SIST EN 60191-6:2005

Mechanical standardization of semiconductor devices -- Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

Gives general rules for the preparation of outlines drawings of surface-mounted semiconductor devices. It supplements EN 60191-1 and 60191-3. It covers all surface-mounted discrete semiconductors devices as well as integrated circuits classified as form E.

Mechanische Normung von Halbleiterbauelementen -- Teil 6: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen

Normalisation mécanique des dispositifs à semiconducteurs -- Partie 6: Règles générales pour la préparation des dessins d'encombrement des dispositifs à semiconducteurs à montage en surface

Gives general rules for the preparation of outlines drawings of surface-mounted semiconductor devices. It supplements EN 60191-1 and 60191-3. It covers all surface-mounted discrete semiconductors devices as well as integrated circuits classified as form E.

Standardizacija mehanskih lastnosti polprevodniških elementov – 6. del: Splošna pravila za pripravo tehničnih risb okrovov površinsko nameščenih polprevodniških elementov (IEC 60191-6:2004)

General Information

• Status: Withdrawn
• Publication Date: 30-Nov-2005
• Withdrawal Date: 19-Jan-2010
• ICS: 01.100.25 - Electrical and electronics engineering drawings
• ICS: 31.080.01 - Semiconductor devices in general
• ICS: 31.240 - Mechanical structures for electronic equipment
• Technical Committee: I11 - Imaginarni 11
• Current Stage: 9900 - Withdrawal (Adopted Project)
• Start Date: 14-Jan-2010
• Due Date: 06-Feb-2010
• Completion Date: 20-Jan-2010
• Ref Project: EN 60191-6:2004 - Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

Relations

• Revised: SIST EN 60191-6:2010 - Mechanical standardization of semiconductor devices -- Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 60191-6:2009)
• Effective Date: 04-Dec-2012
• Replaced By: SIST EN 60191-6:2010 - Mechanical standardization of semiconductor devices -- Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 60191-6:2009)
• Effective Date: 07-Jun-2022
• Replaced By: SIST EN 60191-6:2010 - Mechanical standardization of semiconductor devices -- Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 60191-6:2009)
• Effective Date: 01-Mar-2010
• Replaced By: SIST EN 60191-6:2010 - Mechanical standardization of semiconductor devices -- Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 60191-6:2009)
• Effective Date: 29-Jan-2023

Standards Content (Sample)

SLOVENSKI SIST EN 60191-6:2005

STANDARD
december 2005
Standardizacija mehanskih lastnosti polprevodniških elementov – 6. del:
Splošna pravila za pripravo tehničnih risb okrovov površinsko nameščenih
polprevodniških elementov (IEC 60191-6:2004)
Mechanical standardization of semiconductor devices – Part 6: General rules for
the preparation of outline drawings of surface mounted semiconductor device
packages (IEC 60191-6:2004)
ICS 01.100.25; 31.080.01; 31.240 Referenčna številka
SIST EN 60191-6:2005(en)
©  Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljeno

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EUROPEAN STANDARD EN 60191-6
NORME EUROPÉENNE
EUROPÄISCHE NORM December 2004

ICS 31.080.01


English version


Mechanical standardization of semiconductor devices
Part 6: General rules for the preparation of outline drawings of surface
mounted semiconductor device packages
(IEC 60191-6:2004)


Normalisation mécanique des dispositifs  Mechanische Normung von
à semiconducteurs Halbleiterbauelementen
Partie 6: Règles générales Teil 6: Allgemeine Regeln für
pour la préparation des dessins die Erstellung von Gehäusezeichnungen
d'encombrement des dispositifs von SMD-Halbleitergehäusen
à semiconducteurs à montage en surface (IEC 60191-6:2004)
(CEI 60191-6:2004)






This European Standard was approved by CENELEC on 2004-10-01. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, Czech
Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Slovakia, Slovenia, Spain, Sweden,
Switzerland and United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels


© 2004 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.

