IEC 62680-3-1:2017

Universal Serial Bus interfaces for data and power - Part 3-1: Universal Serial Bus 3.1 Specification

IEC 62680-3-1:2017 defines the latest generation USB industry standard, USB 3.1. The specification describes the protocol definition, types of transactions, bus management, and the programming interface required to design and build systems and peripherals that are compliant with this specification. USB 3.1 is primarily a performance enhancement to SuperSpeed USB 3.0 resulting in providing more than double the bandwidth for devices such as Solid State Drives and High Definition displays. It refers to Enhanced SuperSpeed as a collection of features or requirements that apply to both USB 3.0 and USB 3.1 bus operation. Additionally, where specific differences exist with regard to the USB 3.0 definition of SuperSpeed features or requirements, those differences will be uniquely identified as SuperSpeedPlus (or SSP) features or requirements – generally, “SuperSpeed” is in reference to 5 Gbps operation and “SuperSpeedPlus” is in reference to 10 Gbps operation.

Interfaces de bus universel en série pour les données et l'alimentation électrique - Partie 3-1: Spécification du bus universel en série 3.1

L'IEC 62680-3-1:2017 définit la norme industrielle USB de dernière génération, l'USB 3.1. La spécification décrit la définition du protocole, les types de transactions, la gestion du bus et l'interface de programmation exigée pour la conception et la création des systèmes et des périphériques conformes à la présente spécification. L'USB 3.1 constitue principalement une amélioration des performances de l'USB 3.0 SuperSpeed, offrant ainsi une bande passante plus de deux fois supérieure pour les dispositifs tels que les disques électroniques et les écrans haute définition.
La présente spécification entend par Enhanced SuperSpeed une collection de fonctionnalités ou d'exigences qui s'appliquent au fonctionnement des bus USB 3.0 et USB 3.1. En outre, s'il existe des différences spécifiques concernant la définition des fonctionnalités ou des exigences SuperSpeed de l'USB 3.0, ces différences seront identifiées de manière unique comme des fonctionnalités ou des exigences SuperSpeedPlus (ou SSP) en général, "SuperSpeed" fait référence à un fonctionnement à 5 Gbps et que "SuperSpeedPlus" fait référence à un fonctionnement à 10 Gbps.

General Information

• Status: Published
• Publication Date: 06-Mar-2017
• ICS: 29.220 - Galvanic cells and batteries
• ICS: 35.200 - Interface and interconnection equipment
• Technical Committee: TA 18 - Multimedia home systems and applications for end-user networks
• Current Stage: PPUB - Publication issued
• Start Date: 07-Mar-2017
• Completion Date: 06-Mar-2017

Overview

IEC 62680-3-1:2017 - Universal Serial Bus 3.1 Specification - is the IEC-adopted industry standard that defines the USB 3.1 generation. Prepared from the USB Implementers Forum (USB‑IF) specification, this document defines the protocol, transaction types, bus management and the programming interfaces required to design and implement USB 3.1-compliant hosts, hubs and devices. USB 3.1 (also called Enhanced SuperSpeed) builds on USB 3.0 (SuperSpeed) to deliver significantly higher data rates for modern peripherals.

Key Topics

• Protocol definition: bus-layer behavior and data framing required for USB 3.1 operation.
• Transaction types: the classes of data transfer and control transactions used between hosts and devices.
• Bus management: link management, error handling and power/bandwidth negotiation for stable operation.
• Programming interface: software-facing APIs and descriptors used by device and host firmware/drivers.
• Enhanced SuperSpeed concept: a set of features applying to both USB 3.0 and USB 3.1 bus operation.
• SuperSpeed vs SuperSpeedPlus (SSP): terminology used in the standard - SuperSpeed refers to 5 Gbps operation (USB 3.0), SuperSpeedPlus (SSP) refers to 10 Gbps operation (USB 3.1).
• Performance focus: guidance aimed at delivering more than double the bandwidth of USB 3.0 - relevant to high-throughput devices such as SSDs and high‑definition displays.
• Standards provenance & IP: the text is provided by the USB‑IF and published by IEC; implementers should review the specification’s intellectual property and licensing notices (USB specifications are provided “AS IS” and may have licensing implications).

Applications

IEC 62680-3-1:2017 is applied where high-bandwidth, low-latency USB connectivity is required:

• High-performance storage (NVMe/SSD adapters, external drives)
• Video and display interfaces (USB‑based docking stations, UHD displays)
• High-speed peripherals (network adapters, AV capture devices)
• Host controller and device controller silicon design and validation
• Firmware, driver and OS development for USB 3.1 support
• Compliance testing and product certification labs

Who should use this standard

• Hardware engineers and silicon vendors designing USB 3.1 PHY, controllers and connectors
• Firmware and driver developers implementing the programming interface and transaction handling
• System integrators and device manufacturers seeking reliable high-speed USB operation
• Test laboratories and compliance teams validating interoperability, performance and bus management

Related standards

• IEC 62680 family (other Parts covering connectors, power delivery and legacy USB versions)
• USB-IF published USB specifications and device class documents (for implementation details and test cases)

Keywords: IEC 62680-3-1:2017, USB 3.1, Universal Serial Bus, SuperSpeedPlus, Enhanced SuperSpeed, 10 Gbps, 5 Gbps, bus management, programming interface, SSD, high-definition display.

Standards Content (Sample)

IEC 62680-3-1 ®
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Universal Serial Bus interfaces for data and power –
Part 3-1: Universal Serial Bus 3.1 Specification

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IEC 62680-3-1 ®
Edition 1.0 2017-03
INTERNATIONAL
STANDARD
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Universal Serial Bus interfaces for data and power –

Part 3-1: Universal Serial Bus 3.1 Specification

INTERNATIONAL
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– 2 – IEC 62680-3-1:2017 © IEC 2017
© USB-IF:2015
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
UNIVERSAL SERIAL BUS INTERFACES FOR DATA AND POWER –

Part 3-1: Universal Serial Bus 3.1 Specification

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
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patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62680-3-1 has been prepared by technical area 14: Interfaces and
methods of measurement for personal computing equipment, of IEC technical committee 100:
Audio, video and multimedia systems and equipment.
The text of this standard was prepared by the USB Implementers Forum (USB-IF). The
structure and editorial rules used in this publication reflect the practice of the organization
which submitted it.
The text of this standard is based on the following documents:
CDV Report on voting
100/2589/CDV 100/2684/RVC
Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.

© USB-IF:2015
A list of all parts in the IEC 62680 series, published under the general title Universal serial
bus interfaces for data and power, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
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– 4 – IEC 62680-3-1:2017 © IEC 2017
© USB-IF:2015
INTRODUCTION
The IEC 62680 series is based on a series of specifications that were originally developed by
the USB Implementers Forum (USB-IF). These specifications were submitted to the IEC under
the auspices of a special agreement between the IEC and the USB-IF.
The USB Implementers Forum, Inc. (USB-IF) is a non-profit corporation founded by the group
of companies that developed the Universal Serial Bus specification. The USB-IF was formed
to provide a support organization and forum for the advancement and adoption of Universal
Serial Bus technology. The Forum facilitates the development of high-quality compatible USB
peripherals (devices), and promotes the benefits of USB and the quality of products that have
passed compliance testing.
ANY USB SPECIFICATIONS ARE PROVIDED TO YOU "AS IS", WITH NO WARRANTIES
WHATSOEVER, INCLUDING ANY WARRANTY OF MERCHANTABILITY, NON-
INFRINGEMENT, OR FITNESS FOR ANY PARTICULAR PURPOSE. THE USB
IMPLEMENTERS FORUM AND THE AUTHORS OF ANY USB SPECIFICATIONS DISCLAIM
ALL LIABILITY, INCLUDING LIABILITY FOR INFRINGEMENT OF ANY PROPRIETARY
RIGHTS, RELATING TO USE OR IMPLEMENTATION OR INFORMATION IN THIS
SPECIFICAITON.
THE PROVISION OF ANY USB SPECIFICATIONS TO YOU DOES NOT PROVIDE YOU
WITH ANY LICENCE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY
INTELLECTUAL PROPERTY RIGHTS.
Entering into USB Adopters Agreements may, however, allow a signing company to
participate in a reciprocal, RAND-Z licensing arrangement for compliant products. For more
information, please see:
http://www.usb.org/developers/docs/
http://www.usb.org/developers/devclass_docs#approved
IEC DOES NOT TAKE ANY POSITION AS TO WHETHER IT IS ADVISABLE FOR YOU TO
ENTER INTO ANY USB ADOPTERS AGREEMENTS OR TO PARTICIPATE IN THE "USB
IMPLEMENTERS FORUM".
© USB-IF:2015
Universal Serial Bus 3.1
Specification
Hewlett-Packard Company
Intel Corporation
Microsoft Corporation
Renesas Corporation
ST-Ericsson
Texas Instruments
Revision 1.0
July 26, 2013
– 6 – IEC 62680-3-1:2017 © IEC 2017
© USB-IF:2015
Revision History
Revision Comments Issue Date
1.0 Initial release. USB 3.0 November 12, 2008
Incorporated errata and ECNs June 6, 2011
1.0 Initial release. USB 3.1 July 26, 2013

