IEC TR 60286-7:2019

Packaging of components for automatic handling - Part 7: Introduction of a bulk blister pack for miniaturized components

IEC TR 60286-7:2019 contains information about the introduction of an innovative bulk blister packing system for miniaturized components, for example chip type components of size 1005 (metric) and smaller. It includes a proposal for standardization of the interface between the packaging and automatic assembly systems and requirements to the properties of the packaging.

Emballage de composants pour opérations automatisées - Partie 7: Introduction d’une plaquette thermoformée en volume pour des composants miniaturisés

L’IEC TR 60286-7:2019 contient des informations sur l’introduction d’un système innovant de conditionnement par plaquette thermoformée en volume pour des composants miniaturisés, par exemple des composants de type puce d’une taille inférieure ou égale à 1005 (métrique). Elle comprend une proposition de normalisation de l’interface entre les systèmes d’emballage et de montage automatique ainsi que les exigences relatives aux propriétés de l’emballage.

General Information

• Status: Published
• Publication Date: 13-Oct-2019
• ICS: 31.020 - Electronic components in general
• ICS: 31.240 - Mechanical structures for electronic equipment
• Technical Committee: TC 40 - Capacitors and resistors for electronic equipment
• Drafting Committee: WG 36 - TC 40/WG 36
• Current Stage: PPUB - Publication issued
• Start Date: 14-Oct-2019
• Completion Date: 11-Oct-2019

Overview

IEC TR 60286-7:2019 presents a pivotal advancement in the packaging of electronic components for automatic handling. This technical report introduces an innovative bulk blister pack system specifically designed for miniaturized components, such as chip-type parts measuring 1005 (metric) and smaller. Recognizing the growing challenges in packaging ultra-small components, this report proposes standardized guidelines governing the interface between packaging and automatic assembly systems, as well as requisite packaging properties to optimize handling and assembly efficiency.

The International Electrotechnical Commission (IEC) developed this report based on extensive pilot projects, aiming to address the critical need for improved bulk packaging solutions that support automation and minimize component damage or misplacement during automatic handling processes.

Key Topics

• Miniaturized component challenges: The report outlines the difficulties posed by the miniaturization of components, which leads to a disproportionally large packaging volume relative to component size, especially in tape and reel formats. This results in inefficiencies and handling risks during assembly.

• Limitations of existing bulk feeding systems: Current linear bulk feeding methods face multiple constraints, including the necessity for tight tolerances, sensitivity to component thickness variation, inability to handle cubical components, complex cleaning procedures, and risks of mixing different components.

• Bulk blister pack concept: The core innovation is a blister pack with an arrangement of pockets, including five filled pockets, one empty pocket for handling safety, and a smaller pocket for orientation or test samples. The blister pack uses plastic domes to securely hold miniaturized components while enabling automatic feeding.

• Design and dimensions: Detailed specifications address the structural design of blister pockets, sealing methods, identification and labeling, and overall dimensions to ensure compatibility with automated assembly interfaces.

• Material and electrostatic considerations: Selection of packaging materials focuses on durability and electrostatic discharge (ESD) protection to safeguard sensitive miniaturized components during storage and handling.

• Innovative bulk feeding systems: The report highlights new bulk feeding mechanisms compatible with the proposed blister packs, enabling more reliable, efficient, and standardized pick-and-place operations.

Applications

• Automated electronic assembly: Enables efficient feeding and handling of ultra-small chip components in high-speed surface mount technology (SMT) and other automated assembly lines.

• Miniaturized component packaging: Supports manufacturers who require packaging solutions that reduce volume and minimize component damage while facilitating automation.

• Supply chain and logistics: Improves packaging design for transport and storage, reducing component mix-ups and increasing traceability via integrated labeling.

• Component testing and quality control: The inclusion of designated pockets for test samples enhances inspection and quality assurance processes within the production workflow.

Related Standards

• IEC 60286 series: The bulk blister pack standard is part 7 of the IEC 60286 series that covers the packaging of components for automatic handling, providing harmonized methods and interfaces for automatic assembly.

