SIST EN 61967-1:2005
(Main)Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz -- Part 1: General conditions and definitions
Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz -- Part 1: General conditions and definitions
Provides general information and definitions on measurement of conducted and radiated electromagnetic disturbances from integrated circuits. Also provides a description of measurement conditions, test equipment and set-up as well as the test procedures and content of the test reports. A test method comparison table is included to assist in selecting the appropriate measurement method(s). Measurement of the voltage and current of conducted RF emissions or radiated RF disturbances, coming from an integrated circuit under controlled conditions, yields information about the potential for RF disturbances in an application of the integrated circuit.
Integrierte Schaltungen - Messung von elektromagnetischen Aussendungen im Frequenzbereich von 150 kHz bis 1 GHz -- Teil 1: Allgemeine Bedingungen und Definitionen
Circuits intégrés - Mesure des émissions électromagnétiques, 150 kHz à 1 GHz -- Partie 1: Conditions générales et définitions
Fournit des informations générales et des définitions sur la mesure des perturbations électromagnétiques conduites et rayonnées des circuits intégrés. Décrit également les conditions de mesure, les appareils et le montage d'essai, ainsi que les procédures d'essai et le contenu des rapports d'essai. Un tableau de comparaison des méthodes d'essai permet de choisir la ou les méthodes de mesure appropriées. La mesure de la tension et du courant des perturbations RF conduites ou rayonnées, provenant d'un circuit intégré dans des conditions déterminées, fournit des informations sur les perturbations RF potentielles dans une application du circuit intégré.
Integrirana vezja – Meritve elektromagnetnega sevanja, od 150 kHz do 1 GHz – 1. del: Splošni pogoji in definicije (IEC 61967-1:2002)
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Standards Content (Sample)
SLOVENSKI SIST EN 61967-1:2005
STANDARD
december 2005
Integrirana vezja – Meritve elektromagnetnega sevanja, od 150 kHz do 1 GHz –
1. del: Splošni pogoji in definicije (IEC 61967-1:2002)
Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to 1 GHz
– Part 1: General conditions and definitions (IEC 61967-1:2002)
ICS 31.200 Referenčna številka
SIST EN 61967-1:2005(en)
© Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljeno
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EUROPEAN STANDARD EN 61967-1
NORME EUROPÉENNE
EUROPÄISCHE NORM June 2002
ICS 31.200
English version
Integrated circuits -
Measurement of electromagnetic emissions,
150 kHz to 1 GHz
Part 1: General conditions and definitions
(IEC 61967-1:2002)
Circuits intégrés - Integrierte Schaltungen -
Mesure des émissions électromagnétiques, Messung von elektromagnetischen
150 kHz à 1 GHz Aussendungen im Frequenzbereich
Partie 1: Conditions générales et définitions von 150 kHz bis 1 GHz
(CEI 61967-1:2002) Teil 1: Allgemeine Bedingungen
und Definitionen
(IEC 61967-1:2002)
This European Standard was approved by CENELEC on 2002-05-01. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic,
Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Malta, Netherlands,
Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2002 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61967-1:2002 E
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EN 61967-1:2002 - 2 -
Foreword
The text of document 47A/632/FDIS, future edition 1 of IEC 61967-1, prepared by SC 47A, Integrated
circuits, of IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and
was approved by CENELEC as EN 61967-1 on 2002-05-01.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2003-02-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2005-05-01
Annexes designated "normative" are part of the body of the standard.
Annexes designated "informative" are given for information only.
In this standard, annex ZA is normative and annexes A, B and C are informative.
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 61967:2002 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards
indicated:
IEC 61000-4-3 NOTE Harmonized as EN 61000-4-3:1996 (modified).
IEC 61000-4-6 NOTE Harmonized as EN 61000-4-6:1996 (not modified).
IEC 61967-4 NOTE Harmonized as EN 61967-4:2002 (not modified).
