SIST EN IEC 61189-5-601:2021

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards

This part of IEC 61189 specifies the reflow soldering ability test method for components
mounted on organic rigid printed boards, the reflow heat resistance test method for organic rigid
printed boards, and the reflow soldering ability test method for the lands of organic rigid printed
boards in applications using solder alloys, which are eutectic or near-eutectic tin-lead (Pb), or
lead-free alloys.
The printed boards materials for this organic rigid printed boards are epoxide woven E-glass
laminated sheets that are specified in IEC 61249-2 (all parts).
The objective of this document is to ensure the soldering ability of the solder joint and of the
lands of the printed boards. In addition, test methods are provided to ensure that the printed
boards can resist the heat load to which they are exposed during soldering.
This document covers tests Tg1, Tg2, Tg3, Tg4, Tg5, and Tg6 listed in Table 1:

Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 5-601: Allgemeine Prüfverfahren für Materialien und Baugruppen - Prüfverfahren für die Aufschmelz-Lötfähigkeit für Lötverbindungen und die Aufschmelz-Lötwärmebeständigkeit von Leiterplatten

Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres structures d’interconnexion et ensembles - Partie 5-601: Méthodes d’essai générales pour les matériaux et les assemblages - Essai d’aptitude au brasage par refusion pour un joint brasé, et essai de résistance à la chaleur de refusion pour les cartes imprimées

L'IEC 61189-5-601:2021 spécifie la méthode d’essai d’aptitude au brasage par refusion pour les composants montés sur les cartes imprimées rigides organiques, la méthode d’essai de résistance à la chaleur de refusion pour les cartes imprimées rigides organiques, et la méthode d’essai d’aptitude au brasage par refusion pour les pastilles de cartes imprimées rigides organiques dans les applications utilisant des alliages de brasure, qui sont des alliages étain-plomb (Pb) eutectiques ou quasi eutectiques, ou des alliages sans plomb.
Les matériaux de ces cartes imprimées rigides organiques sont des feuilles stratifiées renforcées en tissu de verre de type E époxyde, spécifiées dans l'IEC 61249-2 (toutes les parties).
Le but du présent document est de garantir l’aptitude au brasage du joint brasé et des pastilles des cartes imprimées. De plus, des méthodes d’essai sont présentées afin d’assurer que les cartes imprimées peuvent résister à la charge de chaleur à laquelle elles sont exposées durant le brasage.

Preskusne metode za električne materiale, tiskana vezja ter druge povezovalne strukture in sestave - 5-601. del: Splošne preskusne metode za materiale in sestave - Preskus zmožnosti valovnega spajkanja za spajkane spoje in preskus toplotne odpornosti za tiskana vezja

General Information

• Status: Published
• Publication Date: 15-Apr-2021
• ICS: 31.180 - Printed circuits and boards
• ICS: 31.190 - Electronic component assemblies
• Technical Committee: ITIV - Electronics assembly technology and Environmental standardization
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 18-Mar-2021
• Due Date: 23-May-2021
• Completion Date: 16-Apr-2021
• Ref Project: EN IEC 61189-5-601:2021 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN IEC 61189-5-601:2021
01-maj-2021
Preskusne metode za električne materiale, tiskana vezja ter druge povezovalne
strukture in sestave - 5-601. del: Splošne preskusne metode za materiale in
sestave - Preskus zmožnosti valovnega spajkanja za spajkane spoje in preskus
toplotne odpornosti za tiskana vezja
Test methods for electrical materials, printed boards and other interconnection structures
and assemblies - Part 5-601: General test methods for materials and assemblies -
Reflow soldering ability test for solder joint, and reflow heat resistance test for printed
boards
Ta slovenski standard je istoveten z: EN IEC 61189-5-601:2021
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
SIST EN IEC 61189-5-601:2021 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN IEC 61189-5-601:2021

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SIST EN IEC 61189-5-601:2021