Ref. No. EN 60191-6:2004 E

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EN 60191-6:2004 - 2 -
Foreword
The text of document 47D/584/FDIS, future edition 2 of IEC 60191-6, prepared by SC 47D,
Mechanical standardization of semiconductor devices, of IEC TC 47, Semiconductor devices, was
submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60191-6 on
2004-10-01.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2005-07-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2007-10-01
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 60191-6:2004 was approved by CENELEC as a European
Standard without any modification.
__________

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- 3 - EN 60191-6:2004
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications
The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.
NOTE Where an international publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
Publication Year Title EN/HD Year
IEC 60191-1 1966 Mechanical standardization of - -
semiconductor devices
Part 1: Preparation of drawings of
semiconductor devices

IEC 60191-3 1999 Part 3: General rules for the preparation EN 60191-3 1999
of outline drawings of integrated circuits

IEC 60191-4 1999 Part 4: Coding system and classification EN 60191-4 1999
into forms of package outlines for
semiconductor device packages

ISO 1101 1983 Technical drawings - Geometrical - -
tolerancing - Tolerancing of form,
orientation, location and run-out -
Generalities, definitions, symbols,
indications on drawings

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INTERNATIONAL IEC


STANDARD 60191-6





Second edition
2004-09


Mechanical standardization
of semiconductor devices –
Part 6:
General rules for the preparation of
outline drawings of surface mounted
semiconductor device packages

 IEC 2004  Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: [phone] Telefax: [phone] E-mail: [e-mail] Web: www.iec.ch
PRICE CODE
Commission Electrotechnique Internationale W
International Electrotechnical Commission
МеждународнаяЭлектротехническаяКомиссия
For price, see current catalogue

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– 2 – 60191-6  IEC:2004(E)
CONTENTS
FOREWORD.3

1 Scope.5
2 Normative references .5
3 Definitions .5
4 Design rules .7
5 Dimensions to be specified.7
6 Notes .7

Annex A (informative) Illustration of the rules.11
A.1 Gull-wing lead package with two parallel rows of terminals (SOP,TSOP Type 2).13
A.2  Gull-wing lead package with two parallel rows of terminals (TSOP Type 1).16
A.3 Gull-wing lead package with one row of terminals on each of four sides (QFP) .19
A.4 J-bent lead package with two parallel rows of terminals (SOJ) .22
A.5 Folded lead package with one row of terminals on each of four sides (QFJ).25
A.6 Leadless package .29
A.7-1 Ball grid array package (BGA) Type 1 .32
A.7-2 Ball grid array package (BGA) Type 2 .35

Annex B (informative) Optional table format.38

Figure 1 – Illustrations of terminal projection zone .12
Figure 2 – Isometric view of an example of gauge.12

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60191-6  IEC:2004(E) – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

MECHANICAL STANDARDIZATION
OF SEMICONDUCTOR DEVICES –

Part 6: General rules for the preparation of outline drawings of
surface mounted semiconductor device packages


FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60191-6 has been prepared by subcommittee 47D: Mechanical
standardization of semiconductor devices, of IEC technical committee 47: Semiconductor
devices.
This second edition of IEC 60191-6 cancels and replaces the first edition, published in 1990
and its amendment 1 (1999), and constitutes a technical revision. This includes the following
significant changes with respect to the previous edition: improvement of the geometrical
drawing format and addition of the examples of the drawing of major packages.

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– 4 – 60191-6  IEC:2004(E)
The text of this standard is based on the following documents:
FDIS Report on voting
47D/584/FDIS 47D/587/RVD

Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in
the data related to the specific publication. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.

A bilingual version of this publication may be issued at a later date.

