IEC 60749-22:2002/COR1:2003
(Corrigendum)Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
Corrigendum 1 - Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 22: Robustesse des contacts soudés
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Standards Content (Sample)
CEI 60749-22 IEC 60749-22
(Première édition – 2002) (First edition – 2002)
DISPOSITIFS À SEMICONDUCTEURS – SEMICONDUCTOR DEVICES –
MÉTHODES D'ESSAIS MÉCANIQUES MECHANICAL AND CLIMATIC TEST METHODS –
ET CLIMATIQUES –
Part 22: Bond strength
Partie 22: Robustesse des contacts soudés
CORRIGENDUM 1
Page 6 Page 7
Au lieu de: Instead of:
Le comité a décidé que le contenu de The committee has decided
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NOTE 1 This test method does not assess the effect of thermal stresses which can occur during the soldering process. More details can be found in IEC 60749‑15 or IEC 60749‑20.
NOTE 2 If a qualitative test method is preferred, the Wetting balance test method can be found in IEC 60068-2-69.
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IEC 60749-7:2025 specifies the testing and measurement of water vapour and other gas content of the atmosphere inside a metal or ceramic hermetically sealed device. The test is used as a measure of the quality of the sealing process and to provide information about the long-term chemical stability of the atmosphere inside the package. It is applicable to semiconductor devices sealed in such a manner but generally only used for high reliability applications such as military or aerospace.
Of particular interest is the measurement of the primary sealing gases (or lack thereof), the moisture content, the presence of bombing gases that are indicative of non-hermeticity (e.g. helium), oxygen to argon ratio indicative of room air ~ 20 to 1 (± 10 %), dissimilar concentration of internally sealed gases (e.g. nitrogen, helium) than originally sealed in the device package, the presence of leak test fluid (i.e. fluorocarbon, helium, air), and all other gases to determine if the device meets the specified moisture, hermeticity and other criteria. Also of interest is the measurement of all the other gases since they reflect upon the quality of the sealing process and provide information about the long-term chemical stability of the atmosphere inside the device. The presence of leak test fluorocarbon vapour in the internal gas analysis (IGA) is an indication of failure to meet leak test requirements of IEC 60749‑8.
This test is destructive.
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IEC 60749-22-2:2025 establishes a means for determining the strength of a ball bond to a die or package bonding surface and can be performed on pre-encapsulation or post-encapsulation devices. This measure of bond strength is extremely important in determining two features:
a) the integrity of the metallurgical bond which has been formed, and
b) the quality of ball bonds to die or package bonding surfaces.
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This test method allows for two distinct methods of pulling wires:
a) One method incorporates the use of a hook that is placed under the wire and is then pulled.
b) One method requires that after the wire be cut, a clamp is placed on the wire connected to the bond to be tested, and this clamp is used to pull the wire.
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