INTELLECTUAL PROPERTY DISCLAIMER
THIS SPECIFICATION IS PROVIDED TO YOU “AS IS” WITH NO WARRANTIES
WHATSOEVER, INCLUDING ANY WARRANTY OF MERCHANTABILITY, NON-
INFRINGEMENT, OR FITNESS FOR ANY PARTICULAR PURPOSE. THE AUTHORS OF
THIS SPECIFICATION DISCLAIM ALL LIABILITY, INCLUDING LIABILITY FOR
INFRINGEMENT OF ANY PROPRIETARY RIGHTS, RELATING TO USE OR
IMPLEMENTATION OF INFORMATION IN THIS SPECIFICATION. THE PROVISION OF THIS
SPECIFICATION TO YOU DOES NOT PROVIDE YOU WITH ANY LICENSE, EXPRESS OR
IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS.

Please send comments to [e-mail]
For industry information, refer to the USB Implementers Forum web page at http://www.usb.org

All product names are trademarks, registered trademarks, or servicemarks of their respective owners.
ST-Ericsson, and Texas Instruments.
All rights reserved.
© USB-IF:2015
Acknowledgement of Technical Contribution
Dedication
Dedicated to the memory of Brad Hosler, the impact of whose
accomplishments made the Universal Serial Bus one of the
most successful technology innovations of the Personal
Computer era.
The authors of this specification would like to recognize the following people who participated
in the USB 3.0 Bus Specification technical workgroups. We would also like to acknowledge
the many others throughout the industry who provided feedback and contributed to the
development of this specification.
Promoter Company Employees
Alan Berkema Hewlett-Packard Company
Walter Fry Hewlett-Packard Company
Anthony Hudson Hewlett-Packard Company
David Roderick Hewlett-Packard Company
Kok Hong Chan Intel Corporation
Huimin Chen Intel Corporation
Bob Dunstan Intel Corporation
Dan Froelich Intel Corporation
Howard Heck Intel Corporation
Brad Hosler Intel Corporation
John Howard Intel Corporation
Rahman Ismail Intel Corporation
John Keys Intel Corporation
Yun Ling Intel Corporation
Andy Martwick Intel Corporation
Steve McGowan Intel Corporation
Ramin Neshati Intel Corporation
Duane Quiet Intel Corporation
Jeff Ravencraft Intel Corporation
Brad Saunders Intel Corporation
Joe Schaefer Intel Corporation
Sarah Sharp Intel Corporation
Micah Sheller Intel Corporation
Gary Solomon Intel Corporation
Karthi Vadivelu Intel Corporation
Clint Walker Intel Corporation
Jim Walsh Intel Corporation
Randy Aull Microsoft Corporation
Fred Bhesania Microsoft Corporation
Martin Borve Microsoft Corporation
Jim Bovee Microsoft Corporation
Stephen Cooper Microsoft Corporation
Lars Giusti Microsoft Corporation
Robbie Harris Microsoft Corporation

– 8 – IEC 62680-3-1:2017 © IEC 2017
© USB-IF:2015
Allen Marshall Microsoft Corporation
Kiran Muthabatulla Microsoft Corporation
Tomas Perez-Rodriguez Microsoft Corporation
Mukund Sankaranarayan Microsoft Corporation
Nathan Sherman Microsoft Corporation
Glen Slick Microsoft Corporation
David Wooten Microsoft Corporation
Rob Young Microsoft Corporation
Nobuo Furuya NEC Corporation
Hiroshi Kariya NEC Corporation
Masami Katagiri NEC Corporation
Yuichi Mizoguchi NEC Corporation
Kats Nakazawa NEC Corporation
Nobuyuki Mizukoshi NEC Corporation
Yutaka Noguchi NEC Corporation
Hajime Nozaki NEC Corporation
Kenji Oguma NEC Corporation
Satoshi Ohtani NEC Corporation
Takanori Saeki NEC Corporation
Eiji Sakai NEC Corporation
Hiro Sakamoto NEC Corporation
Hajime Sakuma NEC Corporation
Makoto Sato NEC Corporation
Hock Seow NEC Corporation
"Peter" Chu Tin Teng NEC Corporation
Yoshiyuki Tomoda NEC Corporation
Satomi Yamauchi NEC Corporation
Yoshiyuki Yamada NEC Corporation
Susumu Yasuda NEC Corporation
Alan Chang ST-NXP Wireless
Wing Yan Chung ST-NXP Wireless
Socol Constantin ST-NXP Wireless
Knud Holtvoeth NXP Semiconductors, B.V.
Linus Kerk ST-NXP Wireless
Martin Klein NXP Semiconductors, B.V.
Geert Knapen NXP Semiconductors, B.V.
Chee Ee Lee ST-NXP Wireless
Christian Paquet NXP Semiconductors, B.V.
Veerappan Rajaram ST-NXP Wireless
Shaun Reemeyer ST-NXP Wireless
Dave Sroka ST-NXP Wireless
Chee-Yen TEE ST-NXP Wireless
Jerome Tjia ST-NXP Wireless
Bart Vertenten NXP Semiconductors, B.V.
Hock Meng Yeo ST-NXP Wireless
Olivier Alavoine Texas Instruments.

© USB-IF:2015
David Arciniega Texas Instruments
Richard Baker Texas Instruments
Sujoy Chakravarty Texas Instruments
T. Y. Chan Texas Instruments
Romit Dasgupta Texas Instruments.
Alex Davidson Texas Instruments
Eric Desmarchelier Texas Instruments
Christophe Gautier Texas Instruments
Dan Harmon Texas Instruments
Will Harris Texas Instruments
Richard Hubbard Texas Instruments
Ivo Huber Texas Instruments
Scott Kim Texas Instruments
Grant Ley Texas Instruments
Karl Muth Texas Instruments
Lee Myers Texas Instruments
Julie Nirchi Texas Instruments
Wes Ray Texas Instruments
Matthew Rowley Texas Instruments
Bill Sherry Texas Instruments
Mitsuru Shimada Texas Instruments
James Skidmore Texas Instruments
Yoram Solomon Texas Instruments.
Sue Vining Texas Instruments
Jin-sheng Wang Texas Instruments
Roy Wojciechowski Texas Instruments

