oSIST prEN ISO 11553-2:2017

Safety of machinery - Laser processing machines - Part 2: Safety requirements for hand-held laser processing devices (ISO/DIS 11553-2:2016)

2018-11-13: WI abandoned due to cancellation of equivalent ISO WI (ISO notification to dataservice on 2018-11-12).

Sicherheit von Maschinen - Laserbearbeitungsmaschinen - Teil 2: Sicherheitsanforderungen an handgeführte Laserbearbeitungsgeräte (ISO/DIS 11553-2:2016)

Sécurité des machines - Machines à laser - Partie 2: Exigences de sécurité pour dispositifs de traitement laser portatifs (ISO/DIS 11553-2:2016)

Varnost strojev - Laserski obdelovalni stroji - 2. del: Varnostne zahteve za ročne laserske obdelovalne naprave (ISO/DIS 11553-2:2016)

General Information

• Status: Not Published
• Public Enquiry End Date: 19-Feb-2017
• ICS: 13.110 - Safety of machinery
• ICS: 31.260 - Optoelectronics. Laser equipment
• Technical Committee: VAZ - Healthcare
• Current Stage: 98 - Abandoned project (Adopted Project)
• Start Date: 13-Dec-2018
• Due Date: 18-Dec-2018
• Completion Date: 13-Dec-2018
• Directive: 2006/42/EC - Directive 2006/42/EC of the European Parliament and of the Council of 17 May 2006 on machinery, and amending Directive 95/16/EC (recast)
• Mandate: M/396 - Mandate to CEN and Cenelec for standardisation in the field of machinery
• Ref Project: prEN ISO 11553-2 - Safety of machinery - Laser processing machines - Part 2: Safety requirements for hand-held laser processing devices (ISO/DIS 11553-2:2016)

Relations

• Revised: SIST EN ISO 11553-2:2009 - Safety of machinery - Laser processing machines - Part 2: Safety requirements for hand-held laser processing devices (ISO 11553-2:2007)
• Effective Date: 01-Feb-2017
• Revised: SIST EN ISO 11553-2:2009 - Safety of machinery - Laser processing machines - Part 2: Safety requirements for hand-held laser processing devices (ISO 11553-2:2007)
• Effective Date: 18-Jan-2023
• Revised: SIST EN ISO 11553-2:2009 - Safety of machinery - Laser processing machines - Part 2: Safety requirements for hand-held laser processing devices (ISO 11553-2:2007)
• Effective Date: 19-Jan-2023

Standards Content (Sample)

SLOVENSKI STANDARD
oSIST prEN ISO 11553-2:2017
01-februar-2017
9DUQRVWVWURMHY/DVHUVNLREGHORYDOQLVWURMLGHO9DUQRVWQH]DKWHYH]DURþQH
ODVHUVNHREGHORYDOQHQDSUDYH,62',6
Safety of machinery - Laser processing machines - Part 2: Safety requirements for hand-
held laser processing devices (ISO/DIS 11553-2:2016)
Sicherheit von Maschinen - Laserbearbeitungsmaschinen - Teil 2:
Sicherheitsanforderungen an handgeführte Laserbearbeitungsgeräte (ISO/DIS 11553-
2:2016)
Sécurité des machines - Machines à laser - Partie 2: Exigences de sécurité pour
dispositifs de traitement laser portatifs (ISO/DIS 11553-2:2016)
Ta slovenski standard je istoveten z: prEN ISO 11553-2
ICS:
13.110 Varnost strojev Safety of machinery
31.260 Optoelektronika, laserska Optoelectronics. Laser
oprema equipment
oSIST prEN ISO 11553-2:2017 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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oSIST prEN ISO 11553-2:2017

