IEC TR 61340-5-5:2018
(Main)Electrostatics - Part 5-5: Protection of electronic devices from electrostatic phenomena - Packaging systems used in electronic manufacturing
Electrostatics - Part 5-5: Protection of electronic devices from electrostatic phenomena - Packaging systems used in electronic manufacturing
IEC TR 61340-5-5:2018(E) discusses packaging material requirements for electrostatic discharge sensitive items (ESDS) as well as non–ESDS which can apply to packaging materials such as embossed carrier tape, trays, tubes (stick magazines), rails and others used in back end line processing and parts handling where test methods described in other standards are, for the most part, inadequate. Issues related to electrostatic charge generation, electrostatic attraction and repulsion are included. The recommendations and discussions within this document can also be applicable to other types of packaging that cannot be evaluated by other means.
This document discusses the issues related to
1) technical considerations for packaging material selection and packaging system design,
2) packaging material specifications for electrostatic control,
3) existing test methods and their limitations for packaging materials,
4) suggestions for the evaluation of small dimension packaging materials, and
5) industry common practices.
General Information
Standards Content (Sample)
IEC TR 61340-5-5 ®
Edition 1.0 2018-11
TECHNICAL
REPORT
colour
inside
Electrostatics –
Part 5-5: Protection of electronic devices from electrostatic phenomena –
Packaging systems used in electronic manufacturing
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IEC TR 61340-5-5 ®
Edition 1.0 2018-11
TECHNICAL
REPORT
colour
inside
Electrostatics –
Part 5-5: Protection of electronic devices from electrostatic phenomena –
Packaging systems used in electronic manufacturing
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 17.220.99; 29.020 ISBN 978-2-8322-6255-9
– 2 – IEC TR 61340-5-5:2018 © IEC 2018
CONTENTS
FOREWORD . 5
INTRODUCTION . 7
1 Scope . 8
2 Normative references . 8
3 Terms, definitions and abbreviated terms . 8
3.1 Terms and definitions . 8
3.2 Abbreviated terms . 9
4 Role of electrostatic protective packaging . 10
4.1 Analysis of electrostatic risks (what can cause problems to ESDS) . 10
4.2 Charge generation (separation) . 10
4.3 Reduction of electrostatic charging items in the environment . 13
4.4 Electrostatic attraction and repulsion issues . 13
4.5 Dissipation of electrostatic charge. 14
4.6 Barrier to ESD current . 14
4.7 Protection against electrostatic fields . 14
4.8 Chemical and outgassing issues . 14
4.9 Moisture barrier . 15
4.10 Environmental conditions affecting packaging materials . 15
4.11 Packaging material principles. 15
4.11.1 General . 15
4.11.2 Low charging . 15
4.11.3 Electrostatic charge dissipation . 15
4.11.4 Conductive materials . 16
4.11.5 Electrostatic field shielding . 16
4.11.6 Electrostatic discharge shielding . 16
5 Types of material . 16
5.1 Filled polymers . 16
5.2 Intrinsically conductive or dissipative . 17
5.3 Surface coated . 17
5.4 Antistat treated . 17
5.5 Anodized materials (e.g. boats used inside automated handlers, metal tubes)
............................................................................................................................. 17
5.6 Material processing . 17
5.6.1 Vacuum forming. 17
5.6.2 Injection moulding . 17
5.6.3 Embossing . 18
5.6.4 Vacuum vapour deposition . 18
5.6.5 Surface coating . 18
5.6.6 Lamination . 18
6 Existing standards for packaging materials . 18
6.1 IEC 61340-5-3 . 18
6.2 ANSI/ESD S541 . 18
6.3 Military standards and other documents related to packaging . 19
6.3.1 General . 19
6.3.2 MIL PRF 81705 (E) (Film) . 19
6.3.3 MIL STD 3010 . 19
6.3.4 MIL PRF 131 . 19
7 Existing test methods for packaging materials . 19
7.1 IEC 61340-2-1 – Ability of materials and products to dissipate static electric
charge . 19
7.2 IEC TR 61340-2-2 – Measurement of chargeability . 20
7.3 IEC 61340-2-3 – Resistance and resistivity . 20
7.4 IEC 61340-4-8 – Discharge shielding – Bags . 20
8 Choosing a packaging technology . 21
8.1 Determining packaging material attributes . 21
8.2 Inside an EPA . 21
8.3 Outside an EPA or between EPAs . 21
8.4 Evaluation of packaging system attributes . 21
8.5 Charge dissipation test methods . 21
8.6 Resistance measurement methods . 21
8.7 Shielding test . 22
9 Does the packaging system meet the intended purpose? . 22
10 New test method concepts and development plans . 22
10.1 General . 22
10.2 Single point probe . 23
10.3 Parallel plates . 23
10.4 Pin-point probe . 24
10.5 Shielding related test methods . 24
10.6 Charge generation – Triboelectrification test methods . 24
10.7 Triboelectric charging of cover tape . 26
10.8 Discharge evaluation method . 27
10.9 Other resistance test methods . 27
Annex A (informative) Packaging forms and types . 28
A.1 Packaging materials for electronic devices . 28
A.2 Embossed tape . 28
A.3 Cover tape . 28
A.4 Reel types and materials . 29
A.5 Injection moulded trays . 30
A.6 Tubes and rails and other configurations of packaging materials . 31
A.7 Clam shell and test socket . 32
A.8 Bags . 32
A.9 Tote boxes and other rigid containers . 33
Bibliography . 34
Figure 1 – Induction charging process – Grounding a conductor in the presence of an
electrical field . 11
Figure 2 – Second part of induction charging process . 12
Figure 3 – First discharge pulse that occurs as shown in Figure 1b . 12
Figure 4 – Second discharge pulse that occurs as shown in Figure 2 . 12
Figure 5 – Single point probe test method set–up . 23
Figure 6 – Single point probe on embossed (pocket) tape . 23
Figure 7 – Parallel plate test method set–up . 24
Figure 8 – Set–up of isolated tape reels . 25
– 4 – IEC TR 61340-5-5:2018 © IEC 2018
Figure 9 – Resistance measurements – Reel to reel . 25
...
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