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60191-6  IEC:2004(E) – 5 –
MECHANICAL STANDARDIZATION
OF SEMICONDUCTOR DEVICES –

Part 6: General rules for the preparation of outline drawings of
surface mounted semiconductor device packages



1 Scope
This part of IEC 60191 gives general rules for the preparation of outlines drawings of surface-
mounted semiconductor devices. It supplements IEC 60191-1 and 60191-3. It covers all surface-
mounted devices-discrete semiconductors as well as integrated circuits classified as form E in
Clause 3 of IEC 60191-4.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60191-1:1966, Mechanical standardization of semiconductor devices – Part 1: Preparation of
drawings of semiconductor devices
IEC 60191-3:1999, Mechanical standardization of semiconductor devices – Part 3: General
rules for the preparation of outline drawings of integrated circuits
IEC 60191-4:1999, Mechanical standardization of semiconductor devices – Part 4: Coding
system and classification into forms of package outlines for semiconductor devices
ISO 1101:1983, Technical drawings – Geometrical tolerancing – Tolerancing of form,
orientation, location and run-out – Generalities, definitions, symbols, indications on drawings
3 Definitions
For the purposes of this document, the following definitions apply.
3.1
seating plane
plane which designates the plane of contact of the package, including any stand-off, with the
surface on which it will be mounted
NOTE This plane is often used as the reference plane.
3.2
reference plane
plane parallel to the seating plane at a distance A3 above seating plane (does not apply to
leadless package)

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– 6 – 60191-6  IEC:2004(E)
The distance A3 is known as the reference plane distance. It determines the terminal
projection zone (see Figure 1).
NOTE This distance is a theoretical dimension which is not related to any feature of the package. Its value is
chosen for each package so the length of terminal projection zone L is a good approximation of the terminal
p
length used for mounting, e.g. the length of the part of the terminal that is soldered to the substrate.

3.3
terminal position area
maximum area on the seating plane within which the terminal projection zone is located,
taking into account the maximum values of L and b
p p
The surface of the terminal position area is equal to l × b with, generally
1 3
l = L max. + (HDmax – HDmin)/2
1 p
 = L max. + (HEmax – HEmin)/2
p
and b = b max. + x
3 p
Checking can be carried out by means of an appropriate gauge (see Figure 2).
3.4
pattern of terminal position areas
group of all terminal position areas of a leaded package or folded lead package in the seating
plane
For a leadless package, it is the projection of its metallized pads or terminals on the seating
plane.
The true positions of the centres of the terminal position areas are located on a grid with as
modulus
e / e or  e / e
D E

The pattern of terminal position areas does not include tolerances stemming from mounting
substrates (printed board) design and placement machine accuracy.
3.5
coplanarity of terminals
the requirement for coplanarity of terminals is given in a tolerance frame showing the ISO
symbol for profile of a surface, the tolerance value y and the reference to the seating plane
Where the part of the terminal intended for soldering is a flat zone of defined dimension b × l,
with nominal position on the seating plane – e.g. pads of leadless packages – then the
requirement for coplanarity of terminals is strictly the ISO requirement for flatness applied to
these zones.
In all the other cases, the requirement for coplanarity of terminals is clarified by note.
3.6
datum
theoretically, the exact geometrical reference is established for controlling the tolerance zone
when specifying a geometrical tolerance as a related feature
NOTE Datum S should be established by seating plane.

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60191-6  IEC:2004(E) – 7 –
4 Design rules
The outline drawing of a surface-mounted semiconductor device package shall comprise in
the given sequence
– the drawing (strictly speaking);
– the tables of dimensions;
– the notes to the tables and the drawings;
– the indication of supporting countries;
– the codification.
The drawing shall conform with the general rules for drawings laid down in IEC 60191-1
sections 1 and 2, as well as with the specific definitions of Clause 3 above.
The following Clauses 5 and 6 give, respectively, the tables of dimensions to be specified and
the notes to be called, where relevant. Supplementary dimensions and notes may be added
when required.
The codification of package outlines shall be in accordance with IEC 60191-4.
5 Dimensions to be specified
Crosses in Tables 1 and 2 indicate where values have to be specified. In the auxiliary right-
hand column, a code indicates for which outline families each dimension is generally relevant,
as follows:
L: leaded packages packages with gull-wing leads for example; QFP, SOP,TSOP
F: folded lead packages packages with J-bent leads for example; QFJ, SOJ
P: leadless packages packages with no leads for example; QFN
B: ball grid array packages packages with ball leads for example; BGA
6 Notes
Notes referred to in the tables and in the drawings appear after Table 2; in the auxiliary right-
hand column, a code indicates for which outline families each note is generally relevant (with
the same code as in Clause 5).
For each particular outline package or package family, the applicable notes shall be
numbered sequentially from 1 in the order in the tables and then on the drawing.

