Environmental testing -- Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

Corrigendum to EN issued December 2004

Umweltprüfungen -- Teil 2-58: Prüfungen - Prüfung Td: Prüfverfahren für Lötbarkeit, Widerstandsfähigkeit gegenüber Auflösen der Metallisierung und Lötwärmebeständigkeit bei oberflächenmontierbaren Bauelementen (SMD)

Essais d'environnement -- Partie 2-58: Essais - Essai Td: Méthodes d'essai de la soudabilité, de la résistance de la métallisation à la dissolution et de la résistance à la chaleur de soudage des composants pour montage en surface (CMS)

Outlines test Td, applicable to surface mounting devices, which are intended to mount on substrates. This standard provides the standard procedures for solder alloys containing lead and for lead-free solder alloys. Provides standard procedures for determining the solderability and resistance of soldering heat to lead-free solder alloys and for determining the solderability, dissolution of metallization (see B.3.3) and resistance of soldering heat to solder alloys which are eutectic or near eutectic tin lead solders. Include the solder bath method and reflow method.

Okoljsko preskušanje – 2-58. del: Preskusi - Preskus Td: Preskusna metoda za spajkanje, odpornost površinsko montiranih komponent (SMD) proti razkrajanju pokovinjenja in vročini spajke

General Information

Status
Published
Publication Date
31-Aug-2005
Current Stage
6060 - National Implementation/Publication (Adopted Project)
Start Date
01-Sep-2005
Due Date
01-Sep-2005
Completion Date
01-Sep-2005

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SLOVENSKI SIST EN 60068-2-58:2005
STANDARD
september 2005
Okoljsko preskušanje – 2-58. del: Preskusi - Preskus Td: Preskusna metoda
za spajkanje, odpornost površinsko montiranih komponent (SMD) proti
razkrajanju pokovinjenja in vročini spajke

Environmental testing – Part 2-58: Tests – Test Td: Test methods for solderability,

resistance to dissolution of metallization and to soldering heat of surface mounting

devices (SMD)
ICS 19.040; 31.190 Referenčna številka
SIST EN 60068-2-58:2005(en)

© Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljeno

---------------------- Page: 1 ----------------------
EUROPEAN STANDARD EN 60068-2-58
NORME EUROPÉENNE
EUROPÄISCHE NORM October 2004
ICS 19.040; 31.190 Supersedes EN 60068-2-58:1999
English version
Environmental testing
Part 2-58: Tests –
Test Td: Test methods for solderability,
resistance to dissolution of metallization and
to soldering heat of surface mounting devices (SMD)
(IEC 60068-2-58:2004)
Essais d'environnement Umweltprüfungen
Partie 2-58: Essais – Teil 2-58: Prüfungen –
Essai Td: Méthodes d'essai Prüfung Td: Prüfverfahren für
de la soudabilité, de la résistance Lötbarkeit, Widerstandsfähigkeit
de la métallisation à la dissolution gegenüber Auflösen der Metallisierung
et de la résistance à la chaleur und Lötwärmebeständigkeit
de soudage des composants bei oberflächenmontierbaren
pour montage en surface (CMS) Bauelementen (SMD)
(CEI 60068-2-58:2004) (IEC 60068-2-58:2004)

This European Standard was approved by CENELEC on 2004-09-01. CENELEC members are bound to

comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European

Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on

application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other

language made by translation under the responsibility of a CENELEC member into its own language and

notified to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, Czech

Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,

Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Slovakia, Slovenia, Spain, Sweden,

Switzerland and United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels

© 2004 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.

Ref. No. EN 60068-2-58:2004 E
---------------------- Page: 2 ----------------------
EN 60068-2-58:2004 - 2 -
Foreword

The text of document 91/447/FDIS, future edition 3 of IEC 60068-2-58, prepared by IEC TC 91,

Electronics assembly technology, was submitted to the IEC-CENELEC parallel vote and was

approved by CENELEC as EN 60068-2-58 on 2004-09-01.
This European Standard supersedes EN 60068-2-58:1999.

