SIST EN 60286-3:2008
(Main)Packaging of components for automatic handling -- Part 3: Packaging of surface mount components on continuous tapes
Packaging of components for automatic handling -- Part 3: Packaging of surface mount components on continuous tapes
This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps which are intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the abovementioned purposes. This standard also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips).
Gurtung und Magazinierung von Bauelementen für die automatische Verarbeitung -- Teil 3: Gurtung von oberflächenmontierbaren Bauelementen auf Endlosgurten
Emballage de composants pour opérations automatisées -- Partie 3: Emballage des composants appropriés au montage en surface en bandes continues
Pakiranje komponent za avtomatsko ravnanje - 3. del: Pakiranje komponent za površinsko montažo na neprekinjenih trakovih (IEC 60286-3:2007)
General Information
Relations
Standards Content (Sample)
SLOVENSKI STANDARD
SIST EN 60286-3:2008
01-januar-2008
1DGRPHãþD
SIST EN 60286-3:2002
Pakiranje komponent za avtomatsko ravnanje - 3. del: Pakiranje komponent za
površinsko montažo na neprekinjenih trakovih (IEC 60286-3:2007)
Packaging of components for automatic handling - Part 3: Packaging of surface mount
components on continuous tapes (IEC 60286-3:2007)
Gurtung und Magazinierung von Bauelementen für die automatische Verarbeitung - Teil
3: Gurtung von oberflächenmontierbaren Bauelementen auf Endlosgurten (IEC 60286-
3:2007)
Emballage de composants pour opérations automatisées - Partie 3: Emballage des
composants appropriés au montage en surface en bandes continues (IEC 60286-
3:2007)
Ta slovenski standard je istoveten z: EN 60286-3:2007
ICS:
31.020 Elektronske komponente na Electronic components in
splošno general
55.060 Tulci. Vretena Spools. Bobbins
SIST EN 60286-3:2008 en,de
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
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EUROPEAN STANDARD
EN 60286-3
NORME EUROPÉENNE
September 2007
EUROPÄISCHE NORM
ICS 31.020; 31.240 Supersedes EN 60286-3:1998
English version
Packaging of components for automatic handling -
Part 3: Packaging of surface mount components on continuous tapes
(IEC 60286-3:2007)
Emballage de composants Gurtung und Magazinierung
pour opérations automatisées - von Bauelementen
Partie 3: Emballage des composants für die automatische Verarbeitung -
appropriés au montage en surface Teil 3: Gurtung von
oberflächenmontierbaren Bauelementen
en bandes continues
(CEI 60286-3:2007) auf Endlosgurten
(IEC 60286-3:2007)
This European Standard was approved by CENELEC on 2007-09-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the
Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain,
Sweden, Switzerland and the United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2007 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60286-3:2007 E
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EN 60286-3:2007 - 2 -
Foreword
The text of document 40/1838/FDIS, future edition 4 of IEC 60286-3, prepared by IEC TC 40, Capacitors
and resistors for electronic equipment, was submitted to the IEC-CENELEC parallel vote and was
approved by CENELEC as EN 60286-3 on 2007-09-01.
This European Standard supersedes EN 60286-3:1998.
EN 60286-3:2007 contains the following significant technical changes with respect to EN 60286-3:1998:
– implementation of Type IV (adhesive-backed punched plastic carrier tape for singulated bare die and
other surface mount components);
– minor revisions related to tables, figures and references.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
(dop) 2008-06-01
national standard or by endorsement
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2010-09-01
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 60286-3:2007 was approved by CENELEC as a European
Standard without any modification.
__________
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- 3 - EN 60286-3:2007
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.
NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.
