Information technology -- Home electronic system (HES) interfaces

ISO/IEC 10192-3:2017(E) this part of ISO/IEC 10192 specifies a Universal Communication Module (UCM) that transfers energy management data via a home network between an end device and an energy management agent (specified in ISO/IEC 15067-3) or an energy service provider. This document specifies the mechanical, electrical and logical characteristics of the interfaces of UCM to an end device and a choice of interfaces to a home communications network.

Technologies de l'information -- Interfaces de systèmes électroniques domestiques (HES)

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Status
Published
Publication Date
28-Nov-2017
Current Stage
6000 - International Standard under publication
Start Date
29-Nov-2017
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ISO/IEC 10192-3
Edition 1.0 2017-11
INTERNATIONAL
STANDARD
colour
inside
Information technology – Home electronic system (HES) interfaces –
Part 3: Modular communications interface for energy management
ISO/IEC 10192-3:2017-11(en)
---------------------- Page: 1 ----------------------
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ISO/IEC 10192-3
Edition 1.0 2017-11
INTERNATIONAL
STANDARD
colour
inside
Information technology – Home electronic system (HES) interfaces –
Part 3: Modular communications interface for energy management
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 35.200 ISBN 978-2-8322-5099-0

Warning! Make sure that you obtained this publication from an authorized distributor.

---------------------- Page: 3 ----------------------
– 2 – ISO/IEC 10192-3:2017 © ISO/IEC 2017
CONTENTS

FOREWORD ........................................................................................................................... 7

INTRODUCTION ..................................................................................................................... 8

1 Scope ............................................................................................................................ 10

2 Normative references .................................................................................................... 10

3 Terms, definitions and abbreviated terms ...................................................................... 11

3.1 Terms and definitions ............................................................................................ 11

3.2 Abbreviated terms ................................................................................................. 11

4 Conformance ................................................................................................................. 12

5 Physical/electrical Interface ........................................................................................... 12

5.1 Form factors ......................................................................................................... 12

5.2 Removal and exchange of a UCM ......................................................................... 12

5.3 Block diagram ....................................................................................................... 12

6 Serial protocol ............................................................................................................... 13

6.1 Protocol data unit .................................................................................................. 13

6.2 Message Type field ............................................................................................... 13

6.3 Payload length field .............................................................................................. 14

6.4 Checksum field ..................................................................................................... 15

6.5 Bit and byte order ................................................................................................. 15

6.5.1 Bit order within a byte .................................................................................... 15

6.5.2 Byte order for multi-byte messages ................................................................ 15

6.6 Message synchronization and timing ..................................................................... 15

6.6.1 Message sequencing ..................................................................................... 15

6.6.2 Link layer timing ............................................................................................ 15

6.6.3 Randomized link layer retries ......................................................................... 17

6.6.4 Application layer timing .................................................................................. 17

6.7 SGD handling of conflicting messages .................................................................. 18

7 Simple Protocol ............................................................................................................. 18

8 Link layer ....................................................................................................................... 19

8.1 Use of link layer messages ................................................................................... 19

8.2 Link layer ACK/NAK .............................................................................................. 19

8.3 Message Type “supported query” .......................................................................... 20

9 Data-link messages ....................................................................................................... 21

9.1 Message format .................................................................................................... 21

9.2 Interface power limit negotiation ........................................................................... 23

9.3 Bit rate negotiation ................................................................................................ 24

9.4 Power-up and state reset ...................................................................................... 25

9.5 Security ................................................................................................................ 25

9.6 Setting slot numbering .......................................................................................... 25

10 Basic DR application (Message Type = 0x08, 0x01) ...................................................... 26

10.1 Basic DR application commands ........................................................................... 26

10.1.1 Message format ............................................................................................. 26

10.1.2 Basic message fixed length ........................................................................... 30

10.1.3 Event Duration field ....................................................................................... 30

10.1.4 Grouped messages ........................................................................................ 31

10.2 Usage and details of basic DR application messages ............................................ 31

10.2.1 Request for power level (Opcode 0x06) ......................................................... 31

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ISO/IEC 10192-3:2017 © ISO/IEC 2017 – 3 –

10.2.2 Relative price commands (Opcode 0x07 and 0x08) ........................................ 32

10.2.3 Time remaining in present price period (Opcode 0x09) .................................. 33

10.2.4 Operating state monitoring (Opcodes 0x12 and 0x13) .................................... 33

11 Intermediate DR application (Message Type = 0x08, 0x02) ............................................ 35

11.1 Intermediate DR message set ............................................................................... 35

11.2 Usage and details of Intermediate DR application messages ................................ 38

11.2.1 Info request ................................................................................................... 38

11.2.2 Get/Set UTC time .......................................................................................... 41

11.2.3 Get/Set energy price ...................................................................................... 42

11.2.4 Get/Set tier .................................................................................................... 44

11.2.5 Get/Set temperature offset............................................................................. 45

11.2.6 Get/Set set point ............................................................................................ 46

11.2.7 Autonomous cycling ....................................................................................... 47

11.2.8 Demand reduction – terminate cycling ........................................................... 49

11.3 Demand response event schedules ....................................................................... 49

11.3.1 Function ........................................................................................................ 49

