SIST EN 62132-3:2008
(Main)Integrated circuits - Measurement of electromagnetic immunity, 150 kHz to 1 GHz -- Part 3: Bulk current injection (BCI) method
Integrated circuits - Measurement of electromagnetic immunity, 150 kHz to 1 GHz -- Part 3: Bulk current injection (BCI) method
This part of IEC 62132 describes a bulk current injection (BCI) test method to measure the immunity of integrated circuits (IC) in the presence of conducted RF disturbances, e.g. resulting from radiated RF disturbances. This method only applies to ICs that have off-board wire connections e.g. into a cable harness. This test method is used to inject RF current on one or a combination of wires. This standard establishes a common base for the evaluation of semiconductor devices to be applied in equipment used in environments that are subject to unwanted radio frequency electromagnetic signals.
Integrierte Schaltungen - Messung der elektromagnetischen Störfestigkeit im Frequenzbereich von 150 kHz bis 1 GHz -- Teil 3: Stromeinspeisungs-(BCI-)Verfahren
Circuits intégrés - Mesure de l'immunité électromagnétique, 150 kHz à 1 GHz -- Partie 3: Méthode d'injection de courant (BCI)
La présente partie de la CEI 62132 décrit une méthode d'essai d'injection de courant (BCI) en vue de mesurer l'immunité des circuits intégrés (CI) en présence de perturbations RF conduites, comme par exemple celles résultant de perturbations RF rayonnées. Cette méthode s'applique uniquement aux CI connectés sur des liaisons externes à la carte, par exemple sur des torons. Cette méthode d'essai est utilisée pour injecter un courant RF sur un ou plusieurs fils. Cette norme établit une base commune pour l'évaluation des dispositifs à semi-conducteurs utilisés dans les matériels fonctionnant dans des environnements soumis à des signaux électromagnétiques à radiofréquences intempestifs.
Integrirana vezja - Meritve elektromagnetne odpornosti, 150 kHz do 1 GHz - 3. del: Metoda z vnašanjem masovnega toka (BCI) (IEC 62132-3:2007)
General Information
Standards Content (Sample)
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.Integrated circuits - Measurement of electromagnetic immunity, 150 KHz to 1 GHz - Part 3: Bulk Current Injection (BCI) method (IEC 62132-3:2007)Integrirana vezja - Meritve elektromagnetne odpornosti, 150 kHz do 1 GHz - 3. del: Metoda z vnašanjem masovnega toka (BCI) (IEC 62132-3:2007)Circuits intégrés - Mesure de l'immunité électromagnétique, 150 kHz a 1 GHz - Partie 3: Méthode d'injection de courant (BCI) (IEC 62132-3:2007)Integrierte Schaltungen - Messung der elektromagnetischen Störfestigkeit im Frequenzbereich von 150 kHz bis 1 GHz - Teil 3: Stromeinspeisungs-Verfahren (IEC 62132-3:2007)Ta slovenski standard je istoveten z:EN 62132-3:2007SIST EN 62132-3:2008en,fr,de33.100.2031.200ICS:SLOVENSKI
STANDARDSIST EN 62132-3:200801-januar-2008
EUROPEAN STANDARD EN 62132-3 NORME EUROPÉENNE
EUROPÄISCHE NORM October 2007
CENELEC European Committee for Electrotechnical Standardization Comité Européen de Normalisation Electrotechnique Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2007 CENELEC -
All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 62132-3:2007 E
ICS 31.200
English version
Integrated circuits -
Measurement of electromagnetic immunity, 150 kHz to 1 GHz -
Part 3: Bulk current injection (BCI) method (IEC 62132-3:2007)
Circuits intégrés -
Mesure de l'immunité électromagnétique, 150 kHz à 1 GHz -
Partie 3: Méthode d'injection
de courant (BCI) (CEI 62132-3:2007)
Integrierte Schaltungen -
Messung der elektromagnetischen Störfestigkeit im Frequenzbereich
von 150 kHz bis 1 GHz -
Teil 3: Stromeinspeisungs- (BCI-)Verfahren (IEC 62132-3:2007)
This European Standard was approved by CENELEC on 2007-10-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom.
