IEC 63287-1:2021

Semiconductor devices - Generic semiconductor qualification guidelines - Part 1: Guidelines for IC reliability qualification

IEC 63287-1:2021 gives guidelines for reliability qualification plans of semiconductor integrated circuit products. This document is not intended for military- and space-related applications.
NOTE 1 The manufacturer can use flexible sample sizes to reduce cost and maintain reasonable reliability by this guideline adaptation based on EDR-4708, AEC Q100, JESD47 or other relevant document can also be applicable if it is specified.
NOTE 2 The Weibull distribution method used in this document is one of several methods to calculate the appropriate sample size and test conditions of a given reliability project.
This first edition of IEC 63287-1 cancels and replaces the first edition of IEC 60749-43 published in 2017. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous edition:
the document has been renamed and renumbered to distinguish it from the IEC 60749 (all parts);
a new section concerning the concept of "family" has been added with appropriate renumbering of the existing text.

Dispositifs à semiconducteurs - Lignes directrices génériques concernant la qualification des semiconducteurs - Partie 1: Lignes directrices concernant la qualification de la fiabilité des circuits intégrés

L’IEC 63287-1:2021 fournit des lignes directrices concernant les plans de qualification de la fiabilité des produits de CI à semiconducteurs. Le présent document n’est pas destiné aux applications militaires et spatiales.
NOTE 1 Le fabricant peut utiliser des tailles d’échantillons flexibles afin de réduire les coûts tout en maintenant une fiabilité raisonnable par l’adaptation des présentes lignes directrices fondées sur l’EDR-4708. S’ils sont spécifiés, les documents AEC Q100, JESD47 ou tout autre document pertinent spécifié peuvent également être applicables.
NOTE 2 La méthode de la loi de Weibull utilisée dans le présent document n’est qu’une méthode parmi d’autres permettant de calculer la taille d’échantillon et les conditions d’essai appropriées pour un projet de fiabilité donné.
Cette première édition de l’IEC 63287-1 annule et remplace la première édition de l’IEC 60749‑43 parue en 2017. Cette édition constitue une révision technique.
Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:
le document a été renommé et renuméroté afin de le différencier de l’IEC 60749 (toutes les parties);
une nouvelle section portant sur le concept de famille a été ajoutée avec une renumérotation appropriée du texte existant.

General Information

• Status: Published
• Publication Date: 24-Aug-2021
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: TC 47 - Semiconductor devices
• Drafting Committee: WG 2 - TC 47/WG 2
• Current Stage: PPUB - Publication issued
• Start Date: 24-Sep-2021
• Completion Date: 25-Aug-2021

Relations

• Replaces: IEC 60749-43:2017 - Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans
• Effective Date: 05-Sep-2023

Standards Content (Sample)

IEC 63287-1
®

Edition 1.0 2021-08
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
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Semiconductor devices – Generic semiconductor qualification guidelines –
Part 1: Guidelines for IC reliability qualification

Dispositifs à semiconducteurs – Lignes directrices génériques concernant la
qualification des semiconducteurs –
Partie 1: Lignes directrices concernant la qualification de la fiabilité des circuits
intégrés

IEC 63287-1:2021-08(en-fr)

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IEC 63287-1

®


Edition 1.0 2021-08




INTERNATIONAL



STANDARD




NORME


INTERNATIONALE
colour

inside










Semiconductor devices – Generic semiconductor qualification guidelines –

Part 1: Guidelines for IC reliability qualification



Dispositifs à semiconducteurs – Lignes directrices génériques concernant la

qualification des semiconducteurs –

Partie 1: Lignes directrices concernant la qualification de la fiabilité des circuits