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oSIST prEN ISO 11553-2:2017
DRAFT INTERNATIONAL STANDARD
ISO DIS 11553-2
ISO/TC 172/SC 9 Secretariat: DIN
Voting begins on: Voting terminates on:
2016-12-06 2017-02-27
Safety of machinery — Laser processing machines —
Part 2:
Safety requirements for hand-held laser processing devices
Sécurité des machines — Machines à laser —
Partie 2: Exigences de sécurité pour dispositifs de traitement laser portatifs
ICS: 13.110; 31.260
Member bodies are requested to consult relevant national interests in IEC/TC
76 before casting their ballot to the e-Balloting application.
THIS DOCUMENT IS A DRAFT CIRCULATED
This document is circulated as received from the committee secretariat.
FOR COMMENT AND APPROVAL. IT IS
THEREFORE SUBJECT TO CHANGE AND MAY
NOT BE REFERRED TO AS AN INTERNATIONAL
STANDARD UNTIL PUBLISHED AS SUCH.
IN ADDITION TO THEIR EVALUATION AS
ISO/CEN PARALLEL PROCESSING
BEING ACCEPTABLE FOR INDUSTRIAL,
TECHNOLOGICAL, COMMERCIAL AND
USER PURPOSES, DRAFT INTERNATIONAL
STANDARDS MAY ON OCCASION HAVE TO
BE CONSIDERED IN THE LIGHT OF THEIR
POTENTIAL TO BECOME STANDARDS TO
WHICH REFERENCE MAY BE MADE IN
Reference number
NATIONAL REGULATIONS.
ISO DIS 11553-2:2016(E)
RECIPIENTS OF THIS DRAFT ARE INVITED
TO SUBMIT, WITH THEIR COMMENTS,
NOTIFICATION OF ANY RELEVANT PATENT
RIGHTS OF WHICH THEY ARE AWARE AND TO
©
PROVIDE SUPPORTING DOCUMENTATION. ISO 2016

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oSIST prEN ISO 11553-2:2017
ISO DIS 11553-2:2016(E)

COPYRIGHT PROTECTED DOCUMENT
© ISO 2016, Published in Switzerland
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized otherwise in any form
or by any means, electronic or mechanical, including photocopying, or posting on the internet or an intranet, without prior
written permission. Permission can be requested from either ISO at the address below or ISO’s member body in the country of
the requester.
ISO copyright office
Ch. de Blandonnet 8 • CP 401
CH-1214 Vernier, Geneva, Switzerland
Tel. [phone]
Fax [phone]
[e-mail]
www.iso.org
ii © ISO 2016 – All rights reserved