EN 62132-3:2007
- 2 - Foreword The text of document 47A/773/FDIS, future edition 1 of IEC 62132-3, prepared by SC 47A, Integrated circuits, of IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 62132-3 on 2007-10-01. The following dates were fixed: – latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement
(dop)
2008-07-01 – latest date by which the national standards conflicting
with the EN have to be withdrawn
(dow)
2010-10-01 Annex ZA has been added by CENELEC. __________ Endorsement notice The text of the International Standard IEC 62132-3:2007 was approved by CENELEC as a European Standard without any modification. __________
- 3 - EN 62132-3:2007
Annex ZA
(normative)
Normative references to international publications with their corresponding European publications
The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies.
NOTE
When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies.
Publication Year Title EN/HD Year IEC 62132-1 2006 Integrated circuits - Measurement of electromagnetic immunity, 150 kHz to
1 GHz -
Part 1: General conditions and definitions EN 62132-1 + corr. November
2006 2006
IEC 62132-3Edition 1.0 2007-09INTERNATIONAL STANDARD NORME INTERNATIONALEIntegrated circuits – Measurement of electromagnetic immunity, 150 kHz to 1 GHz – Part 3: Bulk current injection (BCI) method
Circuits intégrés – Mesure de l’immunité électromagnétique, 150 kHz à 1 GHz – Partie 3: Méthode d’injection de courant (BCI)
INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE RICS 31.200 PRICE CODECODE PRIXISBN 2-8318-9320-8
– 2 – 62132-3 © IEC:2007 CONTENTS FOREWORD.3
1 Scope and object.5 2 Normative references.5 3 Terms and definitions.5 4 General.5 5 Test conditions.6 5.1 General.6 5.2 Test equipment.7 5.3 Test board.7 6 Test procedure.9 6.1 Hazardous electromagnetic fields.9 6.2 Calibration of forward power limitation.9 6.3 BCI test.10 6.4 BCI test set-up characterization procedure.11 7 Test report.12
Annex A (informative)
Examples for test levels and frequency step selection.13 Annex B (informative)
Example of BCI test board and set-up.15 Annex C (informative)
Example of RF test board and set-up.18
Bibliography.19
Figure 1 – Principal current path when using BCI.6 Figure 2 – Schematic diagram of BCI test set-up.7 Figure 3 – Example test board, top view.8 Figure 4 – Calibration set-up.10 Figure 5 – BCI test procedure flowchart for each frequency step.11 Figure 6 – Impedance validation test set-up.11 Figure B.1 – General view.15 Figure B.2 – Example of top view of the test board.16 Figure B.3 – Test board build-up.16 Figure B.4 – Test board and copper fixture.17 Figure B.5 – Example of a non-conductive probes support fixture.17 Figure C.1 – Compact RF coupling to differential IC ports.18
Table A.1 – Test severity levels.13 Table A.2 – Linear frequency step.14 Table A.3 – Logarithmic frequency step.14
62132-3 © IEC:2007 – 3 – INTERNATIONAL ELECTROTECHNICAL COMMISSION ______________
INTEGRATED CIRCUITS – MEASUREMENT OF ELECTROMAGNETIC IMMUNITY, 150 kHz TO 1 GHz –
Part 3: Bulk current injection (BCI) method
FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any equipment declared to be in conformity with an IEC Publication. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications.
8) Attention is drawn to the normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 62132-3 has been prepared by subcommittee 47A: Integrated circuits, of IEC technical committee 47: Semiconductor devices. The text of this standard is based on the following documents: FDIS Report on voting 47A/773/FDIS 47A/776/RVD
Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
– 4 – 62132-3 © IEC:2007 A list of all parts of the IEC 62132 series, published under the general title Integrated circuits − Measurement of electromagnetic immunity, 150 kHz to 1 GHz can be found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in the data related to the specific publication. At this date, the publication will be
• reconfirmed, • withdrawn, • replaced by a revised edition, or • amended.
