Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

This part of IEC 61191 gives the requirements for surface mount solder connections. The
requirements pertain to those assemblies that are totally surface mounted or to the surface
mounted portions of those assemblies that include other related technologies (e.g. throughhole,
chip mounting, terminal mounting, etc.).

Elektronikaufbauten auf Leiterplatten - Teil 2: Rahmenspezifikation - Anforderungen an gelötete Baugruppen in Oberflächenmontage

Ensembles de cartes imprimées - Partie 2: Spécification intermédiaire - Exigences relatives à l'assemblage par brasage pour montage en surface

L’IEC 61191-2:2017 spécifie les exigences relatives aux connexions brasées pour montage en surface. Les exigences se rapportent aux ensembles intégrant uniquement le montage en surface ou aux portions d’ensembles pour montage en surface incluant d’autres technologies associées (par exemple montage par trous traversants, montage à puce, à borne, etc.). Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente: a) mise à jour des exigences pour qu’elles soient conformes aux critères d’acceptation de l’IPC‑A-610F; b) mise à jour d’une partie de la terminologie utilisée dans le présent document; c) correction des références aux normes IEC; d) ajout de cinq styles de terminaisons.

Sestavi plošč tiskanih vezij - 2. del: Področna specifikacija - Zahteve za površinsko nameščene spajkane sestave

Ta del standarda IEC 61191 določa zahteve za površinsko nameščene spajkane sestave. Zahteve se nanašajo na sestave, ki so v celoti nameščeni na površino, ali na dele sestavov, nameščene na površino, ki vključujejo druge povezane tehnologije (npr. nameščanje skozi luknjice, nameščanje čipov, nameščanje priključkov itd.).

General Information

Status
Published
Publication Date
11-Dec-2017
Current Stage
6060 - National Implementation/Publication (Adopted Project)
Start Date
28-Nov-2017
Due Date
02-Feb-2018
Completion Date
12-Dec-2017

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2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.Elektronikaufbauten auf Leiterplatten - Teil 2: Rahmenspezifikation - Anforderungen an gelötete Baugruppen in OberflächenmontageEnsembles de cartes imprimées - Partie 2: Spécification intermédiaire - Exigences relatives à l'assemblage par brasage pour montage en surfacePrinted board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies31.190Sestavljeni elektronski elementiElectronic component assemblies31.180SORãþHPrinted circuits and boardsICS:Ta slovenski standard je istoveten z:EN 61191-2:2017SIST EN 61191-2:2018en01-januar-2018SIST EN 61191-2:2018SLOVENSKI

STANDARDSIST EN 61191-2:20141DGRPHãþD
SIST EN 61191-2:2018
EUROPEAN STANDARD NORME EUROPÉENNE EUROPÄISCHE NORM
EN 61191-2
October 2017 ICS 31.190; 31.240
Supersedes
EN 61191-2:2013
English Version

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (IEC 61191-2:2017)

Ensembles de cartes imprimées - Partie 2: Spécification intermédiaire - Exigences relatives à l'assemblage par brasage pour montage en surface (IEC 61191-2:2017)

Elektronikaufbauten auf Leiterplatten -

Teil 2: Rahmenspezifikation - Anforderungen an gelötete Baugruppen in Oberflächenmontage (IEC 61191-2:2017) This European Standard was approved by CENELEC on 2017-06-27. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. European Committee for Electrotechnical Standardization

Comité Européen de Normalisation Electrotechnique Europäisches Komitee für Elektrotechnische Normung CEN-CENELEC Management Centre: Avenue Marnix 17,

B-1000 Brussels © 2017 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.

Ref. No. EN 61191-2:2017 E SIST EN 61191-2:2018

EN 61191-2:2017 2 European foreword The text of document 91/1386/CDV, future edition 3 of IEC 61191-2, prepared by IEC/TC 91 "Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 61191-2:2017.