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Contents Page
Foreword .iv
Introduction .v
1 Scope . 1
2 Normative references . 1
3 Terms and definitions . 2
4 Hazards . 2
4.1 Inherent hazards . 2
4.2 Hazards induced by external effects (interferences) . 3
4.3 Further hazards related to the use of hand-held laser processing devices . 3
4.3.1 Confined spaces . 3
4.3.2 Working at heights . 4
4.3.3 Environmental effects . 4
5 Safety requirements and measures . 4
5.1 General requirements . 4
5.2 Risk assessment . 5
5.3 Implementation of corrective measures . 5
5.3.1 General requirements . 5
5.3.2 Protection against laser radiation hazards . 5
5.4 Design requirements . 6
5.4.1 Design . 6
5.4.2 Protective enclosure . 7
5.4.3 Authorizing control device . 7
5.4.4 Emission warning device . 7
5.4.5 Alignment laser . 7
5.4.6 Safety devices for scanning laser radiation . 7
5.4.7 Emergency stop control . 7
5.4.8 Control means and circuits . 8
5.4.9 Provisions for isolation of the laser beam .10
5.4.10 Protection against hazards generated by materials and substances .11
6 Verification of safety requirements and measures .11
6.1 General conformance.11
6.2 Classification of safety related control circuit .12
6.3 Laser classification .12
7 Information for use .12
7.1 Additional required information .12
7.2 Further information that should be included.13
8 Labelling .14
Annex A (informative) Risk assessment examples .15
Annex B (informative) Types of hand-held laser processing machines .17
Annex C (informative) Examples for the design of technical safety measures for hand-held
laser processing devices .19
Annex D (informative) Recommendations for the selection of personal protective clothing
for use with HLD .22
Annex ZA (informative) Relationship between this European Standard and the essential
requirements of Directive 2006/42/EC aimed to be covered .25
Bibliography .26
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Foreword
ISO (the International Organization for Standardization) is a worldwide federation of national standards
bodies (ISO member bodies). The work of preparing International Standards is normally carried out
through ISO technical committees. Each member body interested in a subject for which a technical
committee has been established has the right to be represented on that committee. International
organizations, governmental and non-governmental, in liaison with ISO, also take part in the work.
ISO collaborates closely with the International Electrotechnical Commission (IEC) on all matters of
electrotechnical standardization.
The procedures used to develop this document and those intended for its further maintenance are
described in the ISO/IEC Directives, Part 1. In particular the different approval criteria needed for the
different types of ISO documents should be noted. This document was drafted in accordance with the
editorial rules of the ISO/IEC Directives, Part 2 (see www.iso.org/directives).
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. ISO shall not be held responsible for identifying any or all such patent rights. Details of
any patent rights identified during the development of the document will be in the Introduction and/or
on the ISO list of patent declarations received (see www.iso.org/patents).
Any trade name used in this document is information given for the convenience of users and does not
constitute an endorsement.
For an explanation on the meaning of ISO specific terms and expressions related to conformity assessment,
as well as information about ISO’s adherence to the World Trade Organization (WTO) principles in the
Technical Barriers to Trade (TBT) see the following URL: www.iso.org/iso/foreword.html.
ISO 11553-2 was prepared by Technical Committee ISO/TC 172, Optics and photonics, Subcommittee
SC 9, Electro-optical systems in collaboration with IEC/TC 76, Optical radiation safety and laser equipment.
This Draft International Standard 11553-2 is a revision of ISO 11553-2:2007 and includes the following
changes:
— The document has been technically revised.
— Annex C “Examples for the design of technical safety measures for hand-held laser processing
devices “ and Annex D “Recommendations for the selection of personal protective clothing for use
with HLD “ were added.
— An Annex ZA was added.
ISO 11553 consists of the following parts, under the general title Safety of machinery — Laser processing
machines:
— Part 1: General safety requirements
— Part 2: Safety requirements for hand-held laser processing devices
— Part 3: Noise reduction and noise measurement methods for laser processing machines and hand-held
processing devices and associated auxiliary equipment (accuracy grade 2)
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Introduction
This document is a type C standard as stated in ISO 12100:2010.
The machinery concerned and the extent to which hazards, hazardous situations and events are covered
are indicated in the scope of this document. When provisions of this type C standard are different from
those which are stated in type A or B standards, the provisions of this type C standard take precedence
over the provisions of the other standards, for machines that have been designed and built according to
the provisions of this type C standard.
It is applicable to machines using laser radiation to process materials. The purpose of this part of
ISO 11553 is to prevent injuries to persons:
— by listing potential hazards generated by lasers;
— by specifying safety measures and verifications necessary for reducing the risk caused by specific
hazardous conditions;
— by providing references to pertinent standards;
— by specifying the information which is to be supplied to the users so that they can establish proper
procedures and precautions.
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oSIST prEN ISO 11553-2:2017
DRAFT INTERNATIONAL STANDARD ISO DIS 11553-2:2016(E)
Safety of machinery — Laser processing machines —
Part 2:
Safety requirements for hand-held laser processing devices
1 Scope
This part of ISO 11553 specifies the requirements for laser processing devices, as defined in ISO 11553-1,
which are hand-held or hand-operated.
The purpose of this part of ISO 11553 is to draw attention to the particular hazards related to hand-
held and hand-operated laser processing devices and to prevent personal injury. This includes both the