Contributor Company Employees
Glen Chandler Acon
John Chen Acon
Roger Hou Acon
Charles Wang Acon
Norman Wu Acon
Steven Yang Acon
George Yee Acon
George Olear Contech Research
Sophia Liu Electronics Testing Center, Taiwan (ETC)
William Northey FCI
Tom Sultzer FCI
Garry Biddle Foxconn
Kuan-Yu Chen Foxconn
Jason Chou Foxconn
Gustavo Duenas Foxconn
Bob Hall Foxconn
Jiayong He Foxconn
– 10 – IEC 62680-3-1:2017 © IEC 2017
© USB-IF:2015
Jim Koser Foxconn
Joe Ortega Foxconn
Ash Raheja Foxconn
James Sabo Foxconn
Pei Tsao Foxconn
Kevin Walker Foxconn
Tsuneki Watanabe Foxconn
Chong Yi Foxconn
Taro Hishinuma Hirose Electric
Kaz Ichikawa Hirose Electric
Ryozo Koyama Hirose Electric
Karl Kwiat Hirose Electric
Tadashi Sakaizawa Hirose Electric
Shinya Tono Hirose Electric
Eiji Wakatsuki Hirose Electric
Takashi Ehara Japan Aviation Electronics Industry Ltd. (JAE)
Ron Muir Japan Aviation Electronics Industry Ltd. (JAE)
Kazuhiro Saito Japan Aviation Electronics Industry Ltd. (JAE)
Hitoshi Kawamura Mitsumi
Takashi Kawasaki Mitsumi
Atsushi Nishio Mitsumi
Yasuhiko Shinohara Mitsumi
Tom Lu Molex Inc.
Edmund Poh Molex Inc.
Scott Sommers Molex Inc.
Jason Squire Molex Inc.
Dat Ba Nguyen NTS/National Technical System
Jan Fahllund Nokia
Richard Petrie Nokia
Panu Ylihaavisto Nokia
Martin Furuhjelm Seagate Technology LLC
Julian Gorfajn Seagate Technology LLC
Marc Hildebrant Seagate Technology LLC
Tony Priborsky Seagate Technology LLC
Harold To Seagate Technology LLC
Robert Lefferts Synopsys, Inc.
Saleem Mohammad Synopsys, Inc.
Matthew Myers Synopsys, Inc.
Daniel Weinlader Synopsys, Inc.
Mike Engbretson Tektronix, Inc.
Thomas Grzysiewicz Tyco Electronics
Masaaki Iwasaki Tyco Electronics
Kazukiyo Osada Tyco Electronics
Hiroshi Shirai Tyco Electronics
Scott Shuey Tyco Electronics
Masaru Ueno Tyco Electronics
© USB-IF:2015
The authors of this specification would like to recognize the following people who participated
in the USB 3.1 Bus Specification technical workgroups. Additionally we would like to
acknowledge the many others throughout industry who provided feedback and contributed to
the development of this specification.
Promoter Company Employees
Alan Berkema Hewlett Packard
Norton Ewart Hewlett Packard
Monji Jabori Hewlett Packard
Rahul Lakdawala Hewlett Packard
Jim Mann Hewlett Packard
Linden McClure Hewlett Packard
Mike Bell Intel Corporation
Huimin Chen Intel Corporation
Kuan-Yu Chen Intel Corporation
Bob Dunstan Intel Corporation
Benjamin Graniello Intel Corporation
Howard Heck Intel Corporation
John Howard Intel Corporation
Rahman Ismail Intel Corporation
Yun Ling Intel Corporation
Steve Mcgowan Intel Corporation
Sridharan Ranganathan Intel Corporation
Kaleb Ruof Intel Corporation
Brad Saunders Intel Corporation
Sarah Sharp Intel Corporation
Ronald Swartz Intel Corporation
Jennifer Tsai Intel Corporation
Karthi Vadivelu Intel Corporation
Randy Aull Microsoft Corporation
Vivek Gupta Microsoft Corporation
Toby Nixon Microsoft Corporation
Yang You Microsoft Corporation
Nobuo Furuya Renesas Electronics Corp.
Masami Katagiri Renesas Electronics Corp.
Steven Kawamoto Renesas Electronics Corp.
Kiichi Muto Renesas Electronics Corp.
Peter Teng Renesas Electronics Corp.
Hicham Bouzekri ST-Ericsson
Morten Christiansen ST-Ericsson
Grant Ley Texas Instruments
James Skidmore Texas Instruments
Sue Vining Texas Instruments
Tod Wolf Texas Instruments
Li Yang Texas Instruments
– 12 – IEC 62680-3-1:2017 © IEC 2017
© USB-IF:2015
Contributor Company Employees
Jason Chen Aces Electronics Co., Ltd.
Andy Feng Aces Electronics Co., Ltd.
Chris Kao Aces Electronics Co., Ltd.
Glen Chandler ACON, Advanced-Connectek, Inc.
Alan MacDougall ACON, Advanced-Connectek, Inc.
Shadi Barakat Advanced Micro Devices
Walter Fry Advanced Micro Devices
Will Harris Advanced Micro Devices
Jason Hawken Advanced Micro Devices
Hugo Lamarche Advanced Micro Devices
Yufei Ma Advanced Micro Devices
Joseph Scanlon Advanced Micro Devices
Vishant Tyagi Advanced Micro Devices
Min Wang Advanced Micro Devices
James Choate Agilent Technologies, Inc.
Thorsten Goetzelmann Agilent Technologies, Inc.
Takuya Hirato Agilent Technologies, Inc.
Hiroshi Kanda Agilent Technologies, Inc.
Donald Schoenecker Agilent Technologies, Inc.
Chi Chang ASMedia Technology Inc.
Chin Chang ASMedia Technology Inc.
Chiahsin Chen ASMedia Technology Inc.
Weber Chuang ASMedia Technology Inc.
Ming-Wei Hsu ASMedia Technology Inc.
Han Sung Kuo ASMedia Technology Inc.
ShuYu Lin ASMedia Technology Inc.
Luke Peng ASMedia Technology Inc.
Daniel Wei ASMedia Technology Inc.
ShengChung Wu ASMedia Technology Inc.
Ted Hsiao Bizlink Technology, Inc.
Pete Burgers DisplayLink (UK) Ltd.
Dan Ellis DisplayLink (UK) Ltd.
Richard Petrie DisplayLink (UK) Ltd.
Terry Little Foxconn / Hon Hai
Steve Sedio Foxconn / Hon Hai
Tim Barilovits Fresco Logic Inc.
Bob McVay Fresco Logic Inc.
Christopher Meyers Fresco Logic Inc.
Jie Ni Fresco Logic Inc.
Jeffrey Yang Fresco Logic Inc.
Jing-Fan Zhang Fresco Logic Inc.
Mike Engbretson Granite River Labs
Kunia Aihara Hirose Electric Co., Ltd.
Kazu Ichikawa Hirose Electric Co., Ltd.
Masaru Kawamura Hirose Electric Co., Ltd.

© USB-IF:2015
William MacKillop Hirose Electric Co., Ltd.
Sho Nakamura Hirose Electric Co., Ltd.
Toshiyuki Takada Hirose Electric Co., Ltd.
Sid Tono Hirose Electric Co., Ltd.
Tirumal Annamaneni Intersil Corporation
Colby Keith Intersil Corporation
Gourgen Oganessyan Intersil Corporation
Michael Vrazel Intersil Corporation
Toshiyuki Moritake Japan Aviation Electronics Industry Ltd. (JAE)
Takeharu Naito Japan Aviation Electronics Industry Ltd. (JAE)
Mark Saubert Japan Aviation Electronics Industry Ltd. (JAE)
Toshio Shimoyama Japan Aviation Electronics Industry Ltd. (JAE)
Takamitsu Wada Japan Aviation Electronics Industry Ltd. (JAE)
Roy Chestnut LeCroy Corporation
Christopher Forker LeCroy Corporation
Linden Hsu LeCroy Corporation
Daniel H Jacobs LeCroy Corporation
David Li LeCroy Corporation
Mike Micheletti LeCroy Corporation
Michael Romm LeCroy Corporation
Chris Webb LeCroy Corporation
Tomoki Harada Lenovo
Ariel Delos Reyes Lotes Co., Ltd.
Smark Huo Lotes Co., Ltd.
Regina Liu-Hwang Lotes Co., Ltd.
Harvey Newman LSI Corporation
Dave Thompson LSI Corporation
Srinivas Vura LSI Corporation
Josue Castillo Luxshare-ICT
Alan Kinningham Luxshare-ICT
John Lin Luxshare-ICT
Stone Lin Luxshare-ICT
Pat Young Luxshare-ICT
John Garney MCCI Corporation
Peter Harrison Nokia Corporation
Mika Tolvanen Nokia Corporation
Panu Ylihaavisto Nokia Corporation
Jason Chen NXP Semiconductors
Gerrit den Besten NXP Semiconductors
Bart Vertenten NXP Semiconductors
Ho Wai Wong-Lam NXP Semiconductors
Jagoun Koo Samsung Electronics Co., Ltd.
Cheolho Lee Samsung Electronics Co., Ltd.
Jun Bum Lee Samsung Electronics Co., Ltd.
Alvin Cox Seagate Technology LLC
Steven Davis Seagate Technology LLC