The following dates are fixed: • latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2018-04-13 • latest date by which the national standards conflicting with the document have to be withdrawn (dow) 2020-10-13

This document supersedes EN 61191-2:2013.

Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.

Endorsement notice The text of the International Standard IEC 61191-2:2017 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following notes have to be added for the standards indicated:

IEC 60068-2-20 NOTE Harmonized as EN 60068-2-20. IEC 60068-2-58 NOTE Harmonized as EN 60068-2-58. IEC 61188-5-1 NOTE Harmonized as EN 61188-5-1. IEC 61188-5-2 NOTE Harmonized as EN 61188-5-2. IEC 61188-5-3 NOTE Harmonized as EN 61188-5-3. IEC 61188-5-4 NOTE Harmonized as EN 61188-5-4. IEC 61188-5-5 NOTE Harmonized as EN 61188-5-5. IEC 61188-5-6 NOTE Harmonized as EN 61188-5-6. IEC 61188-7 NOTE Harmonized as EN 61188-7. IEC 61189-2 NOTE Harmonized as EN 61189-2. IEC 61190-1-2 NOTE Harmonized as EN 61190-1-2. IEC 61193-1 NOTE Harmonized as EN 61193-1. IEC 61193-3 NOTE Harmonized as EN 61193-3. IEC 62326-1 NOTE Harmonized as EN 62326-1. IEC 62326-4 NOTE Harmonized as EN 62326-4. IEC 62326-4-1 NOTE Harmonized as EN 62326-4-1. ISO 9001 NOTE Harmonized as EN ISO 9001. SIST EN 61191-2:2018

EN 61191-2:2017 3 Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following documents are referred to in the text in such a way that some or all of their content constitutes requirements of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies.

NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies.

NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here: www.cenelec.eu.

Publication Year Title EN/HD Year
IEC 60194 -

Printed board design, manufacture and assembly - Terms and definitions EN 60194 -

IEC 61191-1 -
Printed board assemblies -

Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies EN 61191-1 -

IPC-A-610 -
Acceptability of Electronics Assemblies - -
SIST EN 61191-2:2018
SIST EN 61191-2:2018
IEC 61191-2 Edition 3.0 2017-05 INTERNATIONAL STANDARD
Printed board assemblies –

Part 2: Sectional specification – Requirements for surface mount soldered assemblies

INTERNATIONAL ELECTROTECHNICAL COMMISSION
ICS 31.190; 31.240
ISBN 978-2-8322-4322-0
® Registered trademark of the International Electrotechnical Commission ®

Warning! Make sure that you obtained this publication from an authorized distributor. SIST EN 61191-2:2018 colourinside