• IEC 60286-3: Defines terms related to packaging, which supports the consistent understanding of concepts used in this report.

• Electrostatic protection standards: While not normative here, IEC TR 60286-7 emphasizes electrostatic properties aligning with broader ESD control standards to prevent damage to vulnerable components.

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IEC TR 60286-7:2019 represents a critical step toward modernizing packaging technology for miniaturized electronic components. By standardizing bulk blister pack designs and interfaces, it enables higher automation efficiency and protection, addressing longstanding challenges in the electronics manufacturing industry. This progress is essential for manufacturers striving for precision, reliability, and cost-effectiveness in component packaging and automatic handling systems.

Standards Content (Sample)

IEC TR 60286-7 ®
Edition 1.0 2019-10
TECHNICAL
REPORT
RAPPORT
TECHNIQUE
colour
inside
Packaging of components for automatic handling –
Part 7: Introduction of a bulk blister pack for miniaturized components

Emballage de composants pour opérations automatisées –
Partie 7: Introduction d’une plaquette thermoformée en volume pour des
composants miniaturisés
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IEC TR 60286-7 ®
Edition 1.0 2019-10
TECHNICAL
REPORT
RAPPORT
TECHNIQUE
colour
inside
Packaging of components for automatic handling –

Part 7: Introduction of a bulk blister pack for miniaturized components

Emballage de composants pour opérations automatisées –

Partie 7: Introduction d’une plaquette thermoformée en volume pour des

composants miniaturisés
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.020; 31.240 ISBN 978-2-8322-7413-2

– 2 – IEC TR 60286-7:2019  IEC 2019
CONTENTS
FOREWORD . 3
INTRODUCTION . 5
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Existing bulk feeding systems and challenges . 6
4.1 Challenges of miniaturized components . 6
4.2 Limitations of existing bulk feeding systems . 7
5 Bulk blister pack . 7
5.1 General conception . 7
5.1.1 Packaging style . 7
5.1.2 Component pockets . 7
5.1.3 Sealing . 7
5.1.4 Identification and labelling . 7
5.2 Outline and dimensions . 8
5.2.1 Outline . 8
5.2.2 Dimensions . 9
5.3 Properties . 10
5.3.1 Material . 10
5.3.2 Electrostatic properties . 10
6 Bulk feeding system . 10
6.1 Applicability for component types and sizes . 10
6.2 Example of an innovative bulk feeding system . 10
Bibliography . 12

Figure 1 – Typical bulk blister pack (structure) . 8
Figure 2 – Typical bulk blister pack (mechanism) . 8
Figure 3 – Typical bulk blister pack (overall dimensions) . 9
Figure 4 – Typical bulk blister pack (blister strip dimensions) . 10
Figure 5 – Pick up area with components . 11

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING –

Part 7: Introduction of a bulk blister pack for miniaturized components

FOREWORD
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The main task of IEC technical committees is to prepare International Standards. However, a
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data of a different kind from that which is normally published as an International Standard, for
example "state of the art".
IEC TR 60286-7, which is a technical report, has been prepared by IEC technical
committee 40: Capacitors and resistors for electronic equipment.
The text of this technical report is based on the following documents:
Enquiry draft Report on voting
40/2648/DTR 40/2676/RVDTR
Full information on the voting for the approval of this technical report can be found in the
report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.