11.3.2 Send scheduled events request ..................................................................... 50

11.4 Energy consumption ............................................................................................. 50

11.4.1 Function ........................................................................................................ 50

11.4.2 Commodity read ............................................................................................ 50

11.4.3 Get/Set CommodityType ................................................................................ 53

12 Commissioning and network messages (Message Type = 0x08, 0x04) .......................... 55

13 Pass-Through Mode ...................................................................................................... 55

13.1 Pass-Through method ........................................................................................... 55

13.1.1 General ......................................................................................................... 55

13.1.2 Full Encapsulation in the Message Payload ................................................... 56

13.1.3 Message Type Field ...................................................................................... 56

13.1.4 Message Type Support Query ........................................................................ 56

13.1.5 Maximum Message Length Negotiation .......................................................... 56

13.1.6 Pass-Through mode protocols ....................................................................... 56

13.2 Pass-Through mode protocols............................................................................... 56

13.2.1 USNAP 1.0 protocol Pass-Through ................................................................ 56

13.2.2 SEP1.0 or 1.1 Pass-Through ......................................................................... 57

13.2.3 ClimateTalk Pass-Through ............................................................................. 57

13.2.4 General Internet Protocol Pass-Through ........................................................ 57

13.2.5 ISO/IEC 14543-4-3 Pass-Through ................................................................. 58

13.2.6 ISO/IEC 14543-3-1 Pass-Through ................................................................. 58

13.2.7 ISO/IEC 14908-1 Pass-Through ..................................................................... 59

13.2.8 SunSpec Pass-Through ................................................................................. 59

14 Typical communication exchanges ................................................................................. 59

15 General security principles ............................................................................................ 60

16 Load management event randomization ......................................................................... 60

Annex A (normative) Low voltage DC form factor ................................................................. 62

A.1 General ................................................................................................................. 62

A.2 Limitations ............................................................................................................ 62

A.3 Power for UCM ..................................................................................................... 62

A.4 Mechanical interface ............................................................................................. 62

A.4.1 DC form factor board layout ........................................................................... 62

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– 4 – ISO/IEC 10192-3:2017 © ISO/IEC 2017

A.4.2 Module configuration ..................................................................................... 63

A.4.3 Form factor .................................................................................................... 66

A.4.4 Housing materials .......................................................................................... 66

A.4.5 Connector type .............................................................................................. 66

A.4.6 Pin assignments ............................................................................................ 67

A.5 Electrical interface ................................................................................................ 67

A.5.1 Electrical Interface Levels .............................................................................. 67

A.5.2 Signal timing .................................................................................................. 67

A.5.3 Interface circuits ............................................................................................ 68

A.6 Data transfer protocol ........................................................................................... 68

A.6.1 Control signals............................................................................................... 68

A.6.2 Clock and data rate ....................................................................................... 69

A.6.3 Multiple slots ................................................................................................. 69

A.7 Link layer data flow ............................................................................................... 69

A.8 Messages ............................................................................................................. 69

A.8.1 Frame structure ............................................................................................. 69

A.8.2 Message synchronization (frame delimiting) .................................................. 69

A.8.3 Message filling (inter-message byte filling) .................................................... 69

A.8.4 Command/Response encoding ...................................................................... 70

A.8.5 Checksum calculation .................................................................................... 70

A.8.6 Master/Slave ................................................................................................. 70

A.8.7 Flow control ................................................................................................... 70

A.8.8 Error detection and recovery .......................................................................... 70

A.9 Operation .............................................................................................................. 71

A.9.1 Transaction sequence.................................................................................... 71

A.9.2 SPI data transfer state machine ..................................................................... 74

A.9.3 SGD transmitter operation ............................................................................. 75

A.9.4 SGD device receiver operation ...................................................................... 75

A.9.5 UCM operations ............................................................................................. 76

Annex B (informative) Description of DC form factor applications ......................................... 77

B.1 General ................................................................................................................. 77

B.2 Applications of ISO/IEC 24379 .............................................................................. 77

B.3 Physical Form Factor Review ................................................................................ 77

B.4 Observations with regard to UCM and ATA confusion ........................................... 78

B.4.1 General ......................................................................................................... 78

B.4.2 ATA into Smart Grid Device ........................................................................... 78

B.4.3 Universal Communication Module into ATA device bay .................................. 78

B.5 Conclusion ............................................................................................................ 78

Annex C (normative) AC form factor..................................................................................... 79

C.1 General ................................................................................................................. 79

C.2 Physical form ........................................................................................................ 79

C.2.1 AC SGD and AC UCM connector ................................................................... 79

C.2.2 AC enclosure requirements ............................................................................ 84

C.3 AC power .............................................................................................................. 87

C.4 Obtaining message sync ....................................................................................... 89

Annex D (normative) Fletcher checksum .............................................................................. 90

D.1 Checksum method ................................................................................................ 90

D.2 Calculating the checksum ..................................................................................... 90

D.3 Decoding the checksum ........................................................................................ 90

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ISO/IEC 10192-3:2017 © ISO/IEC 2017 – 5 –