– 14 – IEC 62680-3-1:2017 © IEC 2017
© USB-IF:2015
Bahar Ghaffari Seagate Technology LLC
Henry (John) Hein Seagate Technology LLC
Tony Priborsky Seagate Technology LLC
Tom Skaar Seagate Technology LLC
Dan Smith Seagate Technology LLC
Mark Bohm SMSC
Jerome DeRoo STMicroelectronics
Benoit Mercier STMicroelectronics
Subramaniam Aravindhan Synopsys, Inc.
Bala Babu Synopsys, Inc.
Sanjay Dave Synopsys, Inc.
Gervais Fong Synopsys, Inc.
Kevin Heilman Synopsys, Inc.
Eric Huang Synopsys, Inc.
Behram Minwalla Synopsys, Inc.
Saleem Mohammad Synopsys, Inc.
Matthew Myers Synopsys, Inc.
Tri Nguyen Synopsys, Inc.
John Stonick Synopsys, Inc.
Zongyao Wen Synopsys, Inc.
Paul Wyborny Synopsys, Inc.
Sarah Boen Tektronix, Inc.
Darren Gray Tektronix, Inc.
Srikrishna N.H. Tektronix, Inc.
Randy White Tektronix, Inc.
Jim McGrath Tyco Electronics Corp., a TE Connectivity Ltd. company
Josh Moody Tyco Electronics Corp., a TE Connectivity Ltd. company
Scott Shuey Tyco Electronics Corp., a TE Connectivity Ltd. company
Egbert Stellinga Tyco Electronics Corp., a TE Connectivity Ltd. company
Noah Zhang Tyco Electronics Corp., a TE Connectivity Ltd. company
Marvin DeForest Western Digital Technologies, Inc.
Larry McMillan Western Digital Technologies, Inc.
Cristian Roman Del Nido Western Digital Technologies, Inc.
Curtis Stevens Western Digital Technologies, Inc.

© USB-IF:2015
CONTENTS
FOREWORD . 2
INTRODUCTION . 4
1 Introduction . 38
1.1 Background . 38
1.2 Objective of the Specification . 38
1.3 Scope of the Document . 38
1.4 USB Product Compliance . 39
1.5 Document Organization . 39
1.6 Design Goals . 39
1.7 Related Documents. 39
2 Terms and Abbreviations . 40
3 Architectural Overview . 48
3.1 USB 3.1 System Description . 49
3.1.1 USB 3.1 Physical Interface . 50
3.1.2 USB 3.1 Power . 50
3.1.3 USB 3.1 System Configuration . 51
3.1.4 USB 3.1 Architecture Summary . 51
3.2 Enhanced SuperSpeed Bus Architecture . 51
3.2.1 Physical Layer . 53
3.2.2 Link Layer. 54
3.2.3 Protocol Layer . 55
3.2.4 Robustness . 57
3.2.5 Enhanced SuperSpeed Power Management . 57
3.2.6 Devices . 58
3.2.7 Hosts . 62
3.3 Enhanced SuperSpeed Bus Data Flow Models . 63
4 Enhanced SuperSpeed Data Flow Model . 63
4.1 Implementer Viewpoints . 63
4.2 Enhanced SuperSpeed Communication Flow . 64
4.2.1 Pipes . 64
4.3 Enhanced SuperSpeed Protocol Overview . 64
4.3.1 Differences from USB 2.0 . 64
4.4 Generalized Transfer Description . 66
4.4.1 Data Bursting. 67
4.4.2 IN Transfers . 67
4.4.3 OUT Transfers . 68
4.4.4 Power Management and Performance . 69
4.4.5 Control Transfers . 69
4.4.6 Bulk Transfers . 71
4.4.7 Interrupt Transfers . 74
4.4.8 Isochronous Transfers . 75
4.4.9 Device Notifications . 79
4.4.10 Reliability . 79
4.4.11 Efficiency . 79
5 Mechanical . 80
5.1 Objective . 80

– 16 – IEC 62680-3-1:2017 © IEC 2017
© USB-IF:2015
5.2 Significant Features . 80
5.2.1 Connectors . 80
5.2.2 Allowed Cable Assemblies . 82
5.2.3 Raw Cables . 82
5.3 Connector Mating Interfaces . 82
5.3.1 USB 3.1 Standard-A Connector . 82
5.3.2 USB 3.1 Standard-B Connector . 98
5.3.3 USB 3.1 Micro Connector Family . 103
5.4 Cable Construction and Wire Assignments . 111
5.4.1 Cable Construction . 111
5.4.2 Wire Assignments . 112
5.4.3 Wire Gauges and Cable Diameters . 113
5.5 Cable Assemblies . 113
5.5.1 USB 3.1 Standard-A to USB 3.1 Standard-B Cable Assembly . 113
5.5.2 USB 3.1 Standard-A to USB 3.1 Standard-A Cable Assembly . 115
5.5.3 USB 3.1 Standard-A to USB 3.1 Micro-B Cable Assembly. 115
5.5.4 USB 3.1 Micro-A to USB 3.1 Micro-B Cable Assembly . 117
5.5.5 USB 3.1 Micro-A to USB 3.1 Standard-B Cable Assembly . 119
5.5.6 USB 3.1 Icon Location . 120
5.5.7 Cable Assembly Length . 120
5.6 Electrical Requirements . 120
5.6.1 Enhanced SuperSpeed Electrical Requirements . 121
5.6.2 DC Electrical Requirements . 130
5.7 Mechanical and Environmental Requirements . 130
5.7.1 Mechanical Requirements . 131
5.7.2 Environmental Requirements . 134
5.7.3 Materials . 134
5.8 Implementation Notes and Design Guides . 135
5.8.1 Mated Connector Dimensions . 135
5.8.2 EMI and RFI Management . 137
5.8.3 Stacked Connectors . 138
6 Physical Layer . 139
6.1 Physical Layer Overview . 139
6.2 Physical Layer Functions . 139
6.2.1 Measurement Overview . 143
6.2.2 Channel Overview . 143
6.3 Symbol Encoding . 144
6.3.1 Gen 1 Encoding . 144
6.3.2 Gen 2 Encoding . 146
6.3.3 Special Symbols for Framing and Link Management . 150
6.4 Link Initialization and Training. 151
6.4.1 Link Training . 151
6.4.2 Lane Polarity Inversion . 156
6.4.3 Elasticity Buffer and SKP Ordered Set . 156
6.4.4 Compliance Pattern . 158
6.5 Clock and Jitter . 159
6.5.1 Informative Jitter Budgeting . 159
6.5.2 Normative Clock Recovery Function . 160
6.5.3 Normative Spread Spectrum Clocking (SSC) . 162

