupling human body
communication. A common interface for a capsule endoscope using human body
communication should be defined to secure communication compatibility between various
capsule endoscope devices and receiving devices that are implemented on or inside the
human body.

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SEMICONDUCTOR DEVICES – SEMICONDUCTOR INTERFACE
FOR HUMAN BODY COMMUNICATION –

Part 4: Capsule endoscope



1 Scope
This part of IEC 62779 defines general requirements on the electrical performances of a
semiconductor interface for capsule endoscope using galvanic coupling human body
communication. It includes general and functional specifications of the interface. The
semiconductor interface that is covered in this document is the interface to handle or deliver
an electrical signal between the capsule endoscope inside the human body and the HBC
modem in the receiving device outside the human body.
NOTE Additional information on capsule endoscope using the human body communication is provided in Annex A.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.
IEEE 802.15.6:2012, IEEE Standard for Local and Metropolitan area networks – Part 15.6:
Wireless Body Area Networks
3 Terms, definitions and letter symbols
For the purposes of this document, the following terms, definitions and letter symbols apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1 General terms
3.1.1
transmitting electrode
golden physical structure that transmits an electrical signal from a capsule endoscope to the
human body while typically located inside the human body and adhering to the small bowel
Note 1 to entry: A transmitting electrode delivers an electrical signal to a non-metallic transmission channel, the
human body.
3.1.2
capsule endoscope
small round and tube-shaped fixture that contains a LED module, lens module, sensor PCB,
battery and power module

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IEC 62779-4:2020 © IEC 2020 – 7 –
3.1.3
image sensor
semiconductor device that converts the luminance of light in front of the image sensor to
electrical signal
3.1.4
driver
semiconductor device that delivers image data to the human body in the form of an electrical
signal
Note 1 to entry: The driver is located before the transmitting electrode and outputs the electrical signal with a pre-
limited current and pre-limited voltage.
3.1.5
galvanic coupling human body communication
human body communication method in which a receiver with two electrodes in-body or on-
body can sense the change of electrical current caused by a transmitter through a part of the
human body
3.1.6
capacitive coupling human body communication
human body communication method in which a receiver with an electrode on-body and a
ground off-body can sense the change of electrical potential caused by a transmitter with an
electrode on-body and a ground off-body
3.1.7
receiving electrode
physical metallic structure for receiving an electrical signal from the human body and
delivering the received signal to the analog front end
Note 1 to entry: A receiving electrode delivers an electrical signal from a non-metallic transmission channel, the
human body.
3.1.8
receiving device
electrical device for receiving image data transmitted from a capsule endoscope inside the
human body and storing the received image data in a storage device
Note 1 to entry: The storage device can be a flash memory or hard disk drive.
3.1.9
band-pass filter
semiconductor device or circuit component in an analog front end that eliminates low
frequency noise (i.e. noise from a power line or a fluorescent light) and high frequency noise
(i.e. noise from a radio or a TV broadcasting, a cellular phone) that overlap in a received
signal
3.1.10
analog to digital converter
ADC
semiconductor device or circuit component in an analog front end that converts filtered analog
data to digital data
Note 1 to entry: The converted digital data can be processed in the modem of the receiving device.
3.1.11
data recovery circuit
DRC
semiconductor device or circuit component in an analog front end that recovers a digital data
signal from a filtered signal in the receiving device
Note 1 to entry: The DRC can consist of a comparator and CDR circuit or ADC only.

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3.2 Rating and characteristics
3.2.1 Capsule endoscope characteristics
3.2.1.1
single fault current between transmitting electrodes
I
SFC
maximum amount of short current between the electrodes of the capsule endoscope in the
capsule endoscope semiconductor interface
3.2.1.2
output impedance between transmitting electrodes
Z
EC
impedance seen from the human body into the transmitting electrodes on the capsule
endoscope in the capsule endoscope semiconductor interface
Note 1 to entry The output impedance depends on the output impedances of the driver.
3.2.2 Receiving device characteristics
3.2.2.1
input impedance of receiving electrode
Z
ER
impedance seen from the human body into the receiving electrode of the receiving device in a
capsule endoscope semiconductor interface
Note 1 to entry: The input impedance depends on the input impedances of a band-pass filter and signal amplifier
that are typically the very first stages of an analog front end.
3.2.3 Transfer characteristics
3.2.3.1
input sensitivity of receiving device
IS
minimum signal requirement for the receiving device to recover the transmitted signal from the
capsule endoscope correctly
Note 1 to entry: For the definition of IS the required bit error rate should be satisfied between the capsule
endoscope and the receiving device.
Note 2 to entry: This note applies to the French language only.
3.2.3.2
dynamic range
DR
ratio of a signal’s maximum to minimum voltage ratio at an input of a semiconductor interface
for capsule endoscope human body communication that can be tolerated without signal
distortion
Note 1 to entry: Dynamic range depends on a minimum drive level of a comparator and a signal gain of a signal
amplifier.
Note 2 to entry: This note applies to the French language only.
3.2.3.3
voltage gain
G
V
amplifying amount for the amplifier circuit or band-pass filter component in the analog front
end without being attenuated or removed intentionally

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IEC 62779-4:2020 © IEC 2020 – 9 –
3.2.3.4
lower cut-off frequency
f
CL
lower frequency where a receiving signal is attenuated by 3 dB as passing through a band-
pass filter
SEE: Figure 1.
3.2.3.5
upper cut-off frequency
f
CU
upper frequency where a receiving signal is attenuated by 3 dB as passing through a band-
pass filter
SEE: Figure 1.
3.2.3.6
bandwidth
BW
frequency width starting from the lower cut-off frequency to upper cut-off frequency without
being attenuated or removed intentionally
Note 1 to entry: This note applies to the French language only.
SEE: Figure 1.