Publication Year Title EN/HD Year
IEC 60191-2 1966 Mechanical standardization of - -
semiconductor devices -
Part 2: Dimensions
IEC/TS 61340-5-1 1998 Electrostatics -
+ corr. February 1999 Part 5-1: Protection of electronic devices EN 61340-5-1 2001
from electrostatic phenomena - General + corr. April 2001
requirements
IEC/TS 61340-5-2 1999 Electrostatics - EN 61340-5-2 2001
Part 5-2: Protection of electronic devices + corr. August 2001
from electrostatic phenomena - User guide
IEC/TR 62258-3 2005 Semiconductor die products - CLC/TR 62258-3 2007
Part 3: Recommendations for good practice
in handling, packing and storage
ISO/IEC 16388 1999 Information technology - Automatic - -
identification and data capture techniques -
Bar code symbology specifications - Code 39
ISO 11469 2000 Plastics - Generic identification and marking EN ISO 11469 2000
of plastic products
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INTERNATIONAL IEC
STANDARD 60286-3
Fourth edition
2007-06
Packaging of components for automatic handling –
Part 3:
Packaging of surface mount components
on continuous tapes
PRICE CODE
Commission Electrotechnique Internationale U
International Electrotechnical Commission
МеждународнаяЭлектротехническаяКомиссия
For price, see current catalogue
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– 2 – 60286-3 © IEC:2007(E)
CONTENTS
FOREWORD.4
INTRODUCTION.6
1 General .6
1.1 Scope.6
1.2 Normative references .6
2 Terms and definitions.7
3 Structure of the specification .7
3.1 Type I – Punched carrier tape, with top and bottom cover tape (8 mm and
12 mm).8
3.2 Type II – Blister carrier tape, with single sprocket holes (8 mm, 12 mm,
16 mm and 24 mm) .10
3.3 Type III – Blister carrier tape, with double sprocket holes (32 mm to 200 mm).12
3.4 Type IV – Adhesive-backed punched plastic carrier tape for singulated bare
die and other surface mount components (8 mm, 12 mm, 16 mm and 24 mm) .14
3.4.1 Component positioning and lateral displacement (see Figures 11 and 12) .16
3.4.2 Coordinate system.17
4 Polarity and orientation of components in the tape .18
4.1 All tapes.18
4.2 Tape reeling .18
4.2.1 All types .18
4.2.2 Type I.18
4.2.3 Types I, II and III only.18
4.2.4 Type IV only .19
5 Fixing of components and additional tape requirements.19
5.1 All types .19
5.2 Requirements for Types I, II and III where cover tape is used.20
5.3 Specific requirements for Type IV tapes .20
5.4 Peel force of the cover tape (for Types I, II and III only) .20
5.5 Minimum bending radius (for all Types) .20
5.6 Break force of the cover tapes (for Types I, II & III only) .21
5.7 Taping materials.21
5.8 Camber .21
6 Specific requirements for tapes containing die products .22
6.1 Tape design for tapes containing die products.22
6.2 Cleanliness .22
6.3 Component lateral movement (Types I and II) .22
7 Packing .23
7.1 Leader and trailer tape .23
7.1.1 Leader.23
7.1.2 Trailer.23
7.2 Reels .23
7.2.1 Reel dimensions related to tape (see Figure 18 and Table 12).24
7.2.2 Reel hole dimensions (see Figure 19 and Table 13) .25
7.2.3 Recycling .25
7.3 Missing components.25
8 Marking .26
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60286-3 © IEC:2007(E) – 3 –
Table 1 – Constant dimensions of 8 mm and 12 mm punched carrier tape .9
Table 2 – Variable dimensions of 8 mm and 12 mm punched carrier tape .9
Table 3 – Constant dimensions of 8 mm to 24 mm blister carrier tape.11
Table 4 – Variable dimensions of 8 mm to 24 mm blister carrier tape.11
Table 5 – Constant dimensions of 32 mm to 200 mm blister carrier tape .13
Table 6 – Variable dimensions of 32 mm to 200 mm blister carrier tape .13
Table 7 – Constant dimensions of adhesive backed punched carrier tape .15
Table 8 – Variable dimensions of adhesive-backed punched carrier tape.15
Table 9 – Absolute referencing data for component target position .17
Table 10 – Peel force.20
Table 11 – Minimum bending radius.21
Table 12 – Reel dimensions.24
Table 13 – Reel hole dimensions .25
Figure 1 – 8 mm and 12 mm punched carrier-tape dimensions.8
Figure 2 – Illustration of 2 mm cavity pitch .8
Figure 3 – Maximum component tilt, rotation and lateral movement .8
