SIST EN 62137-1-4:2009
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test
The test method described in this part of IEC 62137 applies to surface mount components with a thin and wide basal plane, such as QFP and BGA. This test method evaluates the endurance of the solder joints between component leads and lands on a substrate by cyclic bending of substrate. This test also evaluates the effects of repeated mechanical stress, such as key pushing in cell phones, the strength of the solder joint between component terminals and lands on a substrate. In this test method, the evaluation requires first to mount the surface mount component on the substrate by reflow soldering, then cyclically bend the substrate to a certain degree of depth until fracture of the solder joints occurs. The properties of the solder joints (e.g, solder alloy, substrate, mounted device or design, etc.) are evaluated to assist in improving the strength of the solder joints.
Oberflächenmontage-Technik - Verfahren zur Prüfung auf Umgebungseinflüsse und zur Prüfung der Haltbarkeit von Oberflächen-Lötverbindungen - Teil 1-4: Zyklische Biegeprüfung
Technologie de montage en surface - Méthodes d'essais d'environnement et d'endurance des joints brasés montés en surface - Partie 1-4: Essai de flexion cyclique
La méthode d'essai décrite dans la CEI 62137-1-4:2009 s'applique aux composants pour montage en surface avec un plan de base fin et large tel que les QFP ou les BGA. La présente méthode d'essai évalue l'endurance des joints de soudure situés entre les broches de raccordement et les plages de connexion sur un substrat par flexion cyclique de ce dernier. Cet essai évalue également les effets des contraintes mécaniques répétées, tels que le fait d'appuyer sur les touches d'un téléphone cellulaire, sur la résistance du joint de soudure situé entre les bornes du composant et les plages de connexion sur un substrat.
Tehnologija površinske montaže - Okoljski preskusi in preskusne metode za določanje zanesljivosti spajkanih spojev, izdelanih s površinsko montažo - 1-4. del: Ciklični preskus na upogib (IEC 62137-1-4:2009)
General Information
Standards Content (Sample)
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.Technologie de montage en surface - Méthodes d'essais d'environnement et d'endurance des joints brasés montés en surface - Partie 1-4: Essai de flexion cycliqueSurface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test31.190Sestavljeni elektronski elementiElectronic component assemblies19.040Preskušanje v zvezi z okoljemEnvironmental testingICS:Ta slovenski standard je istoveten z:EN 62137-1-4:2009SIST EN 62137-1-4:2009en,fr,de01-junij-2009SIST EN 62137-1-4:2009SLOVENSKI
STANDARD
SIST EN 62137-1-4:2009
EUROPEAN STANDARD EN 62137-1-4 NORME EUROPÉENNE
EUROPÄISCHE NORM February 2009
CENELEC European Committee for Electrotechnical Standardization Comité Européen de Normalisation Electrotechnique Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: avenue Marnix 17, B - 1000 Brussels
© 2009 CENELEC -
All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 62137-1-4:2009 E
ICS 31.190
English version
Surface mounting technology -
Environmental and endurance test methods
for surface mount solder joint -
Part 1-4: Cyclic bending test (IEC 62137-1-4:2009)
Technologie de montage en surface -
Méthodes d'essais d'environnement
et d'endurance des joints brasés
montés en surface -
Partie 1-4: Essai de flexion cyclique (CEI 62137-1-4:2009)
Oberflächenmontage-Technik -
Verfahren zur Prüfung
auf Umgebungseinflüsse
und zur Prüfung der Haltbarkeit
von Oberflächen-Lötverbindungen -
Teil 1-4: Zyklische Biegeprüfung (IEC 62137-1-4:2009)
This European Standard was approved by CENELEC on 2009-02-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom.
SIST EN 62137-1-4:2009
EN 62137-1-4:2009
- 2 -
Foreword The text of document 91/815/FDIS, future edition 1 of IEC 62137-1-4, prepared by IEC TC 91, Electronics assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 62137-1-4 on 2009-02-01. The following dates were fixed: – latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement
(dop)
2009-11-01 – latest date by which the national standards conflicting
with the EN have to be withdrawn
(dow)
2012-02-01 Annex ZA has been added by CENELEC. __________ Endorsement notice The text of the International Standard IEC 62137-1-4:2009 was approved by CENELEC as a European Standard without any modification. __________
SIST EN 62137-1-4:2009
- 3 - EN 62137-1-4:2009 Annex ZA (normative)
Normative references to international publications with their corresponding European publications
The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies.
NOTE
When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies.