– 4 – IEC TR 60286-7:2019  IEC 2019
A list of all parts in the IEC 60286 series, published under the general title Packaging of
components for automatic handling, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates that it
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INTRODUCTION
Purpose of this Technical Report
This Technical Report includes the practical experience made during pilot projects and a
proposal for standardization of the interface between the package and automatic assembly
systems as well as requirements to the properties of the package itself.
Patent situation
The International Electrotechnical Commission (IEC) draws attention to the fact that it is
claimed that compliance with this document may involve the use of patents concerning a
“magazine for portion-wise receiving individualized electronic components which are present
in bulk” .
IEC takes no position concerning the evidence, validity and scope of this patent right.
The holder of this patent right has assured the IEC that he/she is willing to negotiate licences
free of charge with applicants throughout the world for claims related to the items described in
this Technical Report. In this respect, the statement of the holder of this patent right is
registered with IEC. Information may be obtained from:
ASM Assembly Systems GmbH & Co.KG, Munich(DE)
Rupert-Mayer-Straße 44, 81379 München
Attention is drawn to the possibility that some of the elements of this document may be the
subject of patent rights other than those identified above. IEC shall not be held responsible for
identifying any or all such patent rights.
ISO (www.iso.org/patents) and IEC (http://patents.iec.ch) maintain on-line data bases of
patents relevant to their standards. Users are encouraged to consult the data bases for the
most up to date information concerning patents.

____________
German Patent: DE102016125495, published 28.06.2018
United States Patent Application: US 2018/0184555 A1

– 6 – IEC TR 60286-7:2019  IEC 2019
PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING –

Part 7: Introduction of a bulk blister pack for miniaturized components

1 Scope
This part of IEC 60286 contains information about the introduction of an innovative bulk blister
packing system for miniaturized components, for example chip type components of size 1005
(metric) and smaller. It includes a proposal for standardization of the interface between the
packaging and automatic assembly systems and requirements to the properties of the
packaging.
2 Normative references
There are no normative references in this document.
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1
packaging
product made of any material or any nature to be used for the containment, protection, and
structured alignment for automatic assembly, handling and delivery
[SOURCE: IEC 60286-3:2019, 3.1.3]
3.2
packing
operations involved in the preparation of goods for containment, protection, and structured
alignment for automatic assembly, handling, and delivery
3.3
blister pack
type of packaging in which components are packed, consisting of domes of plastic
EXAMPLE The example is shown in Figure 1.
4 Existing bulk feeding systems and challenges
4.1 Challenges of miniaturized components
Progressing miniaturization of components has caused an increasing mismatch between
packaging volume and component size, where the volume of components became just a small
percentage of the total packaging volume in the case of tape and reel packaging.

In addition, to enable a smooth pick and place process of such components, tight tolerances
of pocket sizes are needed, which are technically difficult to achieve and increase costs.
As an alternative, bulk packaging and feeding systems had been developed in the past.
4.2 Limitations of existing bulk feeding systems
Existing bulk feeding systems are based on linear feeders, which show various constraints:
• tight dimensional tolerances of components required;
• variation of component thickness is critical;
• cubical components cannot be handled;
• difficult cleaning processes;
• risk of mixed components.
5 Bulk blister pack
5.1 General conception
5.1.1 Packaging style
Blister with seven pockets, five filled with components, one empty pocket and one smaller
size pocket for orientation (Figure 1 and Figure 4).
The small pocket is for mechanical orientation and indicates the end of the strip. The first
pocket is intentionally empty to avoid accidental loss of components during handling.
NOTE The smaller size pocket can be used for provision of test samples, for example for inspection.
5.1.2 Component pockets
The dimensions and maximum filling level of pockets are designed such, that the volume is
aligned to the maximum capacity of bulk feeders.
The dimensions and maximum filling level of pockets shall be specified such, that packed
components will not be damaged during transport and handling.
5.1.3 Sealing
The complete circumference of pocket shall be sealed strongly enough to prevent accidental
loss of components during transportation and handling, but not exceed 15 N when pulled off in
a 180° direction. The seal tape shall be not sticky, so that the packed components do not
attach to the seal.
5.1.4 Identification and labelling
5.1.4.1 Information on label on top
The label on top contains the same information as in the matrix code on the bottom side, and
provides the minimum content described below:
• manufacturer identification;
• manufacturer part number;
• quantity;
NOTE The quantity information on the label is the total quantity of components contained in the blister
packaging. The filling quantity of the component pockets is the same in all five pockets.

