IEC 60539-1:2008
(Main)Directly heated negative temperature coefficient thermistors - Part 1: Generic specification
Directly heated negative temperature coefficient thermistors - Part 1: Generic specification
IEC 60539-1:2008 is applicable to directly heated negative temperature coefficient thermistors, typically made from transition metal oxide materials with semiconducting properties. It establishes standard terms, inspection procedures and methods of test for use in sectional and detail specifications of electronic components for quality assessment or any other purpose.
Thermistances à coefficient de température négatif à chauffage direct - Partie 1: Spécification générique
La CEI 60539-1:2008 s'applique aux thermistances à coefficient de température négatif à chauffage direct, typiquement constitués de matériaux faits d'oxyde de métal de transition dotés de propriétés semi-conductrices. Elle définit les termes normalisés, les procédures d'inspection et les méthodes d'essai utilisés dans les spécifications intermédiaires et particulières des composants électroniques dans le cadre de l'assurance qualité, ainsi qu'à d'autres fins.
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IEC 60539-1
Edition 2.0 2008-02
INTERNATIONAL
STANDARD
QC 430 000
Directly heated negative temperature coefficient thermistors –
Part 1: Generic specification
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
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IEC 60539-1
Edition 2.0 2008-02
INTERNATIONAL
STANDARD
QC 430 000
Directly heated negative temperature coefficient thermistors –
Part 1: Generic specification
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
PRICE CODE
X
ICS 31.040.30 ISBN 2-8318-9584-7
– 2 – 60539-1 © IEC:2008(E)
CONTENTS
FOREWORD.4
1 General .6
1.1 Scope.6
1.2 Normative references .6
2 Technical data.8
2.1 Units, symbols and terminology .8
2.2 Terms and definitions .8
2.3 Preferred values.16
2.4 Marking .16
3 Quality assessment procedures.17
3.1 General .17
3.2 Primary stage of manufacture.17
3.3 Structurally similar components.17
3.4 Qualification approval procedures .18
3.5 Quality conformance inspection.18
3.6 Certified test records of released lots .18
3.7 Delayed delivery.19
3.8 Release for delivery under qualification approval before the completion of
group B tests.19
3.9 Alternative test methods .19
3.10 Unchecked parameters.19
4 Test and measurement procedures.19
4.1 General .19
4.2 Standard atmospheric conditions for testing .19
4.3 Drying and recovery .20
4.4 Mounting (for surface mount thermistors only) .20
4.5 Visual examination and check of dimensions.21
4.6 Zero-power resistance.22
4.7 B-value or resistance ratio.22
4.8 Insulation resistance (for insulated types only) .23
4.9 Voltage proof (for insulated types only) .26
4.10 Resistance/temperature characteristic.26
4.11 Dissipation factor (δ) .26
4.12 Thermal time constant by ambient temperature change (τ ) .28
a
4.13 Thermal time constant by cooling after self-heating (τ ) .28
c
4.14 Robustness of terminations (not applicable to surface mount thermistors) .29
4.15 Resistance to soldering heat .30
4.16 Solderability .31
4.17 Rapid change of temperature .32
4.18 Vibration.32
4.19 Bump .33
4.20 Shock.33
4.21 Free fall (if specified in the detail specification) .33
60539-1 © IEC:2008(E) – 3 –
4.22 Thermal shock (if specified in the detail specification) .34
4.23 Cold (if required by the sectional specification) .34
4.24 Dry heat (if required by the sectional specification) .34
4.25 Damp heat, steady state.35
4.26 Endurance.35
4.27 Shear (adhesion) test .40
4.28 Substrate bending test .40
4.29 Component solvent resistance.41
4.30 Solvent resistance of marking.41
4.31 Salt mist (if required by the sectional specification) .41
4.32 Sealing (if required by the sectional specification) .41
4.33 Composite temperature/humidity cycle (if required by the sectional
specification).41
Annex A (normative) Interpretation of sampling plans and procedures as described in
IEC 60410 for use within the IEC quality assessment system for electronic
components (IECQ) .43
Annex B (normative) Rules for the preparation of detail specifications for capacitors
and resistors for electronic equipment .44
Annex C (informative) Typical examples of mountings for measurements of directly
heated thermistors .45
Figure 1 – Typical resistance-temperature characteristic for NTC thermistors .10
Figure 2 – Decreased power dissipation curve .12
Figure 3 – Maximum current derating.14
Figure 4 – Zero-power resistance measuring basic circuit .22
Figure 5 – Test method 1 .23
Figure 6 – Test method 2 .24
Figure 7 – Test method 2 .24
Figure 8 – Test method 3 .25
Figure 9 – Test method 4 .25
Figure 10 – Example of test chamber.27
Figure 11 – Dissipation factor measuring circuit.27
Figure 12 – Thermal time constant measuring circuit .29
Figure 13 – Endurance at room temperature with I evaluating circuit.36
max.25
Figure 14 – Maximum permissible capacitance test circuit (method 1) .39
Figure 15 – Maximum permissible capacitance test circuit (method 2) .39
Figure C.1 – Mounting for measurements of surface mount thermistors .45
Table 1 – Upper and lower category temperatures and duration of the damp heat test.16
Table 2 – Tensile force .30
– 4 – 60539-1 © IEC:2008(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT
THERMISTORS –
Part 1: Generic specification
FOREWORD
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...