Key
BW f
Bandwidth Lower cut-off frequency
CL
f Upper cut-off frequency
CU
Figure 1 – Definition of cut-off frequency and bandwidth
3.2.3.7
propagation loss
P
L
amount of attenuation when a signal transmitted from the capsule endoscope passes through
the human body
Note 1 to entry: Typically propagation loss can be defined as the ratio of the transmitting voltage swing and
received voltage swing.

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3.2.3.8
lock range
LR
operating frequency range of the CDR where the CDR circuit can be locked
Note 1 to entry: This note applies to the French language only.
3.2.3.9
bit width of ADC
BIT
ADC
output resolution of the ADC which can determine the processing accuracy of the modem in
the receiving device
3.3 Letter symbols
Table 1 – Letter symbols
Name and designation Letter symbol
supply voltage V
SC
operating current I
SC
operating time t
OPC
single fault current between transmitting electrodes I
SFC
output impedance between transmitting electrodes Z
EC
supply voltage V
SR
operating current I
SR
operating time t
OPR
input impedance between receiving electrodes Z
ER
input sensitivity of receiving device IS
dynamic range DR
voltage gain G
V
f
lower cut-off frequency
CL
upper cut-off frequency f
CU
bandwidth BW
propagation loss P
L
lock range LR
bit width of ADC BIT
ADC

4 General requirements
4.1 General specifications
4.1.1 General
Clause 4 provides general specifications to specify the functional and external requirements
for a semiconductor interface for a capsule endoscope using human body communication.
4.1.2 Function
4.1.2.1 Category
If an interface has a functional or electrical category, it shall be stated.

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IEC 62779-4:2020 © IEC 2020 – 11 –
4.1.2.2 Functional description
A general description of the function performed by the interface shall be given.
4.1.2.3 Block diagram
The overall structure of the interface to realize the function shall be given. Details of the
structure shall be given using a block diagram. A semiconductor interface for capsule
endoscope using human body communication consists of a transmitting electrode and
receiving electrode, capsule endoscope (CE), and receiving device (RD). A controller (CTRL)
and driver (DRV) in the capsule endoscope convert the image data into an electrical signal
and send it to the transmitting electrode. The received electrical signal from the human body
is amplified by the signal amplifier (SA), filtered by the band-pass filter (BPF), and processed
by the data recovery circuit (DRC) in an analog front end (AFE). The AFE delivers the
processed data to the modem in the receiving device. (See an example in Figure 2 for more
details.)

Key
CE Capsule endoscope AFE Analog front end
DRV Driver BPF Band-pass filter
CTRL Controller DRC Data recovery circuit
RD Receiving device STG DEV Storage device
SA Signal amplifier TE Transmitting electrode
SB Small bowel RE Receiving electrode
IMGS Image sensor HB Human body
MOD Modem INB Inside of human body
OUTB Outside of human body
NOTE The order of the components in the interface can be changed if necessary, as long as the interface
satisfies the required performances.
Figure 2 – Typical example of semiconductor interface structure for capsule endoscope
using galvanic coupling human body communication
If applicable, control signals that are transmitted between the interface and an HBC modem
shall be defined in the block diagram.
The data recovery circuit (DRC) in the receiving device can be implemented using a
comparator and CDR or it can be implemented using an ADC only. (See an example
in Figure 3 for more details.)

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Key
DRC Data recovery circuit CMP Comparator
CDRC Clock and data recovery circuit ADC Analog to digital converter
Figure 3 – Typical example of data recovery circuit (DRC)
4.1.3 Implementation types
4.1.3.1 Manufacturing and assembling technology
The manufacturing technologies for an electrode, for example metallic pattern, thin film, etc.,
an analog front end, for example semiconductor monolithic integrated circuit, thin-film
integrated circuit, hybrid integrated circuit, module, etc., and capsule, for example plastic,
metal, polymer tube, etc., shall be stated. Details of the semiconductor technologies shall be
included.
An assembling technology between the driver and the transmitting electrode, for example
modularization, integration, shall be stated.
An assembling technology between the receiving electrode and the analog front end, for
example modularization, integration, shall be stated.
4.1.3.2 Package technology
The package type, for example ceramic, plastic or glass, shall be given. The package size, for
example length of the capsule, diameter of capsule, should be given.
If applicable, the IEC and/or national reference number of the outline drawing shall be stated.
4.2 Constructional specifications
The physical specifications of an electrode, for example material, dimensions, location, shall
be given. The number of receiving electrodes should be given. The maximum attachable
distance between the receiving electrodes on the skin should be given.
4.3 Electrical specifications
4.3.1 General
The electrical specifications should be given over the specified range of an operating
temperature.
4.3.2 Power supply characteristics
The following characteristics shall be given:
a) supply voltage;
b) operating current.

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