areas of hazard analysis and risk assessment as well as protective measures.
Requirements dealing with noise as a hazard are covered by ISO 11553-3.
This part of ISO 11553 does not apply to laser products or equipment manufactured solely or expressly
for applications which are excluded from the scope of ISO 11553-1.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments) applies.
ISO 3864-1, Graphical symbols — Safety colours and safety signs — Part 1: Design principles for safety
signs and safety markings
ISO 3864-2, Graphical symbols — Safety colours and safety signs — Part 2: Design principles for product
safety labels
ISO 3864-3, Graphical symbols — Safety colours and safety signs — Part 3: Design principles for graphical
symbols for use in safety signs
ISO 3864-4, Graphical symbols — Safety colours and safety signs — Part 4: Colorimetric and photometric
properties of safety sign materials
ISO 11145, Optics and photonics — Lasers and laser-related equipment — Vocabulary and symbols
ISO 11252, Lasers and laser-related equipment — Laser device — Minimum requirements for documentation
ISO 11553-1, Safety of machinery — Laser processing machines — Part 1: General safety requirements
ISO 12100, Safety of machinery — General principles for design — Risk assessment and risk reduction
ISO 13849-1, Safety of machinery — Safety-related parts of control systems — Part 1: General principles
for design
ISO 13850, Safety of machinery — Emergency stop function — Principles for design
ISO 14118, Safety of machinery — Prevention of unexpected start-up
ISO 14119, Safety of machinery — Interlocking devices associated with guards — Principles for design and
selection
ISO 13851, Safety of machinery — Two-hand control devices — Functional aspects and design principles
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IEC 60204-1, Safety of machinery — Electrical equipment of machines — Part 1: General requirements
IEC 60825-1:2014, Safety of laser products — Part 1: Equipment classification and requirements
IEC/TR 60825-14, Safety of laser products — Part 14: A user’s guide
IEC 60825-4, Safety of laser products — Part 4: Laser guards
3 Terms and definitions
For the purposes of this document, the terms and definitions given in ISO 11145, ISO 11553-1.
ISO 12100, IEC 60825-4 and the following apply. ISO and IEC maintain terminological databases for use
in standardization at the following addresses:
— IEC Electropedia: available at http://www.electropedia.org/
— ISO Online browsing platform: available at http://www.iso.org/obp
3.1
confined spaces
working areas surrounded on all sides, or for the most part, by solid walls where they, on account of
their confinement or containment of materials, preparation or equipment, augment or can augment
particular hazards that considerably exceed the hazard potential normally prevailing at workplaces
3.2
disposal unit
equipment that captures and removes effluents and by-products during laser material processing by
passing these on for filtration (e.g. capture devices, pipes, filtration systems, ventilation systems)
3.3
hand-held laser processing device
device in which a laser provides sufficient energy/power to melt, evaporate or cause a phase transition
in a part of the workpiece and where the laser output or workpiece to be processed is guided manually
or hand-held during the laser process
3.4
supply unit
all devices that provide the process energies and operating material supply direct to the point of action
and are absolutely necessary for the operation of the hand-held laser processing device (e.g. cooling
system, power and gas supply)
4 Hazards
4.1 Inherent hazards
The following hazards (see ISO 12100) may be generated by a laser-processing device:
a) mechanical hazards,
b) electrical hazards,
c) thermal hazards,
d) vibration hazards,
e) radiation hazards; for example:
1) hazards generated by direct or reflected laser beams, (also take into account that radiation can
occur on the back of the workpiece, e.g. when cutting or due to transparency of the workpiece),
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2) hazards generated by ionizing radiation,
3) hazards generated by collateral (UV, microwave, etc.) radiation produced, for example, by flash
lamps, discharge tubes or RF-power sources,
4) hazards generated by secondary radiation re-emitted by targets due to beam effects (the
wavelength of the re-emitted radiation may be different from that of the beam).
f) hazards generated by materials and substances; for example:
1) hazards due to products which are used in the laser-processing device (e.g. laser gases, laser
dyes, solvents),
2) hazards resulting from interaction between the beam and the material (e.g. fumes, particles,
vapours, debris), fire or explosion,
3) hazards from associated gases used to assist laser target interactions; these hazards include
explosion, fire, toxic effects and oxygen depletion,
4) hazards due to the leakage of liquids (e.g. coolant).
g) hazards generated by neglecting ergonomic principles in the design of the laser-processing device.
4.2 Hazards induced by external effects (interferences)
Power conditions and the environment in which the laser-processing device operates can cause the
hand held laser processing device to malfunction thus giving rise to hazardous conditions and/or
making intervention necessary within hazard area.
Additional environmental interferences include
a) Temperature,
b) Humidity,
c) external shock/vibration,
d) vapours, dust or gases from the environment,
e) electromagnetic interference,
f) lightning strike,
g) source voltage interruption/fluctuation,
h) insufficient hardware/software compatibility and integrity,
i) hand-held laser processing devices capable of being separated from the radiation source (example
given in Annex B, Figures B.1),
j) non-observance of interface specification (including power limits, control signals).
4.3 Further hazards related to the use of hand-held laser processing devices
4.3.1 Confined spaces
Hand-held laser processing devices can be used in confined spaces. Additional hazards may be created
including
a) concentration of harmful substances in the air,
b) enrichment of process gases (nitrogen, argon, helium, oxygen) in the air,
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c) oxygen depletion,
d) electrical current,