Annex E (informative) Example Visual Basic code ............................................................... 91

Annex F (informative) Guideline for computing average price............................................... 92

F.1 Average Price versus Time Varying Charges ........................................................ 92

F.2 Relative price command ........................................................................................ 92

F.3 Explanation for non-regulated utilities ................................................................... 93

F.4 Summary .............................................................................................................. 93

Annex G (informative) Product safety considerations ........................................................... 95

Bibliography .......................................................................................................................... 96

Figure 1 – Illustrations of the modular communications interface (MCI) concept ...................... 9

Figure 2 – Modular communications interface (MCI) block diagram ....................................... 13

Figure 3 – Link layer timing ................................................................................................... 16

Figure 4 – Application layer timing ........................................................................................ 17

Figure 5 – Non-linear event duration scaling ......................................................................... 31

Figure 6 – Non-linear relative price scaling ........................................................................... 33

Figure 7 – Illustration of energy storage capacity .................................................................. 53

Figure 8 – Internet Protocol Pass-Through (IPv6) ................................................................. 58

Figure 9 – Illustration of randomization of events by communications modules ..................... 61

Figure A.1 – DC form factor PCB dimensions ........................................................................ 63

Figure A.2 – DC form factor housing dimensions – top view .................................................. 64

Figure A.3 – DC form factor housing dimensions – side view ................................................ 65

Figure A.4 – DC form factor housing dimensions – end view ................................................. 66

Figure A.5 – Pin assignment ................................................................................................. 67

Figure A.6 – SPI Mode 0 bit timing ........................................................................................ 67

Figure A.7 – SPI transaction sequence: SGD-initiated message to the UCM ......................... 71

Figure A.8 – SPI transaction sequence: UCM-initiated message to the SGD ......................... 72

Figure A.9 – SPI data transfer state machine ........................................................................ 74

Figure C.1 – Panel-mount AC connector form factor (device side shown) and pin-out ........... 80

Figure C.2 – PCB-mount AC UCM connector (housing) ......................................................... 80

Figure C.3 – Cable AC UCM connector (housing) ................................................................. 81

Figure C.4 – Panel mount AC SGD connector form factor dimensions ................................... 82

Figure C.5 – PCB mount connector dimensions .................................................................... 83

Figure C.6 – Cable connector dimensions ............................................................................. 83

Figure C.7 – Contact dimensions for cable connector and PCB mount connector .................. 84

Figure C.8 – Reserved area and dimensions on SGD (receptacle) ........................................ 85

Figure C.9 – Right side and top view of maximum UCM dimensions ...................................... 86

Figure C.10 – Left side and bottom view of maximum UCM dimensions ................................ 87

Figure C.11 – Typical RS-485 polarity and byte transfer ....................................................... 88

Figure C.12 – RS-485 connections ........................................................................................ 88

Table 1 – Protocol data unit format ....................................................................................... 13

Table 2 – Message type assignments ................................................................................... 14

Table 3 – Message timing requirements ................................................................................ 16

Table 4 – Basic/Intermediate DR application layer timing parameters ................................... 18

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– 6 – ISO/IEC 10192-3:2017 © ISO/IEC 2017

Table 5 – Mandatory message summary ............................................................................... 19

Table 6 – ACK/NAK Packet ................................................................................................... 19

Table 7 – Link layer NAK codes ............................................................................................ 20

Table 8 – Message type “supported query” ........................................................................... 20

Table 9 – Data-link message format ...................................................................................... 21

Table 10 – Data-link command set ........................................................................................ 22

Table 11 – Interface power level indicator codes ................................................................... 23

Table 12 – Bit rate indicator .................................................................................................. 25

Table 13 – Basic application data format .............................................................................. 26

Table 14 – Basic DR application command set ...................................................................... 27

Table 15 – Operating state codes ......................................................................................... 34

Table 16 – Operating-state codes for usage conditions ......................................................... 35

Table 17 – Intermediate DR application command set (command byte description) ............... 36

Table 18 – Intermediate DR application command set ........................................................... 37

Table 19 – Response code values ........................................................................................ 38

Table 20 – Commissioning and network messages ............................................................... 55

Table 21 – Pass-Through message ....................................................................................... 56

Table 22 – USNAP1.0 over serial .......................................................................................... 56

Table 23 – SEP1.0 or 1.1 over serial..................................................................................... 57

Table 24 – ClimateTalk over serial ........................................................................................ 57

Table 25 – ISO/IEC 14543-4-3 over serial ............................................................................. 58

Table 26 – ISO/IEC 14543-3-1 over serial ............................................................................. 59

Table 27 – ISO/IEC 14908-1 over serial ................................................................................ 59

Table 28 – SunSpec over serial ............................................................................................ 59

Table A.1 – Low voltage interface signal definitions .............................................................. 68

Table A.2 – SPI physical timing requirements ....................................................................... 73

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ISO/IEC 10192-3:2017 © ISO/IEC 2017 – 7 –
INFORMATION TECHNOLOGY –
HOME ELECTRONIC SYSTEM (HES) INTERFACES –
Part 3: Modular communications interface for energy management
FOREWORD

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