ISO/IEC 10373-6:2020/Amd 1:2021
(Amendment)Cards and security devices for personal identification — Test methods — Part 6: Contactless proximity objects — Amendment 1: Dynamic power level management
Cards and security devices for personal identification — Test methods — Part 6: Contactless proximity objects — Amendment 1: Dynamic power level management
Cartes et dispositifs de sécurité pour l'identification personnelle — Méthodes d'essai — Partie 6: Objets sans contact de proximité — Amendement 1: Gestion dynamique de niveau de puissance
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INTERNATIONAL ISO/IEC
STANDARD 10373-6
Fourth edition
2020-07
AMENDMENT 1
2021-05
Cards and security devices for
personal identification — Test
methods —
Part 6:
Contactless proximity objects
AMENDMENT 1: Dynamic power level
management
Cartes et dispositifs de sécurité pour l'identification personnelle —
Méthodes d'essai —
Partie 6: Objets sans contact de proximité
AMENDEMENT 1: Gestion dynamique de niveau de puissance
Reference number
ISO/IEC 10373-6:2020/Amd.1:2021(E)
©
ISO/IEC 2021
---------------------- Page: 1 ----------------------
ISO/IEC 10373-6:2020/Amd.1:2021(E)
COPYRIGHT PROTECTED DOCUMENT
© ISO/IEC 2021
All rights reserved. Unless otherwise specified, or required in the context of its implementation, no part of this publication may
be reproduced or utilized otherwise in any form or by any means, electronic or mechanical, including photocopying, or posting
on the internet or an intranet, without prior written permission. Permission can be requested from either ISO at the address
below or ISO’s member body in the country of the requester.
ISO copyright office
CP 401 • Ch. de Blandonnet 8
CH-1214 Vernier, Geneva
Phone: +41 22 749 01 11
Email: copyright@iso.org
Website: www.iso.org
Published in Switzerland
ii © ISO/IEC 2021 – All rights reserved
---------------------- Page: 2 ----------------------
ISO/IEC 10373-6:2020/Amd.1:2021(E)
Foreword
ISO (the International Organization for Standardization) and IEC (the International Electrotechnical
Commission) form the specialized system for worldwide standardization. National bodies that are
members of ISO or IEC participate in the development of International Standards through technical
committees established by the respective organization to deal with particular fields of technical
activity. ISO and IEC technical committees collaborate in fields of mutual interest. Other international
organizations, governmental and non-governmental, in liaison with ISO and IEC, also take part in the
work.
The procedures used to develop this document and those intended for its further maintenance are
described in the ISO/IEC Directives, Part 1. In particular, the different approval criteria needed for
the different types of document should be noted. This document was drafted in accordance with the
editorial rules of the ISO/IEC Directives, Part 2 (see www .iso .org/ directives or www .iec .ch/ members
_experts/ refdocs).
Attention is drawn to the possibility that some of the elements of this document may be the subject
of patent rights. ISO and IEC shall not be held responsible for identifying any or all such patent
rights. Details of any patent rights identified during the development of the document will be in the
Introduction and/or on the ISO list of patent declarations received (see www .iso .org/ patents) or the IEC
list of patent declarations received (see patents.iec.ch).
Any trade name used in this document is information given for the convenience of users and does not
constitute an endorsement.
For an explanation of the voluntary nature of standards, the meaning of ISO specific terms and
expressions related to conformity assessment, as well as information about ISO's adherence to the
World Trade Organization (WTO) principles in the Technical Barriers to Trade (TBT) see www .iso .org/
iso/ foreword .html. In the IEC, see www .iec .ch/ understanding -standards.
This document was prepared by Joint Technical Committee ISO/IEC JTC 1, Information technology,
Subcommittee SC 17, Cards and security devices for personal identification.
A list of all parts in the ISO/IEC 10373 series can be found on the ISO website.
Any feedback or questions on this document should be directed to the user’s national standards body. A
complete listing of these bodies can be found at www .iso .org/ members .html and www .iec .ch/ national
-committees.