intégrés













INTERNATIONAL

ELECTROTECHNICAL

COMMISSION


COMMISSION

ELECTROTECHNIQUE


INTERNATIONALE




ICS 31.080.01 ISBN 978-2-8322-1017-2




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® Registered trademark of the International Electrotechnical Commission
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– 2 – IEC 63287-1:2021 © IEC 2021
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normative references . 7
3 Terms and definitions . 8
4 Product categories and applications . 8
5 Failure . 9
5.1 Failure distribution . 9
5.2 Early failure . 10
5.2.1 Description . 10
5.2.2 Early failure rate . 11
5.2.3 Screening . 15
5.3 Random failure . 17
5.3.1 Description . 17
5.3.2 Mean failure rate . 18
5.4 Wear-out failure . 21
5.4.1 Description . 21
5.4.2 Wear-out failure rate . 21
6 Reliability test . 24
6.1 Reliability test description . 24
6.2 Reliability test plan . 24
6.2.1 Procedures for creating a reliability test plan . 24
6.2.2 Estimation of the test time required to confirm the TDDB from the
number of test samples . 27
6.2.3 Estimation of the number of samples required to confirm the TDDB from
the test time. 28
6.3 Reliability test methods . 29
6.4 Acceleration models for reliability tests . 33
6.4.1 Arrhenius model . 33
6.4.2 V-model . 33
6.4.3 Absolute water vapor pressure model . 33
6.4.4 Coffin-Manson model . 33
6.5 Concept of family . 34
6.5.1 General . 34
6.5.2 Conducting life test using family . 34
6.5.3 Verification of early failure rate using family . 37
7 Stress test methods . 39
8 Supplementary tests . 40
9 Summary table of assumptions . 40
10 Summary . 42
Bibliography . 43

Figure 1 – Bathtub curve . 10
Figure 2 – Failure process of IC manufacturing lots during the early failure period . 11
Figure 3 – Weibull conceptual diagram of the early failure rate . 12

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IEC 63287-1:2021 © IEC 2021 – 3 –
Figure 4 – Example of a failure ratio: α (in hundreds) and the number of failures for CL
of 60 % . 14
Figure 5 – Screening and estimated early fail rate in Weibull diagram . 16
Figure 6 – Bathtub curve setting the point immediately after production as the origin . 17
Figure 7 – Bathtub curve setting the point after screening as the origin. 17
Figure 8 – Conceptual diagram of calculation method for the mean failure rate from the
exponential distribution . 18
Figure 9 – Conceptual diagram of calculation method for the mean failure rate as an
extension of early failure . 19
Figure 10 – Conceptual diagram of the wear-out failure . 21
Figure 11 – Conceptual diagram describing the concept of the acceleration test . 22
Figure 12 – Concept of the reliability test in a Weibull diagram (based on sample size) . 26
Figure 13 – Concept of the reliability test in a Weibull diagram (based on test time) . 29
Figure 14 – Difference in sampling sizes according to the m value (image) . 30
Figure 15 – How the screening defect rate is seen depending on the difference of chip
size (example) . 37

Table 1 – Examples of product categories . 9
–6
Table 2 – Cumulative failure probability 0,1 % over 10 years [×10 ] for the third, fifth
and seventh years . 26
Table 3 – Major reliability (life) test methods and purposes . 31
Table 4 – Examples of the number of test samples and the test time in typical reliability
(life) test methods . 32
Table 5 – Concept of family (example) . 34
Table 6 – Concept of difference/failure mechanism/corresponding test item (examples). 36
Table 7 – Factors for calculation examples of early failure rate using family data . 38
Table 8 – LTPD sampling table for acceptance number Ac = 0 . 39
Table 9 – Major reliability (strength) test methods and purposes . 39
Table 10 – Supplementary tests . 40
a
Table 11 – Accelerating factors, calculation formulae and numerical values . 41

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INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

SEMICONDUCTOR DEVICES –
GENERIC SEMICONDUCTOR QUALIFICATION GUIDELINES –

Part 1: Guidelines for IC reliability qualification

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
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2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 63287-1 has been prepared by IEC technical committee 47:
Semiconductor devices.
This first edition of IEC 63287-1 cancels and replaces the first edition of IEC 60749-43
published in 2017. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) the document has been renamed and renumbered to distinguish it from the IEC 60749
(all parts);
b) a new section concerning the concept of "family" has been added with appropriate
renumbering of the existing text.

