IEC 60286-3:2019
(Main)Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
IEC 60286-3:2019 is available as IEC 60286-3:2019 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 60286-3:2019 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips). This edition includes the following significant technical changes with respect to the previous edition:
- addition of a table of the classification to symbols concerning tape, reel and common symbols;
- additions of a figure of example of polarity and orientation and a figure of example of dot seal;
- revision of requirements for camber;
- addition of a definition of design value with regard to tilt.
Emballage de composants pour opérations automatisées - Partie 3: Emballage des composants pour montage en surface en bandes continues
IEC 60286-3:2019 est disponible sous forme de IEC 60286-3:2019 RLV qui contient la Norme internationale et sa version Redline, illustrant les modifications du contenu technique depuis l'édition précédente.
L'IEC 60286-3:2019 est applicable à la mise en bande des composants électroniques sans fils de sortie ou avec tronçons de sortie destinés à être connectés à des circuits électroniques. Elle fournit uniquement les dimensions essentielles pour la mise en bande des composants destinés aux opérations susmentionnées. Le présent document inclut également des exigences relatives à l'emballage de produits à puce isolée incluant puces nues et puces à contact (puces retournées). Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:
- ajout d'un tableau de classification des symboles concernant les bandes, les bobines et les symboles courants;
- ajout d'une figure représentant un exemple de polarité et d'orientation et d'une figure représentant un exemple de collage ponctuel;
- révision des exigences de cambrage;
- ajout d'une définition de la valeur de conception concernant l'inclinaison.
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IEC 60286-3 ®
Edition 6.0 2019-01
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
Packaging of components for automatic handling –
Part 3: Packaging of surface mount components on continuous tapes
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
your local IEC member National Committee for further information.
IEC Central Office Tel.: +41 22 919 02 11
3, rue de Varembé info@iec.ch
CH-1211 Geneva 20 www.iec.ch
Switzerland
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.
About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigendum or an amendment might have been published.
IEC publications search - webstore.iec.ch/advsearchform Electropedia - www.electropedia.org
The advanced search enables to find IEC publications by a The world's leading online dictionary on electrotechnology,
variety of criteria (reference number, text, technical containing more than 22 000 terminological entries in English
committee,…). It also gives information on projects, replaced and French, with equivalent terms in 16 additional languages.
and withdrawn publications. Also known as the International Electrotechnical Vocabulary
(IEV) online.
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once a month by email. French extracted from the Terms and Definitions clause of
IEC publications issued since 2002. Some entries have been
IEC Customer Service Centre - webstore.iec.ch/csc collected from earlier publications of IEC TC 37, 77, 86 and
If you wish to give us your feedback on this publication or CISPR.
need further assistance, please contact the Customer Service
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IEC 60286-3 ®
Edition 6.0 2019-01
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
Packaging of components for automatic handling –
Part 3: Packaging of surface mount components on continuous tapes
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.020; 31.240 ISBN 978-2-8322-6449-2
– 2 – IEC 60286-3:2019 RLV © IEC 2019
CONTENTS
FOREWORD . 5
INTRODUCTION . 7
1 Scope . 8
2 Normative references . 8
3 Terms, definitions and symbols. 8
3.1 Terms and definitions . 8
3.2 Symbols . 10
4 Structure of the specification . 11
5 Dimensional requirements for taping . 12
5.1 Component cavity positioning requirements . 12
5.1.1 Requirements for types 1a, 1b, 2a, 2b and 3 . 12
5.1.2 Requirements for types 4 . 12
5.2 Component cavity dimension requirements (tape types 1a, 1b, 2a, 2b and 3) . 12
5.3 Type 1a – Punched carrier tape, with top and bottom cover tape (tape widths:
8 mm and 12 mm) . 13
5.4 Type 1b – Pressed carrier tape, with top cover tape (tape width: 8 mm) . 15
5.5 Type2a – Blister carrier tape, with single round sprocket holes and tape
pitches down to 2 mm (tape widths: 8 mm, 12 mm, 16 mm and 24 mm) . 18
5.6 Type 2b – Blister carrier tape, with single round sprocket holes and with
1mm tape pitch (tape widths: 4 mm) . 20
5.7 Type 3 – Blister carrier tape, with double sprocket holes (32 mm to 200 mm). 21
5.8 Type 4 – Adhesive-backed punched plastic carrier tape for singulated bare
die and other surface mount components (8 mm, 12 mm, 16 mm and 24 mm) . 24
6 Polarity and orientation requirements of components in the tape . 26
6.1 Requirements for all tape types . 26
6.2 Specific requirements for type 1a . 27
6.3 Specific requirements for type 4 . 27
7 Carrier tape requirements . 27
7.1 Taping materials . 27
7.2 Minimum bending radius (for all types) . 27
7.3 Camber . 28
8 Cover tape requirements (for types 1a, 1b, 2a, 2b and 3) . 29
9 Component taping and additional tape requirements. 30
9.1 All types . 30
9.2 Specific requirements for type 1b . 31
9.3 Specific tape requirements for type 2b . 31
9.4 Specific requirement for type 4 . 31
9.4.1 General . 31
9.4.2 Coordinate system . 31
9.4.3 Component positioning and lateral displacement . 33
9.5 Specific requirements for tapes containing die products . 33
9.5.1 General . 33
9.5.2 Tape design for tapes containing die products . 33
9.5.3 Cleanliness . 34
9.5.4 Die lateral movement (types 1a, 2a and 2b) . 34
10 Reel requirements . 34
10.1 Dimensions . 34
10.1.1 General . 34
10.1.2 Reel dimensions . 34
10.1.3 Reel hole dimensions . 36
10.2 Marking . 36
11 Tape reeling requirements . 37
11.1 All types . 37
11.2 Specific requirements for type 1a . 37
11.3 Specific requirements for type 4 . 37
11.4 Leader and trailer tape . 37
11.4.1 General . 37
11.4.2 Leader . 38
11.4.3 Trailer . 38
11.5 Recycling . 38
11.6 Missing components . 38
Annex A (normative) Recommended measuring methods for type 1b . 39
A.1 Measurement method for carrier tape thickness (T and T ) . 39
A.2 Measurement method for cavity (A and B ) . 39
0 0
A.3 Measurement method for cavity depth (dimension K ) . 40
Bibliography . 41
Figure – Camber (top view) .