© ISO/IEC 2021 – All rights reserved iii
---------------------- Page: 3 ----------------------
ISO/IEC 10373-6:2020/Amd.1:2021(E)
Cards and security devices for personal identification —
Test methods —
Part 6:
Contactless proximity objects
AMENDMENT 1: Dynamic power level management
Page 3, 3.2
Add the following symbols:
"H PCD field strength during power level management test procedures"
0
Page 7, 4.7, Table 3
Add the following two rows after the row for "Optional PICC classes":
"
Parameter Description Unit
Ability to change power level (and therefore field strength) after re-
Support of PLI handling
ATQ
ceiving PLI from a PICC
ATQ
Ability to change power level (and therefore field strength) after re-
Support of PLI handling
CID
ceiving PLI from a PICC
CID
"
Page 8, 4.8, Table 6
Replace Table 6 with the following table:
"
Table 6 — PICC manufacturer information
Parameter Description Unit
Location, center and size of the Drawing with dimensions of the PICC outside shape and the posi-
antenna tion of the external rectangle/circle of the claimed PICC class.
a
PICC class (optional) Claimed PICC class
Resonance frequency range (op-
Minimum and maximum resonance frequency MHz
tional)
Supported communication signal interface(s):
— Type A
Communication signal interface
— Type B
— Type A and Type B
a
If not provided, test methods for Class 1 shall be used
© ISO/IEC 2021 – All rights reserved 1
---------------------- Page: 4 ----------------------
ISO/IEC 10373-6:2020/Amd.1:2021(E)
Table 6 (continued)
Parameter Description Unit
Temperature range Minimum and maximum temperature values °C
Supported PLI values List of supported optional PLI values in Answer to Request
ATQ ATQ
Supported PLI values List of supported optional PLI values in CID field
CID CID
PCD to PICC supported bit rates List of supported optional PCD to PICC bit rates
PICC to PCD supported bit rates List of supported optional PICC to PCD bit rates
Indication if only same bit rate from PCD to PICC and from PICC to
Same bit rate for both directions
PCD is supported
Random or fixed UID (Type A) or Indication whether the UID (Type A) or PUPI (Type B) is random or
PUPI (Type B) fixed
Maximum frame size supported Maximum frame size in reception bytes
PCD to PICC frame with error cor- Frame with error correction from PCD to PICC
rection supported
PICC to PCD frame with error cor- Frame with error correction from PICC to PCD
rection supported
TEST_COMMAND_SEQUENCE1 See O.2.1
TEST_COMMAND1 See O.2.1
TEST_COMMAND2 See O.2.1
TEST_COMMAND3 See O.2.1
TEST_COMMAND4 See O.2.1
a
If not provided, test methods for Class 1 shall be used
"
Page 38, 7.1.9
Add the following subclause after 7.1.8.3:
"
7.1.9 Procedures for PCD supporting optional PLI or PLI handling
ATQ CID
7.1.9.1 Scope
These tests apply only to PCDs which support PLI or PLI handling.
ATQ CID
If the PCD supports optional PLI or PLI handling, the additional procedures specified in 7.1.9.2,
ATQ CID
7.1.9.3, 7.1.9.4 and H.5 shall be used to verify that, for every power level used by the PCD:
a) the PCD complies with the field strength requirements specified in ISO/IEC 14443-2:2020/Amd 1,
ISO/IEC 14443-3:2018/Amd 1 and ISO/IEC 14443-4:2018/Amd 1;
b) the PCD complies with modulation index and waveform requirements specified in ISO/IEC 14443-2;
c) the PCD complies with load modulation reception requirements specified in ISO/IEC 14443-2;
d) the PCD complies with EMD immunity requirements specified in ISO/IEC 14443-2.
7.1.9.2 Modulation index and waveform
The steps c) to g) of the procedure specified in 7.1.4.2 shall be repeated for every power level between
minimum and maximum power level obtained by PLI or PLI .
ATQ CID
For each power level, the test report shall be as specified in 7.1.4.3.
2 © ISO/IEC 2021 – All rights reserved
---------------------- Page: 5 ----------------------
ISO/IEC 10373-6:2020/Amd.1:2021(E)
7.1.9.3 Load modulation reception
The procedures specified in 7.1.6.5 and 7.1.6.6 shall be repeated for every power level between
minimum and maximum power level obtained by PLI or PLI .
ATQ CID
For each power level, the test report shall be as specified in 7.1.6.7.
7.1.9.4 PCD EMD immunity test
The steps b) to l) of the procedure specified in 7.1.8.2 shall be repeated for every power level between
minimum and maximum power level obtained by PLI or PLI .
ATQ CID
For each power level, the test report shall be as specified in 7.1.8.3.