e) increased radiation hazard through direct as well as directly or diffusely reflected laser radiation,
f) increased tripping and impact (mechanical shock) hazard.
4.3.2 Working at heights
Hand-held laser processing devices can be used at heights above the ground or other load bearing
surfaces. Hazards are
a) falling objects,
b) fall of the user.
4.3.3 Environmental effects
Hazards that can directly affect the user due to the operating environmental conditions. This applies in
particular when hand-held laser processing machines are used outdoors.
This includes the following environmental effects due to
a) temperature (cold, heat),
b) humidity (rain, fog, hail),
c) mechanical effects (vibration, wind pressure),
d) electromagnetic effects (lightning strike),
e) visibility (sunlight, lighting).
5 Safety requirements and measures
5.1 General requirements
Machinery shall comply, as appropriate, with ISO 12100 for hazards that are not covered by this part of
ISO 11553.
Manufacturers shall ensure the safety of hand-held laser processing devices by
a) hazard identification and risk assessment,
b) implementation of safety measures,
c) verification of the implemented safety measures,
d) provision of appropriate information for the user.
Based on the hazard identification (see 5.2), appropriate safety measures shall be incorporated into the
hand-held laser processing device by design and manufacture.
The following requirements shall be satisfied:
e) each manufacturer shall comply with the safety requirements and measures stipulated in this clause,
f) the manufacturer of a hand-held laser processing device is responsible for compliance of
the complete hand-held laser processing device with the requirements, including associated
components (e.g. handling unit, laser assembly).
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NOTE The information given in Annexes A and B should be taken into account.
5.2 Risk assessment
A risk assessment shall be performed:
a) for all phases of hand-held laser processing device ”life” (as applicable); for examples see ISO 12100,
b) after each modification of the hand-held laser processing device by the person or organization
responsible for the modification,
c) for each use/operation not included by the intended use.
A risk assessment involves a hazard identification, which includes but is not limited to:
d) hazards listed in 4.1 and 4.3,
e) danger zones, particularly those associated with
1) the laser system,
2) the laser beam path/propagation, beam delivery system,
3) the process zone, and
4) interferences listed in 4.2.
The results of the risk assessment shall be duly documented.
5.3 Implementation of corrective measures
5.3.1 General requirements
Manufacturers shall ensure the safety of hand-held laser processing devices by
a) hazard analysis and risk assessment,
b) integration of safety measures,
c) verification of safety measures, and
d) provision of appropriate information for the user.
5.3.2 Protection against laser radiation hazards
5.3.2.1 General
The possibility of people being exposed to levels of laser radiation exceeding the Maximum Permissible
4
Exposure (MPE) limits for an exposure time of 3×10 s, as defined in standards IEC 60825-1 and
IEC/TR 60825-14, shall be eliminated during operation.
To satisfy this, the following requirements shall be met:
a) Risk assessment shall be performed,
b) The hand held laser processing device shall only be operated by trained and authorized persons.
Unauthorized human access to a danger zone should be prevented by engineering controls as
specified in IEC 60825-1.
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c) If access cannot be prevented, exposure above the ocular MPE shall be eliminated by use of
engineering or administrative controls, including Personal Protective Equipment, satisfying the
following requirements:
1) The design of protective devices, such as shutters, guards, beam dissipation devices, trip
devices and deterring/impeding devices shall meet the requirements specified in IEC 60825-1.
2) In cases of ambiguity or difference of interpretation between ISO 12100 and IEC 60825-1, the
first two sentences of 5.3.2.1.1, 5.3.2.1.2 and 5.3.2.1.3 of ISO 11553-1 shall be definitive.
NOTE 1 The same protective device may be used to provide simultaneous protection against more than
one hazard.
NOTE 2 Exposure limits for the eye and the skin of employees in the workplace and the general public are in
many countries specified in national laws. These legally-binding national exposure limits might differ from the
MPEs used is this standard.
5.3.2.2 Protection during operation and maintenance
The principal danger zone is usually the process zone, but the danger zone shall be defined as a result of
the risk assessment.
In the danger zone, human exposure shall be limited during operation and maintenance to levels of
laser radiation not exceeding the Maximum Permissible Exposure (MPE) limits for an exposure time of
4
3×10 s by use of engineering or administrative controls (for example local protection using a protective
enclosure), or the use of Personal Protective Equipment (for example laser protective eyewear and
clothing).
5.3.2.3 Protection during service
During service procedures, human access to laser radiation exceeding the Accessible Emission limit
(AEL) for Class 1 is sometimes unavoidable. During servicing it shall be ensured that only authorized
persons are allowed access to zones exposed to levels of laser radiation that exceed the AEL values
for Class 1. Hand-held laser-processing devices shall therefore be designed and appropriate safety
measures provided, with respect to the following four situations listed in order of preference.
a) Servicing takes place outside danger zones.
b) Servicing takes place in danger zones to which access is controlled in the same manner as during
production (e.g. interlocked cover).
c) Servicing takes place in a danger zone (e.g. with open guards that are normally closed during
production) but accessible laser radiation does not exceed the AEL for Class 1.
d) Servicing takes place in danger zones, e.g. because opening of guards (normally closed during
production) is necessary. In this case, accessible laser radiation exceeds the AEL for Class 1.
The manufacturer shall indicate the class of accessible laser radiation and recommended safety
pr
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