SIST EN 60749-40:2011
Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge
Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge
This part of IEC 60749 is intended to evaluate and compare drop performance of a surface
mount semiconductor device for handheld electronic product applications in an accelerated
test environment, where excessive flexure of a circuit board causes product failure. The
purpose is to standardize test methodology to provide a reproducible assessment of the drop
test performance of a surface mounted semiconductor devices while duplicating the failure
modes normally observed during product level test.
This international standard uses a strain gauge to measure the strain and strain rate of a
board in the vicinity of a component. Test method IEC 60749-37 uses an accelerometer to
measure the mechanical shock duration and magnitude applied which is proportional to the
stress on a given component mounted on a standard board. The detailed specification shall
state which test method is to be used.
NOTE 1 Although this test can evaluate a structure where the mounting method and its conditions, the design of a
printed wired board, solder material, the mounting capability of a semiconductor device, etc. are combined, it does
not solely evaluate the mounting capability of a semiconductor device.
NOTE 2 The result of this test is strongly influenced by the differences between soldering conditions, the design
of the land pattern of a printed wired board, solder material, etc. Therefore, in carrying out this test, it is necessary
to recognize that this test cannot intrinsically guarantee the reliability of the solder joint of the semiconductor
devices.
NOTE 3 When the mechanical stress which is generated by this test does not occur in the actual application of
the device, implementation of this test is unnecessary.
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 40: Prüfverfahren zum Fall einer Leiterplatte unter Verwendung von Dehnungsmessstreifen
Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 40: Méthode d'essai de chute au niveau de la carte avec utilisation d'une jauge de contrainte
La CEI 60749-40:2011 est destinée à évaluer et comparer la performance de chute d'un dispositif à semiconducteurs pour montage en surface dans des applications de produits électroniques portatifs dans un environnement d'essai accéléré, où une flexion excessive d'une carte à circuit imprimé provoque une défaillance du produit. Le but est de normaliser la méthodologie d'essai pour fournir une évaluation reproductible de la performance d'essai de chute des dispositifs à semiconducteurs pour montage en surface, en reproduisant les mêmes modes de défaillance que ceux observés normalement au cours d'un essai au niveau du produit. La présente norme internationale utilise une jauge de contrainte pour mesurer la contrainte et le taux de contrainte d'une carte au voisinage d'un composant.
Polprevodniški elementi - Metode za mehanske in klimatske preskuse - 40. del: Preskusna metoda s padcem z mizne višine z uporabo tenzometra
Ta del IEC 60749 je namenjen vrednotenju in primerjavi odpadanja površinsko nameščenih polprevodniških elementov za elektronske proizvode za ročne aplikacije v pospešenem preskusnem okolju, kjer čezmerno upogibanje plošče z vezjem povzroči okvaro proizvoda. Namen je standardizirati preskusno metodologijo, tako da zagotovi ponovljivo ocenjevanje delovanja pri preskusu odpadanja površinsko nameščenih polprevodniških elementov in hkrati podvoji načine okvare, ki se po navadi opazijo med preskusom na ravni proizvoda.
Ta mednarodni standard za merjenje deformacije in hitrosti deformacije plošče v bližini komponente uporablja tenziometer. Preskusna metoda iz IEC 60749-37 za merjenje trajanja uporabljenega mehanskega šoka in jakosti, ki sta sorazmerna z obremenitvijo na dano komponento, nameščeno na standardno ploščo, uporablja akcelerometer. V podrobni specifikaciji je navedeno, katera preskusna metoda naj se uporabi.
OPOMBA 1: Čeprav lahko ta preskus ovrednoti strukturo, pri kateri se kombinirajo metoda namestitve in njeni pogoji, zasnova plošče tiskanega vezja, spajkalni materiali, zmogljivost nameščanja polprevodniških elementov itd., ne vrednoti samo zmogljivosti namestitve polprevodniških elementov.
OPOMBA 2: Na rezultat tega preskusa močno vplivajo razlike med spajkalnimi pogoji, zasnovo vzorca polaganja na plošči tiskanega vezja, spajkalni material itd. Zato je treba pri izvedbi tega preskusa priznati, da preskus ne more intrinzično zagotoviti zanesljivosti spajkanega spoja polprevodniškega elementa.
OPOMBA 3: Kadar se mehanska obremenitev, do katere pride pri tem preskusu, pri dejanski uporabi ne zgodi, je izvajanje tega preskusa nepotrebno.
