IEC TR 61340-5-5:2018

Electrostatics - Part 5-5: Protection of electronic devices from electrostatic phenomena - Packaging systems used in electronic manufacturing

IEC TR 61340-5-5:2018(E) discusses packaging material requirements for electrostatic discharge sensitive items (ESDS) as well as non–ESDS which can apply to packaging materials such as embossed carrier tape, trays, tubes (stick magazines), rails and others used in back end line processing and parts handling where test methods described in other standards are, for the most part, inadequate. Issues related to electrostatic charge generation, electrostatic attraction and repulsion are included. The recommendations and discussions within this document can also be applicable to other types of packaging that cannot be evaluated by other means.
This document discusses the issues related to
1) technical considerations for packaging material selection and packaging system design,
2) packaging material specifications for electrostatic control,
3) existing test methods and their limitations for packaging materials,
4) suggestions for the evaluation of small dimension packaging materials, and
5) industry common practices.

General Information

• Status: Published
• Publication Date: 27-Nov-2018
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 17.220.99 - Other standards related to electricity and magnetism
• ICS: 29.020 - Electrical engineering in general
• Technical Committee: TC 101 - Electrostatics
• Current Stage: PPUB - Publication issued
• Completion Date: 28-Nov-2018

Standards Content (sample)

IEC TR 61340-5-5
Edition 1.0 2018-11
TECHNICAL
REPORT
colour
inside
Electrostatics –
Part 5-5: Protection of electronic devices from electrostatic phenomena –
Packaging systems used in electronic manufacturing
IEC TR 61340-5-5:2018-11(en)
---------------------- Page: 1 ----------------------
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IEC TR 61340-5-5
Edition 1.0 2018-11
TECHNICAL
REPORT
colour
inside
Electrostatics –
Part 5-5: Protection of electronic devices from electrostatic phenomena –
Packaging systems used in electronic manufacturing
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 17.220.99; 29.020 ISBN 978-2-8322-6255-9

Warning! Make sure that you obtained this publication from an authorized distributor.

® Registered trademark of the International Electrotechnical Commission
---------------------- Page: 3 ----------------------
– 2 – IEC TR 61340-5-5:2018 © IEC 2018
CONTENTS

FOREWORD ........................................................................................................................... 5

INTRODUCTION ..................................................................................................................... 7

1 Scope .............................................................................................................................. 8

2 Normative references ...................................................................................................... 8

3 Terms, definitions and abbreviated terms ........................................................................ 8

3.1 Terms and definitions .............................................................................................. 8

3.2 Abbreviated terms ................................................................................................... 9

4 Role of electrostatic protective packaging ...................................................................... 10

4.1 Analysis of electrostatic risks (what can cause problems to ESDS) ....................... 10

4.2 Charge generation (separation) ............................................................................ 10

4.3 Reduction of electrostatic charging items in the environment ................................ 13

4.4 Electrostatic attraction and repulsion issues ......................................................... 13

4.5 Dissipation of electrostatic charge......................................................................... 14

4.6 Barrier to ESD current ........................................................................................... 14

4.7 Protection against electrostatic fields .................................................................... 14

4.8 Chemical and outgassing issues ........................................................................... 14

4.9 Moisture barrier .................................................................................................... 15

4.10 Environmental conditions affecting packaging materials ........................................ 15

4.11 Packaging material principles................................................................................ 15

4.11.1 General ......................................................................................................... 15

4.11.2 Low charging ................................................................................................. 15

4.11.3 Electrostatic charge dissipation ..................................................................... 15

4.11.4 Conductive materials ..................................................................................... 16

4.11.5 Electrostatic field shielding ............................................................................ 16

4.11.6 Electrostatic discharge shielding .................................................................... 16

5 Types of material ........................................................................................................... 16

5.1 Filled polymers ..................................................................................................... 16

5.2 Intrinsically conductive or dissipative .................................................................... 17

5.3 Surface coated ...................................................................................................... 17

5.4 Antistat treated ..................................................................................................... 17

5.5 Anodized materials (e.g. boats used inside automated handlers, metal tubes)

............................................................................................................................. 17

5.6 Material processing ............................................................................................... 17

5.6.1 Vacuum forming............................................................................................. 17

5.6.2 Injection moulding ......................................................................................... 17

5.6.3 Embossing ..................................................................................................... 18

5.6.4 Vacuum vapour deposition ............................................................................. 18

5.6.5 Surface coating ............................................................................................. 18

5.6.6 Lamination ..................................................................................................... 18

6 Existing standards for packaging materials .................................................................... 18

6.1 IEC 61340-5-3 ...................................................................................................... 18

6.2 ANSI/ESD S541 .................................................................................................... 18

6.3 Military standards and other documents related to packaging ............................... 19

6.3.1 General ......................................................................................................... 19

6.3.2 MIL PRF 81705 (E) (Film) .............................................................................. 19

6.3.3 MIL STD 3010 ............................................................................................... 19

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IEC TR 61340-5-5:2018 © IEC 2018 – 3 –