This European Standard includes the following significant technical changes with respect to

EN 60068-2-58:1999:

– expansion of the scope so that it includes lead-free solder alloy in addition to the existing tin-lead

eutectic or near eutectic solder alloy (the structure of the document has been changed

accordingly);

– addition of the definitions "solderability" and "resistance to soldering heat" for SMDs;

– specification of the re flow temperature profiles for the resistance to soldering heat using lead-free

solder;
– addition of an Annex C enabling a quick overview of the test conditions.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2004-12-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2005-06-01
Annex ZA has been added by CENELEC.
__________
Endorsement notice

The text of the International Standard IEC 60068-2-58:2004 was approved by CENELEC as a

European Standard without any modification.

In the official version, for Bibliography, the following notes have to be added for the standards indicated:

IEC 60068-2-4 NOTE Harmonized as EN 60068-2-4:1995 (not modified).
IEC 60068-2-54 NOTE Harmonized as EN 60068-2-54:1987 (not modified).
IEC 60068-2-69 NOTE Harmonized as EN 60068-2-69:1996 (not modified).
__________
---------------------- Page: 3 ----------------------
- 3 - EN 60068-2-58:2004
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated

references, only the edition cited applies. For undated references, the latest edition of the referenced

document (including any amendments) applies.

NOTE Where an international publication has been modified by common modifications, indicated by (mod), the relevant

EN/HD applies.
Publication Year Title EN/HD Year
IEC 60068-1 1988 Environmental testing EN 60068-1 1994
Part 1: General and guidance
IEC 60068-2-20 1979 Part 2: Tests - Test T: Soldering HD 323.2.20 S3 1988
IEC 60194 1999 Printed board design, manufacture and - -
assembly - Terms and definitions
IEC 60749-20 2002 Semiconductor devices - Mechanical and EN 60749-20 2003
climatic test methods
Part 20: Resistance of plastic-
encapsulated SMDs to the combined
effect of moisture and soldering heat
IEC 61190-1-1 2002 Attachment materials for electronic EN 61190-1-1 2002
assembly
Part 1-1: Requirements for soldering
fluxes for high-quality interconnections in
electronics assembly
IEC 61190-1-2 2002 Attachment materials for electronic EN 61190-1-2 2002
assembly
Part 1-2: Requirements for solder pastes
for high-quality interconnections in
electronics assembly
IEC 61190-1-3 2002 Attachment materials for electronic EN 61190-1-3 2002
assembly
Part 1-3: Requirements for electronic
grade solder alloys and fluxed and non-
fluxed solid solders for electronic
soldering applications
IEC 61191-2 1998 Printed board assemblies EN 61191-2 1998
Part 2: Sectional specification -
Requirements for surface mount soldered
assemblies
EN 60068-1 includes corrigendum October 1988 + A1:1992 to IEC 60068-1:1988.
HD 323.2.20 S3 includes A2:1987 to IEC 60068-2-20.
---------------------- Page: 4 ----------------------
EN 60068-2-58:2004 - 4 -
Publication Year Title EN/HD Year
IEC 61249-2-7 2002 Materials for printed boards and other EN 61249-2-7 2002
interconnecting structures
Part 2-7: Reinforced base materials clad
and unclad - Epoxide woven E-glass
laminated sheet of defined flammability
(vertical burning test), copper-clad
IEC 61760-1 1998 Surface mounting technology EN 61760-1 1998
Part 1: Standard method for the
specification of surface mounting
components (SMDs)
---------------------- Page: 5 ----------------------
NORME CEI
INTERNATIONALE IEC
60068-2-58
INTERNATIONAL
Troisième édition
STANDARD
Third edition
2004-07
Essais d'environnement –
Partie 2-58:
Essais – Essai Td: Méthodes d'essai de la
soudabilité, résistance de la métallisation à la
dissolution et résistance à la chaleur de brasage
des composants pour montage en surface (CMS)
Environmental testing –
Part 2-58:
Tests – Test Td: Test methods for solderability,
resistance to dissolution of metallization and to
soldering heat of surface mounting devices (SMD)
© IEC 2005 Droits de reproduction réservés ⎯ Copyright - all rights reserved

