Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface Insulation Resistance (SIR) testing of assemblies

IEC 61189-5-502:2021 is used for evaluating the changes to the surface insulation resistance of a pre-selected material set on a representative test coupon and quantifies the deleterious effects of improperly used materials and processes that can lead to decreases in electrical resistance.

Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres structures d’interconnexion et ensembles - Partie 5-502: Méthodes d'essai générales pour les matériaux et les ensembles - Essais de résistance d'isolement en surface (RIS) des ensembles

L’IEC 61189-5-502:2021 permet d’évaluer les variations de la résistance d’isolement en surface d’un ensemble de matériaux présélectionné sur une éprouvette représentative et quantifie les effets délétères d’une mauvaise utilisation des matériaux et des processus qui peuvent provoquer une diminution de la résistance électrique.

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Status
Published
Publication Date
02-Feb-2021
Current Stage
PPUB - Publication issued
Completion Date
03-Feb-2021
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IEC 61189-5-502:2021 - Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface Insulation Resistance (SIR) testing of assemblies
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IEC 61189-5-502
Edition 1.0 2021-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Test methods for electrical materials, printed board and other interconnection
structures and assemblies –
Part 5-502: General test methods for materials and assemblies – Surface
Insulation Resistance (SIR) testing of assemblies
Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres
structures d’interconnexion et ensembles –
Partie 5-502: Méthodes d’essai générales pour les matériaux et les ensembles –
Essais de résistance d’isolement en surface (RIS) des ensembles
IEC 61189-5-502:2021-02(en-fr)
---------------------- Page: 1 ----------------------
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---------------------- Page: 2 ----------------------
IEC 61189-5-502
Edition 1.0 2021-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Test methods for electrical materials, printed board and other interconnection
structures and assemblies –
Part 5-502: General test methods for materials and assemblies – Surface
Insulation Resistance (SIR) testing of assemblies
Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres
structures d’interconnexion et ensembles –
Partie 5-502: Méthodes d’essai générales pour les matériaux et les ensembles –
Essais de résistance d’isolement en surface (RIS) des ensembles
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180 ISBN 978-2-8322-9290-7

Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
---------------------- Page: 3 ----------------------
– 2 – IEC 61189-5-502:2021 © IEC 2021
CONTENTS

FOREWORD ........................................................................................................................... 4

1 Scope .............................................................................................................................. 6

2 Normative references ...................................................................................................... 6

3 Terms and definitions ...................................................................................................... 7

4 Equipment/Apparatus ...................................................................................................... 7

4.1 Soldering and other production process equipment ................................................. 7

4.2 Measurement instrument ......................................................................................... 7

4.3 Resistor verification coupon .................................................................................... 8

4.4 Damp heat chamber ................................................................................................ 8

4.5 Magnifiers (10x – 30x) ............................................................................................ 9

4.6 Camera ................................................................................................................... 9

4.7 Cleaning solvent ..................................................................................................... 9

4.8 Interconnecting cable .............................................................................................. 9

4.9 Connector rack ....................................................................................................... 9

4.10 Solder flux .............................................................................................................. 9

5 Test coupon..................................................................................................................... 9

5.1 Test coupon artwork ............................................................................................... 9

5.1.1 General ........................................................................................................... 9

5.1.2 Test coupon ................................................................................................... 10

5.1.3 Laminate ....................................................................................................... 10

5.1.4 Surface finish ................................................................................................ 10

5.1.5 Solder mask .................................................................................................. 10

5.1.6 Quality ........................................................................................................... 10

5.2 Components (bill of materials) .............................................................................. 10

5.3 Number of test coupons ........................................................................................ 12

5.4 Test conditions ..................................................................................................... 12

5.5 Coupon identification ............................................................................................ 13

6 Procedure ...................................................................................................................... 13

6.1 Test coupon preparation ....................................................................................... 13

6.2 Cleaning ............................................................................................................... 13

6.3 Manufacturing process replication ......................................................................... 13

6.4 Preparation of samples for chamber ...................................................................... 13

6.5 Connector system – High-resistance measurement verification ............................. 13

6.6 Hard wiring ........................................................................................................... 14

