IEC TS 62610-3:2009

Mechanical structures for electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 3: Design guide: Evaluation method for thermoelectrical cooling systems (Peltier effect)

IEC/TS 62610-3:2009(E) provides an evaluation method for thermoelectrical cooling systems (Peltier effect). With this design guide it is possible to calculate the efficiency of the thermoelectrical cooling system (Peltier effect) and its cooling power depending on the ambient temperature and internal temperature. This design guide can also be used to appraise thermoelectrical cooling systems by its efficiency.

General Information

• Status: Published
• Publication Date: 13-Dec-2009
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 31.240 - Mechanical structures for electronic equipment
• Technical Committee: SC 48D - Mechanical structures for electrical and electronic equipment
• Drafting Committee: WG 5 - TC 48/SC 48D/WG 5
• Current Stage: PPUB - Publication issued
• Start Date: 31-Jan-2010
• Completion Date: 14-Dec-2009

Standards Content (Sample)

IEC/TS 62610-3 ®
Edition 1.0 2009-12
TECHNICAL
SPECIFICATION
colour
inside
Mechanical structures for electronic equipment – Thermal management for
cabinets in accordance with IEC 60297 and IEC 60917 series –
Part 3: Design guide: Evaluation method for thermoelectrical cooling systems
(Peltier effect)
IEC/TS 62610-3:2009(E)
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by
any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from either IEC or
IEC's member National Committee in the country of the requester.
If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication,
please contact the address below or your local IEC member National Committee for further information.

Droits de reproduction réservés. Sauf indication contraire, aucune partie de cette publication ne peut être reproduite
ni utilisée sous quelque forme que ce soit et par aucun procédé, électronique ou mécanique, y compris la photocopie
et les microfilms, sans l'accord écrit de la CEI ou du Comité national de la CEI du pays du demandeur.
Si vous avez des questions sur le copyright de la CEI ou si vous désirez obtenir des droits supplémentaires sur cette
publication, utilisez les coordonnées ci-après ou contactez le Comité national de la CEI de votre pays de résidence.

IEC Central Office
3, rue de Varembé
CH-1211 Geneva 20
Switzerland
Email: [e-mail]
Web: 1Hwww.iec.ch
About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigenda or an amendment might have been published.
ƒ Catalogue of IEC publications: 2Hwww.iec.ch/searchpub
The IEC on-line Catalogue enables you to search by a variety of criteria (reference number, text, technical committee,…).
It also gives information on projects, withdrawn and replaced publications.
ƒ IEC Just Published: 3Hwww.iec.ch/online_news/justpub
Stay up to date on all new IEC publications. Just Published details twice a month all new publications released. Available
on-line and also by email.
ƒ Electropedia: 4Hwww.electropedia.org
The world's leading online dictionary of electronic and electrical terms containing more than 20 000 terms and definitions
in English and French, with equivalent terms in additional languages. Also known as the International Electrotechnical
Vocabulary online.
ƒ Customer Service Centre: 5Hwww.iec.ch/webstore/custserv
If you wish to give us your feedback on this publication or need further assistance, please visit the Customer Service
Centre FAQ or contact us:
Email: [e-mail]
Tel.: [phone]
Fax: [phone]
IEC/TS 62610-3 ®
Edition 1.0 2009-12
TECHNICAL
SPECIFICATION
colour
inside
Mechanical structures for electronic equipment – Thermal management for
cabinets in accordance with IEC 60297 and IEC 60917 series –
Part 3: Design guide: Evaluation method for thermoelectrical cooling systems
(Peltier effect)
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
PRICE CODE
U
ICS 31.240 ISBN 978-2-88910-773-5
– 2 – TS 62610-3 © IEC:2009(E)
CONTENTS
FOREWORD.0H3
INTRODUCTION.1H5
1 Scope and object.2H6
2 Normative references .3H6
3 Abbreviations, symbols and indices .4H6
3.1 Abbreviations .5H6
3.2 Symbols .6H7
3.3 Indices .7H7
4 Theory of the thermoelectrical cooling system .8H7
4.1 The Peltier element .9H7
4.2 Thermoelectrical cooling systems.10H8
5 Measurement setup .11H12
6 Interpretation and evaluation .12H13
Annex A (informative) Sample calculation .13H17
Bibliography.14H30

