Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 2: General requirements for passive components

IEC TS 62686-2:2019 defines the minimum requirements for general purpose "off-the-shelf" COTS (commercial off-the-shelf) passive components for aerospace, defence and high performance (ADHP) applications. This document applies to all passive components that can be operated in ADHP applications within the manufacturers’ publicly available data sheet limits in conjunction with IEC TS 62239-1. This document can be used by other high performance and high reliability industries, at their discretion.
ADHP application requirements are not necessarily fulfilled by this document alone. ADHP original equipment manufacturers (OEMs) could consider redesigning their products or conducting further testing to verify suitability in ADHP applications using their procedures for satisfying their electronic component management plan (ECMP) (see IEC TS 62239-1).
This first edition cancels and replaces IEC PAS 62686-2 published in 2016.

General Information

Status
Published
Publication Date
29-Jan-2019
Current Stage
PPUB - Publication issued
Completion Date
30-Jan-2019
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IEC TS 62686-2
Edition 1.0 2019-01
TECHNICAL
SPECIFICATION
Process management for avionics – Electronic components for aerospace,
defence and high performance (ADHP) applications –
Part 2: General requirements for passive components
IEC TS 62686-2:2019-01(en)
---------------------- Page: 1 ----------------------
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IEC TS 62686-2
Edition 1.0 2019-01
TECHNICAL
SPECIFICATION
Process management for avionics – Electronic components for aerospace,
defence and high performance (ADHP) applications –
Part 2: General requirements for passive components
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 03.100.50; 31.020; 49.060 ISBN 978-2-8322-6247-4

Warning! Make sure that you obtained this publication from an authorized distributor.

® Registered trademark of the International Electrotechnical Commission
---------------------- Page: 3 ----------------------
– 2 – IEC TS 62686-2:2019 © IEC 2019
CONTENTS

FOREWORD ........................................................................................................................... 5

INTRODUCTION ..................................................................................................................... 7

1 Scope .............................................................................................................................. 8

2 Normative references ...................................................................................................... 8

3 Terms, definitions and abbreviated terms ........................................................................ 8

3.1 Terms and definitions .............................................................................................. 8

3.2 Abbreviated terms ................................................................................................. 11

4 Technical requirements ................................................................................................. 12

4.1 General ................................................................................................................. 12

4.1.1 Overview ....................................................................................................... 12

4.1.2 Equivalent methods ....................................................................................... 13

4.2 Procedures ........................................................................................................... 13

4.2.1 General ......................................................................................................... 13

4.2.2 Product discontinuance ................................................................................. 14

4.2.3 ESD protection during manufacture ............................................................... 14

4.2.4 Traceability .................................................................................................... 14

4.3 Shipment controls ................................................................................................. 14

4.3.1 General ......................................................................................................... 14

4.3.2 Unit pack container ........................................................................................ 14

4.3.3 Intermediate packing ..................................................................................... 14

4.3.4 Date codes .................................................................................................... 15

4.3.5 Moisture sensitivity level (MSL) ..................................................................... 15

4.3.6 Lead-free marking ......................................................................................... 15

4.3.7 Labels ........................................................................................................... 15

4.3.8 Electrostatic discharge (ESD) ........................................................................ 16

4.4 Product or process change notification (PCN) ....................................................... 16

4.4.1 General ......................................................................................................... 16

4.4.2 Notification .................................................................................................... 17

4.4.3 Notification details ......................................................................................... 17

4.5 Electrical ............................................................................................................... 17

4.5.1 General ......................................................................................................... 17

4.5.2 Electrical test ................................................................................................. 17

4.6 Mechanical ........................................................................................................... 17

4.6.1 General ......................................................................................................... 17

4.6.2 Device marking .............................................................................................. 18

4.6.3 Lead-free components ................................................................................... 18

4.6.4 Moisture sensitivity ........................................................................................ 18

4.6.5 Termination finishes ...................................................................................... 18

4.6.6 Termination finish notification of change ........................................................ 19

4.7 Audit capability ..................................................................................................... 19