Aucune partie de cette publication ne peut être reproduite ni No part of this publication may be reproduced or utilized in any

utilisée sous quelque forme que ce soit et par aucun procédé, form or by any means, electronic or mechanical, including

électronique ou mécanique, y compris la photocopie et les photocopying and microfilm, without permission in writing from

microfilms, sans l'accord écrit de l'éditeur. the publisher.

International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland

Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmail@iec.ch Web: www.iec.ch

CODE PRIX
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Pour prix, voir catalogue en vigueur
For price, see current catalogue
---------------------- Page: 6 ----------------------
60068-2-58 © IEC:2005 – 3 –
CONTENTS

FOREWORD.........................................................................................................................5

1 Scope and object............................................................................................................9

2 Normative references .....................................................................................................9

3 Terms and definitions ...................................................................................................11

4 Grouping of soldering processes using lead-free solder alloys .......................................11

5 Preconditioning ............................................................................................................13

6 Solder bath method ......................................................................................................13

6.1 Test apparatus and materials for the solder bath method......................................13

6.2 Test procedure for solder bath method .................................................................15

7 Solder reflow methods ..................................................................................................17

7.1 Test apparatus and materials for solder reflow methods .......................................17

7.2 Test procedure for the solder reflow method.........................................................21

8 Test conditions .............................................................................................................23

8.1 Test conditions for lead-free solder alloys ............................................................23

8.2 Test conditions for lead containing solder alloy.....................................................27

9 Final measurements .....................................................................................................31

9.1 Flux removal........................................................................................................31

9.2 Recovery conditions ............................................................................................31

9.3 Evaluation ...........................................................................................................33

10 Information to be given in the relevant specification.......................................................35

Annex A (normative) Criteria for visual examination............................................................39

Annex B (informative) Guidance.........................................................................................43

Annex C (informative) Overview of test conditions ..............................................................49

Bibliography .......................................................................................................................53

Figure 1 – Examples of immersion ......................................................................................17

Figure 2 – Reflow temperature profile..................................................................................23

Figure 3 – Identification of areas on metallic termination......................................................33

Figure A.1 – Evaluation of wetting .......................................................................................41

Table 1 – Grouping of soldering processes related to lead-free solder alloys........................13

Table 2 – Severities (duration and temperatures) – Solder bath method – Lead-free

solder alloys .......................................................................................................................25

Table 3 – Reflow temperature profile for wetting – Lead-free solder alloys ...........................25

Table 4 – Reflow temperature profile for resistance to soldering heat – Lead-free

solder alloys .......................................................................................................................27

Table 5 – Severities (duration and temperature) ..................................................................27

Table 6 – Reflow temperature profile for wetting – Lead containing solder alloys..................29

Table 7 – Reflow temperature profile for resistance to soldering heat – Lead containing

solder alloys .......................................................................................................................31

Table C.1 – Overview of the temperature and duration conditions ........................................51

---------------------- Page: 7 ----------------------
60068-2-58 © IEC:2005 – 5 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
ENVIRONMENTAL TESTING –
Part 2-58: Tests – Test Td: Test methods for solderability,
resistance to dissolution of metallization and to
soldering heat of surface mounting devices (SMD)
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote

international co-operation on all questions concerning standardization in the electrical and electronic fields. To

this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,

Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC

Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested

in the subject dealt with may participate in this preparatory work. International, governmental and non-

governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely

with the International Organization for Standardization (ISO) in accordance with conditions determined by

agreement between the two organizations.

2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international

consensus of opinion on the relevant subjects since each technical committee has representation from all

interested IEC National Committees.

3) IEC Publications have the form of recommendations for international use and are accepted by IEC National

Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC

Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any

misinterpretation by any end user.