© USB-IF:2015
6.5.4 Normative Slew Rate Limit . 163
6.6 Signaling. 163
6.6.1 Eye Diagrams . 163
6.6.2 Voltage Level Definitions . 164
6.6.3 Tx and Rx Input Parasitics . 165
6.7 Transmitter Specifications . 165
6.7.1 Transmitter Electrical Parameters . 165
6.7.2 Low Power Transmitter . 167
6.7.3 Transmitter Eye . 167
6.7.4 Tx Compliance Reference Receiver Equalize Function . 168
6.7.5 Informative Transmitter De-emphasis . 168
6.7.6 Entry into Electrical Idle, U1 . 170
6.8 Receiver Specifications . 170
6.8.1 Receiver Equalization Training . 170
6.8.2 Informative Receiver CTLE Function . 171
6.8.3 Receiver Electrical Parameters . 174
6.8.4 Receiver Loopback . 175
6.8.5 Normative Receiver Tolerance Compliance Test . 176
6.9 Low Frequency Periodic Signaling (LFPS) . 178
6.9.1 LFPS Signal Definition . 178
6.9.2 Example LFPS Handshake for U1/U2 Exit, Loopback Exit, and U3
Wakeup . 180
6.9.3 Warm Reset. 182
6.9.4 SuperSpeedPlus Capability Declaration . 183
6.9.5 SuperSpeedPlus LFPS Based PWM Message (LBPM) . 184
6.10 Transmitter and Receiver DC Specifications . 186
6.10.1 Informative ESD Protection . 186
6.10.2 Informative Short Circuit Requirements . 186
6.10.3 Normative High Impedance Reflections . 186
6.11 Receiver Detection . 186
6.11.1 Rx Detect Overview . 186
6.11.2 Rx Detect Sequence . 187
6.11.3 Upper Limit on Channel Capacitance . 187
6.12 Retimers . 188
7 Link Layer . 188
7.1 Byte Ordering . 189
7.1.1 SuperSpeed USB Line Code . 189
7.1.2 SuperSpeedPlus USB Line Code . 189
7.2 Link Management and Flow Control . 189
7.2.1 Packets and Packet Framing . 190
7.2.2 Link Commands . 198
7.2.3 Logical Idle . 202
7.2.4 Link Command Usage for Flow Control, Error Recovery, and Power
Management . 202
7.3 Link Error Rules/Recovery . 218
7.3.1 Overview of Enhanced SuperSpeed Bit Errors . 218
7.3.2 Link Error Types, Detection, and Recovery . 218
7.3.3 Link Error Statistics . 218
7.3.4 Header Packet Errors . 219

– 18 – IEC 62680-3-1:2017 © IEC 2017
© USB-IF:2015
7.3.5 Link Command Errors . 220
7.3.6 ACK Tx Header Sequence Number Error . 221
7.3.7 Header Sequence Number Advertisement Error . 222
7.3.8 SuperSpeed Rx Header Buffer Credit Advertisement Error . 222
7.3.9 SuperSpeedPlus Type 1/Type 2 Rx Buffer Credit Advertisement Error . 223
7.3.10 Training Sequence Error . 223
7.3.11 SuperSpeed 8b/10b Errors . 224
7.3.12 SuperSpeedPlus Block Header Errors . 224
7.3.13 Summary of Error Types and Recovery . 224
7.4 PowerOn Reset and Inband Reset . 226
7.4.1 PowerOn Reset . 226
7.4.2 Inband Reset . 227
7.5 Link Training and Status State Machine (LTSSM) . 228
7.5.1 eSS.Disabled . 230
7.5.2 eSS.Inactive . 232
7.5.3 Rx.Detect . 233
7.5.4 Polling . 236
7.5.5 Compliance Mode . 247
7.5.6 U0 . 248
7.5.7 U1 . 249
7.5.8 U2 . 250
7.5.9 U3 . 251
7.5.10 Recovery . 252
7.5.11 Loopback .
...

IEC 62680-3-1 ®
Edition 1.0 2017-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Universal Serial Bus interfaces for data and power –
Part 3-1: Universal Serial Bus 3.1 Specification

Interfaces de bus universel en série pour les données et l'alimentation
électrique –
Partie 3-1: Spécification du bus universel en série 3.1

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IEC 62680-3-1 ®
Edition 1.0 2017-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Universal Serial Bus interfaces for data and power –

Part 3-1: Universal Serial Bus 3.1 Specification

Interfaces de bus universel en série pour les données et l'alimentation

électrique –
Partie 3-1: Spécification du bus universel en série 3.1

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 29.220; 35.200 ISBN 978-2-8322-1059-7

– 2 – IEC 62680-3-1:2017
© USB-IF:2015
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
UNIVERSAL SERIAL BUS INTERFACES FOR DATA AND POWER –

Part 3-1: Universal Serial Bus 3.1 Specification

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
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2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
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3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
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4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
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5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
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6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
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9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62680-3-1 has been prepared by technical area 14: Interfaces and
methods of measurement for personal computing equipment, of IEC technical committee 100:
Audio, video and multimedia systems and equipment.
The text of this standard was prepared by the USB Implementers Forum (USB-IF). The
structure and editorial rules used in this publication reflect the practice of the organization
which submitted it.
The text of this standard is based on the following documents:
CDV Report on voting
100/2589/CDV 100/2684/RVC
Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.

© USB-IF:2015
A list of all parts in the IEC 62680 series, published under the general title Universal serial
bus interfaces for data and power, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.
– 4 – IEC 62680-3-1:2017
© USB-IF:2015
INTRODUCTION
The IEC 62680 series is based on a series of specifications that were originally developed by
the USB Implementers Forum (USB-IF). These specifications were submitted to the IEC under
the auspices of a special agreement between the IEC and the USB-IF.
The USB Implementers Forum, Inc. (USB-IF) is a non-profit corporation founded by the group
of companies that developed the Universal Serial Bus specification. The USB-IF was formed
to provide a support organization and forum for the advancement and adoption of Universal
Serial Bus technology. The Forum facilitates the development of high-quality compatible USB
peripherals (devices), and promotes the benefits of USB and the quality of products that have
passed compliance testing.
ANY USB SPECIFICATIONS ARE PROVIDED TO YOU "AS IS", WITH NO WARRANTIES
WHATSOEVER, INCLUDING ANY WARRANTY OF MERCHANTABILITY, NON-
INFRINGEMENT, OR FITNESS FOR ANY PARTICULAR PURPOSE. THE USB
IMPLEMENTERS FORUM AND THE AUTHORS OF ANY USB SPECIFICATIONS DISCLAIM
ALL LIABILITY, INCLUDING LIABILITY FOR INFRINGEMENT OF ANY PROPRIETARY
RIGHTS, RELATING TO USE OR IMPLEMENTATION OR INFORMATION IN THIS
SPECIFICAITON.
THE PROVISION OF ANY USB SPECIFICATIONS TO YOU DOES NOT PROVIDE YOU
WITH ANY LICENCE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY
INTELLECTUAL PROPERTY RIGHTS.
Entering into USB Adopters Agreements may, however, allow a signing company to
participate in a reciprocal, RAND-Z licensing arrangement for compliant products. For more
information, please see:
http://www.usb.org/developers/docs/
http://www.usb.org/developers/devclass_docs#approved
IEC DOES NOT TAKE ANY POSITION AS TO WHETHER IT IS ADVISABLE FOR YOU TO
ENTER INTO ANY USB ADOPTERS AGREEMENTS OR TO PARTICIPATE IN THE "USB
IMPLEMENTERS FORUM".
© USB-IF:2015
Universal Serial Bus 3.1
Specification
Hewlett-Packard Company
Intel Corporation
Microsoft Corporation
Renesas Corporation
ST-Ericsson
Texas Instruments
Revision 1.0
July 26, 2013
– 6 – IEC 62680-3-1:2017
© USB-IF:2015
Revision History
Revision Comments Issue Date
1.0 Initial release. USB 3.0 November 12, 2008
Incorporated errata and ECNs June 6, 2011
1.0 Initial release. USB 3.1 July 26, 2013

INTELLECTUAL PROPERTY DISCLAIMER
THIS SPECIFICATION IS PROVIDED TO YOU “AS IS” WITH NO WARRANTIES
WHATSOEVER, INCLUDING ANY WARRANTY OF MERCHANTABILITY, NON-
INFRINGEMENT, OR FITNESS FOR ANY PARTICULAR PURPOSE. THE AUTHORS OF
THIS SPECIFICATION DISCLAIM ALL LIABILITY, INCLUDING LIABILITY FOR
INFRINGEMENT OF ANY PROPRIETARY RIGHTS, RELATING TO USE OR
IMPLEMENTATION OF INFORMATION IN THIS SPECIFICATION. THE PROVISION OF THIS
SPECIFICATION TO YOU DOES NOT PROVIDE YOU WITH ANY LICENSE, EXPRESS OR
IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS.