4.7.1 General ......................................................................................................... 19

4.7.2 Internal quality audits .................................................................................... 19

4.7.3 Subcontract manufacturing ............................................................................ 19

4.8 Quality assurance ................................................................................................. 19

4.8.1 General ......................................................................................................... 19

4.8.2 Quality system ............................................................................................... 20

4.8.3 Sampling plans .............................................................................................. 20

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IEC TS 62686-2:2019 © IEC 2019 – 3 –

4.8.4 Failure analysis support ................................................................................. 20

4.8.5 Outgoing quality ............................................................................................ 20

4.9 Qualification .......................................................................................................... 20

4.9.1 General ......................................................................................................... 20

4.9.2 Methodology .................................................................................................. 21

4.9.3 Test samples ................................................................................................. 24

4.9.4 Qualification categories ................................................................................. 24

4.9.5 Maintenance of qualification standard ............................................................ 24

4.9.6 In-process test results ................................................................................... 25

4.9.7 Test references ............................................................................................. 25

4.9.8 Qualification report ........................................................................................ 25

4.9.9 Archiving ....................................................................................................... 25

4.9.10 Qualification of device changes ..................................................................... 25

4.9.11 Similarity assessment .................................................................................... 25

4.10 Product monitoring in the production line .............................................................. 26

4.10.1 General ......................................................................................................... 26

4.10.2 Monitoring programme ................................................................................... 26

4.10.3 Problem notification ....................................................................................... 26

4.10.4 Data reporting................................................................................................ 26

4.11 Environmental health and safety (EHS) ................................................................. 26

4.11.1 General ......................................................................................................... 26

4.11.2 General EHS compliance ............................................................................... 27

4.11.3 Device handling ............................................................................................. 27

4.11.4 Device materials and substances ................................................................... 27

Annex A (informative) Test code (TC) information for guidance ............................................ 28

A.1 General ................................................................................................................. 28

A.2 TC1 – Electrical test.............................................................................................. 28

A.3 TC2 – External visual ............................................................................................ 28

A.4 TC3 – Package dimensions ................................................................................... 29

A.5 TC4 – High temperature exposure (storage) ......................................................... 30

A.6 TC5 – Temperature cycling ................................................................................... 30

A.7 TC6 – Moisture resistance .................................................................................... 30

A.8 TC7 – Biased humidity .......................................................................................... 30

A.9 TC8 – High temperature operating life................................................................... 30

A.10 TC9 – Terminal strength (leaded) .......................................................................... 31

A.11 TC10-Resistance to solvents ................................................................................ 31

A.12 TC11 – Mechanical shock ..................................................................................... 31

A.13 TC12 – Vibration ................................................................................................... 31

A.14 TC13 – Resistance to heat .................................................................................... 31

A.15 TC14 – Thermal shock .......................................................................................... 32

A.16 TC15 – Board flex (SMD) ...................................................................................... 32

A.17 TC16 – Beam load ................................................................................................ 32

A.18 TC17 – Solderability ............................................................................................. 32

A.19 TC18 – Electrostatic discharge ............................................................................. 32

A.20 TC19 – Flammability ............................................................................................. 32

A.21 TC20 – Terminal strength (SMD) ........................................................................... 32

A.22 TC21 – Surge voltage ........................................................................................... 32

A.23 TC22 – Hermeticity ............................................................................................... 33

A.24 TC23 – Tin whisker ............................................................................................... 33

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– 4 – IEC TS 62686-2:2019 © IEC 2019

Annex B (informative) Typical IECQ-CECC approved components ....................................... 34

Annex C (informative) Typical USA military specified passive components........................... 36

Annex D (informative) Typical automotive components ........................................................ 37

Annex E (informative) Typical IEC specified passive components ........................................ 39

E.1 Typical IEC passive component specifications ...................................................... 39

E.2 IEC passive component environmental test methods ............................................. 39

Annex F (informative) Verification requirements matrix for IEC TS 62686-2 ......................... 46

Bibliography .......................................................................................................................... 55

Table 1 – Label requirements................................................................................................ 16

