kSIST FprEN IEC 62132-8:2025
(Main)Integrated circuits - Measurement of electromagnetic immunity - Part 8: Measurement of radiated immunity - IC stripline method
Integrated circuits - Measurement of electromagnetic immunity - Part 8: Measurement of radiated immunity - IC stripline method
Integrierte Schaltungen - Messung der elektromagnetischen Störfestigkeit - Teil 8: Messung der Störfestigkeit bei Einstrahlungen - IC-Streifenleiterverfahren
Circuits intégrés - Mesure de l'immunité électromagnétique - Partie 8: Mesure de l'immunité rayonnée - Méthode de la ligne TEM à plaques pour circuit intégré
Integrirana vezja - Meritve elektromagnetne odpornosti - 8. del: Meritev odpornosti proti sevanju - Metoda z IC na tračnem valovodu
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Standards Content (Sample)
SLOVENSKI STANDARD
oSIST prEN IEC 62132-8:2025
01-maj-2025
Integrirana vezja - Meritve elektromagnetne odpornosti - 8. del: Meritev odpornosti
proti sevanju - Metoda z IC na tračnem valovodu
Integrated circuits - Measurement of electromagnetic immunity - Part 8: Measurement of
radiated immunity - IC stripline method
Integrierte Schaltungen - Messung der elektromagnetischen Störfestigkeit - Teil 8:
Messung der Störfestigkeit bei Einstrahlungen - IC-Streifenleiterverfahren
Circuits intégrés - Mesure de l'immunité électromagnétique - Partie 8: Mesure de
l'immunité rayonnée - Méthode de la ligne TEM à plaques pour circuit intégré
Ta slovenski standard je istoveten z: prEN IEC 62132-8:2025
ICS:
31.200 Integrirana vezja, Integrated circuits.
mikroelektronika Microelectronics
oSIST prEN IEC 62132-8:2025 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
oSIST prEN IEC 62132-8:2025
oSIST prEN IEC 62132-8:2025
47A/1182/CDV
COMMITTEE DRAFT FOR VOTE (CDV)
PROJECT NUMBER:
IEC 62132-8 ED2
DATE OF CIRCULATION: CLOSING DATE FOR VOTING:
2025-03-07 2025-05-30
SUPERSEDES DOCUMENTS:
47A/1167/CD, 47A/1176/CC
IEC SC 47A : INTEGRATED CIRCUITS
SECRETARIAT: SECRETARY:
Japan Mr Yoshinori FUKUBA
OF INTEREST TO THE FOLLOWING COMMITTEES: HORIZONTAL FUNCTION(S):
ASPECTS CONCERNED:
Electromagnetic Compatibility
SUBMITTED FOR CENELEC PARALLEL VOTING NOT SUBMITTED FOR CENELEC PARALLEL VOTING
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CENELEC, is drawn to the fact that this Committee Draft for
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This document is still under study and subject to change. It should not be used for reference purposes.
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to be included should this proposal proceed. Recipients are reminded that the CDV stage is the final stage for submitting ISC
clauses. (SEE AC/22/2007 OR NEW GUIDANCE DOC).
TITLE:
Integrated circuits - Measurement of electromagnetic immunity - Part 8: Measurement of radiated
immunity - IC stripline method
PROPOSED STABILITY DATE: 2029
NOTE FROM TC/SC OFFICERS:
SC47A WG9 reviewed all CC of 47A/1167/CD and resolve all comments in 47A/1176/CC, SC47A decided next
step to be CDV (47A/1177A/RM, Decision 47A-2024-07).
electronic file, to make a copy and to print out the content for the sole purpose of preparing National Committee positions.
You may not copy or "mirror" the file or printed version of the document, or any part of it, for any other purpose without
permission in writing from IEC.