IEC 60539-1 ®
Edition 2.0 2008-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Directly heated negative temperature coefficient thermistors –
Part 1: Generic specification
Thermistances à coefficient de température négatif à chauffage direct –
Partie 1: Spécification générique
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester.
If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication,
please contact the address below or your local IEC member National Committee for further information.
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microfilms, sans l'accord écrit de la CEI ou du Comité national de la CEI du pays du demandeur.
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publication, utilisez les coordonnées ci-après ou contactez le Comité national de la CEI de votre pays de résidence.
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Switzerland www.iec.ch
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.
About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigenda or an amendment might have been published.
Useful links:
IEC publications search - www.iec.ch/searchpub Electropedia - www.electropedia.org
The advanced search enables you to find IEC publications The world's leading online dictionary of electronic and
by a variety of criteria (reference number, text, technical electrical terms containing more than 30 000 terms and
committee,…). definitions in English and French, with equivalent terms in
It also gives information on projects, replaced and additional languages. Also known as the International
withdrawn publications. Electrotechnical Vocabulary (IEV) on-line.
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contactez-nous: csc@iec.ch.
IEC 60539-1 ®
Edition 2.0 2008-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Directly heated negative temperature coefficient thermistors –
Part 1: Generic specification
Thermistances à coefficient de température négatif à chauffage direct –
Partie 1: Spécification générique
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX X
ICS 31.040.30 ISBN 978-2-88912-902-7
– 2 – 60539-1 IEC:2008
CONTENTS
FOREWORD . 4
1 General . 6
1.1 Scope . 6
1.2 Normative references . 6
2 Technical data . 8
2.1 Units, symbols and terminology . 8
2.2 Terms and definitions . 8
2.3 Preferred values . 16
2.4 Marking . 16
3 Quality assessment procedures . 17
3.1 General . 17
3.2 Primary stage of manufacture . 17
3.3 Structurally similar components . 17
3.4 Qualification approval procedures . 18
3.5 Quality conformance inspection . 18
3.6 Certified test records of released lots . 18
3.7 Delayed delivery . 19
3.8 Release for delivery under qualification approval before the completion of
group B tests . 19
3.9 Alternative test methods . 19
3.10 Unchecked parameters . 19
4 Test and measurement procedures . 19
4.1 General . 19
4.2 Standard atmospheric conditions for testing . 19
4.3 Drying and recovery . 20
4.4 Mounting (for surface mount thermistors only) . 20
4.5 Visual examination and check of dimensions . 21
4.6 Zero-power resistance . 22
4.7 B-value or resistance ratio . 22
4.8 Insulation resistance (for insulated types only) . 23
4.9 Voltage proof (for insulated types only) . 26
4.10 Resistance/temperature characteristic . 26
4.11 Dissipation factor (δ) . 26
4.12 Thermal time constant by ambient temperature change (τ ) . 28
a
4.13 Thermal time constant by cooling after self-heating (τ ) . 28
c
4.14 Robustness of terminations (not applicable to surface mount thermistors) . 29
4.15 Resistance to soldering heat . 30
4.16 Solderability . 31
4.17 Rapid change of temperature . 32
4.18 Vibration. 32
4.19 Bump . 33
4.20 Shock . 33
4.21 Free fall (if specified in the detail specification) . 33
4.22 Thermal shock (if specified in the detail specification) . 34
4.23 Cold (if required by the sectional specification) . 34
60539-1 IEC:2008 – 3 –
4.24 Dry heat (if required by the sectional specification) . 34
4.25 Damp heat, steady state . 35
4.26 Endurance . 35
4.27 Shear (adhesion) test . 40
4.28 Substrate bending test . 40
4.29 Component solvent resistance . 41
4.30 Solvent resistance of marking . 41
4.31 Salt mist (if required by the sectional specification) . 41
4.32 Sealing (if required by the sectional specification) . 41
4.33 Composite temperature/humidity cycle (if required by the sectional
specification) . 41
Annex A (normative) Interpretation of sampling plans and procedures as described in
IEC 60410 for use within the IEC quality assessment system for electronic
components (IECQ) . 43
Annex B (normative) Rules for the preparation of detail specifications for capacitors
and resistors for electronic equipment . 44
Annex C (informative) Typical examples of mountings for measurements of directly
heated thermistors . 45
Figure 1 – Typical resistance-temperature characteristic for NTC thermistors . 10
Figure 2 – Decreased power dissipation curve . 12
Figure 3 – Maximum current derating . 14
Figure 4 – Zero-power resistance measuring basic circuit . 22
Figure 5 – Test method 1 . 23
Figure 6 – Test method 2 . 24
Figure 7 – Test method 2 . 24
Figure 8 – Test method 3 . 25
Figure 9 – Test method 4 . 25
Figure 10 – Example of test chamber . 27
Figure 11 – Dissipation factor measuring circuit . 27
Figure 12 – Thermal time constant measuring circuit . 29
Figure 13 – Endurance at room temperature with I evaluating circuit . 36
max25
Figure 14 – Maximum permissible capacitance test circuit (method 1) . 39
Figure 15 – Maximum permissible capacitance test circuit (method 2) .
...
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