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– 8 – 60191-6  IEC:2004(E)

Table 1 – Dimensions to be specified for Group 1

Group 1 - Group 1 includes dimensions and numerals associated with
mounting of packages and kinds of packages. The dimensions and numerals
belonging to the group mean values guaranteed to users and imply that
mechanical compatibility of mounting of packages can be recognized.
Concerned
family
Ref. Min. Nom. Max. Notes
n - x - 2 LFPB

nD - x - 3 LFP

nE - x - 3 LFP

A - - x LFPB

A1 x - x LFB

A2 - x - LF

A3 - x(∗) - 4 LF

bp x - x 4 LFP

∅bp x [x] x 4 B

∅b x - x 4 B

C x - x LF

D x x x 4 LFPB

E x x x 4 LFPB

e - - 4 LFPB
x(∗)
f - - x LF

HD x x x 4 LF

HE x x x 4 LF

h x - x F

k x - x P

k1 x - x P

Lp
x - x 4 LFP

t - - x LF

v - - x B

w - - x B

x - - x LFPB

x1 - - x B

y - - x LFPB

y1 - - x B

x - x
L
θ

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60191-6  IEC:2004(E) – 9 –
Table 2 – Dimensions to be specified for Group 2


Group 2 - Group 2 includes dimensions that do not belong to Group 1, but are
associated with the fabrication of packages and dimensions of terminal position
areas. The group is to achieve its own original purpose as an industry standard.
The group belongs to the dimensions and numerals of external shapes of
packages useful for design and manufacture and the dimensions of terminal
position areas that can be referenced to in fabrications of mounting boards.
Therefore, external dimensions of a package shall have nominal design values
specified thereto.
Concerned
family
Ref. Min. Nom. Max. Notes
b1 - x - LF

b2 x - x F

b3 - - [x] 4 LFPB
c1 - x - LF

eD - x - 4 FP
eE - x - 4 FP
L - x - LF

L1 - x - F

L2 - x - F

l1 - - [x] 4 LFP
SD - x - B

SE - x - B

ZD - x - LFPB

ZE - x - LFPB

G1D - x - L

G1E - x - L

h - x - F

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– 10 – 60191-6  IEC:2004(E)

Notes to the tables



1 All dimensions are in millimetres.
2 n refers to the total number of terminal positions.
3 n refers to the number of terminal positions on one side of the package in
D
the direction of dimension D.
n refers to the number of terminal positions on one side of the package
E
in the direction of dimension E.
4 Check of the dimensions and positions of package terminal is validly performed
when it is ensured that these terminal fit with the pattern of terminal position
LFPB
areas. This can be carried out by means of an appropriate gauge.
(∗) Means true geometrical position.
[ ] Values given within square brackets are calculated values.
5 Zone of a visible index on the top face.
6 Terminal number designation shall be in accordance with
annex C of IEC60191-3.
 Means in this drawing that the distance from the seating plane to the
y
S
 nearest point of each terminal should not exceed y mm.
LF
P  Means projected tolerance zone (see ISO 1101, clause 11).
7 Length of terminal pad number 1 shall be visibly greater than the length of
P
the other terminal pads.
8 Index corner.
F
9  Seating plane S is defined by the spherical crowns of the solder balls.
10 Dimension ∅b is measured at the maximum solder ball diameter, parallel to
seating plane S.
11 The thickness A2 of the package body, exclusive of the lid or encapsulation
B
and ball height.
12 Stand-off A1 is optional, but when present they should be located on
the ball matrix diagonals.

