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IEC TR 63091:2017

(Main)

Study for the derating curve of surface mount fixed resistors - Derating curves based on terminal part temperature

Study for the derating curve of surface mount fixed resistors - Derating curves based on terminal part temperature

IEC TR 63091:2017(E) is a technical report and is applicable to SMB resistors with sizes equal or smaller than the RR6332M, including the typical rectangular and cylindrical SMD resistors mentioned in IEC 60115-8.

General Information

Status
Published
Publication Date
23-May-2017
ICS
01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
31.040.10 - Fixed resistors
Technical Committee
TC 40 - Capacitors and resistors for electronic equipment
Drafting Committee
WG 41 - TC 40/WG 41
Current Stage
PPUB - Publication issued
Start Date
31-May-2017
Completion Date
24-May-2017
Ref Project

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IEC TR 63091:2017 - Study for the derating curve of surface mount fixed resistors - Derating curves based on terminal part temperatureIEC TR 63091:2017 - Study for the derating curve of surface mount fixed resistors - Derating curves based on terminal part temperature
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IEC TR 63091:2017 - Study for the derating curve of surface mount fixed resistors - Derating curves based on terminal part temperature
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IEC TR 63091 ®
Edition 1.0 2017-05
TECHNICAL
REPORT
Study for the derating curve of surface mount fixed resistors – Derating curves
based on terminal part temperature

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IEC TR 63091 ®
Edition 1.0 2017-05
TECHNICAL
REPORT
Study for the derating curve of surface mount fixed resistors – Derating curves

based on terminal part temperature

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.040.10 ISBN 978-2-8322-4368-8

– 2 – IEC TR 63091:2017 © IEC 2017
CONTENTS
FOREWORD . 7
INTRODUCTION . 9
1 Scope . 10
2 Normative references . 10
3 Terms and definitions . 10
4 Study for the derating curve of surface mount fixed resistors . 11
4.1 General . 11
4.2 Using the derating curve based on the terminal part temperature . 12
4.3 Measuring method of the terminal part temperature of the SMD resistor . 13
4.4 Measuring method of the thermal resistance R from the terminal part
th shs-t
to the surface hotspot . 19
4.5 Conclusions . 21
Annex A (informative) Background of the establishment of the derating curve based
on ambient temperature . 22
A.1 Tracing the history of the mounting and heat dissipation figuration of
resistors . 22
A.2 How to establish the high temperature slope part of the derating curve . 24
A.2.1 General . 24
A.2.2 Derating curve for the semiconductors . 26
A.2.3 Derating curve for resistors . 29
Annex B (informative) The temperature rise of SMD resistors and the influence of the
printed circuit board . 40
B.1 Temperature rise of SMD resistors . 40
B.2 The influence of the printed circuit boards . 45
Annex C (informative) The influence of the number of resistors mounted on the test
board . 49
C.1 General . 49
C.2 The influence of the number of resistors mounted on the test board . 49
C.3 The delay of correspondence for current products with nonstandard
dimensions . 51
Annex D (informative) Influence of the air flow in the test chamber . 52
D.1 General . 52
D.2 Influence of the wind speed . 52
Annex E (informative) Validity of the new derating curve . 60
E.1 Suggestion for establishing the derating curve based on the terminal part
temperature . 60
E.2 Conclusion . 65
Annex F (informative) The thermal resistance of SMD resistors . 67
Annex G (informative) How to measure the surface hotspot temperature . 72
G.1 Target of the measurement . 72
G.2 Recommended measuring equipment . 72
G.3 Points to be careful when measuring the surface hotspot of the resistor with
an infrared thermograph . 72
G.3.1 General . 72
G.3.2 Spatial resolution and accuracy of peak temperature measurement . 73
G.3.3 Influence of the angle of the measurement target normal line and the
infrared thermograph light axis . 75

Annex H (informative) How the resistor manufacturers measure the thermal resistance
of resistors . 79
H.1 The measuring system . 79
H.2 Definition of the two kinds of temperatures. 80
H.3 Errors in the measurement . 83
Annex I (informative) Measurement method of the terminal part temperature of the
SMD resistors . 88
I.1 Measuring method using an infrared thermograph . 88
I.2 Measuring method using the thermocouple . 89
I.3 Estimating the error range of the temperature measurement using the
thermal resistance of the thermocouple . 90
I.3.1 General . 90
I.3.2 When using the type T thermocouples . 97
I.4 Thermal resistance of the board . 97
I.5 Conclusion of this annex . 100
Annex J (informative) The variation of the heat dissipation fraction caused by the
difference between the resistor and its mounting configuration . 101
J.1 Heat dissipation ratio of cylindrical resistors wired in the air. 101
J.2 Heat dissipation ratio of SMD resistors mounted on the board . 102
J.3 Heat dissipation ratio of the cylindrical resistors mounted on the through-
hole printed board . 104
Annex K (informative) Influence of airflow on SMD resistors . 105
K.1 General . 105
K.2 Measurement system . 105
K.3 Test results (orthogonal) . 106
K.4 Test results (parallel) . 110
Annex L (informative) The influence of the spatial resolution of the thermograph . 115
L.1 The application for using the thermograph when measuring the temperature
of the SMD resistor . 115
L.2 The relation between the minimum area that the accurate temperature could
be measured and the pixel magnification percentage . 115
L.3 Example of the RR1608M SMD resistor hotspot's actual measurement . 120
L.4 Conclusion . 121
Annex M (informative) Future subjects . 122
Bibliography . 123

Figure 1 – Existing derating curve based on ambient temperature . 12
Figure 2 – Suggested derating curve based on terminal temperature . 12
Figure 3 – Attachment position of the thermocouple when measuring the temperature
of the terminal part . 13
Figure 4 – Attaching type K thermocouples . 14
Figure 5 – Wiring routing of the thermocouple . 15
Figure 6 – The true value and the actual measured value of the terminal part
temperature . 16
Figure 7 – Thermal resistance R of the FR4 single side board (thickness 1,6 mm). 17
th eq
Figure 8 – Length that cause the heat dissipation and the thermal resistance of the
type-K thermocouple (calculated) . 18
Figure 9 – Example of calculation of the measurement error ∆T caused by the heat
dissipation of the thermocouple . 19

– 4 – IEC TR 63091:2017 © IEC 2017
Figure 10 – Recommended measurement system of T and T for calculating R
shs t th
..................................................................................................................................... 20
shs-t
Figure A.1 – Wired in the air using the lug terminal . 22
Figure A.2 – Heat path when wired in the air using the lug terminal . 23
Figure A.3 – Test condition for resistors with category power 0 W . 24
Figure A.4 – Test condition for
...

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