Publication Year Title EN/HD Year
IEC 60068-1
-1) Environmental testing -
Part 1: General and guidance EN 60068-1 19942)
IEC 60194 -1) Printed board design, manufacture and assembly - Terms and definitions EN 60194 20062)
IEC 61188-5 Series Printed boards and printed board
assemblies - Design and use -
Part 5: Attachment (land/joint) considerations EN 61188-5 Series
IEC 61190-1-2 -1) Attachment materials for electronic
assembly -
Part 1-2: Requirements for soldering paste for high-quality interconnects in electronics assembly EN 61190-1-2 20072)
IEC 61190-1-3 -1) Attachment materials for electronic
assembly -
Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications EN 61190-1-3 20072)
IEC 61249-2-7 -1) Materials for printed boards and other interconnecting structures -
Part 2-7: Reinforced base materials, clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad EN 61249-2-7 + corr. September 20022) 2005
IEC 61760-1 -1) Surface mounting technology -
Part 1: Standard method for the specification of surface mounting components (SMDs) EN 61760-1 20062)
1) Undated reference. 2) Valid edition at date of issue. SIST EN 62137-1-4:2009
SIST EN 62137-1-4:2009
IEC 62137-1-4Edition 1.0 2009-01INTERNATIONAL STANDARD NORME INTERNATIONALESurface mounting technology – Environmental and endurance test methods for surface mount solder joint –
Part 1-4: Cyclic bending test
Technologie de montage en surface – Méthodes d’essais d’environnement et d’endurance des joints brasés montés en surface –
Partie 1-4: Essai de flexion cyclique
INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE MICS 31.190 PRICE CODECODE PRIXISBN 2-8318-1021-5
® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale SIST EN 62137-1-4:2009
– 2 – 62137-1-4 © IEC:2009 CONTENTS FOREWORD.3 1 Scope.5 2 Normative references.6 3 Terms and definitions.6 4 Test equipment and material.6 4.1 Test equipment for cyclic bending.6 4.2 Test substrate.7 4.3 Solder alloy.7 4.4 Solder paste.7 4.5 Reflow soldering equipment.7 4.6 Surface mount component for testing.7 5 Mounting method.7 6 Test conditions.8 6.1 Pre-treatment.8 6.2 Test procedures.8 6.3 Judging criteria.9 7 Items to be included in the test report.9 8 Items to be prescribed in the product specifications.9 Annex A (normative)
Cyclic bending test equipment.11
Figure 1 – Image drawing on evaluation area of joint strength.5 Figure 2 – Typical reflow soldering profile.8 Figure A.1 – Sample structure of substrate bending jig.12 Figure A.2 – Sample structure of cyclic bending strength test.13
SIST EN 62137-1-4:2009
62137-1-4 © IEC:2009 – 3 – INTERNATIONAL ELECTROTECHNICAL COMMISSION ___________
SURFACE MOUNTING TECHNOLOGY –
ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT –
Part 1-4: Cyclic bending test
FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any equipment declared to be in conformity with an IEC Publication. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 62137-1-4 has been prepared by IEC technical committee 91: Electronics assembly technology. The text of this standard is based on the following documents: FDIS Report on voting 91/815/FDIS 91/835/RVD
Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. SIST EN 62137-1-4:2009
– 4 – 62137-1-4 © IEC:2009 A list of all parts of the IEC 62137 series, under the general title Surface mounting technology – Environmental and endurance test methods for surface mount solder joint, can be found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in the data related to the specific publication. At this date, the publication will be • reconfirmed, • withdrawn, • replaced by a revised edition, or • amended.
SIST EN 62137-1-4:2009
62137-1-4 © IEC:2009 – 5 – SURFACE MOUNTING TECHNOLOGY – ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT –
Part 1-4: Cyclic bending test
1 Scope The test method described in this part of IEC 62137 applies to surface mount components with a thin and wide basal plane, such as QFP and BGA. This test method evaluates the endurance of the solder joints between component leads and lands on a substrate by cyclic bending of substrate.
This test also evaluates the effects of repeated mechanical stress, such as key pushing in cell phones, the strength of the solder joint between component terminals and lands on a substrate.
In this test method, the evaluation requires first to mount the surface mount component on the substrate by reflow soldering, then cyclically bend the substrate to a certain degree of depth until fracture of the solder joints occurs. The properties of the solder joints (e.g, solder alloy, substrate, mounted device or design, etc.) are evaluated to assist in improving the strength of the solder joints.:w:wComponent lead Substrate Enlarge Evaluation area Plated layers Substrate land Intermetallic compound layers Solder Substrate Component lead IEC
1174/07
Figure 1 – Image drawing on evaluation area of joint strength
SIST EN 62137-1-4:2009
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