General Information
Standards Content (Sample)
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.Polprevodniški elementi - Metode za mehanske in klimatske preskuse - 40. del: Preskusna metoda s padcem z mizne višine z uporabo tenzometraHalbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 40: Prüfverfahren zum Fall einer Leiterplatte unter Verwendung von DehnungsmessstreifenDispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 40: Méthode d'essai de chute au niveau de la carte avec utilisation d'une jauge de contrainteSemiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge31.080.01Polprevodniški elementi (naprave) na splošnoSemiconductor devices in generalICS:Ta slovenski standard je istoveten z:EN 60749-40:2011SIST EN 60749-40:2011en01-december-2011SIST EN 60749-40:2011SLOVENSKI
STANDARD
SIST EN 60749-40:2011
EUROPEAN STANDARD EN 60749-40 NORME EUROPÉENNE
EUROPÄISCHE NORM September 2011
CENELEC European Committee for Electrotechnical Standardization Comité Européen de Normalisation Electrotechnique Europäisches Komitee für Elektrotechnische Normung
Management Centre: Avenue Marnix 17, B - 1000 Brussels
© 2011 CENELEC -
All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60749-40:2011 E
ICS 31.080.01
English version
Semiconductor devices -
Mechanical and climatic test methods -
Part 40: Board level drop test method using a strain gauge (IEC 60749-40:2011)
Dispositifs à semiconducteurs -
Méthodes d'essais mécaniques et climatiques -
Partie 40: Méthode d'essai de chute au niveau de la carte avec utilisation d'une jauge de contrainte (CEI 60749-40:2011)
Halbleiterbauelemente -
Mechanische und klimatische Prüfverfahren -
Teil 40: Prüfverfahren zum Fall einer Leiterplatte unter Verwendung von Dehnungsmessstreifen (IEC 60749-40:2011)
This European Standard was approved by CENELEC on 2011-08-17. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom.
SIST EN 60749-40:2011
EN 60749-40:2011 - 2 - Foreword The text of document 47/2094/FDIS, future edition 1 of IEC 60749-40, prepared by IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60749-40 on 2011-08-17. Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CEN and CENELEC shall not be held responsible for identifying any or all such patent rights. The following dates were fixed: – latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement
(dop)
2012-05-17 – latest date by which the national standards conflicting
with the EN have to be withdrawn
(dow)
2014-08-17 Annex ZA has been added by CENELEC. __________ Endorsement notice The text of the International Standard IEC 60749-40:2011 was approved by CENELEC as a European Standard without any modification. __________ SIST EN 60749-40:2011
- 3 - EN 60749-40:2011 Annex ZA
(normative) Normative references to international publications with their corresponding European publications
The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies.
NOTE
When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies.
Publication Year Title EN/HD Year
IEC 60749-37 - Semiconductor devices - Mechanical and climatic test methods -
Part 37: Board level drop test method using an accelerometer EN 60749-37 -
SIST EN 60749-40:2011
SIST EN 60749-40:2011
IEC 60749-40 Edition 1.0 2011-07 INTERNATIONAL STANDARD NORME INTERNATIONALE Semiconductor devices – Mechanical and climatic test methods –
Part 40: Board level drop test method using a strain gauge
Dispositifs à semiconducteurs – Méthodes d'essais climatiques et mécaniques –
Partie 40: Méthode d’essai de chute au niveau de la carte avec utilisation d’une jauge de contrainte
INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE S ICS 31.080.01 PRICE CODE CODE PRIX ISBN 978-2-88912-583-8
® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale ®
SIST EN 60749-40:2011 colourinside
– 2– 60749-40 IEC:2011 CONTENTS FOREWORD . 3 1 Scope . 5 2 Normative references . 5 3 Terms and definitions . 5 4 Test equipment . 6 5 Test procedure . 6 5.1 Test specimen . 6 5.2 Test substrate . 6 5.3 Solder paste . 6 5.4 Mounting method . 7 5.5 Pre-conditionings . 7 5.6 Initial measurements . 7 5.7 Intermediate measurement . 7 5.8 Final measurement . 7 6 Test method . 7 6.1 Purpose of test method . 7 6.2 Example of drop test equipment . 7 6.3 Example of substrate-securing jig . 8 6.4 Example of distance between supporting points . 8 6.5 Example of impacting surface . 8 6.6 Strain gauge . 8 6.7 Strain gauge attachment . 8 6.8 Strain measurement instrument . 9 6.9 Test condition . 10 6.9.1 Drop test conditions . 10 6.9.2 Test procedure . 10 6.9.3 Drop height. 11 6.9.4 Pre-test characterization . 11 6.9.5 Direction . 13 6.9.6 Number of drops . 13 7 Summary . 13 Annex A (normative)
Drop impact test method using test rod . 15 Annex B (informative)
An example of strain gauge attachment procedure . 18
Figure 1 – Example of drop test equipment and substrate securing jig . 9 Figure 2 – Position of strain gauge attachment . 10 Figure 3 – Strain measurement instrument . 11 Figure 4 – Waveform of strain and electrical conductivity of daisy chain . 11 Figure 5a – Number of times of drop to failure . 13 Figure 5b – Pulse duration . 13 Figure 5 – Correlation strain and number of failures and strain and pulse duration . 13 Figure 6 – Correlation between pulse duration