Figure 4 – Blister carrier tape dimensions (8 mm, 12 mm, 16 mm and 24 mm).10
Figure 5 – Illustration of 2 mm cavity pitch .10
Figure 6 – Maximum component tilt, rotation and lateral movement .10
Figure 7 – Blister carrier tape .12
Figure 8 – Maximum component tilt, rotation and lateral movement .12
Figure 9 – Adhesive-backed punched carrier-tape dimensions (4 mm compartment pitch) .14
Figure 10 – Illustration of 2 mm compartment pitch .14
Figure 11 – Component clearance and positioning method .16
Figure 12 – Maximum component tilt and lateral displacement.16
Figure 13 – Type IV coordinate system .17
Figure 14 – Tape reeling and label area on the reel .19
Figure 15 – Bending radius .21
Figure 16 – Camber (top view).22
Figure 17 – Leader and trailer.23
Figure 18 – Reel dimensions.24
Figure 19 – Reel hole presentation .25
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– 4 – 60286-3 © IEC:2007(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING –
Part 3: Packaging of surface mount components
on continuous tapes
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60286-3 has been prepared by IEC technical committee 40:
Capacitors and resistors for electronic equipment.
This fourth edition cancels and replaces the third edition issued in 1997. It constitutes a
technical revision.
This edition contains the following significant technical changes with respect to the previous
edition:
a) implementation of Type IV (adhesive-backed punched plastic carrier tape for singulated
bare die and other surface mount components);
b) minor revisions related to tables, figures and references.
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60286-3 © IEC:2007(E) – 5 –
The text of this standard is based on the following documents:
FDIS Report on voting
40/1838/FDIS 40/1847/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
The list of all the parts of the IEC 60286 series, under the general title Packaging of
components for automatic handling, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in
the data related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date
---------------------- Page: 9 ----------------------
– 6 – 60286-3 © IEC:2007(E)
PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING –
Part 3: Packaging of surface mount components
on continuous tapes
INTRODUCTION
Tape packaging meets the requirements of automatic component placement machines and
also covers the use of tape packaging for components for test purposes and other operations.
1 General
1.1 Scope
This part of IEC 60286 is applicable to the tape packaging of electronic components without
leads or with lead stumps which are intended to be connected to electronic circuits. It includes
only those dimensions that are essential for the taping of components intended for the above-
mentioned purposes.
This standard also includes requirements related to the packaging of singulated die products
including bare die and bumped die (flip chips).
1.2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60191-2:1966, Mechanical standardization of semiconductor devices – Part 2:
Dimensions
IEC 61340-5-1:1998, Electrostatics – Part 5-1: Protection of electronic devices from
electrostatic phenomena – General requirements
IEC 61340-5-2:1999, Electrostatics – Part 5-2: Protection of electronic devices from
electrostatic phenomena – User guide
IEC 62258-3:2005, Semiconductor die products – Part 3: Recommendations for good practice
in handling, packing and storage
ISO/IEC 16388:1999, Information technology – Automatic identification and data capture
techniques – Bar code symbology specifications – Code 39
ISO 11469:2000, Plastics – Generic identification and marking of plastics products
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60286-3 © IEC:2007(E) – 7 –
2 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
2.1
packaging
product made of any material of any nature to be used for the containment, protection,
structured alignment for automatic assembly, handling and delivery
3 Structure of the specification
The various types of tapes are as follows.