__________
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- 3 - EN 61967-1:2002
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
This European Standard incorporates by dated or undated reference, provisions from other
publications. These normative references are cited at the appropriate places in the text and the
publications are listed hereafter. For dated references, subsequent amendments to or revisions of any
of these publications apply to this European Standard only when incorporated in it by amendment or
revision. For undated references the latest edition of the publication referred to applies (including
amendments).
NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
Publication Year Title EN/HD Year
1)
IEC 60050-161 - International Electrotechnical --
Vocabulary (IEV)
Chapter 161: Electromagnetic
compatibility
CISPR 16-1 1999 Specification for radio disturbance and--
immunity measuring apparatus and
methods
Part 1: Radio disturbance and immunity
measuring apparatus
CISPR 25 1995 Limits and methods of measurement of--
radio disturbance characteristics for the
protection of receivers used on board
vehicles
ANSI C63.2 1996 American standard for electromagnetic--
noise and field strength instrumentation,
10 Hz to 40 GHz - Specifications
1)
Undated reference.
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NORME CEI
INTERNATIONALE IEC
61967-1
INTERNATIONAL
Première édition
STANDARD
First edition
2002-03
Circuits intégrés –
Mesure des émissions électro-
magnétiques, 150 kHz à 1 GHz –
Partie 1:
Conditions générales et définitions
Integrated circuits –
Measurement of electromagnetic
emissions, 150 kHz to 1 GHz
Part 1:
General conditions and definitions
© IEC 2002 Droits de reproduction réservés ⎯ Copyright - all rights reserved
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utilisée sous quelque forme que ce soit et par aucun procédé, form or by any means, electronic or mechanical, including
électronique ou mécanique, y compris la photocopie et les photocopying and microfilm, without permission in writing from
microfilms, sans l'accord écrit de l'éditeur. the publisher.
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Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmail@iec.ch Web: www.iec.ch
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International Electrotechnical Commission
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Pour prix, voir catalogue en vigueur
For price, see current catalogue
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61967-1 © IEC:2002 – 3 –
CONTENTS
FOREWORD.7
1 Scope.11
2 Normative references .11
3 Definitions .13
4 Test conditions .19
4.1 General .19
4.2 Ambient conditions .21
4.2.1 Ambient temperature .21
4.2.2 Ambient RF field strength .21
4.2.3 Other ambient conditions.21
4.2.4 IC stability over time.21
5 Test equipment.21
5.1 General .21
5.2 Shielding .21
5.3 RF measuring instrument .21
5.3.1 Measuring receiver .23
5.3.2 Spectrum analyser.23
5.3.3 Other RBW for narrowband disturbances .23
5.3.4 Disturbance type, detector type and sweep speed .23
5.3.5 Video bandwidth .25
5.3.6 Verification of calibration for the RF measuring instrument .25
5.4 Frequency range .25
5.5 Pre-amplifier or attenuator.25
5.6 System gain .25
5.7 Other components .25
6 Test set-up .25
6.1 General .25
6.2 Test circuit board .27
6.3 IC pin loading .27
6.4 Power supply requirements – Test board power supply .27
6.5 IC specific considerations.29
6.5.1 IC supply voltage.29
6.5.2 IC decoupling .29
6.5.3 Activity of IC .29
6.5.4 Guidelines regarding IC operation .29
7 Test procedure .29
7.1 Ambient check.29
7.2 Operational check .29
7.3 Specific procedures.31
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61967-1 © IEC:2002 – 5 –
8 Test report.31
8.1 General .31
8.2 Ambient.31
8.3 Description of device.31
8.4 Description of set-up .31
8.5 Description of software.31
8.6 Data presentation.31
8.6.1 Graphical presentation .31
8.6.2 Software for data capture .31
8.6.3 Data processing .31
8.7 RF emission limits .31
8.8 Interpretation of results .33
8.8.1 Comparison between IC(s) using the same test method.33
8.8.2 Comparison between different test methods .33
8.8.3 Correlation to module test methods .33
9 General basic test board specification .33
9.1 Board description – mechanical.33
9.2 Board description – electrical characteristics .33
9.3 Ground planes.35
9.4 Pins.35
9.4.1 DIL packages .35
9.4.2 SOP, PLCC, QFP packages.35
9.4.3 PGA, BGA packages .35
9.5 Via type.35
9.6 Via distance .37
9.7 Additional components .37
