SIST EN 60191-6-10:2005

Mechanical standardization of semiconductor devices -- Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON

Provides the common outline drawings and dimensions for all types of structures and composed materials of plastic very thin small outline non-lead package (P-VSON).

Mechanische Normung von Halbleiterbauelementen -- Teil 6-10: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen - P-VSON Gehäusemaße

Normalisation mécanique des dispositifs à semiconducteurs -- Partie 6-10: Règles générales pour la préparation des dessins d'encombrement des dispositifs à semiconducteurs pour montage en surface - Dimensions des boîtiers P-VSON

Provides the common outline drawings and dimensions for all types of structures and composed materials of plastic very thin small outline non-lead package (P-VSON).

Standardizacija mehanskih lastnosti polprevodniških elementov – 6-10. del: Splošna pravila za pripravo tehničnih risb okrovov polprevodniških elementov za površinsko montažo - Splošna pravila za mere zelo tankih in majhnih plastičnih okrovov s kontakti brez priključkov (P-VSON) (IEC 60191-6-10:2003)

General Information

• Status: Published
• Publication Date: 28-Feb-2005
• ICS: 01.100.25 - Electrical and electronics engineering drawings
• ICS: 31.080.01 - Semiconductor devices in general
• ICS: 31.240 - Mechanical structures for electronic equipment
• Technical Committee: SS EIT - Technical Board for the electrotechnical, information technology and telecommunications fields
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 01-Mar-2005
• Due Date: 01-Mar-2005
• Completion Date: 01-Mar-2005
• Ref Project: EN 60191-6-10:2003 - Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 60191-6-10:2005
01-marec-2005
6WDQGDUGL]DFLMDPHKDQVNLKODVWQRVWLSROSUHYRGQLãNLKHOHPHQWRY±GHO
6SORãQDSUDYLOD]DSULSUDYRWHKQLþQLKULVERNURYRYSROSUHYRGQLãNLKHOHPHQWRY]D
SRYUãLQVNRPRQWDåR6SORãQDSUDYLOD]DPHUH]HORWDQNLKLQPDMKQLKSODVWLþQLK
RNURYRYVNRQWDNWLEUH]SULNOMXþNRY39621,(&
Mechanical standardization of semiconductor devices -- Part 6-10: General rules for the
preparation of outline drawings of surface mounted semiconductor device packages -
Dimensions of P-VSON
Mechanische Normung von Halbleiterbauelementen -- Teil 6-10: Allgemeine Regeln für
die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen - P-VSON
Gehäusemaße
Normalisation mécanique des dispositifs à semiconducteurs -- Partie 6-10: Règles
générales pour la préparation des dessins d'encombrement des dispositifs à
semiconducteurs pour montage en surface - Dimensions des boîtiers P-VSON
Ta slovenski standard je istoveten z: EN 60191-6-10:2003
ICS:
01.100.25 5LVEHVSRGURþMD Electrical and electronics
HOHNWURWHKQLNHLQHOHNWURQLNH engineering drawings
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
31.240 Mehanske konstrukcije za Mechanical structures for
elektronsko opremo electronic equipment
SIST EN 60191-6-10:2005 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 60191-6-10:2005

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SIST EN 60191-6-10:2005
EUROPEAN STANDARD EN 60191-6-10
NORME EUROPÉENNE
EUROPÄISCHE NORM December 2003

ICS 31.080.01


English version


Mechanical standardization of semiconductor devices
Part 6-10: General rules for the preparation of outline drawings of surface
mounted semiconductor device packages –
Dimensions of P-VSON
(IEC 60191-6-10:2003)


Normalisation mécanique des dispositifs  Mechanische Normung von
à semiconducteurs Halbleiterbauelementen
Partie 6-10: Règles générales pour Teil 6-10: Allgemeine Regeln für
la préparation des dessins die Erstellung von Gehäusezeichnungen
d'encombrement des dispositifs von SMD-Halbleitergehäusen -
à semiconducteurs pour montage P-VSON Gehäusemaße
en surface – (IEC 60191-6-10:2003)
Dimensions des boîtiers P-VSON
(CEI 60191-6-10:2003)

This European Standard was approved by CENELEC on 2003-11-01. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic,
Denmark, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Lithuania, Luxembourg, Malta,
Netherlands, Norway, Portugal, Slovakia, Spain, Sweden, Switzerland and United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels


© 2003 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.

Ref. No. EN 60191-6-10:2003 E

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SIST EN 60191-6-10:2005
EN 60191-6-10:2003 - 2 -
Foreword
The text of document 47D/551/FDIS, future edition 1 of IEC 60191-6-10, prepared by SC 47D,
Mechanical standardization of semiconductor devices, of IEC TC 47, Semiconductor devices, was
submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60191-6-10 on
2003-11-01.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2004-08-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2006-11-01

Annexes designated "normative" are part of the body of the standard.
In this standard, annex ZA is normative.
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 60191-6-10:2003 was approved by CENELEC as a
European Standard without any modification.
__________

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SIST EN 60191-6-10:2005
- 3 - EN 60191-6-10:2003
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications
This European Standard incorporates by dated or undated reference, provisions from other
publications. These normative references are cited at the appropriate places in the text and the
publications are listed hereafter. For dated references, subsequent amendments to or revisions of any
of these publications apply to this European Standard only when incorporated in it by amendment or
revision. For undated references the latest edition of the publication referred to applies (including
amendments).
NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
Publication Year Title EN/HD Year
IEC 60191 Series Mechanical standardization of EN 60191 Series
semiconductor devices

ISO/DIS 2692 - Geometrical Product Specification - - -
Geometrical tolerancing - Maximum
material requirement (MMR) and least
material requirement (LMR)

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SIST EN 60191-6-10:2005

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SIST EN 60191-6-10:2005
INTERNATIONAL IEC
STANDARD
60191-6-10
First edition
2003-11
Mechanical standardization of semiconductor devices –
Part 6-10:
General rules for the preparation of outline drawings of
surface mounted semiconductor device packages –
Dimensions of P-VSON
Normalisation mécanique des dispositifs à semiconducteurs –
Partie 6-10:
Règles générales pour la préparation des dessins
d'encombrement des dispositifs à semiconducteurs
pour montage en surface –
Dimensions des boîtiers P-VSON
 IEC 2003  Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: [phone] Telefax: [phone] E-mail: [e-mail]  Web: www.iec.ch
PRICE CODE
Commission Electrotechnique Internationale M
International Electrotechnical Commission
МеждународнаяЭлектротехническаяКомиссия
For price, see current catalogue

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SIST EN 60191-6-10:2005
– 2 – 60191-6-10 © IEC:2003(E)

INTERNATIONAL ELECTROTECHNICAL COMMISSION
___________

MECHANICAL STANDARDIZATION
OF SEMICONDUCTOR DEVICES –

Part 6-10: General rules for the preparation of outline drawings of
surface mounted semiconductor device packages –
Dimensions of P-VSON

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all
national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in
addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence between
any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any equipment
declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the
...