Type I - Punched carrier tape, with top and bottom cover tape (8 mm and 12 mm)
Type II - Blister carrier tape, with single sprocket holes (8 mm, 12 mm, 16 mm and
24 mm)
Type III - Blister carrier tape, with double sprocket holes (32 mm to 200 mm)
Type IV - Adhesive-backed punched plastic carrier tape for singulated bare die and
other surface mount components
Type V - Continuous pressed carrier tapes (in development)
Type VI - Blister carrier tapes 4 mm in width (in development)
All dimensions in the tables are in millimetres.
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– 8 – 60286-3 © IEC:2007(E)
3.1 Type I – Punched carrier tape, with top and bottom cover tape (8 mm and 12 mm)
P
0
T
D P
0 2
Top Bottom
cover cover
E
1
tape tape
F
W
E
2
B
0
T
1
T
1
G
A P
0 1
Direction of unreeling
IEC 625/07
Figure 1 – 8 mm and 12 mm punched carrier-tape dimensions
P
0
P
2
P
1
Pocket off-set: 0,05 mm max.
IEC 629/07
Figure 2 – Illustration of 2 mm cavity pitch
0,3 mm max. (P = 2 )
1
20° max.
0,5 mm max. (P ≥ 4 )
1
See also Table 2, Note d
Typical
cavity
centre line
(design value)
10° max.
B
0
Typical
component
centre line
A
0
Component tilt Component planar Component lateral
movements
rotation
Side or front
sectional view Top view
Top view
Sketch A Sketch B
Sketch C
IEC 627/07
Figure 3 – Maximum component tilt, rotation and lateral movement
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60286-3 © IEC:2007(E) – 9 –
Table 1 – Constant dimensions of 8 mm and 12 mm punched carrier tape
Tape size D E P P G T T Cumulative
0 1 0 2 min max 1max
pitch (over
10 pitches)
+0,1
1,5
8 and 12 1,75 ± 0,1 4,0 ± 0,1 2,0 ± 0,05 0,75 1,1 paper 0,1 ± 0,2
0
(P ≥ 4)
1
1,6 non-
4,0 ± 0,05
paper
(P = 2)
1
Table 2 – Variable dimensions of 8 mm and 12 mm punched carrier tape
Tape size E F P W A , B , T
2 min 1 0 0
+0,3
8 6,25 3,5 ± 0,05 4,0 ± 0,1 See note
8,0
−0,1
(P ≥ 4)
1
2,0 ± 0,05
(P = 2)
1
+0,3
4,0 ± 0,1
12 10,25 5,5 ± 0,05 12,0
−0,1
(P ≥ 4)
1
2,0 ± 0,05
(P = 2)
1
NOTE The nominal dimensions of the component compartment should be derived from the relevant component
specification. The tolerances on the nominal dimensions of the compartment should be chosen so that the
components cannot change their orientation within the tape and can be easily removed from the tape, with the
following characteristics.
There shall be sufficient clearance surrounding the component so that
a) the component does not protrude beyond either surface of the carrier tape;
b) the component can be removed from the cavity in a vertical direction without mechanical restriction
after the top cover tape has been removed;
c) the rotation of the component is limited to a 10° max. tilt (see Figure 3, sketch A) and a 20°
max. planar rotation (see Figure 3, sketch B);
d) the lateral movement of the component is restricted to 0,5 mm max.(P ≥ 4), 0,3 mm max.(P = 2)
1 1
(see Figure 3, sketch C).
For components with either length or width dimensions of less than 1,2 mm, market trends are towards a planar
rotation limit of 10° max. and a lateral movement of 0,2 mm max. and a component rotation depends on the
agreement between suppliers and users. See also Clause 6 for die products.
For defined component positioning, the pocket positions should be defined to an origin point; in this case, the
index hole. Pockets should be positioned relative to this hole.
Preferred dimensions for components should be taken from the relevant IEC specifications.
Dimensions A ≤ B .