oSIST prEN IEC 62132-8:2025
IEC 62132-8 ED2 © IEC 2025 – 2 – 47A/1182/CDV
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 General . 7
5 Test conditions . 7
5.1 General . 7
5.2 Supply voltage . 7
5.3 Frequency range . 8
6 Test equipment . 8
6.1 General . 8
6.2 Cables . 8
6.3 Shielding . 8
6.4 RF disturbance generator . 8
6.5 IC stripline . 8
6.6 50 Ω termination . 8
6.7 DUT monitor . 8
7 Test setup . 8
7.1 General . 8
7.2 Test configuration . 9
7.3 EMC test board (PCB) . 9
8 Test procedure . 9
8.1 General . 9
8.2 Operational check. 9
8.3 Immunity measurement . 9
8.3.1 General . 9
8.3.2 RF disturbance signal . 10
8.3.3 Test frequency steps and ranges . 10
8.3.4 Test levels and dwell time . 10
8.3.5 DUT monitoring . 10
8.3.6 Detailed procedure . 10
9 Test report . 11
10 RF immunity acceptance level . 11
Annex A (normative) Field strength determination . 12
A.1 General . 12
A.2 Characteristic impedance of stripline arrangements . 12
A.3 Field strength calculation . 12
A.4 RF characteristic verification of the IC stripline . 13
Annex B (normative) IC stripline descriptions . 14
B.1 IC stripline . 14
B.2 Example for IC stripline arrangement . 15
Annex C (informative) Closed stripline geometrical limitations . 17
Bibliography . 21
oSIST prEN IEC 62132-8:2025
IEC 62132-8 ED2 © IEC 2025 – 3 – 47A/1182/CDV
Figure 1 – IC stripline test setup . 9
Figure A.1 – Definition of height (h) and width (w) of an IC stripline . 12
Figure A.2 – EM field distribution . 13
Figure B.1 – Cross section view of an example of an open IC stripline . 14
Figure B.2 – Cross section view of an example of a closed IC stripline . 15
Figure B.3 – Example of a closed version of an IC stripline . 16
Figure C.1 – Calculated H-field reduction of closed version referenced to referring
open version as a function of portion of active conductor width of closed version to
open version . 19
Figure C.2 – Location of currents and mirrored currents at grounded planes used for
calculation of fields . 20
Table B.1 – Maximum DUT dimensions for 6,7 mm IC stripline (Open version) . 15
Table B.2 – Maximum DUT dimensions for 6,7 mm IC stripline (Closed version) . 15
Table C.1 – Height of shielding, simulated at hbottom = 6,7mm to achieve practically
50 Ω system . 18
oSIST prEN IEC 62132-8:2025
IEC 62132-8 ED2 © IEC 2025 – 4 – 47A/1182/CDV
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
INTEGRATED CIRCUITS –
MEASUREMENT OF ELECTROMAGNETIC IMMUNITY –
Part 8: Measurement of radiated immunity –
IC stripline method
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) IEC draws attention to the possibility that the implementation of this document may involve the use of (a)
patent(s). IEC takes no position concerning the evidence, validity or applicability of any claimed patent rights in
respect thereof. As of the date of publication of this document, IEC [had/had not] received notice of (a) patent(s),
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IEC 62132-8 has been prepared by subcommittee 47A: Integrated circuits, of IEC technical
committee 47: Semiconductor devices. It is an International Standard.
This second edition cancels and replaces the first edition published in 2012. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) [short description of the main changes].
oSIST prEN IEC 62132-8:2025
IEC 62132-8 ED2 © IEC 2025 – 5 – 47A/1182/CDV
The text of this International Standard is based on the following documents:
Draft Report on voting
47A/XX/FDIS 47A/XX/RVD
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English [change
language if necessary].
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/publications.
This part of IEC 62132 is to be read in conjunction with IEC 62132–1.
A list of all the parts in the IEC 62132 series, published under the general title Integrated
circuits – Measurement of electromagnetic immunity, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn, or
• revised.
oSIST prEN IEC 62132-8:2025
IEC 62132-8 ED2 © IEC 2025 – 6 – 47A/1182/CDV
INTEGRATED CIRCUITS –
MEASUREMENT OF ELECTROMAGNETIC IMMUNITY –
Part 8: Measurement of radiated immunity –
IC stripline method
1 Scope
This part of IEC 62132 specifies a method for measuring the immunity of an integrated circuit
(IC) to radio frequency (RF) radiated electromagnetic disturbances using an IC stripline.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition cited
applies. For undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 60050 (all parts), International Electrotechnical Vocabulary (available at
http://www.electropedia.org)
IEC 61000–4–20, Electromagnetic compatibility (EMC) – Part 4-20: Testing and measurement
techniques – Emission and immunity testing in transverse electromagnetic (TEM) waveguides
IEC 62132-1, Integrated circuits - Measurement of electromagnetic immunity - Part 1: General
conditions and definitions
3 Terms and definitions
For the purposes of this document, the terms and definitions given in IEC 62132-1,
IEC 60050-131, IEC 60050–161 and the following apply.
ISO and IEC maintain terminology databases for use in standardization at the following
addresses:
• IEC Electropedia: available at https://www.electropedia.org/
• ISO Online browsing platform: available at https://www.iso.org/obp
3.1
transverse electromagnetic mode
TEM
waveguide mode in which the components of the electric and magnetic fields in the propagation
direction are much less than the primary field components across any transverse cross-section
Note 1 to entry: This note only applies to the French language.
3.2
TEM waveguide
open or closed transmission line system, in which a wave is propagating in the transverse
electromagnetic mode to produce a specified field for testing purposes
3.3
IC stripline
TEM waveguide, consisting of an active conductor placed on a defined spacing over an
enlarged ground plane, connected to a port structure on each end and an optional shielded
enclosure
oSIST prEN IEC 62132-8:2025
IEC 62132-8 ED2 © IEC 2025 – 7 – 47A/1182/CDV
Note 1 to entry: This arrangement guides a wave propagation in the transverse electromagnetic mode to produce
a specific field for testing purposes between the active conductor and the enlarged ground plane. The ground plane
of the standard EMC test board, according to IEC 62132-1, is used. An optional shielding enclosure may be used to
shield the IC stripline. In contrast to the open version without a shielding enclosure, the shied leads to a closed
version of the IC stripline. For further information, see Annex A.