"
Page 38, 7.2.1.1
Replace the text with the following:
"The purpose of this test is to verify that the load modulation amplitude V of the PICC and the phase
LMA
parameters Ø and Ø of the PICC conform to ISO/IEC 14443-2 for all mandatory and
LM, INTER LM, INTRA
supported optional PICC to PCD bit rates within the operating field range [H respectively H if the
min LP
PICC supports PLI or PLI , H ]."
ATQ CID max
Page 40, 7.2.2.1
Replace the text with the following:
"The purpose of this test is to determine that the PICC does not generate an electromagnetic disturbance
amplitude V higher than V during t with the exceptions defined in ISO/IEC 14443-2 within
EMD E, PICC E, PICC
the operating field range [H respectively H if the PICC supports PLI or PLI , H ] as specified
min LP ATQ CID max
in ISO/IEC 14443-2 for all supported PICC to PCD bit rates.
NOTE 1 The low EMD time t is a function of FDT/TR0 as defined in ISO/IEC 14443-3:2018, 8.2.
E, PICC
NOTE 2 The EMD limit V is a function of the field strength.
E, PICC
"
Page 41, 7.2.3.1
Replace the text with the following:
"The purpose of this test is to verify the ability of the PICC to receive the PCD commands within the
operating field range [H respectively H if the PICC supports PLI or PLI , H ] as specified in
min LP ATQ CID max
ISO/IEC 14443-2 for all supported PCD to PICC bit rates."
Page 45, 7.2.5.1
Replace the text with the following:
"This test is used to measure the PICC loading effect at the minimum operating field strength H
min
respectively H if the PICC supports PLI or PLI as specified in ISO/IEC 14443-2."
LP ATQ CID
© ISO/IEC 2021 – All rights reserved 3
---------------------- Page: 6 ----------------------
ISO/IEC 10373-6:2020/Amd.1:2021(E)
Page 45, 7.2.5.2
rd
Add the following paragraph after the 3 paragraph:
"If the PICC supports PLI or PLI , the test shall be repeated at a field strength of H , with the
ATQ CID LP
Reference PICC having R2 value, or alternatively the applied voltage on CON2, set for a field strength of
H ."
LP
Page 46, 7.2.6.1
Replace the text with the following:
"This test verifies that the PICC operates as intended within the operating field range [H respectively
min
H if the PICC supports PLI or PLI , H ] as specified in ISO/IEC 14443-2 for all supported PCD to
LP ATQ CID max
PICC bit rates."
Page 47, 7.2.7
Add the following subclause after 7.2.6.4:
"
7.2.7 Procedures for PICC supporting optional PLI or PLI values
ATQ CID
7.2.7.1 Scope
These tests apply only to PICCs which support PLI or PLI values.
ATQ CID
If the PICC supports optional PLI or PLI values, the additional procedures specified in 7.2.1, 7.2.2,
ATQ CID
7.2.3, 7.2.5 and 7.2.6 and the additional procedures specified in 7.2.7.2 to 7.2.7.4 shall be used to verify
that:
a) the PICC complies with the requirements specified in ISO/IEC 14443-2:2020/Amd 1,
ISO/IEC 14443-3:2018/Amd 1 and ISO/IEC 14443-4:2018/Amd 1;
b) the PICC complies with the transmission requirements specified in ISO/IEC 14443-2 for a field
strength of H ;
LP
c) the PICC complies with the EMD level and low EMD time requirements specified in ISO/IEC 14443-2
and ISO/IEC 14443-3 for a field strength of H ;
LP
d) the PICC complies with the reception requirements specified in ISO/IEC 14443-2 for a field strength
of H ;
LP
e) the PICC complies with the maximum loading effect requirements specified in 7.2.5 for a field
strength of H ;
LP
f) the PICC complies with operating field strength requirements specified in 7.2.6 for a field strength
of H .
LP
7.2.7.2 Determination of PICC minimum requested field strength H
LP
The following sequence is applied to determine the minimum field strength H that the PICC may
LP
request and at which it shall comply with all ISO/IEC 14443 requirements.
a) Find the minimum field strength at which the PICC still indicates that its received field strength
is at least (H + H ), with a resolution of 0,1 dB (a factor of ~1,012). H is specified in
LP step, max step, max
ISO/IEC 14443-2:2020/Amd 1:2021, 6.3.
4 © ISO/IEC 2021 –
...