EUROPEAN STANDARD EN IEC 61189-5-601

NORME EUROPÉENNE

EUROPÄISCHE NORM
March 2021
ICS 31.180

English Version
Test methods for electrical materials, printed boards and other
interconnection structures and assemblies - Part 5-601: General
test methods for materials and assemblies - Reflow soldering
ability test for solder joint, and reflow heat resistance test for
printed boards
(IEC 61189-5-601:2021)
Méthodes d'essai pour les matériaux électriques, les cartes Prüfverfahren für Elektromaterialien, Leiterplatten und
imprimées et autres structures d'interconnexion et andere Verbindungsstrukturen und Baugruppen – Teil 5-
ensembles - Partie 5-601: Méthodes d'essai générales pour 601: Allgemeine Prüfverfahren für Materialien und
les matériaux et les assemblages - Essai d'aptitude au Baugruppen – Prüfverfahren für die Aufschmelz-Lötfähigkeit
brasage par refusion pour un joint brasé, et essai de für Lötverbindungen und die Aufschmelz-
résistance à la chaleur de refusion pour les cartes Lötwärmebeständigkeit von Leiterplatten
imprimées (IEC 61189-5-601:2021)
(IEC 61189-5-601:2021)
This European Standard was approved by CENELEC on 2021-03-10. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.


European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2021 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
 Ref. No. EN IEC 61189-5-601:2021 E

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SIST EN IEC 61189-5-601:2021
EN IEC 61189-5-601:2021 (E)
European foreword
The text of document 91/1601/CDV, future edition 1 of IEC 61189-5-601, prepared by IEC/TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 61189-5-601:2021.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2021-12-10
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2024-03-10
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Endorsement notice
The text of the International Standard IEC 61189-5-601:2021 was approved by CENELEC as a
European Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards
indicated:
IEC 60068-2-58 NOTE Harmonized as EN 60068-2-58
IEC 60068-2-78 NOTE Harmonized as EN 60068-2-78
IEC 61188-5-8 NOTE Harmonized as EN 61188-5-8
IEC 61189-5-3 NOTE Harmonized as EN 61189-5-3
IEC 61190-1-1 NOTE Harmonized as EN 61190-1-1
IEC 61190-1-2 NOTE Harmonized as EN 61190-1-2
IEC 61249 (series) NOTE Harmonized as EN 61249 (series)
IEC 61249-2-7 NOTE Harmonized as EN 61249-2-7
IEC 61249-2-8 NOTE Harmonized as EN 61249-2-8
IEC 61760-1:2006 NOTE Harmonized as EN 61760-1:2006 (not modified)
IEC 62137-1-1 NOTE Harmonized as EN 62137-1-1
IEC 62137-4:2014 NOTE Harmonized as EN 62137-4:2014 (not modified)
2

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SIST EN IEC 61189-5-601:2021
EN IEC 61189-5-601:2021 (E)
Annex ZA
(normative)

Normative references to international publications with their
corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1  Where an International Publication has been modified by common modifications, indicated by (mod),
the relevant EN/HD applies.
NOTE 2  Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60068-2 series Environmental testing EN 60068-2 series
IEC 60068-2-14 - Environmental testing - Part 2-14: Tests - EN 60068-2-14 -
Test N: Change of temperature
IEC 60191-6-2 - Mechanical standardization of EN 60191-6-2 -
semiconductor devices - Part 6-2: General
rules for the preparation of outline drawings
of surface mounted semiconductor devices
packages - Design guide for 1,50 mm, 1,27
mm and 1,00 mm pitch ball and column
terminal packages
IEC 60191-6-5 - Mechanical standardization of - -
semiconductor devices - Part 6-5: General
rules for the preparation of outline drawings
of surface mounted semiconductor device
packages - Design guide for fine-pitch ball
grid array (FBGA)
IEC 60191-6-19 - Mechanical standardization of EN 60191-6-19 -
semiconductor devices - Part 6-19:
Measurement methods of the package
warpage at elevated temperature and the
maximum permissible warpage
1
IEC 60194-1 - Printed boards design, manufacture and - -
assembly - Vocabulary - Part 1: Common
usage in printed board and electronic
assembly technologies