and distance between supporting points . 13 Figure 7 – Correlation between the number of times
of failure and the maximum strain. 14 Figure 8 – Direction of dropping . 14 SIST EN 60749-40:2011
60749-40 IEC:2011 – 3 – Figure A.1 – Outline of test apparatus . 16 Figure A.2 – Waveform of strain and electrical
conductivity of a daisy chain . 18 Figure B.1 – Equipment and materials . 19 Figure B.2 – Example of Attaching Strain Gauge and Guide Mark Dimensions . 20 Figure B.3 – Strain gauge attachment procedure, part 1 . 21 Figure B.4 – Strain gauge attachment procedure, part 2 . 22
SIST EN 60749-40:2011
– 4– 60749-40 IEC:2011 INTERNATIONAL ELECTROTECHNICAL COMMISSION ____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –
Part 40: Board level drop test method using a strain gauge
FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 60749-40 has been prepared by IEC technical committee 47: Semiconductor devices. The text of this standard is based on the following documents: FDIS Report on voting 47/2094/FDIS 47/2100/RVD
Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. SIST EN 60749-40:2011
60749-40 IEC:2011 – 5 – This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all parts of the IEC 60749 series, under the general title Semiconductor devices – Mechanical and climatic test methods, can be found in the IEC website. The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data related to the specific publication. At this date, the publication will be
• reconfirmed, • withdrawn, • replaced by a revised edition, or • amended.
IMPORTANT – The “colour inside” logo on the cover page of this publication indicates that it contains colours which are considered to be useful for the correct understanding of its contents. Users should therefore print this publication using a colour printer.
SIST EN 60749-40:2011
– 6– 60749-40 IEC:2011
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –
Part 40: Board level drop test method using a strain gauge
1 Scope This part of IEC 60749 is intended to evaluate and compare drop performance of a surface mount semiconductor device for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize test methodology to provide a reproducible assessment of the drop test performance of a surface mounted semiconductor devices while duplicating the failure modes normally observed during product level test. This international standard uses a strain gauge to measure the strain and strain rate of a board in the vicinity of a component. Test method IEC 60749-37 uses an accelerometer to measure the mechanical shock duration and magnitude applied which is proportional to the stress on a given component mounted on a standard board. The detailed specification shall state which test method is to be used. NOTE 1 Although this test can evaluate a structure where the mounting method and its conditions, the design of a printed wired board, solder material, the mounting capability of a semiconductor device, etc. are combined, it does not solely evaluate the mounting capability of a semiconductor device. NOTE 2 The result of this test is strongly influenced by the differences between soldering conditions, the design of the land pattern of a printed wired board, solder material, etc. Therefore, in carrying out this test, it is necessary to recognize that this test cannot intrinsically guarantee the reliability of the solder joint of the semiconductor devices. NOTE 3 When the mechanical stress which is generated by this test does not occur in the actual application of the device, implementation of this test is unnecessary. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60749-37, Semiconductor devices – Mechanical and climatic test methods – Part 37: Board level drop test method using an accelerometer 3 Terms and definitions For purposes of this document, the following terms and definitions apply. 3.1
device single electronic component to be surface mounted 3.2
drop impact strength strength of the test substrate held by a jig that is dropped from a defined height, as represented by the number of cyclic drops that finally cause fracture on the joint between a device and a PWB copper land SIST EN 60749-40:2011
60749-40 IEC:2011 – 7 – 3.3
strain strain of surface of substrate degree of stretching observed when the test substrate is distorted NOTE The strain is a numeric dimensionless quantity. 3.4
maximum strain tensile side (+) of the strain waveform 3.5
pulse duration duration between the instant when the acceleration first reaches 10 % of its specified peak level and the instant when the acceleration first returns to 10 % of the specified peak level after having reached that peak level 3.6
momentary interruption detector equipment which detects extremely short electrical discontinuity (momentary interruptions) in a daisy-chain circuit 4 Test equipment The equipment shall be selected to satisfy the test conditions specified in Clause 6. Alternatively, the test method described in Annex A can be used. 5 Test procedure 5.1 Test specimen Unless otherwise specified, specimen devices shall be of a structure that allows continuity to be checked (e.g., daisy chain). They shall be of a design based on the same specifications as devices in actual use. The test specimens shall
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