6.7 Coupon orientation in the chamber ....................................................................... 14

6.8 Test coupon measurements .................................................................................. 14

6.9 Evaluation ............................................................................................................. 15

6.10 Test report ............................................................................................................ 15

6.11 Additional information ........................................................................................... 16

Annex A (informative) Additional information ........................................................................ 17

A.1 Additional information ........................................................................................... 17

A.1.1 General ......................................................................................................... 17

A.1.2 Advisory notes ............................................................................................... 17

A.1.3 Use of coupon test pattern on production product .......................................... 17

A.2 Use of dummy components ................................................................................... 17

A.3 Frequency of monitoring ....................................................................................... 17

---------------------- Page: 4 ----------------------
IEC 61189-5-502:2021 © IEC 2021 – 3 –

A.4 Condensation ........................................................................................................ 18

A.5 Flux volatilisation .................................................................................................. 18

A.5.1 General ......................................................................................................... 18

A.5.2 90 % RH or 93 % RH ..................................................................................... 18

A.6 Drip shield ............................................................................................................ 18

A.7 Inspection ............................................................................................................. 19

A.8 Connector test racks ............................................................................................. 19

A.8.1 Advantages ................................................................................................... 19

A.8.2 Disadvantages ............................................................................................... 19

A.9 Electromagnetic shielding ..................................................................................... 19

A.10 Wiring to the IPC B-52 test coupons ..................................................................... 20

A.11 Connector test rack wiring..................................................................................... 21

A.12 Test voltage .......................................................................................................... 21

Bibliography .......................................................................................................................... 22

Figure 1 – Resistor verification coupon using the IPC-B-52 coupon ........................................ 8

Figure 2 – IPC B-52 Rev B Top Side ..................................................................................... 11

Figure 3 – IPC B-52 Rev B bottom side ................................................................................. 11

Figure 4 – Test specimen location with respect to chamber air flow ...................................... 14

Table 1 – IPC B-52 bill of materials (BOM) ............................................................................ 12

Table A.1 – IPC B-52 Rev B wiring diagram .......................................................................... 20

---------------------- Page: 5 ----------------------
– 4 – IEC 61189-5-502:2021 © IEC 2021
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND
OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –
Part 5-502: General test methods for materials and assemblies –
Surface Insulation Resistance (SIR) testing of assemblies
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international

co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and

in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,

Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their

preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with

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Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.

2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international

consensus of opinion on the relevant subjects since each technical committee has representation from all

interested IEC National Committees.

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services carried out by independent certification bodies.

6) All users should ensure that they have the latest edition of this publication.

7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and

members of its technical committees and IEC National Committees for any personal injury, property damage or

other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and

expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications.

8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is

indispensable for the correct application of this publication.

9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent

rights. IEC shall not be held responsible for identifying any or all such patent rights.

IEC 61189-5-502 has been prepared by IEC technical committee 91: Electronics assembly

technology. It is an International Standard.
The text of this International Standard is based on the following documents:
Draft Report on voting
91/1646/CDV 91/1673/RVC

Full information on the voting for its approval can be found in the report on voting indicated in

the above table.
The language used for the development of this International Standard is English.
---------------------- Page: 6 ----------------------
IEC 61189-5-502:2021 © IEC 2021 – 5 –

This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in

accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available

at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are

described in greater detail at www.iec.ch/standardsdev/publications.

A list of all parts in the IEC 61189 series, published under the general title Test methods for

electrical materials, printed board and other interconnection structures and assemblies, can be

found on the IEC website.

The committee has decided that the contents of this document will remain unchanged until the

stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to

the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates

that it contains colours which are considered to be useful for the correct understanding

of its contents. Users should therefore print this document using a colour printer.

---------------------- Page: 7 ----------------------
– 6 – IEC 61189-5-502:2021 © IEC 2021
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND
OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –
Part 5-502: General test methods for materials and assemblies –
Surface Insulation Resistance (SIR) testing of assemblies
1 Scope

This part of IEC 61189 is used for evaluating the changes to the surface insulation resistance

of a pre-selected material set on a representative test coupon and quantifies the deleterious

effects of improperly used materials and processes that can lead to decreases in electrical

resistance.