62132-3 © IEC:2007 – 5 – INTEGRATED CIRCUITS – MEASUREMENT OF ELECTROMAGNETIC IMMUNITY, 150 kHz TO 1 GHz –
Part 3: Bulk current injection (BCI) method
1 Scope and object This part of IEC 62132 describes a bulk current injection (BCI) test method to measure the immunity of integrated circuits (IC) in the presence of conducted RF disturbances, e.g. resulting from radiated RF disturbances. This method only applies to ICs that have off-board wire connections e.g. into a cable harness. This test method is used to inject RF current on one or a combination of wires. This standard establishes a common base for the evaluation of semiconductor devices to be applied in equipment used in environments that are subject to unwanted radio frequency electromagnetic signals. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 62132-1:2006, Integrated circuits – Measurement of electromagnetic immunity, 150 kHz to 1 GHz – Part 1: General conditions and definitions 3 Terms and definitions For the purposes of this document, the terms and definitions given in IEC 62132-1 apply. 4 General The characterization of RF immunity (or susceptibility) of an integrated circuit (IC) is essential to define the optimum design of a printed circuit board, filter concepts and for further integration into an electronic system. This document defines a method for measuring the immunity of ICs to RF current induced by electromagnetic disturbance. This method is based on the bulk current injection (BCI) method used for equipment and systems [1, 2, 3]. The BCI method simulates the induced current as a result of direct radiated RF signals coupled onto the wires and cables of equipment and systems.
In general, in electronic systems, off-board wire connections or traces on the printed circuit board act as antennas for electromagnetic fields. Via this coupling path, these electro-magnetic fields will induce voltages and currents at the pins of the IC and may cause interference. ICs are often used in various configurations dependent on their application. In this case, immunity levels of electronic equipment are closely linked to the ability of an IC to withstand the effects of an electromagnetic field represented. To characterize the RF immunity of an IC, the induced current level necessary to cause the IC’s malfunction is measured. The malfunction may be classified from A to E according to the performance classes defined in IEC 62132-1.
– 6 – 62132-3 © IEC:2007 A principal set-up for the bulk current injection method is presented in Figure 1.
Current monitoring Power injection Supportive circuitry and by-pass capacitor Injection probe Current probeIC under test DUT Idisturbance IC controlling and monitoring Vss GND IEC
1811/07
Figure 1 – Principal current path when using BCI Two electrically shielded magnetic probes are clamped on one wires or a combination of wires that is/are connected to the device under test. The first probe is for the injection of RF power that induces Idisturbance onto the wires. The second probe is used for monitoring the induced current on those wires. The disturbance current flows in a loop comprising: wire(s), the selected IC’s pin(s), Vss terminal, ground path and supportive circuitry. This supportive circuit provides the IC functional elements as source and/or load(s). The supportive circuitry is directly connected to the IC. When the equivalent RF impedance of the supportive circuitry is larger than 50 Ω, then a by-pass capacitor is recommended. The by-pass capacitor, to be used at the supportive circuitry side, may also be needed to confine the loop area in which the induced current will be flowing. By default, the lumped by-pass capacitor of 1 nF shall be used. It represents the capacitance from the wire onto a cable harness or chassis. Deviation from using this bypass capacitor (e.g. as functional performance becomes affected) shall be given in the test report
The by-pass capacitor may be supplemented with optional decoupling network, see Figure 3, to achieve the required attenuation towards the supportive circuitry. The decoupling impedance is determined by the RF immunity of the supportive circuitry. It shall not adversely affect the response of the device under test, i.e. the result of the test. The disturbance current Idisturbance induced into the wire(s) flows through the IC and may create a failure in the device’s operation. This failure is defined by parameters called the immunity acceptance criteria, which are checked by a controlling and monitoring system. 5 Test conditions
5.1 General The general test conditions are described in the IEC 62132-1. During the immunity tests, either a continuous wave (CW) or an amplitude modulated (AM) RF signal shall be used as the disturbance signal. The
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