Please send comments to [e-mail]
For industry information, refer to the USB Implementers Forum web page at http://www.usb.org

All product names are trademarks, registered trademarks, or servicemarks of their respective owners.
ST-Ericsson, and Texas Instruments.
All rights reserved.
© USB-IF:2015
Acknowledgement of Technical Contribution
Dedication
Dedicated to the memory of Brad Hosler, the impact of whose
accomplishments made the Universal Serial Bus one of the
most successful technology innovations of the Personal
Computer era.
The authors of this specification would like to recognize the following people who participated
in the USB 3.0 Bus Specification technical workgroups. We would also like to acknowledge
the many others throughout the industry who provided feedback and contributed to the
development of this specification.
Promoter Company Employees
Alan Berkema Hewlett-Packard Company
Walter Fry Hewlett-Packard Company
Anthony Hudson Hewlett-Packard Company
David Roderick Hewlett-Packard Company
Kok Hong Chan Intel Corporation
Huimin Chen Intel Corporation
Bob Dunstan Intel Corporation
Dan Froelich Intel Corporation
Howard Heck Intel Corporation
Brad Hosler Intel Corporation
John Howard Intel Corporation
Rahman Ismail Intel Corporation
John Keys Intel Corporation
Yun Ling Intel Corporation
Andy Martwick Intel Corporation
Steve McGowan Intel Corporation
Ramin Neshati Intel Corporation
Duane Quiet Intel Corporation
Jeff Ravencraft Intel Corporation
Brad Saunders Intel Corporation
Joe Schaefer Intel Corporation
Sarah Sharp Intel Corporation
Micah Sheller Intel Corporation
Gary Solomon Intel Corporation
Karthi Vadivelu Intel Corporation
Clint Walker Intel Corporation
Jim Walsh Intel Corporation
Randy Aull Microsoft Corporation
Fred Bhesania Microsoft Corporation
Martin Borve Microsoft Corporation
Jim Bovee Microsoft Corporation
Stephen Cooper Microsoft Corporation
Lars Giusti Microsoft Corporation
Robbie Harris Microsoft Corporation

– 8 – IEC 62680-3-1:2017
© USB-IF:2015
Allen Marshall Microsoft Corporation
Kiran Muthabatulla Microsoft Corporation
Tomas Perez-Rodriguez Microsoft Corporation
Mukund Sankaranarayan Microsoft Corporation
Nathan Sherman Microsoft Corporation
Glen Slick Microsoft Corporation
David Wooten Microsoft Corporation
Rob Young Microsoft Corporation
Nobuo Furuya NEC Corporation
Hiroshi Kariya NEC Corporation
Masami Katagiri NEC Corporation
Yuichi Mizoguchi NEC Corporation
Kats Nakazawa NEC Corporation
Nobuyuki Mizukoshi NEC Corporation
Yutaka Noguchi NEC Corporation
Hajime Nozaki NEC Corporation
Kenji Oguma NEC Corporation
Satoshi Ohtani NEC Corporation
Takanori Saeki NEC Corporation
Eiji Sakai NEC Corporation
Hiro Sakamoto NEC Corporation
Hajime Sakuma NEC Corporation
Makoto Sato NEC Corporation
Hock Seow NEC Corporation
"Peter" Chu Tin Teng NEC Corporation
Yoshiyuki Tomoda NEC Corporation
Satomi Yamauchi NEC Corporation
Yoshiyuki Yamada NEC Corporation
Susumu Yasuda NEC Corporation
Alan Chang ST-NXP Wireless
Wing Yan Chung ST-NXP Wireless
Socol Constantin ST-NXP Wireless
Knud Holtvoeth NXP Semiconductors, B.V.
Linus Kerk ST-NXP Wireless
Martin Klein NXP Semiconductors, B.V.
Geert Knapen NXP Semiconductors, B.V.
Chee Ee Lee ST-NXP Wireless
Christian Paquet NXP Semiconductors, B.V.
Veerappan Rajaram ST-NXP Wireless
Shaun Reemeyer ST-NXP Wireless
Dave Sroka ST-NXP Wireless
Chee-Yen TEE ST-NXP Wireless
Jerome Tjia ST-NXP Wireless
Bart Vertenten NXP Semiconductors, B.V.
Hock Meng Yeo ST-NXP Wireless
Olivier Alavoine Texas Instruments.

© USB-IF:2015
David Arciniega Texas Instruments
Richard Baker Texas Instruments
Sujoy Chakravarty Texas Instruments
T. Y. Chan Texas Instruments
Romit Dasgupta Texas Instruments.
Alex Davidson Texas Instruments
Eric Desmarchelier Texas Instruments
Christophe Gautier Texas Instruments
Dan Harmon Texas Instruments
Will Harris Texas Instruments
Richard Hubbard Texas Instruments
Ivo Huber Texas Instruments
Scott Kim Texas Instruments
Grant Ley Texas Instruments
Karl Muth Texas Instruments
Lee Myers Texas Instruments
Julie Nirchi Texas Instruments
Wes Ray Texas Instruments
Matthew Rowley Texas Instruments
Bill Sherry Texas Instruments
Mitsuru Shimada Texas Instruments
James Skidmore Texas Instruments
Yoram Solomon Texas Instruments.
Sue Vining Texas Instruments
Jin-sheng Wang Texas Instruments
Roy Wojciechowski Texas Instruments