6.3.4 MIL PRF 131 ................................................................................................. 19

7 Existing test methods for packaging materials ............................................................... 19

7.1 IEC 61340-2-1 – Ability of materials and products to dissipate static electric

charge .................................................................................................................. 19

7.2 IEC TR 61340-2-2 – Measurement of chargeability ............................................... 20

7.3 IEC 61340-2-3 – Resistance and resistivity ........................................................... 20

7.4 IEC 61340-4-8 – Discharge shielding – Bags ........................................................ 20

8 Choosing a packaging technology ................................................................................. 21

8.1 Determining packaging material attributes ............................................................ 21

8.2 Inside an EPA ....................................................................................................... 21

8.3 Outside an EPA or between EPAs ......................................................................... 21

8.4 Evaluation of packaging system attributes ............................................................ 21

8.5 Charge dissipation test methods ........................................................................... 21

8.6 Resistance measurement methods ........................................................................ 21

8.7 Shielding test ........................................................................................................ 22

9 Does the packaging system meet the intended purpose? ............................................... 22

10 New test method concepts and development plans ........................................................ 22

10.1 General ................................................................................................................. 22

10.2 Single point probe ................................................................................................. 23

10.3 Parallel plates ....................................................................................................... 23

10.4 Pin-point probe ..................................................................................................... 24

10.5 Shielding related test methods .............................................................................. 24

10.6 Charge generation – Triboelectrification test methods ........................................... 24

10.7 Triboelectric charging of cover tape ...................................................................... 26

10.8 Discharge evaluation method ................................................................................ 27

10.9 Other resistance test methods .............................................................................. 27

Annex A (informative) Packaging forms and types ............................................................... 28

A.1 Packaging materials for electronic devices ............................................................ 28

A.2 Embossed tape ..................................................................................................... 28

A.3 Cover tape ............................................................................................................ 28

A.4 Reel types and materials ....................................................................................... 29

A.5 Injection moulded trays ......................................................................................... 30

A.6 Tubes and rails and other configurations of packaging materials ........................... 31

A.7 Clam shell and test socket .................................................................................... 32

A.8 Bags ..................................................................................................................... 32

A.9 Tote boxes and other rigid containers ................................................................... 33

Bibliography .......................................................................................................................... 34

Figure 1 – Induction charging process – Grounding a conductor in the presence of an

electrical field ....................................................................................................................... 11

Figure 2 – Second part of induction charging process ........................................................... 12

Figure 3 – First discharge pulse that occurs as shown in Figure 1b ....................................... 12

Figure 4 – Second discharge pulse that occurs as shown in Figure 2 .................................... 12

Figure 5 – Single point probe test method set–up ................................................................. 23

Figure 6 – Single point probe on embossed (pocket) tape ..................................................... 23

Figure 7 – Parallel plate test method set–up ......................................................................... 24

Figure 8 – Set–up of isolated tape reels ................................................................................ 25

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– 4 – IEC TR 61340-5-5:2018 © IEC 2018

Figure 9 – Resistance measurements – Reel to reel ............................................................. 25

Figure 10 – Charge drain test – Reel to reel.......................................................................... 26

Figure 11 – Cover tape evaluation concepts ......................................................................... 26

Figure 12 – Discharge evaluation method ............................................................................. 27

Figure A.1 – Examples of embossed (pocket) tape................................................................ 28

Figure A.2 – Cover tape ........................................................................................................ 29

Figure A.3 – Cover tape ........................................................................................................ 29

Figure A.4 – Cover tape ........................................................................................................ 29

Figure A.5 – Cover tape ........................................................................................................ 29

Figure A.6 – Cover tape ........................................................................................................ 29

Figure A.7 – Cover tape ........................................................................................................ 29

Figure A.8 – Cover tape ........................................................................................................ 29

Figure A.9 – Reels ................................................................................................................ 30

Figure A.10 – Reels .............................................................................................................. 30

Figure A.11 – Reels .............................................................................................................. 30

Figure A.12 – Reels .............................................................................................................. 30

Figure A.13 – Trays .............................................................................................................. 30

Figure A.14 – Trays .............................................................................................................. 30

Figure A.15 –Trays ............................................................................................................... 30

Figure A.16 – Trays .............................................................................................................. 31

Figure A.17– Trays ............................................................................................................... 31

Figure A.18 –Trays ............................................................................................................... 31

Figure A.19 – Trays .............................................................................................................. 31

Figure A.20 – Trays .............................................................................................................. 31

Figure A.21 – Trays .............................................................................................................. 31

Figure A.22 –Trays ............................................................................................................... 31

Figure A.23 – Trays .............................................................................................................. 31

Figure A.24 – Tubes ............................................................................................................. 32

Figure A.25 – Tubes ............................................................................................................. 32

Figure A.26 Tubes ............................................................................................................... 32

Figure A.27 –Clam shells ...................................................................................................... 32

Figure A.28 – Static discharge shielding bag ........................................................................ 33

Figure A.29 Moisture barrier – Metal foil bags ....................................................................... 33

Figure A.30 – Moisture barrier – Metal vapour deposition ..................................................... 33

Figure A.31 – Box ................................................................................................................. 33

Figure A.32 – Rigid container ................................................................................................ 33

Table 1 – Test methods for electrostatic protective packaging .............................................. 22

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IEC TR 61340-5-5:2018 © IEC 2018 – 5 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
ELECTROSTATICS –
Part 5-5: Protection of electronic devices from electrostatic phenomena –
Packaging systems used in electronic manufacturing
FOREWORD

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The main task of IEC technical committees is to prepare International Standards. However, a

technical committee may propose the publication of a Technical Report when it has collected

data of a different kind from that which is normally published as an International Standard, for

example "state of the art".