Figure 1 – Sectional view of component cavity (type 1b) . 10
Figure 2 – 8 mm and 12 mm punched carrier-tape dimensions (4 mm cavity pitch) . 13
Figure 3 – Illustration of 2 mm and 1 mm cavity pitch and maximum pocket offset . 13
Figure 4 – Maximum component tilt, rotation and lateral movement . 14
Figure 5 – Dimensions (P = 4 mm/P = 2 mm) and (P = 4 mm/P = 1 mm) . 16
0 1 0 1
Figure 6 – Illustration of 2 mm and 1 mm cavity pitch and maximum pocket offset . 16
Figure 7 – Maximum component tilt, rotation and lateral movement . 16
Figure 8 – Blister carrier tape dimensions (8 mm, 12 mm, 16 mm and 24 mm) . 18
Figure 9 – Illustration of 2 mm cavity pitch and pocket offset . 18
Figure 10 – Maximum component tilt, rotation and lateral movement . 18
Figure 11 – Type 2b carrier tape . 20
Figure 12 – Maximum pocket offset . 20
Figure 13 – Maximum component tilt, rotation and lateral movement . 20
Figure 14 – Blister carrier tape . 22
Figure 15 – Elongated sprocket hole skew . 22
Figure 16 – Maximum component tilt, rotation and lateral movement . 22
Figure 17 – Adhesive-backed punched carrier-tape dimensions (4 mm compartment
pitch) . 24
Figure 18 – Illustration of 2 mm compartment pitch . 24
Figure 19 – Maximum component planar rotation and lateral displacement . 25
Figure 20 – Example of polarity and orientation . 27
Figure 21 – Bending radius . 28
Figure 22 – Measuring method and camber . 29
– 4 – IEC 60286-3:2019 RLV © IEC 2019
Figure 23 – Dot seals for thin components (as exceptions) . 30
Figure 24 – Type 4 coordinate system . 32
Figure 25 – Component clearance and positioning method . 33
Figure 26 – Reel . 35
Figure 27 – Reel hole presentation . 36
Figure 28 – Tape reeling and label area on the reel . 37
Figure 29 – Leader and trailer .
...
IEC 60286-3 ®
Edition 6.0 2019-01
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Packaging of components for automatic handling –
Part 3: Packaging of surface mount components on continuous tapes
Emballage de composants pour opérations automatisées –
Partie 3: Emballage des composants pour montage en surface en bandes
continues
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
your local IEC member National Committee for further information.
Droits de reproduction réservés. Sauf indication contraire, aucune partie de cette publication ne peut être reproduite
ni utilisée sous quelque forme que ce soit et par aucun procédé, électronique ou mécanique, y compris la photocopie
et les microfilms, sans l'accord écrit de l'IEC ou du Comité national de l'IEC du pays du demandeur. Si vous avez des
questions sur le copyright de l'IEC ou si vous désirez obtenir des droits supplémentaires sur cette publication, utilisez
les coordonnées ci-après ou contactez le Comité national de l'IEC de votre pays de résidence.
IEC Central Office Tel.: +41 22 919 02 11
3, rue de Varembé info@iec.ch
CH-1211 Geneva 20 www.iec.ch
Switzerland
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.
About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigendum or an amendment might have been published.
IEC publications search - webstore.iec.ch/advsearchform Electropedia - www.electropedia.org
The advanced search enables to find IEC publications by a The world's leading online dictionary on electrotechnology,
variety of criteria (reference number, text, technical containing more than 22 000 terminological entries in English
committee,…). It also gives information on projects, replaced and French, with equivalent terms in 16 additional languages.
and withdrawn publications. Also known as the International Electrotechnical Vocabulary
(IEV) online.