– 8 – IEC TR 60286-7:2019  IEC 2019
• lot code.
Additional information can be given as appropriate, also in human readable form.
Details can be found in IEC 62090.
5.1.4.2 Information on label on bottom
A label is placed on the first filled pocket with information identical to that on the bar code on
top (see 5.1.4.1), but in the form of a 2D-matrix code.
5.2 Outline and dimensions
5.2.1 Outline
The structure of a typical bulk blister pack is shown in Figure 1.

Figure 1 – Typical bulk blister pack (structure)
The mechanism of a typical bulk blister pack is shown in Figure 2.

Figure 2 – Typical bulk blister pack (mechanism)

5.2.2 Dimensions
The dimensions of a typical bulk blister pack are shown in Figure 3 and Figure 4.
NOTE It is possible that the slide lid does not cover the blister strip completely.

a) Top view b) Width side view
Key
L Length = 169 mm ± 1 mm
H Height = (13,7 ± 1) mm
W Width = 35,8 mm ± 1 mm
W Width of cover tape = 28,0 mm max. (considering seal runout)
W Width of rim of the slide lid = 2,7 mm to 5,0 mm
D Diameter of pocket = φ19 mm ± 0,2 mm
H Height of pass line = 2 mm ± 0,2 mm
H Thickness of slide lid = 4,0 mm to 6,0 mm
Figure 3 – Typical bulk blister pack (overall dimensions)

– 10 – IEC TR 60286-7:2019  IEC 2019

Key
L Length = (168 ± 1) mm
L Length from edge of blister strip to center of D = (12,0 ± 0,5) mm

3 1
W Width = (32 ± 0,3) mm
W Outer width of convex part of pocket = 24 mm max.
W Width from edge of blister strip to center of D = (16,0 ± 0,5) mm
6 1
D Pocket size: diameter = φ19 mm ± 0,2mm, at a depth = 12,5 mm ± 0,5 mm

D Small pocket: diameter = φ15 mm ± 0,2mm, at a depth = 5,5 mm ± 0,5 mm

P Pocket pitch = 24,0 mm ± 0,1 mm
R Radius = (8 ± 0,5) mm
Figure 4 – Typical bulk blister pack (blister strip dimensions)
5.3 Properties
5.3.1 Material
The bulk blister pack is made from material providing sufficient strength and stability to
prevent damage and to enable appropriate handling for filling the components into a cartridge
or similar container for refilling the feeder.
5.3.2 Electrostatic properties
Where applicable, the blister shall comply with the requirements for material to be brought
into electrostatic protected areas (see IEC 61340-5-1), for example conductive or electrostatic
dissipative (see IEC 61340-5-3).
6 Bulk feeding system
6.1 Applicability for component types and sizes
The bulk blister pack and related feeding system are most effective for all no-lead cuboid-type
components with a length and width of less than 1 mm. The minimum size depends upon the
optical resolution of the pick and place system.
It is designed primarily for non-polarity devices. For components with a specific orientation, a
marking or other means for identification shall be identifiable on the component's bottom.
6.2 Example of an innovative bulk feeding system
An innovative bulk feeding system for cuboid components can move bulk components in a
way that allows transporting large numbers (several hundred loose components) within a
feeding unit in parallel to an area, where this bulk of components can be separated. The

separation is done in a way that components can then be picked up, one by one, by a pick
and place machine.
All this can be achieved in a feeder unit, which contains a vibration generator, which
generates controlled 3-dimensional vibrations, which move components in a so-called
cartridge to a glass plate, on which the components are separated by a second modulated
vibration sequence that spreads out the components randomly and also is able to flip them.
Underneath the glass plate, a camera takes a picture of the randomly distributed components
and, with a smart evaluation algorithm, a vision system can identify which components are in
the right position and orientation to be picked up (see Figure 5). The result of the picture
evaluation is a list with component positions being able to be picked-up (distance between
adjacent components, X and Y and angle orientation). With this information, the head can now
pick up the components. The remaining components that are on the glass plate are then
vibrated again and fall into new positions and orientations. If there are not enough
components to be picked, more components can be vibrated from the cartridge onto the glass
plate.
Figure 5 – Pick up area with components
For r
...