IEC TR 61340-5-5, which is a Technical Report, has been prepared by IEC technical

committee 101: Electrostatics and IEC technical committee 40: Capacitors and resistors for

electronic equipment.
The text of this Technical Report is based on the following documents:
Draft TR Report on voting
101/564/DTR 101/575/RVDTR

Full information on the voting for the approval of this Technical Report can be found in the

report on voting indicated in the above table.
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– 6 – IEC TR 61340-5-5:2018 © IEC 2018

This document has been drafted in accordance with the ISO/IEC Directives, Part 2.

A list of all parts in the IEC 61340 series, published under the general title Electrostatics, can

be found on the IEC website.

The committee has decided that the contents of this document will remain unchanged until the

stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to

the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
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IEC TR 61340-5-5:2018 © IEC 2018 – 7 –
INTRODUCTION

Packaging materials used within an electrostatic discharge (ESD) control programme often

are defined by an electrical resistance measurement. Packaging material manufacturers rely

on industry standardized test methods to ensure that the materials they supply meet industry

defined specifications. However, other attributes provided by a packaging material often are

difficult to quantify, leading to confusion between packaging material manufacturers and the

end users.

Increased use of automated handling equipment for the manufacture of electronic products

has resulted in changes in the design and form of packaging materials that contain electronic

parts and components. In particular, very small profile parts such as surface mount resistors

and capacitors are contained within pocket tape reels that are unloaded by automatic

equipment. Small dimension parts require small dimension packaging materials. Small

dimension packaging materials cannot be evaluated for electrical properties by the existing

industry accepted test methods.

Several types of packaging are used within the electronics industries that do not have the

basic properties generally associated with electrostatic control, such as paper tape. Industry

best practices involving these standard packaging material forms are discussed. Other forms

of packaging for non-ESDS (electrostatic discharge sensitive items) that are brought into the

ESD protected area (EPA) and considerations for handling such packaging forms are

described. This document has been prepared by a joint working group so that the

considerations of electrostatics and the application of protective measures are compatible

with the concerns of those who provide or use small dimension electronic components.

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– 8 – IEC TR 61340-5-5:2018 © IEC 2018
ELECTROSTATICS –
Part 5-5: Protection of electronic devices from electrostatic phenomena –
Packaging systems used in electronic manufacturing
1 Scope

This part of IEC 61340 discusses packaging material requirements for electrostatic discharge

sensitive items (ESDS) as well as non–ESDS which can apply to packaging materials such as

embossed carrier tape, trays, tubes (stick magazines), rails and others used in back end line

processing and parts handling where test methods described in other standards are, for the

most part, inadequate. Issues related to electrostatic charge generation, electrostatic

attraction and repulsion are included. The recommendations and discussions within this

document can also be applicable to other types of packaging that cannot be evaluated by

other means.
This document discusses the issues related to

1) technical considerations for packaging material selection and packaging system design,

2) packaging material specifications for electrostatic control,
3) existing test methods and their limitations for packaging materials,
4) suggestions for the evaluation of small dimension packaging materials, and
5) industry common practices.
2 Normative references
There are no normative references in this document.
3 Terms, definitions and abbreviated terms
3.1 Terms and definitions
For the purposes of this document, the following terms and definitions apply.

ISO and IEC maintain terminological databases for use in standardization at the following

addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1.1
electrostatic protective packaging

containers and other enclosures that have properties and functionality to limit electrostatic

charge generation, dissipate electrostatic charge, or limit interior electrostatic fields

3.1.2
intimate packaging
materials that come into direct contact with ESD sensitive items
3.1.3
proximity packaging
materials or items that cover or surround intimate packaging materials
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IEC TR 61340-5-5:2018 © IEC 2018 – 9 –
3.1.4
conductive material

material with surface or volume conductive properties generally specified by electrical

resistance lower than dissipative materials
3.1.5
dissipative material

material with surface or volume conductive properties with an electrical resistance greater

than conductive materials but less than insulative materials
3.1.6
insulative material

material with electrical resistance high enough to impede charge flow to some degree

3.1.7
low charging
antistatic

property of a material that limits electrostatic charge transfer by contact and separation

(triboelectrification)
3.1.8
surface resistance

ratio of DC voltage to the current flowing between two electrodes of specified configuration

that contact the same side of a material
Note 1 to entry: Surface resistance is expressed in Ω.
3.1.9
surface
...