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60191-6  IEC:2004(E) – 11 –
Annex A
(informative)

Illustration of the rules


The above rules are illustrated by examples of application to several package families:
− gull-wing lead package with two parallel rows of terminals (SOP, TSOP, Type 2) (see A.1);
− gull-wing lead package with two parallel rows of terminals (TSOP Type 1) (see A.2);
− gull-wing lead package with one row of terminals on each of four sides (see A.3);
− J-bend lead package with two parallel rows of terminals (see A.4);
− folded lead package with one row of terminals on each of four sides (see A.5);
− leadless package (see A.6);
− ball grid array package (see A.7.1, A.7.2).

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– 12 – 60191-6  IEC:2004(E)

Reference plane
Side view
P A3  Projected zone

Lp
S
Seating
plane
Bottom view
Lp × bp: terminal projection
zone (hatched)
IEC  667/04
Figure 1a – Illustrations of terminal projection zone (a)
Reference plane
Side view
P A3 Projected zone
Lp
S
Seating plane
Bottom view
Lp × bp: terminal projection
zone (hatched)
IEC  668/04
Figure 1b – Illustrations of terminal projection zone (b)
Figure 1 – Illustrations of terminal projection zone
IEC  669/04
Figure 2 – Isometric view of an example of gauge

bp
bp

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60191-6  IEC:2004(E) – 13 –

A.1  Gull-wing lead package with two parallel rows of terminals (SOP, TSOP Type 2)
A
n  n-1 n/2-1
n4 n3

n1 n2
n/2
1 2
B
IEC  670/04
Terminal 1 index area
Figure 1a
D
Seating plane
S
e
y
S
Z D
bp
x M P S A-B
IEC  671/04
Figure 1b
G
1E
P
bp
b1
L1
Lp
L
IEC  673/04
IEC  672/04
Figure 1d
Figure 1c −−−− Lead section
e
b3
IEC  674/04
Figure 2 −− Pattern of terminal position areas
−−
Date:

c1
l1
c

E
HE MIN
E
  −2Lpmax
H
HE max
A3
A1
A2
A

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– 14 – 60191-6  IEC:2004(E)

Group 1 - Group 1 includes dimensions and numerals associated with mounting
of packages and kinds of packages. The dimensions and numerals belonging to
the group mean values guaranteed to users and imply that mechanical
compatibility of mounting of packages can be recognized.

Ref. Min. Nom. Max. Notes
n - x - 2
A - - x
A1 x - x
A2 - x -
A3 - x(∗) - 3
bp x - x 3
c x - x
D x x x
E x x x
e - x(∗) - 3
HE x x x 3
Lp x - x 3
x - - x
y - - x
θ x - x 3

Group 2 - Group 2 includes dimensions that do not belong to Group 1, but are
associated with the fabrication of packages and dimensions of terminal position
areas. The group is to achieve its own original purpose as an industry standard.
The group belongs to the dimensions and numerals of external shapes of
packages useful for design and manufacture and the dimensions of terminal
position areas that can be referenced to in fabrications of mounting boards.
Therefore, external dimensions of a package shall have nominal design values
specified thereto.

Ref. Min. Nom. Max. Notes
b1 - x -

b3 - - x 3
c1 - x -
L - x -
L1 - x -
l1 - - x 3
( ZD ) - x -
G1E - x -

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60191-6  IEC:2004(E) – 15 –
NOTES
(∗)  Means true geometrical position.
[ ]   Values given within square brackets are calculated values.
P Means projected tolerance zone (see ISO 1101, Clause 11).

Means in this drawing that the distance from the seating plane
y
S
to the nearest point of each terminal should not exceed y mm.