Contributor Company Employees
Glen Chandler Acon
John Chen Acon
Roger Hou Acon
Charles Wang Acon
Norman Wu Acon
Steven Yang Acon
George Yee Acon
George Olear Contech Research
Sophia Liu Electronics Testing Center, Taiwan (ETC)
William Northey FCI
Tom Sultzer FCI
Garry Biddle Foxconn
Kuan-Yu Chen Foxconn
Jason Chou Foxconn
Gustavo Duenas Foxconn
Bob Hall Foxconn
Jiayong He Foxconn
– 10 – IEC 62680-3-1:2017
© USB-IF:2015
Jim Koser Foxconn
Joe Ortega Foxconn
Ash Raheja Foxconn
James Sabo Foxconn
Pei Tsao Foxconn
Kevin Walker Foxconn
Tsuneki Watanabe Foxconn
Chong Yi Foxconn
Taro Hishinuma Hirose Electric
Kaz Ichikawa Hirose Electric
Ryozo Koyama Hirose Electric
Karl Kwiat Hirose Electric
Tadashi Sakaizawa Hirose Electric
Shinya Tono Hirose Electric
Eiji Wakatsuki Hirose Electric
Takashi Ehara Japan Aviation Electronics Industry Ltd. (JAE)
Ron Muir Japan Aviation Electronics Industry Ltd. (JAE)
Kazuhiro Saito Japan Aviation Electronics Industry Ltd. (JAE)
Hitoshi Kawamura Mitsumi
Takashi Kawasaki Mitsumi
Atsushi Nishio Mitsumi
Yasuhiko Shinohara Mitsumi
Tom Lu Molex Inc.
Edmund Poh Molex Inc.
Scott Sommers Molex Inc.
Jason Squire Molex Inc.
Dat Ba Nguyen NTS/National Technical System
Jan Fahllund Nokia
Richard Petrie Nokia
Panu Ylihaavisto Nokia
Martin Furuhjelm Seagate Technology LLC
Julian Gorfajn Seagate Technology LLC
Marc Hildebrant Seagate Technology LLC
Tony Priborsky Seagate Technology LLC
Harold To Seagate Technology LLC
Robert Lefferts Synopsys, Inc.
Saleem Mohammad Synopsys, Inc.
Matthew Myers Synopsys, Inc.
Daniel Weinlader Synopsys, Inc.
Mike Engbretson Tektronix, Inc.
Thomas Grzysiewicz Tyco Electronics
Masaaki Iwasaki Tyco Electronics
Kazukiyo Osada Tyco Electronics
Hiroshi Shirai Tyco Electronics
Scott Shuey Tyco Electronics
Masaru Ueno Tyco Electronics
© USB-IF:2015
The authors of this specification would like to recognize the following people who participated
in the USB 3.1 Bus Specification technical workgroups. Additionally we would like to
acknowledge the many others throughout industry who provided feedback and contributed to
the development of this specification.
Promoter Company Employees
Alan Berkema Hewlett Packard
Norton Ewart Hewlett Packard
Monji Jabori Hewlett Packard
Rahul Lakdawala Hewlett Packard
Jim Mann Hewlett Packard
Linden McClure Hewlett Packard
Mike Bell Intel Corporation
Huimin Chen Intel Corporation
Kuan-Yu Chen Intel Corporation
Bob Dunstan Intel Corporation
Benjamin Graniello Intel Corporation
Howard Heck Intel Corporation
John Howard Intel Corporation
Rahman Ismail Intel Corporation
Yun Ling Intel Corporation
Steve Mcgowan Intel Corporation
Sridharan Ranganathan Intel Corporation
Kaleb Ruof Intel Corporation
Brad Saunders Intel Corporation
Sarah Sharp Intel Corporation
Ronald Swartz Intel Corporation
Jennifer Tsai Intel Corporation
Karthi Vadivelu Intel Corporation
Randy Aull Microsoft Corporation
Vivek Gupta Microsoft Corporation
Toby Nixon Microsoft Corporation
Yang You Microsoft Corporation
Nobuo Furuya Renesas Electronics Corp.
Masami Katagiri Renesas Electronics Corp.
Steven Kawamoto Renesas Electronics Corp.
Kiichi Muto Renesas Electronics Corp.
Peter Teng Renesas Electronics Corp.
Hicham Bouzekri ST-Ericsson
Morten Christiansen ST-Ericsson
Grant Ley Texas Instruments
James Skidmore Texas Instruments
Sue Vining Texas Instruments
Tod Wolf Texas Instruments
Li Yang Texas Instruments
– 12 – IEC 62680-3-1:2017
© USB-IF:2015
Contributor Company Employees
Jason Chen Aces Electronics Co., Ltd.
Andy Feng Aces Electronics Co., Ltd.
Chris Kao Aces Electronics Co., Ltd.
Glen Chandler ACON, Advanced-Connectek, Inc.
Alan MacDougall ACON, Advanced-Connectek, Inc.
Shadi Barakat Advanced Micro Devices
Walter Fry Advanced Micro Devices
Will Harris Advanced Micro Devices
Jason Hawken Advanced Micro Devices
Hugo Lamarche Advanced Micro Devices
Yufei Ma Advanced Micro Devices
Joseph Scanlon Advanced Micro Devices
Vishant Tyagi Advanced Micro Devices
Min Wang Advanced Micro Devices
James Choate Agilent Technologies, Inc.
Thorsten Goetzelmann Agilent Technologies, Inc.
Takuya Hirato Agilent Technologies, Inc.
Hiroshi Kanda Agilent Technologies, Inc.
Donald Schoenecker Agilent Technologies, Inc.
Chi Chang ASMedia Technology Inc.
Chin Chang ASMedia Technology Inc.
Chiahsin Chen ASMedia Technology Inc.
Weber Chuang ASMedia Technology Inc.
Ming-Wei Hsu ASMedia Technology Inc.
Han Sung Kuo ASMedia Technology Inc.
ShuYu Lin ASMedia Technology Inc.
Luke Peng ASMedia Technology Inc.
Daniel Wei ASMedia Technology Inc.
ShengChung Wu ASMedia Technology Inc.
Ted Hsiao Bizlink Technology, Inc.
Pete Burgers DisplayLink (UK) Ltd.
Dan Ellis DisplayLink (UK) Ltd.
Richard Petrie DisplayLink (UK) Ltd.
Terry Little Foxconn / Hon Hai
Steve Sedio Foxconn / Hon Hai
Tim Barilovits Fresco Logic Inc.
Bob McVay Fresco Logic Inc.
Christopher Meyers Fresco Logic Inc.
Jie Ni Fresco Logic Inc.
Jeffrey Yang Fresco Logic Inc.
Jing-Fan Zhang Fresco Logic Inc.
Mike Engbretson Granite River Labs
Kunia Aihara Hirose Electric Co., Ltd.
Kazu Ichikawa Hirose Electric Co., Ltd.
Masaru Kawamura Hirose Electric Co., Ltd.

© USB-IF:2015
William MacKillop Hirose Electric Co., Ltd.
Sho Nakamura Hirose Electric Co., Ltd.
Toshiyuki Takada Hirose Electric Co., Ltd.
Sid Tono Hirose Electric Co., Ltd.
Tirumal Annamaneni Intersil Corporation
Colby Keith Intersil Corporation
Gourgen Oganessyan Intersil Corporation
Michael Vrazel Intersil Corporation
Toshiyuki Moritake Japan Aviation Electronics Industry Ltd. (JAE)
Takeharu Naito Japan Aviation Electronics Industry Ltd. (JAE)
Mark Saubert Japan Aviation Electronics Industry Ltd. (JAE)
Toshio Shimoyama Japan Aviation Electronics Industry Ltd. (JAE)
Takamitsu Wada Japan Aviation Electronics Industry Ltd. (JAE)
Roy Chestnut LeCroy Corporation
Christopher Forker LeCroy Corporation
Linden Hsu LeCroy Corporation
Daniel H Jacobs LeCroy Corporation
David Li LeCroy Corporation
Mike Micheletti LeCroy Corporation
Michael Romm LeCroy Corporation
Chris Webb LeCroy Corporation
Tomoki Harada Lenovo
Ariel Delos Reyes Lotes Co., Ltd.
Smark Huo Lotes Co., Ltd.
Regina Liu-Hwang Lotes Co., Ltd.
Harvey Newman LSI Corporation
Dave Thompson LSI Corporation
Srinivas Vura LSI Corporation
Josue Castillo Luxshare-ICT
Alan Kinningham Luxshare-ICT
John Lin Luxshare-ICT
Stone Lin Luxshare-ICT
Pat Young Luxshare-ICT
John Garney MCCI Corporation
Peter Harrison Nokia Corporation
Mika Tolvanen Nokia Corporation
Panu Ylihaavisto Nokia Corporation
Jason Chen NXP Semiconductors
Gerrit den Besten NXP Semiconductors
Bart Vertenten NXP Semiconductors
Ho Wai Wong-Lam NXP Semiconductors
Jagoun Koo Samsung Electronics Co., Ltd.
Cheolho Lee Samsung Electronics Co., Ltd.
Jun Bum Lee Samsung Electronics Co., Ltd.
Alvin Cox Seagate Technology LLC
Steven Davis Seagate Technology LLC

– 14 – IEC 62680-3-1:2017
© USB-IF:2015
Bahar Ghaffari Seagate Technology LLC
Henry (John) Hein Seagate Technology LLC
Tony Priborsky Seagate Technology LLC
Tom Skaar Seagate Technology LLC
Dan Smith Seagate Technology LLC
Mark Bohm SMSC
Jerome DeRoo STMicroelectronics
Benoit Mercier STMicroelectronics
Subramaniam Aravindhan Synopsys, Inc.
Bala Babu Synopsys, Inc.
Sanjay Dave Synopsys, Inc.
Gervais Fong Synopsys, Inc.
Kevin Heilman Synopsys, Inc.
Eric Huang Synopsys, Inc.
Behram Minwalla Synopsys, Inc.
Saleem Mohammad Synopsys, Inc.
Matthew Myers Synopsys, Inc.
Tri Nguyen Synopsys, Inc.
John Stonick Synopsys, Inc.
Zongyao Wen Synopsys, Inc.
Paul Wyborny Synopsys, Inc.
Sarah Boen Tektronix, Inc.
Darren Gray Tektronix, Inc.
Srikrishna N.H. Tektronix, Inc.
Randy White Tektronix, Inc.
Jim McGrath Tyco Electronics Corp., a TE Connectivity Ltd. company
Josh Moody Tyco Electronics Corp., a TE Connectivity Ltd. company
Scott Shuey Tyco Electronics Corp., a TE Connectivity Ltd. company
Egbert Stellinga Tyco Electronics Corp., a TE Connectivity Ltd. company
Noah Zhang Tyco Electronics Corp., a TE Connectivity Ltd. company
Marvin DeForest Western Digital Technologies, Inc.
Larry McMillan Western Digital Technologies, Inc.
Cristian Roman Del Nido Western Digital Technologies, Inc.
Curtis Stevens Western Digital Technologies, Inc.