FINAL
ISO/IEC
AMENDMENT
DRAFT
10373-6:2020
FDAM 1
ISO/IEC JTC 1/SC 17
Cards and security devices for
Secretariat: BSI
personal identification — Test
Voting begins on:
2021-02-15 methods —
Voting terminates on:
Part 6:
2021-04-12
Contactless proximity objects
AMENDMENT 1: Dynamic power level
management
Cartes et dispositifs de sécurité pour l'identification personnelle —
Méthodes d'essai —
Partie 6: Objets sans contact de proximité
AMENDEMENT 1: Gestion dynamique de niveau de puissance
RECIPIENTS OF THIS DRAFT ARE INVITED TO
SUBMIT, WITH THEIR COMMENTS, NOTIFICATION
OF ANY RELEVANT PATENT RIGHTS OF WHICH
THEY ARE AWARE AND TO PROVIDE SUPPOR TING
DOCUMENTATION.
IN ADDITION TO THEIR EVALUATION AS
Reference number
BEING ACCEPTABLE FOR INDUSTRIAL, TECHNO-
ISO/IEC 10373-6:2020/FDAM 1:2021(E)
LOGICAL, COMMERCIAL AND USER PURPOSES,
DRAFT INTERNATIONAL STANDARDS MAY ON
OCCASION HAVE TO BE CONSIDERED IN THE
LIGHT OF THEIR POTENTIAL TO BECOME STAN-
DARDS TO WHICH REFERENCE MAY BE MADE IN
©
NATIONAL REGULATIONS. ISO/IEC 2021
---------------------- Page: 1 ----------------------
ISO/IEC 10373-6:2020/FDAM 1:2021(E)
COPYRIGHT PROTECTED DOCUMENT
© ISO/IEC 2021
All rights reserved. Unless otherwise specified, or required in the context of its implementation, no part of this publication may
be reproduced or utilized otherwise in any form or by any means, electronic or mechanical, including photocopying, or posting
on the internet or an intranet, without prior written permission. Permission can be requested from either ISO at the address
below or ISO’s member body in the country of the requester.
ISO copyright office
CP 401 • Ch. de Blandonnet 8
CH-1214 Vernier, Geneva
Phone: +41 22 749 01 11
Email: copyright@iso.org
Website: www.iso.org
Published in Switzerland
ii © ISO/IEC 2021 – All rights reserved
---------------------- Page: 2 ----------------------
ISO/IEC 10373-6:2020/FDAM 1:2021(E)
Foreword
ISO (the International Organization for Standardization) and IEC (the International Electrotechnical
Commission) form the specialized system for worldwide standardization. National bodies that
are members of ISO or IEC participate in the development of International Standards through
technical committees established by the respective organization to deal with particular fields of
technical activity. ISO and IEC technical committees collaborate in fields of mutual interest. Other
international organizations, governmental and non-governmental, in liaison with ISO and IEC, also
take part in the work.
The procedures used to develop this document and those intended for its further maintenance are
described in the ISO/IEC Directives, Part 1. In particular, the different approval criteria needed for
the different types of document should be noted. This document was drafted in accordance with the
editorial rules of the ISO/IEC Directives, Part 2 (see www .iso .org/ directives).
Attention is drawn to the possibility that some of the elements of this document may be the subject
of patent rights. ISO and IEC shall not be held responsible for identifying any or all such patent
rights. Details of any patent rights identified during the development of the document will be in the
Introduction and/or on the ISO list of patent declarations received (see www .iso .org/ patents) or the IEC
list of patent declarations received (see patents.iec.ch).
Any trade name used in this document is information given for the convenience of users and does not
constitute an endorsement.
For an explanation of the voluntary nature of standards, the meaning of ISO specific terms and
expressions related to conformity assessment, as well as information about ISO's adherence to the
World Trade Organization (WTO) principles in the Technical Barriers to Trade (TBT), see www .iso .org/
iso/ foreword .html.
This document was prepared by Joint Technical Committee ISO/IEC JTC 1, Information technology,
Subcommittee SC 17, Cards and security devices for personal identification.
A list of all parts in the ISO/IEC 10373 series can be found on the ISO website.
Any feedback or questions on this document should be directed to the user’s national standards body. A
complete listing of these bodies can be found at www .iso .org/ members .html.
© ISO/IEC 2021 – All rights reserved iii
---------------------- Page: 3 ----------------------
ISO/IEC 10373-6:2020/FDAM 1:2021(E)
Cards and security devices for personal identification —
Test methods —
Part 6:
Contactless proximity objects
AMENDMENT 1: Dynamic power level management
Page 3, 3.2
Add the following symbols:
"H PCD field strength during power level management test procedures"
0
Page 7, 4.7, Table 3
Replace Table 3 with the following table:
"
Table 3 — PCD manufacturer information
Parameter Description Unit
Position and orientation of the Reference PICCs on the PCD surface.