An assembly process involves a number of different process materials including solder flux,

solder paste, solder wire, underfill materials, adhesives, staking compounds, temporary

masking materials, cleaning solvents, conformal coatings and more. The test employs two

different test conditions of 85 °C and 85 % relative humidity (RH), preferred for a process that

includes cleaning, or 40 °C and 90 % relative humidity (RH), preferred for processes where no

cleaning is involved.

NOTE 40 °C and 93 % RH can be used as an alternative to 40 °C and 90 % RH. Additional information is provided

in 5.4 and A.5.2.

Testing is material (set) and process / equipment specific. Qualifications are to be performed

using the production intent equipment, processes and materials.
2 Normative references

The following documents are referred to in the text in such a way that some or all of their content

constitutes requirements of this document. For dated references, only the edition cited applies.

For undated references, the latest edition of the referenced document (including any

amendments) applies.
IEC 60068-1, Environmental testing – Part 1: General and guidance

IEC 60068-2-20, Environmental testing – Part 2-20: Tests – Test T: Test methods for

solderability and resistance to soldering heat of devices with leads

IEC 60068-2-58, Environmental testing – Part 2-58: Tests – Test Td: Test methods for

solderability, resistance to dissolution of metallization and to soldering heat of surface mounting

devices (SMD)

IEC 60068-2-67, Environmental testing – Part 2-67: Tests – Test Cy: Damp heat, steady state,

accelerated test primarily intended for components

IEC 60068-2-78, Environmental testing – Part 2-78: Tests – Test Cab: Damp heat, steady state

IEC 60194, Printed board design, manufacture and assembly – Terms and definitions

IEC 61190-1-3, Attachment materials for electronic assembly – Part 1-3: Requirements for

electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering

applications
---------------------- Page: 8 ----------------------
IEC 61189-5-502:2021 © IEC 2021 – 7 –
3 Terms and definitions

For the purposes of this document, the terms and definitions given in IEC 60068-1, IEC 60068-

2-20:2008, IEC 60068-2-58, IEC 60194, and IEC 61190-1-3 and the following apply.

ISO and IEC maintain terminological databases for use in standardization at the following

addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1
test coupon
test specimen, test vehicle, test sample
4 Equipment/Apparatus
4.1 Soldering and other production process equipment
All the equipment shall represent the equipment to be used in production.
4.2 Measurement instrument

This shall consist of a measuring device capable of measuring insulation resistance in the range

6 12
of at least 10 Ω to 10 Ω.

It shall be capable of measuring and recording each individual test pattern of an IPC-B-52 test

board/assembly. The measurement circuit shall incorporate a 1 MΩ current limiting resistor in

each current pathway.
The tolerance of the total measurement system shall be:
• ±5 % up to 10 Ω at 5 V;
10 11
• ±10 % between 10 Ω to 10 Ω at 5 V;
• ±20 % above 10 Ω at 5 V.

If a different test voltage is to be used, the measurement circuit shall be assessed at that voltage

rather than the 5 V stipulated. See 6.8 and Clause A.12 for additional information on test

voltages.

The resistors used to confirm the "total measurement system tolerance" defined above, shall

have a purchased tolerance of:
• ±0,1 % up to and including 10 Ω;
6 8
• ±1 % above 10 Ω and up to and including 10 Ω;
8 10
• ±5 % above 10 Ω and up to and including 10 Ω;
• ±10 % above 10 Ω.

The instrument can be used with either an external or internal power supply but shall be capable

of delivering a variable voltage from (5 to 100) V DC ±1 % with a 1 MΩ load and a channel to

channel isolation resistance of 10 Ω.

The system shall be capable of taking measurements in the time interval required.

---------------------- Page: 9 ----------------------
– 8 – IEC 61189-5-502:2021 © IEC 2021

Equipment shall have the measurement capability to repeat the resistance measurement on all

channels at least every 20 min.
4.3 Resistor verification coupon

The measurement system measurement performance shall be verified by substituting a resistor

verification coupon (see Figure 1) in place of the test coupons while in the chamber at both

ambient and elevated conditions.

