ISO 11855-3:2021/Amd 1:2023

Building environment design — Embedded radiant heating and cooling systems — Part 3: Design and dimensioning — Amendment 1

Conception de l'environnement des bâtiments — Systèmes intégrés de chauffage et de refroidissement par rayonnement — Partie 3: Conception et dimensionnement — Amendement 1

General Information

• Status: Published
• Publication Date: 15-Oct-2023
• ICS: 91.040.01 - Buildings in general
• Technical Committee: ISO/TC 205 - Building environment design
• Drafting Committee: ISO/TC 205 - Building environment design
• Current Stage: 6060 - International Standard published
• Start Date: 16-Oct-2023
• Due Date: 22-Sep-2023
• Completion Date: 16-Oct-2023

Relations

• Consolidates: ISO 5323:2019 - Wood flooring and parquet — Vocabulary
• Effective Date: 06-Jun-2022
• Amends: ISO 11855-3:2021 - Building environment design — Embedded radiant heating and cooling systems — Part 3: Design and dimensioning
• Effective Date: 06-Jun-2022

Standards Content (Sample)

INTERNATIONAL ISO
STANDARD 11855-3
Second edition
2021-08
AMENDMENT 1
2023-10
Building environment design —
Embedded radiant heating and cooling
systems —
Part 3:
Design and dimensioning
AMENDMENT 1
Conception de l'environnement des bâtiments — Systèmes intégrés de
chauffage et de refroidissement par rayonnement —
Partie 3: Conception et dimensionnement
AMENDEMENT 1
Reference number
ISO 11855-3:2021/Amd.1:2023(E)
ISO 11855-3:2021/Amd.1:2023(E)
© ISO 2023
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ii
ISO 11855-3:2021/Amd.1:2023(E)
Foreword
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This document was prepared by Technical Committee ISO/TC 205, Building environment design, in
collaboration with the European Committee for Standardization (CEN) Technical Committee CEN/TC
228, Heating systems and water based cooling systems in buildings, in accordance with the Agreement on
technical cooperation between ISO and CEN (Vienna Agreement).
Any feedback or questions on this document should be directed to the user’s national standards body. A
complete listing of these bodies can be found at www.iso.org/members.html.
iii
ISO 11855-3:2021/Amd.1:2023(E)
Building environment design — Embedded radiant heating
and cooling systems —
Part 3:
Design and dimensioning
AMENDMENT 1
5.1.4
Modify to the following:
The field of characteristic curves of a floor heating system with a specific pipe spacing W shall at least
contain the characteristic curves for values of the thermal resistance of surface covering R = 0,
λ,B
R = 0,05, R = 0,10 and R = 0,15 (m K/W), in accordance with ISO 11855-2 (see Figure 1). In order
λ,B λ,B λ,B
to apply values of R > 0,15 (m K/W), it is possible only when the values are verified.
λ,B
5.1.5 Figure 1
Modify to the following:
ISO 11855-3:2021/Amd.1:2023(E)
Key
X Δθ K
H
Y q W/m
1 limit curves
2 performance characteristic curves
a
Peripheral area.
b
Occupied area.
Figure 1 — Field of characteristic curves, including limit curves for floor heating, for constant
pipe spacing
5.1.6
Modify to the following:
In order to limit the heat flow through the floor towards the space below, the required back-side
thermal resistance of the insulating layer R shall be specified in the design to be not lower than the
λ,ins
value in ISO 11855-5:2021, 5.1.2.3.2.
For systems which have a flat insulating layer (system types I, II and IV in ISO 11855-1), the back-side
thermal resistance of the insulating layer R is calculated by Formula (7) where there is no stud
λ,ins
and the effective thickness of thermal insulating layer s is identical to the thickness of the thermal
ins
insulating panel and the effective thermal conductivity of the thermal insulation layer λ is calculated
ins
by Formula (8) where there are studs.
s
ins
R = (7)
λ,ins
λ
ins
ISO 11855-3:2021/Amd.1:2023(E)
ll−
l
pws
ws
λλ= +λ (8)
insi ws
l l
ps ps
ISO 11855-3:2021/Amd.1:2023(E)
where
λ is thermal conductivity of the thermal insulation layer between the studs;
i
λ is thermal conductivity of the stud;
ws
l is the distance between the studs (see Figure 2);
ps
l is the thickness of the stud (see Figure 2).
ws
Depending on the construction of the floor heating system, the effective thickness of thermal insulating
layer s and effective thermal conductivity of the thermal insulation layer λ are determined
ins ins
differently.
For floor heati
...