– 2 – IEC 61191-2:2017 © IEC 2017 CONTENTS FOREWORD ........................................................................................................................... 5 1 Scope .............................................................................................................................. 7 2 Normative references ...................................................................................................... 7 3 Terms and definitions ...................................................................................................... 7 4 General requirements ...................................................................................................... 7 5 Surface mounting of components ..................................................................................... 7 5.1 General ................................................................................................................... 7 5.2 Alignment requirements .......................................................................................... 8 5.3 Process control ....................................................................................................... 8 5.4 Surface mounted component requirements ............................................................. 8 5.5 Flatpack lead forming .............................................................................................. 8 5.5.1 General ........................................................................................................... 8 5.5.2 Surface mounted device lead bends ................................................................ 8 5.5.3 Surface mounted device lead deformation ....................................................... 9 5.5.4 Flattened leads ................................................................................................ 9 5.5.5 Dual-in-line packages (DIPs) ........................................................................... 9 5.5.6 Parts not configured for surface mounting ........................................................ 9 5.6 Small devices with two terminations ........................................................................ 9 5.6.1 General ........................................................................................................... 9 5.6.2 Stack mounting ................................................................................................ 9 5.6.3 Devices with external deposited elements ........................................................ 9 5.7 Lead component body positioning ......................................................................... 10 5.7.1 General ......................................................................................................... 10 5.7.2 Axial-leaded components ............................................................................... 10 5.7.3 Other components ......................................................................................... 10 5.8 Parts configured for butt lead mounting ................................................................. 10 5.9 Non-conductive adhesive coverage limits .............................................................. 10 6 Acceptance requirements .............................................................................................. 10 6.1 General ................................................................................................................. 10 6.2 Control and corrective actions ............................................................................... 10 6.3 Surface soldering of leads and terminations .......................................................... 11 6.3.1 General ......................................................................................................... 11 6.3.2 Solder fillet height and heel fillets .................................................................. 11 6.3.3 Flat ribbon L and gull-wing leads ................................................................... 12 6.3.4 Round or flattened (coined) leads .................................................................. 13 6.3.5 J leads ........................................................................................................... 14 6.3.6 Rectangular or square end component .......................................................... 15 6.3.7 Cylindrical end-cap terminations .................................................................... 16 6.3.8 Bottom only terminations ............................................................................... 17 6.3.9 Castellated terminations ................................................................................ 18 6.3.10 Butt joints ...................................................................................................... 19 6.3.11 Inward L-shaped ribbon leads ........................................................................ 20 6.3.12 Flat lug leads ................................................................................................. 21 6.3.13 Ball grid array ................................................................................................ 22 6.3.14 Column grid array .......................................................................................... 23 6.3.15 Bottom termination components ..................................................................... 24 SIST EN 61191-2:2018

IEC 61191-2:2017 © IEC 2017 – 3 –

6.3.16 Components with bottom thermal plane terminations (D-Pak) ........................ 24 6.3.17 P-style terminations ....................................................................................... 26 6.4 General post-soldering requirements applicable to all surface-mounted assemblies ............................................................................................................ 26 6.4.1 Dewetting ...................................................................................................... 26 6.4.2 Leaching ........................................................................................................ 26 6.4.3 Pits, voids, blowholes, and cavities ................................................................ 26 6.4.4 Solder wicking ............................................................................................... 27 6.4.5 Solder webs and skins ................................................................................... 27 6.4.6 Bridging ......................................................................................................... 27 6.4.7 Degradation of marking ................................................................................. 27 6.4.8 Solder spikes ................................................................................................. 27 6.4.9 Disturbed joint ............................................................................................... 27 6.4.10 Component damage....................................................................................... 27 6.4.11 Open circuit, non-wetting ............................................................................... 27 6.4.12 Component tilting........................................................................................... 27 6.4.13 Non-conducting adhesive encroachment ........................................................ 28 6.4.14 Open circuit, no solder available .................................................................... 28 6.4.15 Component on edge ...................................................................................... 28 7 Rework and repair ......................................................................................................... 28 Annex A (normative)

Placement requirements for surface mounted devices ......................... 30 A.1 General ................................................................................................................. 30 A.2 Component positioning ......................................................................................... 30 A.3 Small devices incorporating two terminations ........................................................ 30 A.3.1 Metallization coverage over the land (side-to-side) ........................................ 30 A.3.2 Metallization coverage over the land (end) ..................................................... 30 A.4 Mounting of cylindrical end-cap devices (MELFs) .................................................. 30 A.5 Registration of castellated chip carriers ................................................................ 30 A.6 Surface mounted device lead and land contact ..................................................... 30 A.7 Surface mounted device lead side overhang ......................................................... 30 A.8 Surface mounted device lead toe overhang ........................................................... 31 A.9 Surface mounted device lead height off land (prior to soldering) ........................... 31 A.10 Positioning of J lead devices ................................................................................. 31 A.11 Positioning gull-wing lead devices ......................................................................... 31 A.12 External connections to packaging and interconnect structures ............................. 31 Bibliography .......................................................................................................................... 32