This coupon should be fitted with at least 4 “known value” resistors. The tolerances for the

“known value” resistors shall be as per the purchased tolerances detailed in 4.2.

Figure 1 – Resistor verification coupon using the IPC-B-52 coupon

The resistor verification coupon should have a protective metal (stainless steel) cover attached

with stainless hardware to the grounded mounting holes on the coupon to protect the resistors

from contamination or damage during handling operations.

Other types of test coupon may be used in place of the IPC-B-52 RVC, as this coupon is used

only to verify continuity prior to the commencement of the test.
4.4 Damp heat chamber
° ° °

A damp heat chamber capable of being adjusted to a temperature of 20 C ± 2 C to 100 C

± 2 °C and of relative humidity between 80 % RH ±3 % RH and 90 % RH ± 3 % RH according

to IEC 60068-2-67 and IEC 60068-2-78 shall be used.

If the alternative conditions of 40 °C and 93 % RH are to be used, the damp heat chamber shall

be capable of the upper humidity level of 93 % RH ± 3 % RH rather than the 90 % RH ± 3 %

RH specified above; see 5.4 and A.5.1 for further information.

The chamber shall be constructed with stainless steel inner surfaces and be well-insulated.

The temperature and humidity measurement should be taken using sensors such as dry and

wet bulb thermometers or solid-state sensors. The temperature and humidity levels of the test

chamber shall be recorded at a minimum of 5 minute intervals throughout the test, preferably with

independent control sensors.

The location of the samples within the chamber should ensure that the airflow within is not

impeded.
---------------------- Page: 10 ----------------------
IEC 61189-5-502:2021 © IEC 2021 – 9 –

Adequate mixing of water vapour and air is imperative to ensure condensation does not occur

anywhere in the chamber except on/around cooling or dehumidification coils. If any part of

interior of the chamber is below the dew point, possibly due to insulation or control issues,

condensation will occur. The samples should be kept above the dew point and be shielded from

dripping or flying condensate.

Prior to every test, the chamber interior shall be wiped down with a mixture of 50 % propan-2-

ol and 50 % deionized water. The chamber shall be free from any unwanted residues from

previous tests. The chamber should have been dedicated to heat and humidity testing only and

not used for tests such as salt fog, salt mist or salt spray.
4.5 Magnifiers (10x – 30x)

To assist in post-test inspection, it is recommended that the user has a magnifier of not less

than 10x to a maximum 30x magnification.
4.6 Camera

It is recommended the user has a suitable camera available to photograph test coupons that

exhibit electrochemical migration or intermetallic dendritic growth.
4.7 Cleaning solvent

Removal of flux residues by a cleaning solvent should replicate the processes intended for

production hardware.
4.8 Interconnecting cable

A PTFE insulated wire or ribbon cable should be used to connect the test coupon to the

measurement system. This cable should be shielded using a suitable metallised cable mesh to

minimise the risk of tribo-electrical interference and electrical noise.
4.9 Connector rack

The connector rack should employ a connector (edge card or hard solder connection) suitable

to withstand the test environment. For edge card connection, use of gold-plated mating parts is

recommended.
4.10 Solder flux

Preferably use a fluxless solder wire. Alternatively, a flux-cored solder wire that conforms to

IEC 61190-1-3.
5 Test coupon
5.1 Test coupon artwork
5.1.1 General

The test coupon shall be the IPC-B-52 as shown in Figure 2 and Figure 3. The necessary

manufacturing data and artwork for this test coupon can be acquired from the IPC online store

under the reference: IPC-A-52-English-D.

The test board shall be prepared by the preferred board supplier, using the same processes as

those intended for the user’s end-product.
---------------------- Page: 11 ----------------------
– 10 – IEC 61189-5-502:2021 © IEC 2021
5.1.2 Test coupon

The IPC B-52 printed circuit assembly consists of several components having test patterns

adjacent to, and beneath, the components. Prior to being subjected to conditioning the

components are soldered onto the board, using methodologies replicating as closely as possible

the proposed p
...

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