4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications

transparently to the maximum extent possible in their national and regional publications. Any divergence

between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in

the latter.

5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any

equipment declared to be in conformity with an IEC Publication.

6) All users should ensure that they have the latest edition of this publication.

7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and

members of its technical committees and IEC National Committees for any personal injury, property damage or

other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and

expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC

Publications.

8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is

indispensable for the correct application of this publication.

9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of

patent rights. IEC shall not be held responsible for identifying any or all such patent rights.

International Standard IEC 60068-2-58 has been prepared by IEC technical committee 91:

Electronics assembly technology.

This edition includes the following significant technical changes with respect to the previous

edition:

– expansion of the scope so that it includes lead-free solder alloy in addition to the existing

tin-lead eutectic or near eutectic solder alloy (the structure of the document has been

changed accordingly);

– addition of the definitions of "solderability" and "resistance to soldering heat" for SMDs;

– specification of the reflow temperature profiles for the resistance to soldering heat using

lead-free solder;
– addition of an Annex C enabling a quick overview of the test conditions.
---------------------- Page: 8 ----------------------
60068-2-58 © IEC:2005 – 7 –
This bilingual version (2005-02) replaces the English version.
The text of this standard is based on the following documents:
FDIS Report on voting
91/447/FDIS 91/459/RVD

Full information on the voting for the approval of this standard can be found in the report on

voting indicated in the above table.
The French version of this standard has not been voted upon.

This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

The committee has decided that the contents of this publication will remain unchanged until

the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in

the data related to the specific publication. At this date, the publication will be

• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
---------------------- Page: 9 ----------------------
60068-2-58 © IEC:2005 – 9 –
ENVIRONMENTAL TESTING –
Part 2-58: Tests – Test Td: Test methods for solderability,
resistance to dissolution of metallization and to
soldering heat of surface mounting devices (SMD)
1 Scope and object

This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD), which

are intended to mount on substrates. This standard provides the standard procedures for

solder alloys containing lead (Pb) and for lead-free solder alloys.

This standard provides standard procedures for determining the solderability and resistance

of soldering heat to lead-free solder alloys.

This standard provides standard procedures for determining the solderability, dissolution of

metallization (see B.3.3) and resistance of soldering heat to solder alloys which are eutectic

or near eutectic tin lead solders.

The procedures in this standard include the solder bath method and reflow method. The

solder bath method is applicable to the SMD designed for flow soldering and the SMD

designed for reflow soldering when the solder bath (dipping) method is appropriate.

The reflow method is applicable to the SMD designed for reflow soldering, to determine the

suitability of SMD for reflow soldering and when the solder bath (dipping) method is not

appropriate.

The objective of this standard is to ensure that component lead or termination solderability

meets the applicable solder joint requirements of IEC 61191-2 using each of the soldering

methods specified in IEC 61760-1. In addition, test methods are provided to ensure that the

component body can resist against the heat load to which it is exposed during soldering.

2 Normative references

The following referenced documents are indispensable for the application of this document.

For dated references, only the edition cited applies. For undated references, the latest edition

of the referenced document (including any amendments) applies.
IEC 60068-1:1988, Environmental testing – Part 1: General and guidance
IEC 60068-2-20:1979, Environmental testing – Part 2: Tests – Test T: Soldering

IEC 60194:1999, Printed board design, manufacture and assembly – Terms and definitions

IEC 60749-20:2002, Semiconductor devices – Mechanical and climatic test methods –

Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and

soldering heat
---------------------- Page: 10 ----------------------
60068-2-58 © IEC:2005 – 11 –

IEC 61190-1-1:2002, Attachment materials for electronic assembly – Part 1-1: Requirements

for soldering fluxes for high-quality interconnections in electronic assembly

IEC 61190-1-2:2002, Attachment materials for electronic assembly – Part 1-2: Requirements

for solder pastes for high-quality interconnections in electronic assembly

IEC 61190-1-3:2002, Attachment materials for electronic assembly – Part 1-3: Requirements

for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic

soldering applications

IEC 61191-2:1998, Printed board assemblies – Part 2: Sectional specification – Requirements

for surface mount soldered assemblies

IEC 61249-2-7:2002, Materials for printed boards and other interconnecting structures –

