IEC 61188-6-4:2019

Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design

IEC 61188-6-4:2019 specifies generic requirements for dimensional drawings of SMD from the viewpoint of land pattern design.
The purpose of this document is to prevent land pattern design issues caused by lack of information and/or misuse of the information from SMD outline drawing as well as to improve the utilization of IEC 61188 series. This document is applicable to the SMD of semiconductor devices and electrical components.

Cartes imprimées et cartes imprimées équipées - Conception et utilisation - Partie 6-4: Conception de la zone de report - Exigences génériques pour les dessins dimensionnels de composants montés en surface (CMS) du point de vue de la conception de la zone de report

L'IEC 61188-6-4:2019 spécifie les exigences génériques pour les dessins dimensionnels de CMS du point de vue de la conception de la zone de report. Le présent document a pour objet d'éviter les problèmes de conception de la zone de report causés par un manque d'informations et/ou une mauvaise utilisation des informations provenant des dessins d'encombrement de CMS, ainsi que d'améliorer l'utilisation de la série IEC 61188. Le présent document est applicable au CMS de dispositifs à semiconducteurs et de composants électriques.

General Information

• Status: Published
• Publication Date: 01-May-2019
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 31.180 - Printed circuits and boards
• Technical Committee: TC 91 - Electronics assembly technology
• Drafting Committee: WG 12 - TC 91/WG 12
• Current Stage: PPUB - Publication issued
• Start Date: 24-May-2019
• Completion Date: 02-May-2019

Standards Content (Sample)

IEC 61188-6-4 ®
Edition 1.0 2019-05
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Printed boards and printed board assemblies – Design and use –
Part 6-4: Land pattern design – Generic requirements for dimensional drawings
of surface mounted components (SMD) from the viewpoint of land pattern
design
Cartes imprimées et cartes imprimées équipées – Conception et utilisation –
Partie 6-4: Conception de la zone de report – Exigences génériques pour les
dessins dimensionnels de composants montés en surface (CMS) du point
de vue de la conception de la zone de report

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IEC 61188-6-4 ®
Edition 1.0 2019-05
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Printed boards and printed board assemblies – Design and use –

Part 6-4: Land pattern design – Generic requirements for dimensional drawings

of surface mounted components (SMD) from the viewpoint of land pattern

design
Cartes imprimées et cartes imprimées équipées – Conception et utilisation –

Partie 6-4: Conception de la zone de report – Exigences génériques pour les

dessins dimensionnels de composants montés en surface (CMS) du point

de vue de la conception de la zone de report

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180 ISBN 978-2-8322-6866-7

– 2 – IEC 61188-6-4:2019 © IEC 2019
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms, definitions and symbols. 6
4 Applicable SMDs . 8
5 Requirements . 9
5.1 Figures and dimensional symbols . 9
5.2 Common requirements . 9
5.2.1 General . 9
5.2.2 Requirements for solder joint fillet design . 9
5.2.3 Requirements for courtyard design . 10
5.2.4 Height parameters . 10
5.2.5 Bottom view . 12
5.2.6 Detail view . 12
5.2.7 Distinguish between metal and resin . 12
5.2.8 Consistency of various dimensions . 12
5.2.9 The relation between a land pattern and an element-placement position . 13
5.2.10 Coplanarity . 14
5.3 Requirements for a specific SMD . 14
5.3.1 General . 14
5.3.2 End-terminal type . 14
5.3.3 Gull-wing terminals type, inward L-shaped ribbon terminals type and
under-body L type . 18
5.3.4 Bottom surface terminal type and flat lug terminals type . 30
6 Supplementary dimensions . 39
Bibliography . 40

Figure 1 – Example of the dimensional relationship to the drawings of SMDs, the land
pattern design and the after soldering state . 12
Figure 2 – Example of dimensional consistency for an asymmetrical SMD . 13
Figure 3 – Example of the direction of recommendation for land pattern position of an
asymmetrical SMD . 14
Figure 4 – Influence of good and bad (after soldering) coplanarity . 14
Figure 5 – Example of the dimensional relationship between the drawings of
components with rectangular terminals and the land pattern design . 16
Figure 6 – Example of the dimensional notations for a component with rectangular
terminals . 17
Figure 7 – Example of the dimensional notations for cylindrical components with end
cap terminals . 18
Figure 8 – Example of the dimensional relationship between the drawings of gull-wing
terminals type and the land pattern design . 19
Figure 9 – Example of the dimensional notations for gull-wing terminals type (QFP) . 20
Figure 10 – Details of terminal (case 1) . 21
Figure 11 – Details of terminal (case 2) . 22
Figure 12 – Details of terminal (case 3) . 22

Figure 13 – Details of terminal (case 4) . 23
Figure 14 – Details of terminal (case 5) . 23
Figure 15 – Example of the dimensional relationship between the drawings of inward
L-shaped ribbon terminals type and the land pattern design . 24
Figure 16 – Example of the dimensional notations for inward L-shaped ribbon terminals

type . 25
Figure 17 – Example of the dimensional notations for under-body L type . 26
Figure 18 – Terminal shape expansion drawing of under-body L type (capacitor) . 27
Figure 19 – Example of the dimensional notations for a connector . 28
Figure 20 – The cross-sectional a-a detail (terminal shape) of Figure 18, side view . 29
Figure 21 – Example of the drawing showing the moving range (lock lever open state) . 29
Figure 22 – Example of the upper surface cap constitution . 29
Figure 23 – Example of the dimensional relationship between the drawings of a BGA
and the land pattern design. 31
Figure 24 – Example of the dimensional notations for BGA . 32
Figure 25 – Example of details of solder balls (side view) . 33
Figure 26 – Example of the dimensional relationship between the drawings of QFN and
the land pattern design . 34
Figure 27 – Example of the dimensional notations for bottom surface terminals . 36
Figure 28 – Example of the dimensional relationship between the drawings of flat lug
terminals type and the land pattern design . 38
Figure 29 – Example of the dimensional notations for flat lug terminals type . 39
Figure 30 – Example of the recommended dimensions in the tray . 39

Table 1 – Reference symbols used in this document . 7

– 4 – IEC 61188-6-4:2019 © IEC 2019
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES –
DESIGN AND USE –
Part 6-4: Land pattern design – Generic requirements for dimensional
drawings of surface mounted components (SMD) from the viewpoint of
land pattern design
FOREWORD
1) Th
...