IEC 62610-4:2013

Mechanical structures for electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 4: Cooling performance tests for water supplied heat exchangers in electronic cabinets

IEC 62610-4:2013 specifies the test setup and test parameters for water supplied heat exchangers within single electronic cabinet configurations. The tests are focused on cabinets for the installation of high power dissipation electronic equipment. The cabinets concerned are from the IEC 60297 (19 in) and IEC 60917 (25 mm) series. The purpose of this standard is to provide comparable data for the cooling performance of cabinets according to defined test setups and cooling parameters. Key words: Electronic cabinets, cooling, water supplied heat exchangers

Structures mécaniques pour équipements électroniques - Gestion thermique pour les armoires conformes aux séries CEI 60297 et CEI 60917 - Partie 4: Essais de performances de refroidissement pour les échangeurs de chaleur alimentés par de l'eau dans des baies électroniques

La CEI 62610-4:2013 spécifie les montages d'essai et les paramètres d'essai pour des échangeurs de chaleur alimentés par de l'eau dans des configurations à une seule baie électronique. Les essais portent sur des baies destinées à l'installation d'équipements électroniques à forte dissipation d'énergie. Les baies concernées sont conformes aux séries CEI 60297 (19 pouces) et CEI 60917 (25 mm). La présente norme a pour objectif de fournir des données comparables pour les performances de refroidissement des baies conformément aux montages d'essai et aux paramètres d'essai définis. Mots-clés: baies électroniques, refroidissement, échangeurs de chaleur alimentés par de l'eau

General Information

• Status: Published
• Publication Date: 14-Aug-2013
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 31.240 - Mechanical structures for electronic equipment
• Technical Committee: SC 48D - Mechanical structures for electrical and electronic equipment
• Drafting Committee: WG 5 - TC 48/SC 48D/WG 5
• Current Stage: PPUB - Publication issued
• Start Date: 15-Sep-2013
• Completion Date: 15-Aug-2013

Standards Content (Sample)

IEC 62610-4 ®
Edition 1.0 2013-08
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Mechanical structures for electronic equipment – Thermal management for
cabinets in accordance with IEC 60297 and IEC 60917 series –
Part 4: Cooling performance tests for water supplied heat exchangers in
electronic cabinets
Structures mécaniques pour équipements électroniques – Gestion thermique
pour les armoires conformes aux séries CEI 60297 et CEI 60917 –
Partie 4: Essais de performances de refroidissement pour les échangeurs de
chaleur alimentés par de l'eau dans des baies électroniques

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IEC 62610-4 ®
Edition 1.0 2013-08
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Mechanical structures for electronic equipment – Thermal management for

cabinets in accordance with IEC 60297 and IEC 60917 series –

Part 4: Cooling performance tests for water supplied heat exchangers in

electronic cabinets
Structures mécaniques pour équipements électroniques – Gestion thermique

pour les armoires conformes aux séries CEI 60297 et CEI 60917 –

Partie 4: Essais de performances de refroidissement pour les échangeurs de

chaleur alimentés par de l'eau dans des baies électroniques

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX R
ICS 31.240 ISBN 978-2-8322-1037-6

– 2 – 62610-4 © IEC:2013
CONTENTS
FOREWORD . 3
INTRODUCTION . 5
1 Scope and object . 6
2 Normative references . 6
3 Terms and definitions, symbols and units . 6
3.1 Terms and definitions . 6
3.2 Symbols and units . 7
4 Performance test for the heat exchanger . 8
4.1 General . 8
4.2 Test setup . 9
4.2.1 Test room . 9
4.2.2 Simulating the equipment heat load in the test sample. 9
4.2.3 Chilled-water flow rate and temperatures . 10
4.2.4 Measurement of the air temperature . 10
4.2.5 Temperature difference between chilled water supply and equipment
air inlet temperature . 11
4.3 Assessment of the heat exchanger performance . 11
4.3.1 Determination of the cooling capacity by means of simplified tests . 11
4.3.2 Determination of the cooling capacity by way of an extended test . 12
4.3.3 Complete identification of the cooling capacity. 14
4.4 Electrical power consumption . 16
4.5 Water circuit pressure resistance . 16
Annex A (normative) Test conditions . 17
Annex B (normative) Test results . 18

Figure 1 – Principle of the heat exchanger performance test . 9
Figure 2 – Test setup of simplified tests . 12
Figure 3 – Test setup of extended tests . 14
Figure 4 – Test setup, test for complete identification of the cooling capacity . 15
Figure 5 – Diagram of electrical power consumption versus cooling capacity . 16
Figure 6 – Diagram of water pressure resistance versus water flow rate . 16
Figure B.1 – System cooling capacity and water flow rate . 19

Table B.1 – Test result recording template . 18
Table B.2 – Test for closed air loop air to water heat exchanger for high density
cooling systems for IT equipment and server cooling . 19

62610-4 © IEC:2013 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
_____________
MECHANICAL STRUCTURES FOR ELECTRONIC EQUIPMENT –
THERMAL MANAGEMENT FOR CABINETS IN ACCORDANCE
WITH IEC 60297 AND IEC 60917 SERIES –

Part 4: Cooling performance tests for water supplied
heat exchangers in electronic cabinets

FOREWORD
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International Standard IEC 62610-4 has been prepared by subcommittee 48D: Mechanical
structures for electronic equipment, of IEC technical committee 48: Electromechanical
components and mechanical structures for electronic equipment.
The text of this standard is based on the following documents:
FDIS Report on voting
48D/542/FDIS 48D/545/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

– 4 – 62610-4 © IEC:2013
A list of all parts of IEC 62610 series, under the general title Mechanical structures for
electronic equipment – Thermal management for cabinets in accordance with IEC 60297 and
IEC 60917 series, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
...