Part 2-7: Reinforced base materials clad and unclad – Epoxide woven E-glass laminated

sheet of defined flammability (vertical burning test), copper-clad
IEC 61760-1:1998, Surface mounting technology – Part 1: Standard method for the
specification of surface mounting components (SMDs)
3 Terms and definitions

For the purposes of this document, the terms and definitions as defined in IEC 60068-1,

IEC 60068-2-20, IEC 60194, as well as the following apply.
3.1
solderability

ability of the termination or electrode of SMD to be wetted by solder at the temperature of the

termination or electrode which is assumed to be the lowest temperature in the soldering

process within solderable temperature of solder alloy
3.2
resistance to soldering heat

ability of SMD to withstand the highest temperature of the termination or electrode in

soldering process, within applicable temperature range of solder alloy
4 Grouping of soldering processes using lead-free solder alloys

The melting temperatures of lead-free solder alloys selected currently for industrial processes

are significantly different from those for Sn-Pb solder alloy. Moreover, the melting

temperatures of lead-free solder alloys are different from each other but can be clustered in

groups.

According to the ability of the SMD to withstand the typical temperature and dwell time

conditions that match the exposure to the processes using the selected lead-free alloys, the

following groups of soldering processes outlined in Table 1 are given as a a guideline for

selecting the severities for the wetting and resistance tests against the specified soldering

heat:
---------------------- Page: 11 ----------------------
60068-2-58 © IEC:2005 – 13 –
Table 1 – Grouping of soldering processes related to lead-free solder alloys
Typical process temperature
Alloys
Group
(examples)
Flow soldering Reflow soldering
– 170 °C – 210 °C Sn-Bi
Low temperature
Sn-Zn-Bi
Medium – 210 °C – 235 °C
Sn-Zn
temperature
3 Sn-Ag
Medium-high 245 °C – 255 °C 235 °C – 250 °C Sn-Ag-Cu
temperature Sn-Ag-Bi
250 °C – 260 °C – Sn-Cu
High temperature
NOTE 1 Flow soldering applies to both wave soldering and dip soldering.

NOTE 2 Typical process temperatures for flow soldering are identical to the solder temperature. Typical process

temperatures for reflow soldering are the terminal and top surface temperature of the SMDs.

NOTE 3 In Group 2 reflow soldering under inert atmosphere (e.g. nitrogen) is required.

NOTE 4 The basic solder alloys listed in this table represent compositions that are currently preferred for lead-

free soldering processes. However, other solder alloys when matching with the specified group should not be

excluded.
5 Preconditioning

5.1 The specimen shall be tested in the “as-received“ condition unless otherwise specified

by the relevant specification. Care should be taken that no contamination, by contact with the

fingers or by other means, occurs.

5.2 When accelerated ageing is prescribed by the relevant specification, one of the methods

of 4.5 of IEC 60068-2-20 shall be used or, when appropriate, 4 h/155 °C dry heat shall be

used.

5.3 The preconditioning and resistance to soldering heat test of semiconductor SMDs in

plastic encapsulation shall be done conform the test procedure as described in IEC 60749-20.

6 Solder bath method
6.1 Test apparatus and materials for the solder bath method
6.1.1 Solder bath

The solder bath dimensions shall comply with the requirements of 4.6.1 of IEC 60068-2-20.

The material of the solder bath container shall be resistant to the liquid solder alloy.