Table 2 – Internal quality audit areas .................................................................................... 19

Table 3 – Technology/family qualification and device qualification ........................................ 22

Table 4 – Qualification tests for device types ........................................................................ 23

Table D.1 – AEC-Q200 temperature grades .......................................................................... 37

Table E.1 – IEC passive specifications' environmental test methods compared to

those specified in Table 3 ..................................................................................................... 40

Table F.1 – Verification requirements matrix for IEC TS 62686-2 .......................................... 46

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IEC TS 62686-2:2019 © IEC 2019 – 5 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PROCESS MANAGEMENT FOR AVIONICS – ELECTRONIC
COMPONENTS FOR AEROSPACE, DEFENCE AND
HIGH PERFORMANCE (ADHP) APPLICATIONS –
Part 2: General requirements for passive components
FOREWORD

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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is

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9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of

patent rights. IEC shall not be held responsible for identifying any or all such patent rights.

The main task of IEC technical committees is to prepare International Standards. In

exceptional circumstances, a technical committee may propose the publication of a technical

specification when

• the required support cannot be obtained for the publication of an International Standard,

despite repeated efforts, or

• the subject is still under technical development or where, for any other reason, there is the

future but no immediate possibility of an agreement on an International Standard.

Technical specifications are subject to review within three years of publication to decide

whether they can be transformed into International Standards.

IEC TS 62686-2 which is a technical specification, has been prepared by IEC technical

committee 107: Process management for avionics.
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– 6 – IEC TS 62686-2:2019 © IEC 2019

This first edition cancels and replaces the first edition of IEC PAS 62686-2 published in 2016.

This edition constitutes a technical revision.
The text of this technical specification is based on the following documents:
Enquiry draft Report on voting
107/302/DTS 107/343/RVDTS

Full information on the voting for the approval of this technical specification can be found in

the report on voting indicated in the above table.

This document has been drafted in accordance with the ISO/IEC Directives, Part 2.

A list of all the parts in the IEC 62686 series, published under the general title Process

management for avionics – Electronic components for aerospace, defence and high
performance (ADHP) applications, can be found on the IEC website.

The committee has decided that the contents of this document will remain unchanged until the

stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to

the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.
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IEC TS 62686-2:2019 © IEC 2019 – 7 –
INTRODUCTION

This part IEC 62686 includes all the requirements of the obsolete STACK Specification

S/0003 issue 2 related to passive components and contains revisions for alternative

qualification test methods and additional test information for the aerosapace, defence and

high performance (ADHP) industries. This document is typically used in conjunction with

IEC TS 62239-1.

NOTE With the addition of alternative methods, it is possible for manufacturers to be audited by IECQ under the

new IECQ automotive scheme or IECQ approved component scheme.
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– 8 – IEC TS 62686-2:2019 © IEC 2019
PROCESS MANAGEMENT FOR AVIONICS – ELECTRONIC
COMPONENTS FOR AEROSPACE, DEFENCE AND
HIGH PERFORMANCE (ADHP) APPLICATIONS –
Part 2: General requirements for passive components
1 Scope

This part of IEC 62686 defines the minimum requirements for general purpose "off-the-shelf"

COTS (commercial off-the-shelf) passive components for aerospace, defence and high

performance (ADHP) applications.

This document applies to all passive components that can be operated in ADHP applications

within the manufacturers’ publicly available data sheet limits in conjunction with

IEC TS 62239-1. This document can be used by other high performance and high reliability

industries, at their discretion.

ADHP application requirements are not necessarily fulfilled by this document alone. ADHP

original equipment manufacturers (OEMs) could consider redesigning their products or

conducting further testing to verify suitability in ADHP applications using their procedures for

satisfying their electronic component management plan (ECMP) (see IEC TS 62239-1).

2 Normative references

The following documents are referred to in the text in such a way that some or all of their

content constitutes requirements of this document. For dated references, only the edition

cited applies. For undated references, the latest edition of the referenced document (including

any amendments) applies.
JESD48, Product discontinuance

J-STD-609B, Marking, symbols, and labels of leaded and lead-free terminal finished materials

used in electronic assembly
3 Terms, definitions and abbreviated terms
3.1 Terms and definitions
For the purposes of this document, the following terms and definitions apply.