9.7.1 Supply decoupling .37
9.7.2 I/O load .37
Annex A (informative) Test method comparison .41
Annex B (informative) Flow chart of an example counter test code .43
Annex C (informative) Prescription of a worst-case application software description .45
Bibliography.47
Figure 1 – General basic test board .39
Figure B.1 – Test code flow chart.43
Table 1 – Measuring receiver bands and RBW (resolution bandwidth) default settings.23
Table 2 – Spectrum analyser bands and RBW default settings.23
Table 3 – IC pin loading recommendations .27
Table 4 – Position of vias over the board .35
Table A.1 – Test method comparison.41
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61967-1 © IEC:2002 – 7 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
INTEGRATED CIRCUITS –
MEASUREMENT OF ELECTROMAGNETIC EMISSIONS,
150 kHz to 1 GHz –
Part 1: General conditions and definitions
FOREWORD
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of the IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, the IEC publishes International Standards. Their preparation is
entrusted to technical committees; any IEC National Committee interested in the subject dealt with may
participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. The IEC collaborates closely with the International
Organization for Standardization (ISO) in accordance with conditions determined by agreement between the
two organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an
international consensus of opinion on the relevant subjects since each technical committee has representation
from all interested National Committees.
3) The documents produced have the form of recommendations for international use and are published in the form
of standards, technical specifications, technical reports or guides and they are accepted by the National
Committees in that sense.
4) In order to promote international unification, IEC National Committees undertake to apply IEC International
Standards transparently to the maximum extent possible in their national and regional standards. Any
divergence between the IEC Standard and the corresponding national or regional standard shall be clearly
indicated in the latter.
5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with one of its standards.
6) Attention is drawn to the possibility that some of the elements of this International Standard may be the subject
of patent rights. The IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61967-1 has been prepared by subcommittee 47A: Integrated
circuits, of IEC technical committee 47: Semiconductor devices.
The text of this standard is based on the following documents:
FDIS Report on voting
47A/632/FDIS 47A/643/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 3.
Annexes A, B and C are for information only.
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61967-1 © IEC:2002 – 9 –
1)
IEC 61967 consists of the following parts , under the general title Integrated circuits –
Measurement of electromagnetic emissions, 150 kHz to 1 GHz:
Part 1: General conditions and definitions
2)
Part 2: Measurement of radiated emissions – TEM-cell method
2)
Part 3: Measurement of radiated emissions – Surface scan method
1)
Part 4: Measurement of conducted emissions – 1 Ω/150 Ω direct coupling method
1)
Part 5: Measurement of conducted emissions – Workbench Faraday cage method
1)
Part 6: Measurement of conducted emissions – Magnetic probe method
The committee has decided that the contents of this publication will remain unchanged until
2012. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
___________
1)
To be published.
2)
Under consideration.
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61967-1 © IEC:2002 – 11 –
INTEGRATED CIRCUITS –
MEASUREMENT OF ELECTROMAGNETIC EMISSIONS,
150 kHz to 1 GHz –
Part 1: General conditions and definitions
1 Scope
This part of IEC 61967 provides general information and definitions on measurement of
conducted and radiated electromagnetic disturbances from integrated circuits. It also provides
a description of measurement conditions, test equipment and set-up as well as the test
procedures and content of the test reports. A test method comparison table is included as
annex A to assist in selecting the appropriate measurement method(s).
The object of this standard is to describe general conditions in order to establish a uniform
testing environment and obtain a quantitative measure of RF disturbances from integrated
circuits (IC). Critical parameters that are expected to influence the test results are described.