1
Under preparation. Stage at the time of publication: IEC/FDIS 60194-1:2020.
3

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SIST EN IEC 61189-5-601:2021
EN IEC 61189-5-601:2021 (E)
Publication Year Title EN/HD Year
IEC 60194-2 - Printed boards design, manufacture and - -
assembly - Vocabulary - Part 2: Common
usage in electronic technologies as well as
printed board and electronic assembly
technologies
IEC 61190-1-3 - Attachment materials for electronic EN IEC 61190-1-3 -
assembly - Part 1-3: Requirements for
electronic grade solder alloys and fluxed
and non-fluxed solid solder for electronic
soldering applications
IEC 62137-3 - Electronics assembly technology - Part 3: EN 62137-3 -
Selection guidance of environmental and
endurance test methods for solder joints

4

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SIST EN IEC 61189-5-601:2021



IEC 61189-5-601

®


Edition 1.0 2021-02




INTERNATIONAL



STANDARD




NORME


INTERNATIONALE











Test methods for electrical materials, printed boards and other interconnection

structures and assemblies –

Part 5-601: General test methods for materials and assemblies – Reflow

soldering ability test for solder joint, and reflow heat resistance test for printed

boards




Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres

structures d’interconnexion et ensembles –

Partie 5-601: Méthodes d’essai générales pour les matériaux et


les assemblages – Essai d’aptitude au brasage par refusion pour un joint brasé,

et essai de résistance à la chaleur de refusion pour les cartes imprimées








INTERNATIONAL

ELECTROTECHNICAL

COMMISSION


COMMISSION

ELECTROTECHNIQUE


INTERNATIONALE




ICS 31.180 ISBN 978-2-8322-9293-8




Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

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SIST EN IEC 61189-5-601:2021
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CONTENTS
FOREWORD . 6
1 Scope . 8
2 Normative references . 8
3 Terms and definitions . 9
4 Grouping of soldering processes and related test severities . 10
5 Specimens . 11
5.1 Devices . 11
5.2 Test substrate . 13
5.3 Solder paste . 13
5.4 Solder ball . 14
6 Apparatus and equipment . 14
6.1 Constant temperature and humidity testing equipment . 14
6.2 Device-mounting equipment . 15
6.3 X-ray transmission equipment . 15
6.4 Electrical resistance recorder . 15
6.5 Warpage measurement equipment . 15
6.6 Temperature cycling chamber . 16
6.7 Pull strength test equipment . 16
7 Tg Solder joint initial quality after reflow . 16
1
7.1 General . 16
7.2 Specimen preparation . 16
7.3 Pre-process . 16
7.3.1 Pre-conditioning . 16
7.3.2 Initial measurement . 16
7.3.3 Moistening process (1) . 17
7.3.4 Baking and warp correction . 17
7.3.5 Pre-reflow heating . 17
7.3.6 Moistening process (2) . 17
7.4 Assembly process . 17
7.4.1 Solder paste printing . 17
7.4.2 Device mounting . 18
7.4.3 Reflow heating . 21
7.5 Recovery . 22
7.6 Final measurement . 22
8 Tg warpage of component and printed boards in reflow process . 22
2
8.1 General . 22
8.2 Specimen preparation . 22
8.3 Assembly process . 23
8.3.1 Initial measurement . 23
8.3.2 Baking and warp correction . 23
8.3.3 Pre-reflow heating . 23
8.4 Final measurement . 23
8.4.1 Warpage measurement . 23
8.4.2 Measurement area . 23
8.4.3 Gap measurement . 23