Position 0
This position may be PICC classes dependent.
a
Position with maximum operating distance on the Z axis . This position
Position Z
max
may be PICC classes dependent.
Temperature range Minimum and maximum temperature values °C
Optional PICC classes List of supported optional PICC classes (4 and/or 5 and/or 6)
Ability to change power level (and therefore field strength) after re-
Support of PLI handling
ATQ
ceiving PLI from a PICC
ATQ
Ability to change power level (and therefore field strength) after re-
Support of PLI handling
CID
ceiving PLI from a PICC
CID
PCD to PICC supported bit rates List of supported optional PCD to PICC bit rates
PICC to PCD supported bit rates List of supported optional PICC to PCD bit rates
Maximum frame size supported Maximum frame size in reception bytes
PCD to PICC frame with error cor- Frame with error correction from PCD to PICC
rection supported
PICC to PCD frame with error cor- Frame with error correction from PICC to PCD
rection supported
a
Z axis shall be perpendicular to the PCD surface through Position 0. If the PCD surface is not flat, Z axis shall correspond
to the axis along which PICCs would habitually be held to the PCD and shall be coherent with PCD ergonomics; if not, the
test laboratory may elect to redefine it (directionally).
"
© ISO/IEC 2021 – All rights reserved 1
---------------------- Page: 4 ----------------------
ISO/IEC 10373-6:2020/FDAM 1:2021(E)
Page 8, 4.8, Table 6
Replace Table 6 with the following table:
"
Table 6 — PICC manufacturer information
Parameter Description Unit
Location, center and size of the Drawing with dimensions of the PICC outside shape and the posi-
antenna tion of the external rectangle/circle of the claimed PICC class.
a
PICC class (optional) Claimed PICC class
Resonance frequency range
Minimum and maximum resonance frequency MHz
(optional)
Supported communication signal interface(s):
— Type A
Communication signal interface
— Type B
— Type A and Type B
Temperature range Minimum and maximum temperature values °C
Supported PLI values List of supported optional PLI values in Answer to Request
ATQ ATQ
Supported PLI values List of supported optional PLI values in CID field
CID CID
PCD to PICC supported bit rates List of supported optional PCD to PICC bit rates
PICC to PCD supported bit rates List of supported optional PICC to PCD bit rates
Indication if only same bit rate from PCD to PICC and from PICC to
Same bit rate for both directions
PCD is supported
Random or fixed UID (Type A) or Indication whether the UID (Type A) or PUPI (Type B) is random
PUPI (Type B) or fixed
Maximum frame size supported Maximum frame size in reception bytes
PCD to PICC frame with error cor- Frame with error correction from PCD to PICC
rection supported
PICC to PCD frame with error cor- Frame with error correction from PICC to PCD
rection supported
TEST_COMMAND_SEQUENCE1 See O.2.1
TEST_COMMAND1 See O.2.1
TEST_COMMAND2 See O.2.1
TEST_COMMAND3 See O.2.1
TEST_COMMAND4 See O.2.1
a
If not provided, test methods for Class 1 shall be used
"
Page 38, 7.1.9
Add the following subclause after 7.1.8.3:
"
7.1.9 Procedures for PCD supporting optional PLI or PLI handling
ATQ CID
7.1.9.1 Scope
2 © ISO/IEC 2021 – All rights reserved
---------------------- Page: 5 ----------------------
ISO/IEC 10373-6:2020/FDAM 1:2021(E)
These tests apply only to PCDs which support PLI or PLI handling.
ATQ CID
If the PCD supports optional PLI or PLI handling, the additional procedures specified in H.5,
ATQ CID
7.1.9.2, 7.1.9.3 and 7.1.9.4 shall be used to verify that, for every power level used by the PCD:
a) the PCD complies with the field strength requirements specified in ISO/IEC 14443-2:2020/Amd 1,
ISO/IEC 14443-3:2018/Amd 1 and ISO/IEC 14443-4:2018/Amd 1;
b) the PCD complies with modulation index and waveform requirements specified in ISO/IEC 14443-2;
c) the PCD complies with load modulation reception requirements specified in ISO/IEC 14443-2;
d) the PCD complies with EMD immunity requirements specified in ISO/IEC 14443-2.