0 0
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– 10 – 60286-3 © IEC:2007(E)
3.2 Type II – Blister carrier tape, with single sprocket holes (8 mm, 12 mm, 16 mm
and 24 mm)
P
0
T
D P
0 2
E
Cover
1
tape
F
W
E
2
B
B
0
1
G
T
D
1 1
T
2 G
P
1
K
0
A
0
Direction of unreeling
IEC 628/07
Figure 4 – Blister carrier tape dimensions (8 mm, 12 mm, 16 mm and 24 mm)
P
0
P
2
P
1
Pocket off-set: 0,05 mm max.
IEC 629/07
Figure 5 – Illustration of 2 mm cavity pitch
20° max.
(W = 8 mm and 12 mm)
10° max. (W > 12 mm)
See also Table 2, Note d
Typical
cavity
centre line
10° max.
B
0
Typical
component
centre line
A
0
Component tilt Component planar Component lateral
rotation movements
Side or front
sectional view Top view
Top view
Sketch D Sketch E
Sketch F
IEC 630/07
Figure 6 – Maximum component tilt, rotation and lateral movement
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60286-3 © IEC:2007(E) – 11 –
Table 3 – Constant dimensions of 8 mm to 24 mm blister carrier tape
Tape size D E G P T T Cumulative pitch
0 1 min 0 max 1max
(over 10 pitches)
+0,1
1,5
8 to 24 1,75 ± 0,1 0,75 4,0 ± 0,1 0,6 0,1 ±0,2
0
(P ≥ 4)
1
4,0 ± 0,05
(P = 2)
1
Table 4 – Variable dimensions of 8 mm to 24 mm blister carrier tape
a
Tape B1max. E2 min F P1 P2 T2 max W A0, B0,
D
1 min
size K
0
+0,3
8
4,35 0,3 6,25 3,5 ± 0,05 2,0 ± 0,05 2,0 ± 0,05 3,5 8,0 see
−0,1
4,0 ± 0,1 Note
+0,3
12 8,2 1,5 10,25 5,5 ± 0,05 2,0 ± 0,05 2,0 ± 0,05 6,5
12,0
−0,1
4,0 ± 0,1 or
12,0 ± 0,1 in
4,0 increments
+0,3
16 12,1 1,5 14,25 7,5 ± 0,1 4,0 ± 0,1 to 2,0 ± 0,1 9,5 16,0
−0,1
16,0 ± 0,1 in
4,0 increments
+0,3
24 20,1 1,5 22,25 11,5 ± 0,1 4,0 ± 0,1 to 2,0 ± 0,1 12,5 24,0
−0,1
24,0 ± 0,1 in
4,0 increments
NOTE The nominal dimensions of the component compartment should be derived from the relevant component
specification. The tolerances on the nominal sizes of the compartment should be selected so that the
components cannot change their orientation within the tape and can be easily removed from the tape, with the
following characteristics.
There shall be sufficient clearance surrounding the component so that
a) the component does not protrude above the top surface of the carrier tape;
b) the component can be removed from the cavity in a vertical direction without mechanical restriction after the
top cover tape has been removed;
c) the rotation of the component is limited to a 10° max. tilt (see Figure 6, sketch D), a 20° max. planar rotation
for W = 8 mm and 12 mm and a 10° max. planar rotation for W = 16 mm and 24 mm (see Figure 6, sketch E);
d) the lateral movement of the component is restricted to 0,5 mm max. (see Figure 6, sketch F).
For components with either length or width dimensions of less than 1,2 mm, market trends are towards a planar
rotation limit of 10° max. and lateral movements of 0,2 mm max. See also Clause 6 for die products.
The centre of the component compartment is defined by P and F, relative to the sprocket holes, as shown in
2
Figure 4 with tolerances given in the table above. The centre of the index hole is defined by P and F, relative to
2
the sprocket holes, as shown in Figure 4 with the tolerances given in the table above.
Preferred dimensions for components shall be taken from the relevant IEC specifications.
Dimensions A ≤ B .
0 0
Dimension K should comply with the component tilt in Sketch D.
0
In the case of P1 = 2 mm, the off-set between the centre of the component compartment and the centre of the
sprocket hole should not be more than 0,05 mm (see
...
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