6.1.2 Flux

The flux shall consist of 25 % by weight of colophony in 75 % by weight of 2-propanol

(isopropanol) or ethyl alcohol (as specified in Appendix C of IEC 60068-2-20). Preferably the

flux activity should conform with the “Low (0)” level, corresponding to a halide content of

<0,01 wt % (Cl, Br, F) (see IEC 61190-1-1). When non-activated flux is inappropriate, the

above flux with the addition of diethylammonium chloride (analytical reagent grade), up to an

amount of 0,5 % chloride (expressed as free chlorine based on the colophony content), may

be used. Information concerning the used flux type shall be given in the product detail

specification.
---------------------- Page: 12 ----------------------
60068-2-58 © IEC:2005 – 15 –
6.1.3 Solder
6.1.3.1 Lead-free solder alloys

When testing solderability, the solder composition shall be as defined in Table 2. For the

resistance to soldering heat test, any alloys may be used, provided they are completely liquid

at the required temperature.
6.1.3.2 Solder alloys containing lead

The solder composition shall be either 60 % tin and 40 % lead according to Annex B of

IEC 60068-2-20 (Sn60Pb40A, according to IEC 61190-1-3) or 63 % tin and 37 % lead
(Sn63Pb37A, according to IEC 61190-1-3).
6.2 Test procedure for solder bath method
6.2.1 Specimens
A specimen shall not be used for more than one test.
6.2.2 Clamping

Unless otherwise specified in the relevant specification, the specimen shall be placed in a

stainless steel clip as shown in Figure 1. No part of the clip jaws shall make contact with the

areas to be examined. The specimen shall remain in the clip while being fluxed and dipped in

the solder.
6.2.3 Fluxing

Unless otherwise specified in the relevant specification, the specimen shall be completely

immersed in flux and withdrawn slowly. Any excess flux shall be removed by contact with

absorbent paper.
6.2.4 Solder immersion

When preheating is prescribed by the relevant specification, the specified duration and

temperature shall be applied immediately prior to the immersion of the specimen in the solder

bath.

The oxide film on the solder bath shall be skimmed off immediately before immersion.

The immersion and withdrawal speed shall be between 20 mm/s and 25 mm/s.
---------------------- Page: 13 ----------------------
60068-2-58 © IEC:2005 – 17 –
View of surface to be examined
IEC 711/04
Figure 1 – Examples of immersion
6.2.5 Attitude
Two attitudes of immersion are standardized:

Attitude A: For most specimens, the areas to be examined shall be immersed not less than

2 mm below the solder meniscus (but not to a greater depth than necessary; see
Figure 1) with the seating plane vertical.

Attitude B: For certain specimens (see B.3.4), the specimen may be floated on the solder, but

only when testing resistance to soldering heat.

If the relevant specification does not mention the attitude, attitude A shall be adopted.

7 Solder reflow methods
7.1 Test apparatus and materials for solder reflow methods
7.1.1 Reflow equipment
As long as the test conditions are fulfilled, any reflow equipment may be used:
a) forced gas convection;
b) infrared;
c) vapour phase;

d) hot plate soldering; metallic plate (carrier), floating on a molten solder bath or an

electrically heated plate.
NOTE 1 Forced gas convection is preferred; including infrared assistance.

NOTE 2 Infrared reflow equipments are known to have variations of peak reflow temperature (PRT) of 30 °C or

more across the board in a PC board.

NOTE 3 In case of vapour phase soldering, a specific liquid is necessary for each test temperature.

NOTE 4 Hot plate soldering is a method which at times may have large PRT variations in the order of 40 °C.

---------------------- Page: 14 ----------------------
60068-2-58 © IEC:2005 – 19 –
7.1.2 Solder paste for solder reflow
7.1.2.1 Lead-free solder paste

Unless otherwise specified in the relevant specification, solder paste shall be as shown

below. For the resistance to soldering heat test, any alloys may be used, provided they are

completely liquid at the required temperature.
a) Solder paste for group 1:
– Alloy composition

The alloy composition to be used shall consist of 58 wt % of Bi (bismuth) and the

remainder of Sn (tin), Sn42Bi58. The solder alloy shall consist of 57 wt % to 58 wt % Bi

and
...

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