IEC 61189-2-809:2024

Test methods for electrical materials, circuit boards and other interconnection structures and assemblies – Part 2-809: X/Y coefficient of thermal expansion (CTE) test for thick base materials by TMA

IEC 61189-2-809:2024 defines the method to be followed for the determination of the X/Y coefficient of thermal expansion of electrical insulating materials by the use of a thermomechanical analyser (TMA).
This method is applicable to materials that are solid of the entire range of temperature used and retain sufficient hardness and rigidity over the temperature range so that irreversible indentation of the specimen by the sensing probe does not occur.

Méthodes d'essai pour les matériaux électriques, les circuits imprimées et autres structures d'interconnexion et ensembles – Partie 2-809: Essai du coefficient de dilatation thermique (CTE) X/Y pour matériaux de base épais à l'aide d'un analyseur thermomécanique (TMA)

L’IEC 61189-2-809:2024 définit la méthode à suivre en vue de déterminer le coefficient de dilatation thermique (CTE, coefficient of thermal expansion) X/Y des matériaux isolants électriques à l'aide d'un analyseur thermomécanique (TMA, thermomechanical analyser).
La présente méthode est applicable aux matériaux qui sont solides dans toute la plage de températures utilisée, et qui conservent une dureté et une rigidité suffisantes sur la plage de températures, de telle sorte qu'une indentation irréversible de l'éprouvette par la sonde de détection ne se produise pas.

General Information

• Status: Published
• Publication Date: 08-Dec-2024
• ICS: 31.180 - Printed circuits and boards
• Technical Committee: TC 91 - Electronics assembly technology
• Drafting Committee: WG 10 - TC 91/WG 10
• Current Stage: PPUB - Publication issued
• Start Date: 27-Dec-2024
• Completion Date: 09-Dec-2024

Standards Content (Sample)

IEC 61189-2-809 ®
Edition 1.0 2024-12
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Test methods for electrical materials, circuit boards and other interconnection
structures and assemblies –
Part 2-809: X/Y coefficient of thermal expansion (CTE) test for thick base
materials by TMA
Méthodes d'essai pour les matériaux électriques, les circuits imprimées et
autres structures d'interconnexion et ensembles –
Partie 2-809: Essai du coefficient de dilatation thermique (CTE) X/Y pour
matériaux de base épais à l'aide d'un analyseur thermomécanique (TMA)
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IEC 61189-2-809 ®
Edition 1.0 2024-12
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Test methods for electrical materials, circuit boards and other interconnection

structures and assemblies –
Part 2-809: X/Y coefficient of thermal expansion (CTE) test for thick base

materials by TMA
Méthodes d'essai pour les matériaux électriques, les circuits imprimées et

autres structures d'interconnexion et ensembles –

Partie 2-809: Essai du coefficient de dilatation thermique (CTE) X/Y pour

matériaux de base épais à l'aide d'un analyseur thermomécanique (TMA)

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180  ISBN 978-2-8327-0054-9

– 2 – IEC 61189-2-809:2024-© IEC 2024
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Test specimens . 5
5 Test apparatus . 6
6 Test procedure . 6
7 Calculations . 7
8 Report . 8
Bibliography . 9

Figure 1 – Diagram of sample direction . 6
Figure 2 – Specimen size versus temperature . 8

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
TEST METHODS FOR ELECTRICAL MATERIALS, CIRCUIT BOARDS AND
OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –

Part 2-809: X/Y coefficient of thermal expansion (CTE) test
for thick base materials by TMA

FOREWORD
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IEC 61189-2-809 has been prepared by IEC technical committee 91: Electronics assembly
technology. It is an International Standard.
The text of this International Standard is based on the following documents:
Draft Report on voting
91/1983/FDIS 91/1994/RVD
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
– 4 – IEC 61189-2-809:2024-© IEC 2024
The language used for the development of this International Standard is English.
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/publications.
A list of all parts in the IEC 61189 series, published under the general title Test methods for
electrical materials, circuit boards and other interconnection structures and assemblies, can be
found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn, or
• revised.
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TEST METHODS FOR ELECTRICAL MATERIALS, CIRCUIT BOARDS AND
OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –

Part 2-809: X/Y coefficient of thermal expansion (CTE) test
for thick base materials by TMA

1 Scope
This part of IEC 61189 defines the method to be followed for the determination of the X/Y
coefficient of thermal expansion of electrical insulating materials by the use of a
thermomechanical analyser (TMA).
This method is applicable to materials that are solid of the entire range of temperature used
and retain sufficient hardness and rigidity over the temperature range so that irreversible
indentation of the specimen by the sensing probe does not occur.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated
...