1 All dimensions are in millimetres.
2 n refers to the total number of terminal positions.
3 Verification of the dimensions and positions of package
terminal is validly performed when it is ensured that these
terminal fit with the pattern of terminal position areas. This can
be carried out by means of an appropriate gauge.

---------------------- Page: 19 ----------------------

– 16 – 60191-6  IEC:2004(E)

A.2  Gull-wing lead package with two parallel rows of terminals (TSOP Type 1)
HD
D
n
1
n-1
2
A B
Terminal 1
index area
n/2
n/2+1
IEC  675/04
Figure 1a
E
Seating plane
S
y
S
e
bp
Z E
M P S A-B
x
IEC  676/04
Figure 1b
G1D
P
bp
b1
L1
Lp
L
IEC  678/04
IEC  677/04
Figure 1d
Figure 1c −−−− Lead section
l1
HDmin − 2Lpmax
HD max
IEC  679/04
Figure 2 −−−− Pattern of terminal position areas
Date:

c1
c
θ
b3
e
A3
A2
A1
A

---------------------- Page: 20 ----------------------

60191-6  IEC:2004(E) – 17 –
Group 1 - Group 1 includes dimensions and numerals associated with the
mounting of packages and kinds of packages. The dimensions and numerals
belonging to the group means values guaranteed to users and imply that
mechanical compatibility of mounting of packages can be recognized.

Ref. Min. Nom. Max. Notes
n - x - 2
A - - x
A1 x - x
A2 - x -
A3 - x(∗) - 3
bp x - x 3
c x - x
D x x x
E x x x
e - x(∗) - 3
HD x x x 3
Lp x - x 3
x - - x
y - - x
θ x x

Group 2 - Group 2 includes dimensions that do not belong to Group 1, but are
associated with the fabrication of packages and dimensions of terminal position
areas. The group is to achieve its own original purpose as an industry standard.
The group belongs to the dimensions and numerals of external shapes of
packages useful for design and manufacture and the dimensions of terminal
position areas that can be referenced to in fabrications of mounting boards.
Therefore, external dimensions of a package shall have nominal design values
specified thereto.

Ref. Min. Nom. Max. Notes
b1 - x -
b3 - - x 3
c1 - x -
eD - x - 3
L - x -
l1 - - x 3
( ZE ) - x -
G1D - x -

---------------------- Page: 21 ----------------------

– 18 – 60191-6  IEC:2004(E)

NOTES
(∗)  Means true geometrical position.
[ ]   Values given within square brackets are calculated values.
P Means projected tolerance zone (see ISO 1101, Clause 11).

Means in this drawing that the distance from the seating plane
y
S
to the nearest point of each terminal should not exceed y mm.

1 All dimensions are in millimetres.
2 n refers to the total number of terminal positions.
3 Verification of the dimensions and positions of package
terminal is validly performed when it is ensured that these
terminal fit with the pattern of terminal position areas.This can
be carried out by means of an appropriate gauge.

---------------------- Page: 22 ----------------------

60191-6  IEC:2004(E) – 19 –
A.3 Gull-wing lead package with one row of terminals on each of four sides (QFP)
H D
D
C
A B
n
Terminal 1
index area
1 2
e
bp
x M P S A-B C
Z D
IEC  680/04
Figure 1a
Seating plane
S
y
S
G 1D or G 1E
IEC  681/04
Figure 1b
bp
b1
P
L1
Lp
IEC  682/04
L
IEC  683/04
Figure 1d
Figure 1c −− Lead section
−−
HDmin − 2Lpma
H max
D
IEC  684/04
Figure 2 −− Pattern of terminal position areas
−−
Date:

e
b3
c1
c
ZE
E
l H E
1
HEmin − 2Lpm
θ
HE max
A3
A1 A2
A

---------------------- Page: 23 ----------------------

– 20 – 60191-6  IEC:2004(E)

Group 1 – Group 1 includes dimensions and numerals associated with the
mounting of packages and kinds of packages. The dimensions and numerals
belonging to t
...