Figure 1 – Lead formation for surface mounted device ............................................................ 8 Figure 2 – Fillet height .......................................................................................................... 12 Figure 3 – Flat ribbon and gull-wing leads ............................................................................. 13 Figure 4 – Round or flattened (coined) lead joint ................................................................... 14 Figure 5 – J lead joint ........................................................................................................... 15 Figure 6 – Rectangular or square end components ............................................................... 16 Figure 7 – Cylindrical end-cap terminations .......................................................................... 17 Figure 8 – Bottom only terminations ...................................................................................... 18 Figure 9 – Leadless chip carriers with castellated terminations ............................................. 19 Figure 10 – Butt joints ........................................................................................................... 20 SIST EN 61191-2:2018

– 4 – IEC 61191-2:2017 © IEC 2017 Figure 11 – Inward L-shaped ribbon leads ............................................................................ 21 Figure 12 – Flat lug leads ..................................................................................................... 22 Figure 13 – BGA with collapsing balls ................................................................................... 23 Figure 14 – Bottom termination components ......................................................................... 24 Figure 15 – Bottom thermal plane terminations ..................................................................... 25 Figure 16 – P-style terminations ........................................................................................... 26

Table 1 – BGA with non-collapsing balls ............................................................................... 23 Table 2 – Column grid array .................................................................................................. 23 Table 3 – Reworkable defects ............................................................................................... 29

SIST EN 61191-2:2018
IEC 61191-2:2017 © IEC 2017 – 5 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION ____________
PRINTED BOARD ASSEMBLIES –
Part 2: Sectional specification –
Requirements for surface mount soldered assemblies

FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees.

3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications.

8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 61191-2 has been prepared by IEC technical committee 91: Electronics assembly technology. This third edition cancels and replaces the second edition published in 2013. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: a) the requirements have been updated to be compliant with the acceptance criteria in IPC-A-610F; b) some of the terminology used in the document has been updated; c) references to IEC standards have been corrected; d) five termination styles have been added. SIST EN 61191-2:2018

– 6 – IEC 61191-2:2017 © IEC 2017 The text of this International Standard is based on the following documents: CDV Report on voting 91/1386/CDV 91/1429/RVC

Full information on the voting for the approval of this International Standard can be found in the report on voting indicated in the above table. This document has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all parts of IEC 61191 under the general title Printed board assemblies can be found in the IEC website. The committee has decided that the contents of this document will remain unchanged until the stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to the specific document. At this date, the document will be

• reconfirmed, • withdrawn, • replaced by a revised edition, or • amended. A bilingual version of this publication may be issued at a later date.

IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates that it contains colours which are considered to be useful for the correct understanding of its contents. Users should therefore print this document using a colour printer.

SIST EN 61191-2:2018
IEC 61191-2:2017 © IEC 2017 – 7 –
PRINTED BOARD ASSEMBLIES –
Part 2: Sectional specification –
Requirements for surface mount soldered assemblies

1 Scope This part of IEC 61191 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole, chip mounting, terminal mounting, etc.). 2 Normative references The following documents are referred to in the text in such a way that some or all of their content constitutes requirements of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60194, Printed board design, manufacture and assembly – Terms and definitions IEC 61191-1, Printed board assemblies – Part 1: Generic specification – Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies IPC-A-610, Acceptability of Electronic Assemblies 3 Terms and definitions For the purposes of this document, the terms and definitions given in IEC 60194 apply. ISO and IEC maintain terminological databases for use in standardization at the following addresses: • IEC Electropedia: available at http://www.electropedia.org/ • ISO Online browsing platform: available at http://www.iso.org/obp 4 General requirements The requirements of IEC 61191-1 are a mandatory part of this specification. Workmanship shall meet the requirements of IPC-A-610 in accordance with the classification requirements of this document. 5 Surface mounting of components 5.1 General This clause covers assembly of components that are placed on the surface to be manually or machine soldered and includes components designed for surface mounting as well as through-hole components that have been adapted for surface mounting technology. SIST EN 61191-2:2018