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IEC 63287-1:2021 © IEC 2021 – 5 –
The text of this International Standard is based on the following documents:
DRAFT Report on voting
47/2703/FDIS 47/2720/RVD

Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement,
available at www.iec.ch/members_experts/refdocs. The main document types developed by
IEC are described in greater detail at www.iec.ch/standardsdev/publications.
A list of all parts in the IEC 63287 series, published under the general title Semiconductor,
devices – Generic semiconductor qualification guidelines, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates that it
contains colours which are considered to be useful for the correct understanding of its
contents. Users should therefore print this document using a colour printer.

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– 6 – IEC 63287-1:2021 © IEC 2021
INTRODUCTION
This document provides guidelines for semiconductor IC vendors in the preparation of
detailed reliability test plans for device qualification. Such plans are intended to be prepared
before commencing qualification tests and after consultation with the user of their
semiconductor integrated circuit product.
The guideline gives some examples for creating reliability qualification test plans to determine
appropriate reliability test conditions based on the use conditions and requirements for each
application of semiconductor integrated circuits. Categories are set for automotive
applications and for general applications as a target of reliability. The grade for automotive
use is further classified into two grades according to applications. The guideline assumes
annual operating hours, useful life, etc. for each grade, and defines the verification methods
for early failure rate and wear-out failure to propose appropriate reliability tests, and at the
same time, presents concepts to properly ensure the quality of semiconductor integrated
circuits using screening techniques which are designed to reduce the early failure rate.
The test conditions and the values of acceleration factors presented in this guideline are
shown to provide examples of calculations for obtaining reliability test conditions in order to
verify the required quality standards and are not designed to define the standards to ensure
reliability of semiconductor integrated circuits.
NOTE Qualification tests are tests in which the semiconductor vendor takes account of the reliability required by
its product users.

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IEC 63287-1:2021 © IEC 2021 – 7 –
SEMICONDUCTOR DEVICES –
GENERIC SEMICONDUCTOR QUALIFICATION GUIDELINES –

Part 1: Guidelines for IC reliability qualification



1 Scope
This part of IEC 63287 gives guidelines for reliability qualification plans of semiconductor
integrated circuit products. This document is not intended for military- and space-related
applications.
NOTE 1 The manufacturer can use flexible sample sizes to reduce cost and maintain reasonable reliability by this
guideline adaptation based on EDR-4708, AEC Q100, JESD47 or other relevant document can also be applicable if
it is specified.
NOTE 2 The Weibull distribution method used in this document is one of several methods to calculate the
appropriate sample size and test conditions of a given reliability project.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.
IEC 60749-5, Semiconductor devices – Mechanical and climatic test methods – Part 5:
Steady-state temperature humidity bias life test
IEC 60749-6, Semiconductor devices – Mechanical and climatic test methods – Part 6:
Storage at high temperature
IEC 60749-15, Semiconductor devices – Mechanical and climatic test methods – Part 15:
Resistance to soldering temperature for through-hole mounted devices
IEC 60749-20, Semiconductor devices – Mechanical and climatic test methods – Part 20:
Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering
heat
IEC 60749-21, Semiconductor devices – Mechanical and climatic test methods – Part 21:
Solderability
IEC 60749-23, Semiconductor devices – Mechanical and climatic test methods – Part 23: High
temperature operating life
IEC 60749-25, Semiconductor devices – Mechanical and climatic test methods – Part 25:
Temperature cycling
IEC 60749-26, Semiconductor devices – Mechanical and climatic test methods – Part 26:
Electrostatic discharge (ESD) sensitivity testing – Human body model (HBM)
IEC 60749-28, Semiconductor devices – Mechanical and climatic test methods – Part 28:
Electrostatic discharge (ESD) sensitivity testing – Charged device model (CDM) – Device
level

