IEC 62047-6:2009

Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials

IEC 62047-6:2009 specifies the method for axial tensile-tensile force fatigue testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 µm and 10 µm under constant force range or constant displacement range. Thin films are used as main structural materials for MEMS and micromachines. The main structural materials for MEMS, micromachines, etc., have special features, such as typical dimensions of a few microns, material fabrication by deposition, andtest piece fabrication by means of non-mechanical machining, including photolithography. This International Standard specifies the axial force fatigue testing methods for micro-sized smooth specimens, which enables a guarantee of accuracy corresponding to the special features. The tests are carried out at room temperatures, in air, with loading applied to the test piece along the longitudinal axis.

Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 6: Méthodes d'essais de fatigue axiale des matériaux en couche mince

La CEI 62047-6:2009 spécifie la méthode relative à l'essai de fatigue pour une force axiale de traction-traction des matériaux en couche mince de longueur et largeur inférieures à 1 mm et d'une épaisseur comprise entre 0,1 µm et 10 µm dans le cadre d'une gamme de force constante ou d'une gamme de déplacement constant. Les couches minces sont utilisées comme matériaux de construction principaux pour les systèmes micro-électromécaniques (MEMS, Micro-Electromechanical Systems) et les micromachines. Les matériaux de construction principaux pour les MEMS, les micromachines, etc. comportent des caractéristiques spéciales telles que des dimensions typiques de l'ordre de quelques microns, une fabrication de matériau par dépôt, et une fabrication d'éprouvettes d'essai au moyen d'un usinage non mécanique, qui peut être la photolithographie. La présente Norme internationale spécifie les méthodes d'essais de fatigue pour force axiale pour des éprouvettes lisses microminiaturisées, qui garantissent une précision correspondant aux caractéristiques spéciales. Les essais sont effectués à températures ambiantes, à l'air, en appliquant la charge à l'éprouvette le long de l'axe longitudinal.

General Information

• Status: Published
• Publication Date: 06-Apr-2009
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 31.080.99 - Other semiconductor devices
• Technical Committee: SC 47F - Micro-electromechanical systems
• Drafting Committee: WG 1 - TC 47/SC 47F/WG 1
• Current Stage: PPUB - Publication issued
• Start Date: 30-Apr-2009
• Completion Date: 07-Apr-2009

Standards Content (Sample)

IEC 62047-6 ®
Edition 1.0 2009-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices – Micro-electromechanical devices –
Part 6: Axial fatigue testing methods of thin film materials

Dispositifs à semiconducteurs – Dispositifs microélectromécaniques –
Partie 6: Méthodes d’essais de fatigue axiale des matériaux en couche mince

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IEC 62047-6 ®
Edition 1.0 2009-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices – Micro-electromechanical devices –
Part 6: Axial fatigue testing methods of thin film materials

Dispositifs à semiconducteurs – Dispositifs microélectromécaniques –
Partie 6: Méthodes d’essais de fatigue axiale des matériaux en couche mince

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
P
CODE PRIX
ICS 31.080.99 ISBN 978-2-88910-611-0
– 2 – 62047-6 © IEC:2009
CONTENTS
FOREWORD.3
1 Scope.5
2 Normative references .5
3 Terms and definitions .5
4 Test piece .7
4.1 Design of test piece.7
4.2 Preparation of test piece .7
4.3 Test piece thickness.7
4.4 Storage prior to testing.7
5 Testing method and test apparatus.7
5.1 General .7
5.2 Method of gripping (mounting of test piece).8
5.3 Static loading test.8
5.4 Method of loading.8
5.5 Speed of testing .8
5.6 Environment control .8
6 Endurances (test termination).9
7 Test report.9
Annex A (informative) Technical background of this standard .10
Annex B (informative) Test piece .11
Annex C (informative) Displacement measurement .12
Annex D (informative) Testing environment.13
Annex E (informative) Number of test pieces .14
Bibliography.15

62047-6 © IEC:2009 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –

Part 6: Axial fatigue testing methods of thin film materials

FOREWORD
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International Standard IEC 62047-6 has been prepared by subcommittee 47F: Micro-
electromechanical systems, of IEC technical committee 47: Semiconductor devices.
The text of this standard is based on the following documents:
FDIS Report on voting
47F/15/FDIS 47F/17/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all the parts in the IEC 62047 series, under the general title Semiconductor devices –
Micro-electromechanical devices, can be found on the IEC website.

– 4 – 62047-6 © IEC:2009
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in
the data related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
62047-6 © IEC:2009 – 5 –
SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –

Part 6: Axial fatigue testing methods of thin film materials

1 Scope
This International Standard specifies the method for axial tensile–tensile force fatigue testing
of thin film materials with a length and width under 1 mm and a thickness in the range
between 0,1 μm and 10 μm under constant force range or constant displacement range. Thin
films are used as main structural materials for MEMS and micromachines.
The main structural materials for MEMS, micromachines, etc., have special features, such as
typical dimensions of a few microns, material fabrication by deposition, and test piece
fabrication by means of non-mechanical machining, including photolithography. This
International Standard specifies the axial force fatigue testing methods for micro-sized smooth
specimens, which enables a guarantee of accuracy corresponding to the special features. The
tests are carried out at room temperatures, in air, with loading applied to the test piece along
the longitudinal axis.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 62047-2:2006, Semiconductor devices – Micro-electromechanical devices – Part 2:
Tensile testing method of thin film materials
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
3.1
maximum force
P
max
highest algebraic value of applied force in a cycle
NOTE Adapted from ASTM E 1823-05a [1] .
3.2
minimum force
P
min
lowest algeb
...