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IEC 61189-5-601:2021 © IEC 2021 – 3 –
9 Tg Resistance to soldering heat of printed boards . 25
3
9.1 General . 25
9.2 Specimen preparation . 26
9.3 Pre-process . 26
9.3.1 Pre-conditioning . 26
9.3.2 Initial measurement . 26
9.3.3 Moistening process (1) . 26
9.3.4 Baking and warp correction . 26
9.4 Reflow heating . 26
9.5 Final measurement . 27
10 Tg Wetting and dewetting of a printed-board land . 27
4
10.1 General . 27
10.2 Specimen preparation . 27
10.3 Pre-process . 27
10.3.1 Pre-conditioning . 27
10.3.2 Initial measurement . 28
10.3.3 Moistening process (1) . 28
10.3.4 Pre-baking . 28
10.3.5 Pre-reflow heating . 28
10.3.6 Moistening process (2) . 28
10.4 Assembly process . 28
10.4.1 Solder paste printing . 28
10.4.2 Reflow heating . 28
10.5 Final measurement . 29
10.5.1 Measurement . 29
10.5.2 Flux removal . 30
11 Tg Resistance to dissolution of a printed-board land . 30
5
11.1 General . 30
11.2 Specimen preparation . 31
11.3 Pre-process . 31
11.3.1 Pre-conditioning . 31
11.3.2 Initial measurement . 31
11.4 Assembly process . 31
11.4.1 Solder paste printing . 31
11.4.2 Reflow heating . 31
11.5 Final measurement . 31
11.5.1 Observation . 31
11.5.2 Observation method . 32
11.5.3 Measurement . 32
11.5.4 Example of influence upon occurrence of dissolution . 33
12 Tg Pull strength of the test substrate land . 33
6
12.1 General . 33
12.2 Specimen preparation . 34
12.3 Pre-process . 34
12.3.1 Pre-conditioning . 34
12.3.2 Initial measurement . 34
12.3.3 Pre-baking . 34
12.3.4 Pre-reflow heating . 34

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12.4 Assembly process . 34
12.4.1 Solder paste printing . 34
12.4.2 Solder ball placement . 34
12.4.3 Reflow heating process . 35
12.5 Final measurement . 35
12.5.1 Pull strength measurement . 35
12.5.2 Pull strength measuring method A – Probe heat bond method . 35
12.5.3 Pull strength measuring method B – Ball pinch method . 35
12.5.4 Pull strength measuring method C – Pin pull down method . 36
12.5.5 Pull strength measuring method D – Lead pull method . 36
12.5.6 Final observation . 36
Annex A (informative) Test process items and meaning of processing contents and
condition . 38
A.1 General . 38
A.2 Meaning of processing contents and condition . 38
A.3 Test process items . 38
Bibliography . 40

Figure 1 – Example of a test circuit for the electrical continuity test of a solder joint . 12
Figure 2 – Example of area array type packages . 12
Figure 3 – Example of leaded type devices . 12
Figure 4 – Example of leadless termination type devices . 12
Figure 5 – Example of connector for card type devices . 13
Figure 6 – Example of shielding metal components . 13
Figure 7 – Recommended solder ball shape. 14
Figure 8 – Test procedure for Tg . 16
1
Figure 9 – Example of printed conditions of solder paste . 18
Figure 10 – Typical reflow soldering profile for Sn63Pb37 solder alloy . 18
Figure 11 – Typical reflow soldering profile for Sn96,5Ag3Cu,5 solder alloy . 19
Figure 12 – Reflow temperature profile for soldering ability . 20
Figure 13 – Temperature measurement of the package device using thermocouples . 21
Figure 14 – Temperature measurement of other specimen using thermocouples . 21
Figure 15 – Test procedure for Tg . 22
2
Figure 16 – Contact point . 24
Figure 17 – Maximum gap . 25
Figure 18 – Test procedure for Tg . 26
3
Figure 19 – Test procedure for Tg . 27
4
Figure 20 – State of solder wetting. 30
Figure 21 – Solder contact angle . 30
Figure 22 – Test procedure for Tg . 31
5
Figure 23 – Evaluation of resistance to dissolution of land . 32
Figure 24 – Cross-section observation . 33
Figure 25 – Test procedure for Tg . 34
6
Figure 26 – Measuring methods for pull strength . 35

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IEC 61189-5-601:2021 © IEC 2021 – 5 –
Figure 27 – Breaking modes in pull strength test . 37

Table 1 – Test items defined in this standard . 8
Table 2 – Grouping of soldering processes and typical test severities – Overview . 11
Table 3 – Stencil design standard for devices . 15
Table 4 – Maximum reflow heating conditions . 20
Table 5 – Minimum reflow heating conditions . 21
Table 6 – Wetting level . 29
Table A.1 – Meaning of processing contents and condition . 38
Table A.2 – Test process items and clauses . 39

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INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS
AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –

Part 5-601: General test methods for materials and assemblies –
Reflow soldering ability test for solder joint, and reflow heat
resistance test for printed boards

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
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preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
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with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
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transparently to the maximum extent possible in their n
...