Deviations from this standard are noted explicitly in the individual test report. The measure-
ment results can be used for comparison or other purposes.
Measurement of the voltage and current of conducted RF emissions or radiated RF
disturbances, coming from an integrated circuit under controlled conditions, yields information
about the potential for RF disturbances in an application of the integrated circuit.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60050(161), International Electrotechnical Vocabulary (IEV) – Chapter 161: Electro-
magnetic compatibility
CISPR 16-1:1999, Specification for radio disturbance and immunity measuring apparatus and
methods – Part 1: Radio disturbance and immunity measuring apparatus
CISPR 25:1995, Limits and methods of measurement of radio disturbance characteristics for
the protection of receivers used on board vehicles
ANSI C63.2:1996, American Standard for Electromagnetic Noise and Field Strength
Instrumentation, 10 Hz to 40 GHz – Specifications
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61967-1 © IEC:2002 – 13 –
3 Definitions
For the purpose of this part of IEC 61967, the following definitions, taken mostly from
IEC 60050(161), apply.
3.1
artificial network
AN
agreed reference load impedance (simulated), presented to the EUT by networks (for
example, extended power or communication lines) across which the RF disturbance voltage is
measured and which isolates the apparatus from the power supply or loads in that frequency
range
[IEV 161-04-05, modified]
3.2
associated equipment
transducers (for example, probes, networks and antennas) connected to a measuring receiver
or test generator; also transducers (for example, probes, networks, and antennas) which are
used in the signal or disturbance transmission path between an EUT and measuring
equipment or a (test-) signal generator
3.3
auto sweep
fastest calibrated sweep which a spectrum analyser will automatically select based on start
frequency, stop frequency, resolution bandwidth and video bandwidth
3.4
broadband emission
emission which has a bandwidth greater than that of a particular measuring apparatus or
receiver
[IEV 161-06-11, modified]
3.5
common mode voltage
asymmetrical voltage
mean of the phasor voltages appearing between each conductor and a specified reference,
usually earth or frame
[IEV 161-04-09]
3.6
common mode current
in a cable having more than one conductor, including shields and screens, if any, the
magnitude of the sum of the phasors representing the currents in each conductor
[IEV 161-04-39]
3.7
conducted emissions
transients and/or other disturbances observed on the external terminals of a device during its
normal operation
3.8
continuous disturbance
RF disturbance with a duration of more than 200 ms at the IF-output of a measuring receiver,
which causes a deflection on the meter of a measuring receiver in quasi-peak detection mode
which does not decrease immediately
[IEV 161-02-11, modified]
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61967-1 © IEC:2002 – 15 –
3.9
device under test
DUT
device, equipment or system being evaluated
NOTE As used in this standard, DUT refers to a semiconductor device being tested.
3.10
die shrink
amount of shrink of the mask used to produce the integrated circuit (IC) expressed as a
percentage or dimensions relative to the original artwork layout (drawn size)
3.11
differential mode current
in a two-conductor cable, or for two particular conductors in a multi-conductor cable, half the
magnitude of the difference of the phasors representing the currents in each conductor
[IEV 161-04-38]
3.12
differential mode voltage
voltage between any two of a specified set of active conductors
[IEV 161-04-08]
3.13
discontinuous disturbance
for counted clicks, disturbance with a duration of less than 200 ms at the IF-output of a
measuring receiver, which causes a transient deflection on the meter of a measuring receiver
in quasi-peak detection mode
[IEV 161-02-28, modified]
3.14
electrically small PCB
printed circuit board, whose dimension is smaller than λ/2, for example, 100 mm to 150 mm
at 1 GHz
3.15
electromagnetic compatibility
EMC
ability of an equipment or system to function satisfactorily in its electromagnetic environment
without introducing intolerable electromagnetic disturbances to anything in that environment
[IEV 161-01-07]
3.16
electromagnetic emission
phenomenon by which electromagnetic energy emanates from a source
3.17
electromagnetic radiation
radiated emissions
1. phenomena by which energy in the form of electromagnetic waves emanates from a
source into space
2. energy transferred through space in the form of electromagnetic waves
[IEV 161-01-10]
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61967-1 © IEC:2002 – 17 –
3.18
emission limit (from a disturbing source)
specified maximum emission level of a source of electromagnetic disturbance
[IEV 161-03-12]
3.19
ground (reference) plane
flat conductive surface whose potential is used as a common reference
[IEV 161-04-36]
3.20
lead frame
supporting structure for the silicon die that interfaces the external pins to the die
3.21
measuring receiver
receiver for the measurement of disturbances with different detectors
NOTE The bandwidth of the receiver should be as specified in CISPR 16-1.