Figure 1 – Principles of the thermoelectrical cooling system .15H9
Figure 2 – Thermal resistances.16H10
Figure 3 – Thermodynamic system boundaries of a thermoelectrical cooling system
attached to a closed cabinet .17H11
Figure 4 – Measurement setup.18H12
Figure 5 – Results of the measurement.19H14
Figure 6 – Example for a specification sheet of a thermoelectrical cooling system
(Peltier) .20H16
Figure A.1 – Mollier h-x-diagram for humid air .21H20
Figure A.2 – Principles of the Peltier effect .22H21
Figure A.3 – Illustration for Z dependent on the number of charge carrier .23H22
Figure A.4 – Influence of the Figure of Merit ZT on the efficiency of the Peltier device.24H22
Figure A.5 – Thermodynamic system boundaries of a Peltier device .25H23
Figure A.6– Thermal resistance of a thermoelectrical cooling system.26H24
Figure A.7 – Typical temperature curve of a thermoelectrical cooling system .27H25
Figure A.8 – Example for the thermal resistance between air and a heat sink as a
function of the air velocity .28H26
Figure A.9 – Temperature distribution of a common heat sink for given boundary
29H26
conditions .
Figure A.10 – Illustration of the importance of the Thermal Interface Material (TIM).30H27
Figure A.11 – Dependency of the effective cooling power Q on the difference ΔT
C
between inside temperature and ambient temperature .31H28

Table A.1 – Measurement dataset.32H17

TS 62610-3 © IEC:2009(E) – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
MECHANICAL STRUCTURES FOR ELECTRONIC EQUIPMENT –
THERMAL MANAGEMENT FOR CABINETS IN ACCORDANCE
WITH IEC 60297 AND IEC 60917 SERIES –

Part 3: Design guide: Evaluation method
for thermoelectrical cooling systems (Peltier effect)

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
The main task of IEC technical committees is to prepare International Standards. In
exceptional circumstances, a technical committee may propose the publication of a technical
specification when
• the required support cannot be obtained for the publication of an International Standard,
despite repeated efforts, or
• The subject is still under technical development or where, for any other reason, there is
the future but no immediate possibility of an agreement on an International Standard.
Technical specifications are subject to review within three years of publication to decide
whether they can be transformed into International Standards.

– 4 – TS 62610-3 © IEC:2009(E)
IEC 62610-3, which is a technical specification, has been prepared by subcommittee 48D:
Mechanical structures for electronic equipment, of IEC technical committee 48:
Electromechanical components and mechanical structures for electronic equipment.
The text of this technical specification is based on the following documents:
Enquiry draft Report on voting
48D/401/DTS 48D/414/RVC
Full information on the voting for the approval of this technical specification can be found in
the report on voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts of the IEC 62610 series can be found, under the general title Mechanical
structures for electronic equipment – Thermal management for cabinets in accordance with
IEC 60297 and IEC 60917 series, on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in
the data related to the specific publication. At this date, the publication will be
• transformed into an International standard,
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.

IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.
TS 62610-3 © IEC:2009(E) – 5 –
INTRODUCTION
Besides the conventional compressor cooling there are several alternatives for cooling, for
example: absorption cooling, thermoelectric cooling (Peltier), magneto caloric cooling, CO
cooling and others.
For the design of thermoelectrical cooling systems, values of the dissipation loss depending
on the ambient temperature and internal temperature are necessary.
Thermoelectrical cooling systems performance is a function of ambient temperature, hot and
cold side heat exchanger (heat sink) performance, thermal load, of the design of the Peltier
device and of Peltier electrical parameters.
Therefore an evaluation method has to be developed. This design guide allows a comparison
of thermoelectrical cooling systems.
...