IEC 60297-3-109:2015
(Main)Mechanical structures for electrical and electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-109: Dimensions of chassis for embedded computing devices
Mechanical structures for electrical and electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-109: Dimensions of chassis for embedded computing devices
IEC 60297-3-109:2015 specifies dimensions and physical properties of chassis and associated printed boards in order to provide mechanical and environmental integrity for embedded computing devices. They are used in various applications such as machine control, medical, transportation, aerospace and telecommunication, typically based on single board computers. For the easy definition of the suitable chassis and associated single board dimensions, this standard is based on a structural grid of 44,45 mm (1,75 in). Key words: Dimensions, Mechanical Structures, Chassis, Embedded Computing Devices
Structures mécaniques pour équipements électriques et électroniques - Dimensions des structures mécaniques de la série 482,6 mm (19 pouces) - Partie 3-109: Dimensions des châssis pour dispositifs informatiques intégrés
L'IEC 60297-3-109:2015 spécifie les dimensions et les propriétés physiques des châssis et des cartes imprimées associées, afin de garantir l'intégrité mécanique et environnementale des dispositifs informatiques intégrés. Ces derniers sont utilisés dans de nombreuses applications, notamment pour commander des machines dans les environnements de la santé, des transports, de l'aérospatial et des communications. Il s'agit généralement d'ordinateurs monocartes. Pour faciliter la définition des dimensions adaptées des châssis et cartes imprimées associées, la présente norme se base sur une grille structurelle de 44,45 mm (1,75 pouce). Mots-clés: Dimensions, Structures mécaniques, Châssis, Dispositifs informatiques intégrés
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IEC 60297-3-109 ®
Edition 1.0 2015-11
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Mechanical structures for electrical and electronic equipment – Dimensions of
mechanical structures of the 482,6 mm (19 in) series –
Part 3-109: Dimensions of chassis for embedded computing devices
Structures mécaniques pour équipements électriques et électroniques –
Dimensions des structures mécaniques de la série 482,6 mm (19 pouces) –
Partie 3-109: Dimensions des châssis pour dispositifs informatiques intégrés
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IEC 60297-3-109 ®
Edition 1.0 2015-11
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Mechanical structures for electrical and electronic equipment – Dimensions of
mechanical structures of the 482,6 mm (19 in) series –
Part 3-109: Dimensions of chassis for embedded computing devices
Structures mécaniques pour équipements électriques et électroniques –
Dimensions des structures mécaniques de la série 482,6 mm (19 pouces) –
Partie 3-109: Dimensions des châssis pour dispositifs informatiques intégrés
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.240 ISBN 978-2-8322-3007-7
– 2 – IEC 60297-3-109:2015 © IEC 2015
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normative references . 7
3 Terms and definitions . 7
4 Arrangement overview . 7
5 Chassis dimensions . 8
Annex A (normative) Printed board dimensions . 11
A.1 Illustrative figure . 11
A.2 Maximum printed board dimensions . 11
Annex B (normative) Printed board dimensions in conjunction with fan cooling . 13
B.1 Illustrative figure . 13
B.2 Maximum printed board dimensions in conjunction with fan cooling . 13
Annex C (normative) Chassis mounting options . 16
C.1 Type A: Example for 19” cabinet mounting option . 16
C.2 Type B: Example for 19” cabinet mounting option . 16
C.3 Type C: Chassis mounting example . 17
C.4 Type D: Chassis mounting option . 17
Annex D (normative) Environmental tests . 19
D.1 Static and dynamic load test . 19
D.2 Seismic test . 19
D.3 Electromagnetic shielding performance test . 19
D.4 Degrees of protection . 19
Annex E (informative) Extended chassis dimensions . 20
E.1 General . 20
E.2 Illustrative figure . 20
E.3 Extended chassis dimensions . 20
Figure 1 – Three dimensional grid for chassis and associated printed boards . 6
Figure 2 – Chassis arrangement of an embedded application . 8
Figure 3 – Chassis front dimensions . 8
Figure 4 – Chassis depth dimensions . 8
Figure A.1 – Chassis with printed board . 11
Figure A.2 – Printed board dimensions . 11
Figure B.1 – Chassis with fan cooling . 13
Figure B.2 – Printed board dimensions in conjunction with fan cooling, example (fan
depth = 28,0 mm) . 14
Figure C.1 – Type A: Chassis mounting in a 19” cabinet . 16
Figure C.2 – Type B: Chassis mounting in a 19” cabinet . 17
Figure C.3 – Type C: Vertical flange mounting . 17
Figure C.4 – Type D: Horizontal flange mounting . 18
Figure E.1 – Extended chassis example . 20
Figure E.2 – Extended chassis – front dimensions . 20
Figure E.3 – Extended chassis – depth dimensions. 21
Table 1 – Chassis height dimensions . 9
Table 2 – Chassis width dimensions . 9
Table 3 – Chassis depth dimensions . 10
Table A.1 – Printed board width dimensions . 12
Table A.2 – Printed board depth dimensions . 12
Table B.1 – Printed board width dimensions in conjunction with fan cooling, example
(fan depth=28,0 mm) . 15
– 4 – IEC 60297-3-109:2015 © IEC 2015
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
MECHANICAL STRUCTURES FOR ELECTRICAL AND
ELECTRONIC EQUIPMENT – DIMENSIONS OF MECHANICAL
STRUCTURES OF THE 482,6 mm (19 in) SERIES –
Part 3-109: Dimensions of chassis for embedded computing devices
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
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agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from
...
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