3.22
multi-chip module
MCM
integrated circuit whose elements are formed on or within two or more semiconductor chips
that are mounted in a single package
3.23
multi IC sets
set of ICs that functions as a unit; in a higher level of integration the set could be a single IC
3.24
narrowband emission
emission which has a bandwidth less than that of a particular measuring apparatus or receiver
[IEV 161-06-13, modified]
3.25
peak detector
detector, the output voltage of which is the peak value of the applied signal
[IEV 161-04-24]
3.26
preamp noise floor
inherent thermal noise generated by the first stage amplifier that limits the signal resolution of
the measurement system
3.27
receiver terminal voltage
external voltage measured in dB(µV) at the input of a radio interference measuring instrument
conforming to the requirements of CISPR 16-1 or ANSI C63.2
[CISPR 25, 3.1 modified]
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61967-1 © IEC:2002 – 19 –
3.28
reference point
specific port or point on the test set-up where the measurement of the sampled parameter is
made
3.29
repetition rate
number of surges, spikes, or pulses per unit time
3.30
electromagnetic environment (RF ambient)
totality of electromagnetic phenomena existing at a given location
[IEV 161-01-01]
3.31
shielded enclosure
mesh or sheet metallic housing designed expressly for the purpose of separating
electromagnetically the internal and external environment
[IEV 161-04-37]
3.32
significant IC changes
all changes that may influence the electromagnetic emissions of an IC
NOTE Examples include changes of new device, new manufacturer or process line, die shrink, new package type,
significant manufacturing process, internal/external clock, I/O drive capability, etc.
3.33
system gain
gain (or attenuation) of the measurement path between the reference point and the input of
the RF measuring instrument
3.34
test plan
document provided by the test requester to define the tests to be carried out, the object of the
testing, the DUT operating status, the conditions for the test and performance objectives
NOTE It completely guides the implementation of the test, by reference to the standard test procedure, or by
detailing revisions or additions for the specific DUT.
3.35
work bench Faraday cage
WBFC
Under consideration.
4 Test conditions
4.1 General
These default test conditions are intended to assure a consistent test environment. If other
values are agreed to by the users of this procedure, they shall be documented in the test
report.
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61967-1 © IEC:2002 – 21 –
4.2 Ambient conditions
The following ambient conditions shall be met.
4.2.1 Ambient temperature
The ambient temperature during the test shall be 23 °C ± 5 °C for repeatability. IC emissions
may vary with temperature.
4.2.2 Ambient RF field strength
The ambient RF noise level shall be at least 6 dB below the lowest emission level(s) to be
measured. This shall be verified before measurements of the IC are made. The DUT shall be
installed in the test set-up, as used for testing. The DUT shall not be activated (for example,
power supply voltage disconnected). A scan shall be made to measure the residual noise.
A description of the ambient shall be a part of the test report.
4.2.3 Other ambient conditions
All other ambient conditions that may affect the result shall be stated in the individual test
report.
4.2.4 IC stability over time
The functional behaviour of the IC shall be stable over time so that two measurements,
separated by an interval of time, shall yield the same results within the expected
...
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