ISO and IEC maintain terminological databases for use in standardization at the following

addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp.
3.1.1
calendar days, pl.
continuous days, including weekends and holidays
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IEC TS 62686-2:2019 © IEC 2019 – 9 –
3.1.2
container
outer shipping container consisting of one or more inner containers
3.1.3
data sheet

document prepared by the manufacturer that describes the electrical, mechanical, and

environmental characteristics of the component
3.1.4
deviation

user agreement to allow the delivery of a shipping lot which does not fully meet the

requirements of this document

Note 1 to entry: This is considered equivalent to concession for the purposes of this document.

3.1.5
device specification
document written by a user and agreed by the supplier
3.1.6
form

shape, size, dimensions, and other physically measurable parameters that uniquely

characterize a product
[SOURCE: IEC TS 62239-2:2017, 3.1.23]
3.1.7
fit
ability to physically interface or connect with
3.1.8
function
action or actions that a product is designed to perform
[SOURCE: IEC TS 62239-2:2017, 3.1.25]
3.1.9
incoming lot

one or more shipments of a device, grouped together for the purpose of incoming inspection

3.1.10
inner container
box or bag containing devices, either in magazines or bulk packaged
3.1.11
magazine
shipping container that feeds into automatic placement machines
EXAMPLE: Sticks, tubes, matrix trays, tape/reel, etc.
3.1.12
component
device

electrical or electronic device that is not subject to disassembly without destruction or

impairment of design use and is a small circuit having a high equivalent circuit element

density
---------------------- Page: 11 ----------------------
– 10 – IEC TS 62686-2:2019 © IEC 2019

Note 1 to entry: It is considered as a single part composed of interconnected elements on or within a single

substrate to perform an electronic circuit function.

Note 2 to entry: This excludes printed wiring boards/printed circuit boards, circuit card assemblies and modules

composed exclusively of discrete electronic components.
3.1.13
manufacturing lot
definite quantity of devices tracked at each manufacturing operation

Note 1 to entry: A manufacturing lot is associated with a travel log and constitutes a group homogeneously

processed through all manufacturing operations under uniform manufacturing conditions.

3.1.14
moisture sensitivity level
MSL

rating indicating a component’s susceptibility to damage due to absorbed moisture when

subjected to reflow soldering
3.1.15
original component manufacturer
OCM
company specifying and manufacturing the electronic component
[SOURCE: IEC TS 62668-1:2016, 3.1.13]
3.1.16
OEM
original equipment manufacturer

manufacturer which defines the electronic subassembly that includes the electronic

components or defines the components used in an assembly and/or test specification

[SOURCE: IEC TS 62668-1:2016, 3.1.14]
3.1.17
passive component

component that does not require electrical power to operate (for example not capable of

power gain)

Note 1 to entry: For the purposes of this document, the term ’passive’ is restricted to capacitors and resistors.

3.1.18
room temperature
temperature identified at 25 °C ± 5 °C in a room
3.1.19
shipping lot
single lot of one or more containers received by a user
3.1.20
supplier

company which provides to another an electronic component which is identified by the logo or

name marked on the device

Note 1 to entry: A supplier can be the OCM, a franchised distributor or agent, a non-franchised distributor,

broker, reseller, OEM, CEM and EMS etc.
[SOURCE: IEC TS 62686-1:2015, 3.1.19]
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IEC TS 62686-2:2019 © IEC 2019 – 11 –
3.1.21
termination

element of a component that connects it electrically and mechanically to the next level of

assembly
3.2 Abbreviated terms
AC alternating current
ADHP aerospace, defence and high performance
AEC Automotive Electronics Council
AOQ average out-going quality
AQEC aerospace qualified electronic component
AQL acceptable quality level
CB certification body
CECC CENELEC electronic components committee
CFC chlorofluorocarbon
COTS commercial off-the-shelf
...

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