© USB-IF:2015
CONTENTS
FOREWORD . 2
INTRODUCTION . 4
1 Introduction . 38
1.1 Background . 38
1.2 Objective of the Specification . 38
1.3 Scope of the Document . 38
1.4 USB Product Compliance . 39
1.5 Document Organization . 39
1.6 Design Goals . 39
1.7 Related Documents. 39
2 Terms and Abbreviations . 40
3 Architectural Overview . 48
3.1 USB 3.1 System Description . 49
3.1.1 USB 3.1 Physical Interface . 50
3.1.2 USB 3.1 Power . 50
3.1.3 USB 3.1 System Configuration . 51
3.1.4 USB 3.1 Architecture Summary . 51
3.2 Enhanced SuperSpeed Bus Architecture . 51
3.2.1 Physical Layer . 53
3.2.2 Link Layer. 54
3.2.3 Protocol Layer . 55
3.2.4 Robustness . 57
3.2.5 Enhanced SuperSpeed Power Management . 57
3.2.6 Devices . 58
3.2.7 Hosts . 62
3.3 Enhanced SuperSpeed Bus Data Flow Models . 63
4 Enhanced SuperSpeed Data Flow Model . 63
4.1 Implementer Viewpoints . 63
4.2 Enhanced SuperSpeed Communication Flow . 64
4.2.1 Pipes . 64
4.3 Enhanced SuperSpeed Protocol Overview . 64
4.3.1 Differences from USB 2.0 . 64
4.4 Generalized Transfer Description . 66
4.4.1 Data Bursting. 67
4.4.2 IN Transfers . 67
4.4.3 OUT Transfers . 68
4.4.4 Power Management and Performance . 69
4.4.5 Control Transfers . 69
4.4.6 Bulk Transfers . 71
4.4.7 Interrupt Transfers . 74
4.4.8 Isochronous Transfers . 75
4.4.9 Device Notifications . 79
4.4.10 Reliability . 79
4.4.11 Efficiency . 79
5 Mechanical . 80
5.1 Objective . 80

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© USB-IF:2015
5.2 Significant Features . 80
5.2.1 Connectors . 80
5.2.2 Allowed Cable Assemblies . 82
5.2.3 Raw Cables . 82
5.3 Connector Mating Interfaces . 82
5.3.1 USB 3.1 Standard-A Connector . 82
5.3.2 USB 3.1 Standard-B Connector . 98
5.3.3 USB 3.1 Micro Connector Family . 103
5.4 Cable Construction and Wire Assignments . 111
5.4.1 Cable Construction . 111
5.4.2 Wire Assignments . 112
5.4.3 Wire Gauges and Cable Diameters . 113
5.5 Cable Assemblies . 113
5.5.1 USB 3.1 Standard-A to USB 3.1 Standard-B Cable Assembly . 113
5.5.2 USB 3.1 Standard-A to USB 3.1 Standard-A Cable Assembly . 115
5.5.3 USB 3.1 Standard-A to USB 3.1 Micro-B Cable Assembly. 115
5.5.4 USB 3.1 Micro-A to USB 3.1 Micro-B Cable Assembly . 117
5.5.5 USB 3.1 Micro-A to USB 3.1 Standard-B Cable Assembly . 119
5.5.6 USB 3.1 Icon Location . 120
5.5.7 Cable Assembly Length . 120
5.6 Electrical Requirements . 120
5.6.1 Enhanced SuperSpeed Electrical Requirements . 121
5.6.2 DC Electrical Requirements . 130
5.7 Mechanical and Environmental Requirements . 130
5.7.1 Mechanical Requirements . 131
5.7.2 Environmental Requirements . 134
5.7.3 Materials . 134
5.8 Implementation Notes and Design Guides . 135
5.8.1 Mated Connector Dimensions . 135
5.8.2 EMI and RFI Management . 137
5.8.3 Stacked Connectors . 138
6 Physical Layer . 139
6.1 Physical Layer Overview . 139
6.2 Physical Layer Functions . 139
6.2.1 Measurement Overview . 143
6.2.2 Channel Overview . 143
6.3 Symbol Encoding . 144
6.3.1 Gen 1 Encoding . 144
6.3.2 Gen 2 Encoding . 146
6.3.3 Special Symbols for Framing and Link Management . 150
6.4 Link Initialization and Training. 151
6.4.1 Link Training . 151
6.4.2 Lane Polarity Inversion . 156
6.4.3 Elasticity Buffer and SKP Ordered Set . 156
6.4.4 Compliance Pattern . 158
6.5 Clock and Jitter . 159
6.5.1 Informative Jitter Budgeting . 159
6.5.2 Normative Clock Recovery Function . 160
6.5.3 Normative Spread Spectrum Clocking (SSC) . 162

© USB-IF:2015
6.5.4 Normative Slew Rate Limit . 163
6.6 Signaling. 163
6.6.1 Eye Diagrams . 163
6.6.2 Voltage Level Definitions . 164
6.6.3 Tx and Rx Input Parasitics . 165
6.7 Transmitter Specifications . 165
6.7.1 Transmitter Electrical Parameters . 165
6.7.2 Low Power Transmitter . 167
6.7.3 Transmitter Eye . 167
6.7.4 Tx Compliance Reference Receiver Equalize Function . 168
6.7.5 Informative Transmitter De-emphasis . 168
6.7.6 Entry into Electrical Idle, U1 . 170
6.8 Receiver Specifications . 170
6.8.1 Receiver Equalization Training . 170
6.8.2 Informative Receiver CTLE Function . 171
6.8.3 Receiver Electrical Parameters . 174
6.8.4 Receiver Loopback . 175
6.8.5 Normative Receiver Tolerance Compliance Test . 176
6.9 Low Frequency Periodic Signaling (LFPS) . 178
6.9.1 LFPS Signal Definition . 178
6.9.2 Example LFPS Handshake for U1/U2 Exit, Loopback Exit, and U3
Wakeup . 180
6.9.3 Warm Reset. 182
6.9.4 SuperSpeedPlus Capability Declaration . 183
6.9.5 SuperSpeedPlus LFPS Based PWM Message (LBPM) . 184
6.10 Transmitter and Receiver DC Specifications . 186
6.10.1 Informative ESD Protection . 186
6.10.2 Informative Short Circuit Requirements . 186
6.10.3 Normative High Impedance Reflections . 186
6.11 Receiver Detection . 186
6.11.1 Rx Detect Overview . 186
6.11.2 Rx Detect Sequence . 187
6.11.3 Upper Limit on Channel Capacitance . 187
6.12 Retimers . 188
7 Link Layer . 188
7.1 Byte Ordering . 189
7.1.1 SuperSpeed USB Line Code . 189
7.1.2 SuperSpeedPlus USB Line Code . 189
7.2 Link Management and Flow Control . 189
7.2.1 Packets and Packet Framing . 190
7.2.2 Link Commands . 198
7.2.3 Logical Idle . 202
7.2.4 Link Command Usage for Flow Control, Error Recovery, and Power
Management . 202
7.3 Link Error Rules/Recovery . 218
7.3.1 Overview of Enhanced SuperSpeed Bit Errors . 218
7.3.2 Link Error Types, Detection, and Recovery . 218
7.3.3 Link Error Statistics . 218
7.3.4 Header Packet Errors . 219

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© USB-IF:2015
7.3.5 Link Command Errors . 220
7.3.6 ACK Tx Header Sequence Number Error . 221
7.3.7 Header Sequence Number Advertisement Error . 222
7.3.8 SuperSpeed Rx Header Buffer Credit Advertisement Error . 222
7.3.9 SuperSpeedPlus Type 1/Type 2 Rx Buffer Credit Advertisement Error . 223
7.3.10 Training Sequence Error . 223
7.3.11 SuperSpeed 8b/10b Errors . 224
7.3.12 SuperSpeedPlus Block Header
...