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– 8 – IEC 63287-1:2021 © IEC 2021
IEC 60749-29, Semiconductor devices – Mechanical and climatic test methods – Part 29:
Latch-up test
IEC 60749-42, Semiconductor devices – Mechanical and climatic test methods – Part 42:
Temperature and humidity storage
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1
failure mode
classification of a fault phenomenon which causes product failure
Note 1 to entry: Disconnection, a short circuit, occasional loss, abrasion, characteristic deterioration, etc. are
typical items considered as failure modes.
3.2
failure mechanism
physical, chemical or other process that results in a product failure to meet functional
requirements (or failure modes)
3.3
integrated circuit
IC
microcircuit in which all or some of the circuit elements are inseparably associated and
electrically interconnected so that it is considered to be indivisible for the purpose of
construction and commerce
Note 1 to entry: IEV:521-10-03
4 Product categories and applications
Quality-related requirements, operating hours, and field operating condition of ICs depend on
the applications of products in which they are used. As an example of creating scientific test
plans, their applications are broadly classified into three product categories: Automotive Use
A; Automotive Use B; and Consumer Use. Table 1 shows a list of quality-related requirements
according to each product category and the definition of their use conditions.

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IEC 63287-1:2021 © IEC 2021 – 9 –
Table 1 – Examples of product categories
Category Automotive Use A Automotive Use B Consumer Use
Criteria for Applications for automotive Applications for automotive Home or office electronics,
category use directly relating to safety. use not directly relating to toys, appliances and server
(Failures can cause
safety. applications.
accidents.)
Examples of Powertrains, brakes, driving Navigation systems, car air- Home electronics, toys,
applications support systems, airbags conditioners, audio systems appliances
Annual 500 h 500 h Up to 8 760 h
operating hours
Differs depending on whether Differs among applications.
or not to work with KEY
ON/OFF.
Useful life 15 years (cumulative failure 15 years (cumulative failure Up to 10 years (cumulative
probability: 0,1 %) probability: 0,1 %) failure probability: 0,1 %)
Differs among applications.
Assumed Example of engine compartment
operating
T = −40 °C/ T = 125 °C T = 0 °C / T = 70 °C
conditions a,min a,max a,min a,max
T = 100 °C/ T = 150 °C T = 70 °C/105 °C (max.)
(examples of j,typ j,max j
conditions which

RH = 10 (min.)/80 % (max.)
min. RH: 0 / max. RH: 100 %,
differ among
RH (during 20 % power on)
applications) RH (during 10 % driving) (during 70 % stop)
(during 60 % power off)
Example of interior environment
T = -40 °C (min.)/85 °C (max.)
a
T = 85 °C (typ.)/125 °C (max.)
j
RH = 0 (min.)/100 % (max.),
RH (during 10 % driving) (during 70 % stop)
−6 −6 −6
Early failure rate 1 × 10 or below per annum 50 × 10 or below per Up to 500 × 10 per annum
annum
Differs among applications.
Random failure 10 FIT or below 50 FIT or below >50 FIT (typical)
rate
Differs among applications.
NOTE These are examples of application conditions and requirements that do not have to all be met to be
relevant for each use case.

5 Failure
5.1 Failure distribution
Failure distribution of ICs can be broadly divided into three regions: early failure portion
(e.g., t = 1 year), random failure portion, and wear-out failure portion. Figure 1 shows the
ELF
relationship between the field use time and the instantaneous failure rate (bathtub curve).
Failure distributions for each region are described in detail in 5.2 to 5.4.
Most early failures are screened within manufacturing processes of IC vendors. However, ICs
not fully screened can expose problems in a relatively short period after their operation starts
in the field.

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Random failure has been considered to achieve a certain failure rate with respect to time, but
actually, it is appropriate to consider as an extension of the early failure region where the
failure rate continues to decline. Potentially induced failures outside of the supplier’s control,
such as ESD, EOS and soft errors, should not be included in the failure rate calculations
unless a total fail rate that includes these types of fail modes is intended.
Wear-out failure is a failure which occurs due to the end of life of IC components such as
transistors and interconnections, and indicates the life of the ICs themselves. Wear-out failure
is a failure which depends on the
...