IEC Just Published - webstore.iec.ch/justpublished
Stay up to date on all new IEC publications. Just Published IEC Glossary - std.iec.ch/glossary
details all new publications released. Available online and 67 000 electrotechnical terminology entries in English and
once a month by email. French extracted from the Terms and Definitions clause of
IEC publications issued since 2002. Some entries have been
IEC Customer Service Centre - webstore.iec.ch/csc collected from earlier publications of IEC TC 37, 77, 86 and
If you wish to give us your feedback on this publication or CISPR.
need further assistance, please contact the Customer Service
Centre: sales@iec.ch.
A propos de l'IEC
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Normes internationales pour tout ce qui a trait à l'électricité, à l'électronique et aux technologies apparentées.
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IEC 60286-3 ®
Edition 6.0 2019-01
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Packaging of components for automatic handling –
Part 3: Packaging of surface mount components on continuous tapes
Emballage de composants pour opérations automatisées –
Partie 3: Emballage des composants pour montage en surface en bandes
continues
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.020; 31.240 ISBN 978-2-8322-6387-7
– 2 – IEC 60286-3:2019 © IEC 2019
CONTENTS
FOREWORD . 5
INTRODUCTION . 7
1 Scope . 8
2 Normative references . 8
3 Terms, definitions and symbols. 8
3.1 Terms and definitions . 8
3.2 Symbols . 10
4 Structure of the specification . 11
5 Dimensional requirements for taping . 12
5.1 Component cavity positioning requirements . 12
5.1.1 Requirements for types 1a, 1b, 2a, 2b and 3 . 12
5.1.2 Requirements for types 4 . 12
5.2 Component cavity dimension requirements (tape types 1a, 1b, 2a, 2b and 3) . 12
5.3 Type 1a – Punched carrier tape, with top and bottom cover tape (tape widths:
8 mm and 12 mm) . 12
5.4 Type 1b – Pressed carrier tape, with top cover tape (tape width: 8 mm) . 15
5.5 Type2a – Blister carrier tape, with single round sprocket holes and tape
pitches down to 2 mm (tape widths: 8 mm, 12 mm, 16 mm and 24 mm) . 17
5.6 Type 2b – Blister carrier tape, with single round sprocket holes and with
1mm tape pitch (tape widths: 4 mm) . 20
5.7 Type 3 – Blister carrier tape, with double sprocket holes (32 mm to 200 mm). 21
5.8 Type 4 – Adhesive-backed punched plastic carrier tape for singulated bare
die and other surface mount components (8 mm, 12 mm, 16 mm and 24 mm) . 24
6 Polarity and orientation requirements of components in the tape . 26
6.1 Requirements for all tape types . 26
6.2 Specific requirements for type 1a . 27
6.3 Specific requirements for type 4 . 27
7 Carrier tape requirements . 27
7.1 Taping materials . 27
7.2 Minimum bending radius (for all types) . 27
7.3 Camber . 28
8 Cover tape requirements (for types 1a, 1b, 2a, 2b and 3) . 29
9 Component taping and additional tape requirements. 30
9.1 All types . 30
9.2 Specific requirements for type 1b . 31
9.3 Specific tape requirements for type 2b . 31
9.4 Specific requirement for type 4 . 31
9.4.1 General . 31
9.4.2 Coordinate system . 31
9.4.3 Component positioning and lateral displacement . 33
9.5 Specific requirements for tapes containing die products . 33
9.5.1 General . 33
9.5.2 Tape design for tapes containing die products . 33
9.5.3 Cleanliness . 34
9.5.4 Die lateral movement (types 1a, 2a and 2b) . 34
10 Reel requirements . 34
10.1 Dimensions . 34
10.1.1 General . 34
10.1.2 Reel dimensions . 34
10.1.3 Reel hole dimensions . 36
10.2 Marking . 36
11 Tape reeling requirements . 37
11.1 All types . 37
11.2 Specific requirements for type 1a . 37
11.3 Specific requirements for type 4 . 37
11.4 Leader and trailer tape . 37
11.4.1 General . 37
11.4.2 Leader . 38
11.4.3 Trailer . 38
11.5 Recycling . 38
11.6 Missing components . 38
Annex A (normative) Recommended measuring methods for type 1b . 39
A.1 Measurement method for carrier tape thickness (T and T ) . 39
A.2 Measurement method for cavity (A and B ) . 39
0 0
A.3 Measurement method for cavity depth (dimension K ) . 40
Bibliography . 41
Figure 1 – Sectional view of component cavity (type 1b) . 9
Figure 2 – 8 mm and 12 mm punched carrier-tape dimensions (4 mm cavity pitch) . 13
Figure 3 – Illustration of 2 mm and 1 mm cavity pitch and maximum pocket offset . 13
Figure 4 – Maximum component tilt, rotation and lateral movement . 13
Figure 5 – Dimensions (P = 4 mm/P = 2 mm) and (P = 4 mm/P = 1 mm) . 15
0 1 0 1
Figure 6 – Illustration of 2 mm and 1 mm cavity pitch and maximum pocket offset . 16
Figure 7 – Maximum component tilt, rotation and lateral movement . 16
Figure 8 – Blister carrier tape dimensions (8 mm, 12 mm, 16 mm and 24 mm) . 18
Figure 9 – Illustration of 2 mm cavity pitch and pocket offset .
...
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