– 8 – IEC 61191-2:2017 © IEC 2017 5.2 Alignment requirements Sufficient process control at all stages of design and assembly shall be in place to enable the post-soldering alignments and solder joint fillet controls specified in 6.3 to be achieved. Relevant factors affecting the requirements include land and conductor design, component proximities, component and land solderability, solder paste/adhesive quantity and alignment and component placement accuracy. 5.3 Process control If suitable process controls are not in place to ensure compliance with 5.2 and the intent of Annex A, the detailed requirements of Annex A shall be mandatory. 5.4 Surface mounted component requirements The leads of lead surface mounted components shall be formed to their final configuration prior to mounting. Leads shall be formed in such a manner that the lead-to-body seal is not damaged or degraded and that they may be soldered into place by subsequent processes which do not result in residual stresses decreasing reliability. When the leads of dual-in-line packages, flatpacks, and other multilead devices become misaligned during processing or handling, they may be straightened to ensure parallelism and alignment prior to mounting, while maintaining the lead-to-body seal integrity. 5.5 Flatpack lead forming 5.5.1 General Leads on opposite sides of surface mounted flatpacks shall be formed such that the non-parallelism between the base surface of the component and the surface of the printed board (i.e. component cant) is minimal. Component cant is permissible provided the final configuration does not exceed the maximum spacing limit of 2,0 mm (see Figure 1).

Key R lead-bend radius T nominal lead thickness Figure 1 – Lead formation for surface mounted device 5.5.2 Surface mounted device lead bends Leads shall be supported during forming to protect the lead-to-body seal. Bends shall not extend into the seal (see Figure 1). The lead-bend radius (R) shall be > 1 T (T = nominal lead ≤ 2,0 mm 45° – 90° T No bend into the seal R R IEC SIST EN 61191-2:2018

IEC 61191-2:2017 © IEC 2017 – 9 –

thickness). The angle of that part of the lead between the upper and lower bends in relation to the mounting land shall be 45° minimum and 90° maximum. 5.5.3 Surface mounted device lead deformation Lead deformation (unintentional bending) may be allowed when a) no evidence of a short circuit or potential short circuit exists, b) lead-to-body seal or weld is not damaged by the deformation, c) does not violate minimum electrical spacing requirement, d) top of lead does not extend beyond the top of body; preformed stress loops may extend above the top of the body; however, stand-off height limit shall not be exceeded, e) toe curl, if present on bends, shall not exceed two times the thickness of the lead (2 T), f) coplanarity limits are not exceeded. 5.5.4 Flattened leads Components with axial leads of round cross-section may be flattened (coined) for positive seating in surface mounting. If flattening is used, the flattened thickness shall be not less than 40 % of the original diameter. Flattened areas of leads shall be excluded from the 10 % deformation requirement in 6.5.3 of IEC 61191-1:2013. Flattened leads on opposite sides of a surface mount part shall be formed such that the non-parallelism between the base surface of the component and the surface of the printed board (e.g. component cant) is minimal. 5.5.5 Dual-in-line packages (DIPs) Dual-in-line packages may be surface mounted provided the leads are configured to meet the mounting requirements for surface mounted loaded parts. The lead preparation operation shall be performed using die forming/cutting systems. Hand forming and trimming of leads are prohibited. 5.5.6 Parts not configured for surface mounting Flatpacks of the through-hole configuration, transistors, metal power packages, and other non-axial lead components shall not be surface mounted unless the leads are formed to meet the surface mounted device lead forming requirements. Such applications shall be agreed on between user and manufacturer. 5.6 Small devices with two terminations 5.6.1 General The detailed requirements for mounting of small devices with two lead terminations are defined in 5.6.2 and 5.6.3. 5.6.2 Stack mounting When part stacking is permitted by the assembly drawing, parts shall not bridge spacing between other parts or compone

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