3.4
two-port TEM waveguide
TEM waveguide with input/output measurement ports at both ends
3.5
characteristic impedance
magnitude of the ratio of the voltage between the active conductor and the corresponding
ground plane to the current on either conductor for any constant phase wave-front
Note 1 to entry: The characteristic impedance is independent of the voltage/current magnitudes and depends only
on the cross sectional geometry of the transmission line. TEM waveguides are typically designed to have a 50 Ω
characteristic impedance. For further information and equation to stripline arrangements, see Annex A.
3.6
primary field component
primary component
electric field component aligned with the intended test polarization
Note 1 to entry: For example, in IC stripline, the active conductor is parallel to the horizontal floor, and the primary
mode electric field vector is vertical at the transverse centre of the IC stripline.
4 General
An IC to be evaluated for EMC performance is referred to as a device under test (DUT). The
DUT should be mounted on an EMC test board according to IEC 62132–1. The EMC test board
is provided with the appropriate measurement or monitoring points at which the DUT response
parameters can be measured. It controls the geometry and orientation of the DUT relative to
the active conductor and eliminates in the case of a closed version of the IC stripline any
connecting leads within the housing (these are on the backside of the board, which is outside
the housing).
For the IC stripline, one of the 50 Ω ports is terminated with a 50 Ω load. The other 50 Ω port
is connected to the output of an RF disturbance generator. The injected RF disturbance signal
exposes the DUT to an electromagnetic field determined by the injected power, the typical
impedance and the distance between the ground plane of the EMC test board and the active
conductor of the IC stripline. The relation is given in Annex A.
Rotating the EMC test board in the four possible orientations in the aperture to accept EMC
test board of the IC stripline will affect the sensitivity of the DUT. Dependent upon the DUT,
the response parameters of the DUT may vary (e.g. a change of current consumption,
deterioration in function performance, waveform jitter). The intent of this test method is to
provide a quantitative measure of the RF immunity of DUTs for comparison or other purposes.
For further information, see Annex A.
5 Test conditions
5.1 General
The test conditions shall meet the requirements as described in IEC 62132-1. In addition, the
following test conditions shall apply.
5.2 Supply voltage
The supply voltage shall be as specified by the IC manufacturer. If the users of this procedure
agree to other values, they shall be documented in the test report.
oSIST prEN IEC 62132-8:2025
IEC 62132-8 ED2 © IEC 2025 – 8 – 47A/1182/CDV
5.3 Frequency range
The effective frequency range of this radiated immunity procedure is 150 kHz to 6 GHz in
combination with the VSWR characteristic ≤ 1,25 for f ≤ 3 GHz and ≤ 1,4 for f > 3 GHz. The
upper frequency can be extended if the IC stripline does not exhibit significant higher order
modes over the frequency range being measured.
NOTE 1 The given VSWR value of 1,4 is based on evolving technical solutions for IC striplines. For accuracy
reasons the VSWR value is targeted as low as possible (e.g. 1,3).
NOTE 2 Higher-order modes can affect the VSWR of the IC Striplines by interfering with the TEM mode and perturb
the desired field distribution.
6 Test equipment
6.1 General
The test equipment shall meet the requirements described in IEC 62132-1. In addition, the
following test equipment requirements shall apply.
6.2 Cables
Double shielded or semi-rigid coaxial cable, of 50 Ω characteristic impedance, may be required
to interface with the IC stripline.
6.3 Shielding
Testing in a shielded room is only necessary for the open IC stripline version. The closed
version of the IC stripline is shielded by its housing.
6.4 RF disturbance generator
An RF disturbance generator with sufficient power handling capabilities shall be used. The RF
disturbance generator may comprise of an RF signal generator with a modulation function, an
RF power amplifier and an optional attenuater. The voltage standing wave ratio (VSWR) at the
output of the RF disturbance generator shall be less than 1,5 over the frequency range being
measured.
6.5 IC stripline
The IC stripline (open or closed version) used for this test procedure shall be fitted with an
aperture to mate with the EMC test board.
For further information as to field strength determination, IC stripline designs and the limitation
of geometrical dimensions of closed version, see Annex A, Annex B and Annex C.
6.6 50 Ω termination
A 50 Ω termination with a VSWR ≤ 1,1 for f ≤ 3 GHz and ≤ 1,2 for f > 3 GHz up to the maximum
used frequency and sufficient power handling capabilities over the frequency range of
measurement is recommended for the IC stripline 50 Ω port not connected to the RF
disturban
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