7.1.9.2 Modulation index and waveform
The steps c) to g) of the procedure specified in 7.1.4.2 shall be repeated for every power level between
minimum and maximum power level obtained by PLI or PLI .
ATQ CID
For each power level, the test report shall be as specified in 7.1.4.3.
7.1.9.3 Load Modulation reception
The procedures specified in 7.1.6.5 and 7.1.6.6 shall be repeated for every power level between
minimum and maximum power level obtained by PLI or PLI .
ATQ CID
For each power level, the test report shall be as specified in 7.1.6.7.
7.1.9.4 PCD EMD immunity test
The steps b) to l) of the procedure specified in 7.1.8.2 shall be repeated for every power level between
minimum and maximum power level obtained by PLI or PLI .
ATQ CID
For each power level, the test report shall be as specified in 7.1.8.3.
"
Page 38, 7.2.1.1
Replace the text with the following:
"The purpose of this test is to verify that the load modulation amplitude V of the PICC and the phase
LMA
parameters Ø and Ø of the PICC conform to ISO/IEC 14443-2 for all mandatory and
LM, INTER LM, INTRA
supported optional PICC to PCD bit rates within the operating field range [H respectively H if the
min LP
PICC supports PLI or PLI , H ]."
ATQ CID max
Page 40, 7.2.2.1
Replace the text with the following:
"The purpose of this test is to determine that the PICC does not generate an electromagnetic disturbance
amplitude V higher than V during t with the exceptions defined in ISO/IEC 14443-2 within
EMD E, PICC E, PICC
the operating field range [H respectively H if the PICC supports PLI or PLI , H ] as specified
min LP ATQ CID max
in ISO/IEC 14443-2 for all supported PICC to PCD bit rates.
NOTE 1 The low EMD time t is a function of FDT/TR0 as defined in ISO/IEC 14443-3:2018, 8.2.
E, PICC
NOTE 2 The EMD limit V is a function of the field strength.
E, PICC
"
© ISO/IEC 2021 – All rights reserved 3
---------------------- Page: 6 ----------------------
ISO/IEC 10373-6:2020/FDAM 1:2021(E)
Page 41, 7.2.3.1
Replace the text with the following:
"The purpose of this test is to verify the ability of the PICC to receive the PCD commands within the
operating field range [H respectively H if the PICC supports PLI or PLI , H ] as specified in
min LP ATQ CID max
ISO/IEC 14443-2 for all supported PCD to PICC bit rates."
Page 45, 7.2.5.1
Replace the text with the following:
"This test is used to measure the PICC loading effect at the minimum operating field strength H
min
respectively H if the PICC supports PLI or PLI as specified in ISO/IEC 14443-2."
LP ATQ CID
Page 45, 7.2.5.2
rd
Add the following paragraph after the 3 paragraph:
"If the PICC supports PLI or PLI , the test shall be repeated at a field strength of H , with the Reference
ATQ CID LP
PICC having R2 value, or alternatively the applied voltage on CON2, set for a field strength of H ."
LP
Page 46, 7.2.6.1
Replace the text with the following:
"This test verifies that the PICC operates as intended within the operating field range [H respectively
min
H if the PICC supports PLI or PLI , H ] as specified in ISO/IEC 14443-2 for all supported PCD to
LP ATQ CID max
PICC bit rates."
Page 47, 7.2.7
Add the following subclause after 7.2.6.4:
"
7.2.7 Procedures for PICC supporting optional PLI or PLI values
ATQ CID
7.2.7.1 Scope
These tests apply only to PCDs which support PLI or PLI handling.
ATQ CID
If the PICC supports optional PLI or PLI values, the additional procedures specified in 7.2.1, 7.2.2,
ATQ CID
7.2.3, 7.2.5 and 7.2.6 and the additional procedures specified in 7.2.7.2 to 7.2.7.4 shall be used to verify that:
a) the PICC complies with the requirements specified in ISO/IEC 14443-2:2020/Amd 1,
ISO/IEC 14443-3:2018/Amd 1 and ISO/IEC 14443-4:2018/Amd 1;
b) the PICC complies with the transmission requirements specified in ISO/IEC 14443-2 for a field
strength of H ;
LP
4 © ISO/IEC 2021 – All rights reserved
---------------------- Page: 7 ----------------------
ISO/IEC 10373-6:2020/FDAM 1:2021(E)
c) the PICC complies with the EMD level and low EMD time requirements specified in ISO/IEC 14443-2
and ISO/IEC 14443-3 for a field strength of
...
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